封面
市場調查報告書
商品編碼
2149588

EUV光刻材料市場預測至2034年-按材料類型、光阻劑化學成分、層數、技術節點、最終用戶和地區分類的全球分析

EUV Lithography Materials Market Forecasts to 2034 - Global Analysis By Material Type, Photoresist Chemistry, Layer, Technology Node, End User and Geography

出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據,預計到 2026 年,全球 EUV 光刻材料市場規模將達到 18 億美元,並在預測期內以 14.2% 的複合年成長率成長,到 2034 年將達到 52 億美元。

極紫外線(EUV)微影材料是用於極紫外線(EUV)微影技術中形成極為精細半導體結構的專用材料。此類別包括EUV光阻劑、底層、硬掩模、顯影劑以及相關的製程化學品,這些材料能夠利用波長約13.5奈米的EUV輻射實現圖案轉移。這些材料必須具備高解析度、高靈敏度、高圖案保真度和抗工藝缺陷的能力。它們對於在最先進的製程節點上製造先進的邏輯裝置和儲存裝置至關重要。 EUV抗蝕劑系統必須在解析度和曝光效率之間取得平衡,同時抑制諸如線邊緣粗糙度和圖案變化等隨機缺陷。隨著半導體小型化的發展,對先進EUV材料的需求日益成長。研究重點在於開發能夠支援日益複雜的高數值孔徑(NA)EUV微影製程的材料,包括含金屬抗蝕劑、化學放大抗蝕劑、改良的底層、缺陷減少等。

市場動態

對先進節點製造的需求不斷成長

隨著人工智慧、5G 和高效能運算等應用領域採用極紫外光微影技術(EUV)製造先進節點半導體的產量不斷成長,對 EUV 微影材料的需求也日益旺盛。 EUV 光刻技術能夠實現 7 奈米以下微結構的圖形化,這對於基於莫耳定律的持續小型化至關重要。隨著每個裝置上 EUV 層數的增加,每片晶圓的材料消耗量也隨之增加。 EUV 掃描儀的日益普及推動了對相容光阻劑及相關材料的需求。先進節點對更高解析度和更低缺陷率的需求,也促進了高品質材料的應用。

高昂的材料成本和複雜的製程

EUV光阻劑及相關材料的高成本是其應用推廣的主要障礙,尤其是在對成本敏感的應用領域。 EUV微影術程的複雜性要求具備專業知識和廣泛的製程最佳化能力。持續的材料創新對於應對隨機缺陷和線邊緣粗糙度等挑戰至關重要。認證的EUV材料供應商數量有限,限制了供應鏈的柔軟性。抗蝕劑光阻的環境和安全要求進一步增加了整體擁有成本(TCO)。

採用金屬氧化物抗蝕劑和開發新的化學成分

先進節點中金屬氧化物抗蝕劑的日益普及為材料供應商帶來了巨大的商機。 2奈米以下節點新型光阻劑化學技術的開發創造了差異化機會。 EUV微影術在記憶體製造領域的擴展催生了新的材料需求。 EUV微影圖形化在先進封裝應用中的擴展拓寬了目標市場。永續發展計劃正在推動EUV材料環保替代品的需求。

技術轉型和大規模生產的挑戰

技術變革可能導致現有極紫外光刻材料配方過時,因此需要持續投資於創新。金屬氧化物抗蝕劑大規模生產的挑戰可能會限制其部署進度。半導體市場的商業週期會影響對極紫外光刻材料的需求。地緣政治緊張局勢可能會擾亂關鍵極紫外光刻材料的供應鏈。來自其他圖形化技術的競爭可能會限制某些應用領域的成長。

新型冠狀病毒(COVID-19)的影響:

新冠感染疾病加速了數位轉型和半導體需求,推動了對先進節點製造能力的投資以及極紫外光微影術的應用。供應鏈中斷凸顯了穩定EUV材料供應的重要性,並促使區域生產舉措加速推進。即使在疫情後期,對EUV微影術產能的持續投資也支撐了材料需求。政府對半導體製造業的持續支持繼續推動市場成長。 EUV材料的創新對於實現下一代裝置架構仍然至關重要。

