晶載冷卻競爭:TSMC，Samsung，Intel的策略分析

On-Chip Cooling Race: TSMC, Samsung, Intel Strategies Analysis

出版日期: 2025年08月29日 | 出版商:

TrendForce | 英文 26 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄

人工智慧應用的快速普及推動了半導體產業的發展和成長，同時也帶來了新的挑戰。除了先進製程技術接近物理極限、製程小型化難度日益增加之外，散熱也成為各大半導體代工廠面臨的主要難題。

用於人工智慧伺服器（尤其是GPU）的晶片效能不斷提升，導致單一晶片的熱設計功耗（TDP）達到千瓦級。傳統的風冷技術已接近其物理極限，為液冷技術的崛起鋪平了道路。同時，半導體產業及相關學術研究機構正積極投入研發晶片級液冷解決方案。

主要亮點

先進製程的熱管理挑戰
片上冷卻技術的興起
片上嵌入式冷卻
嵌入式片上冷卻將成為未來重要的冷卻技術
主要晶圓代工廠（台積電/三星/英特爾）的片上冷卻解決方案部署
主要晶圓代工廠的片上冷卻解決方案部署

樣品

The surge in AI applications has fueled the development and growth of the semiconductor industry but has also brought new challenges. Apart from advanced process technology nearing physical limits and the increasing difficulty of process miniaturization, heat dissipation has emerged as a primary concern for major semiconductor foundries.

Chips used in AI servers, particularly GPUs, continue to improve in terms of performance. Consequently, the thermal design power (TDP) of individual chips has reached kilowatt levels. The traditional air cooling technology is approaching its physical limits, making way for the rise of liquid cooling technology. At the same time, the semiconductor industry and related academic research institutions are actively investing in the development of embedded liquid cooling solutions within chips.

Key Highlights:

Thermal Management Challenges Brought by Advanced Processes.
Emergence of On-Chip Cooling Technology.
On-Chip Embedded Cooling.
Embedded On-Chip Cooling to Become a Key Cooling Technology in the Future.
Deployment in On-Chip Cooling Solutions among Major Foundries (TSMC / Samsung / Intel).
Deployment in On-Chip Cooling Solutions among Major Foundries.

SAMPLE VIEW

1. AI Chips Are Getting Hotter and Hotter

Table 1: Foundry Processes and Maximum TDP of NVIDIA's AI Chips

2. Thermal Management Challenges Brought by Advanced Processes

Figure 1: Traditional Cooling Architecture for Semiconductor Chip and Temperature Variations
Figure 2: Simulation Test Results from IMEC

3. Latest Developments in Cooling Technologies

Table 2: Comparison of Current Cooling Technologies

4. Emergence of On-Chip Cooling Technology

Figure 3: Srikanth Rangarajan and Research Team Segmented Cooling Technology of Chips from Inside Out into T1-T4
Figure 4: Structural Schematics of TED Embedded Thermoelectric Component
Figure 5: Structural Schematics of Embedded Micro-Jet Cooling
Figure 6: Comparison of Cooling Effect between Traditional Liquid-Cooling and Embedded Micro-Jet Cooling under the Same 500micrometer Unit
Figure 7: Microchannel Cooling Embedded in Power Electronic Chips
Figure 8: Cross-Sectional Comparison of Traditional Cold Plates and Microchannel Cooling Components
Figure 9: Technical Advancement of Next-Gen HBM Cooling
Figure 10: KAIST's Projection on Various Technical Nodes and Corresponding Cooling Technology of HBM

5. Deployment in On-Chip Cooling Solutions among Major Foundries

Figure 11: TSMC's IMC-Si Process
Table 3: Comparison of Samsung's FOWLP Technology
Figure 12: Intel's Package-Level Liquid-Cooling Technology
Figure 13: Intel Showcasing TIM Solutions Corresponding to Various Application Scenarios and Cost