在預測期內,EUV光阻劑細分市場預計將佔據最大的市場佔有率。

預計在預測期內,EUV光阻劑細分市場將佔據最大的市場佔有率。這是因為光阻劑是實現EUV圖形化的關鍵材料。對先進節點製造日益成長的需求推動了光阻劑消耗量的增加和性能要求的提高。光阻劑化學技術的進步提高了解析度並減少了缺陷。成熟的供應關係和應用專業知識鞏固了該細分市場的領先地位。 EUV光阻劑對於實現先進節點所需的圖案保真度至關重要。

預計在預測期內,金屬氧化物抗蝕劑細分市場將呈現最高的複合年成長率。

在預測期內,金屬氧化物抗蝕劑市場預計將呈現最高的成長率,這主要得益於先進節點關鍵層中金屬氧化物光阻應用的增加。與化學放大抗蝕劑相比,金屬氧化物抗蝕劑具有更高的耐蝕刻性和更高解析度。對2奈米以下圖形化日益成長的需求也推動了該市場的成長。金屬氧化物抗蝕劑配方技術的進步正在提升其性能並減少缺陷。在極具挑戰性的極紫外光微影應用中,金屬氧化物抗蝕劑正變得越來越受歡迎。

市佔率最大的地區:

在預測期內,亞太地區預計將佔據最大的市場佔有率,這主要得益於台灣、韓國和日本在先進製程節點製造地的優勢地位。該地區擁有一些世界領先的晶圓代工廠和記憶體製造商,這些工廠和製造商廣泛採用極紫外光刻技術。主要的半導體製造商正在推動對極紫外光刻材料的巨大需求。政府對半導體製造業的支持進一步鞏固了該地區的市場領導地位。先進製程節點產能的持續擴張將進一步推動對極紫外光刻材料的需求。

複合年成長率最高的地區:

在預測期內,亞太地區預計將呈現最高的複合年成長率,這主要得益於全部區域的應用。韓國和台灣正在擴大其用於記憶體和邏輯裝置的EUV微影產能。中國正在加大對國內EUV技術研發的投資,從而創造了長期需求潛力。對先進節點生產投資的增加將加速EUV材料的需求。區域供應鏈的發展也為市場成長提供了支撐。

免費客製化服務:

所有購買此報告的客戶均可從以下免費自訂選項中選擇一項:

  • 企業概況
    • 對其他市場參與者(最多 3 家公司)進行全面分析
    • 對主要公司進行SWOT分析(最多3家公司)
  • 區域細分
    • 根據客戶的興趣,我們將提供主要國家的市場估算和預測,以及複合年成長率(註:需經可行性確認)。
  • 競爭性標竿分析
    • 根據產品系列、地理覆蓋範圍和策略聯盟對領先公司進行基準分析。

目錄

第1章執行摘要

  • 市場概覽及主要亮點
  • 促進因素、挑戰與機遇
  • 競爭格局概述
  • 戰略洞察與建議

第2章:研究框架

  • 研究目標和範圍
  • 相關人員分析
  • 研究假設和限制
  • 調查方法

第3章 市場動態與趨勢分析

  • 市場定義與結構
  • 主要市場促進因素
  • 市場限制與挑戰
  • 投資成長機會和重點領域
  • 產業威脅與風險評估
  • 技術與創新展望
  • 新興市場/高成長市場
  • 監管和政策環境
  • 新冠疫情的影響及復甦前景

第4章:競爭環境與策略評估

  • 波特五力分析
    • 供應商的議價能力
    • 買方的議價能力
    • 替代品的威脅
    • 新進入者的威脅
    • 競爭公司之間的競爭
  • 主要公司市佔率分析
  • 產品基準評效和效能比較

第5章 全球極紫外光刻材料市場:依材料類型分類

  • 極紫外光光阻劑
  • 基材
  • 面漆材料
  • 開發者解決方案
  • 微影術輔助化學品
  • 其他EUV材料

第6章 全球極紫外光刻材料市場:以光阻劑化學成分分類

  • 化學敏化抗蝕劑
  • 金屬氧化物抗蝕劑
  • 分子玻璃基抗蝕劑
  • 非化學敏化抗蝕劑
  • 雜交抗蝕劑
  • 其他光阻劑的化學成分

第7章 全球極紫外光刻材料市場:分層結構

  • 重要金屬層
  • 佈線層
  • 接觸層
  • 啤酒層
  • 切割層和阻擋層
  • 其他層

第8章 全球極紫外光刻材料市場:依技術節點分類

  • 7奈米級節點
  • 5奈米級節點
  • 3奈米級節點
  • 2奈米級節點
  • 節點尺寸小於 2 nm

第9章 全球極紫外光刻材料市場:依最終用戶分類

  • 邏輯裝置製造商
  • 記憶體製造商
  • 鑄造廠
  • 垂直整合的設備製造商
  • 研究與開發設施
  • 其他最終用戶

第10章 全球極紫外光刻材料市場:依地區分類

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 荷蘭
    • 比利時
    • 瑞典
    • 瑞士
    • 波蘭
    • 其他歐洲國家
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 韓國
    • 澳洲
    • 印尼
    • 泰國
    • 馬來西亞
    • 新加坡
    • 越南
    • 其他亞太國家
  • 南美洲
    • 巴西
    • 阿根廷
    • 哥倫比亞
    • 智利
    • 秘魯
    • 其他南美國家
  • 世界其他地區(RoW)
    • 中東
      • 沙烏地阿拉伯
      • 阿拉伯聯合大公國
      • 卡達
      • 以色列
      • 其他中東國家
    • 非洲
      • 南非
      • 埃及
      • 摩洛哥
      • 其他非洲國家

第11章 策略市場資訊

  • 工業價值網路和供應鏈評估
  • 空白區域和機會地圖
  • 產品演進與市場生命週期分析
  • 通路、經銷商和打入市場策略的評估

第12章 產業趨勢與策略舉措

  • 併購
  • 夥伴關係、聯盟和合資企業
  • 新產品發布和認證
  • 擴大生產能力和投資
  • 其他策略舉措

第13章:公司簡介

  • Japan Advanced Semiconductor Technology Co., Ltd.
  • Japan Electronic Materials Corporation
  • Japan Synthetic Rubber Co., Ltd.
  • TOKYO OHKA KOGYO CO., LTD.
  • JSR Corporation
  • Shin-Etsu Chemical Co., Ltd.
  • Fujifilm Holdings Corporation
  • Merck KGaA
  • DuPont de Nemours, Inc.
  • SCREEN Holdings Co., Ltd.
  • Entegris, Inc.
  • AGC Inc.
  • Resonac Holdings Corporation
  • ArF Monomer Co., Ltd.
  • Inpria Corporation
Product Code: SMRC40075

According to Stratistics MRC, the Global EUV Lithography Materials Market is accounted for $1.8 billion in 2026 and is expected to reach $5.2 billion by 2034 growing at a CAGR of 14.2% during the forecast period. EUV Lithography Materials are specialized materials used in extreme ultraviolet lithography to pattern extremely small semiconductor features. The category includes EUV photoresists, underlayers, hard masks, developers, and related process chemicals that enable pattern transfer using approximately 13.5-nanometer EUV radiation. These materials must provide high resolution, sensitivity, pattern fidelity, and resistance to process-related defects. They are essential for manufacturing advanced logic and memory devices at leading-edge process nodes. EUV resist systems must balance resolution with exposure efficiency while limiting stochastic defects such as line-edge roughness and pattern variability. Continued semiconductor scaling is increasing demand for advanced EUV materials. Research is focused on metal-containing and chemically amplified resists, improved underlayers, defect reduction, and materials capable of supporting increasingly complex high-NA EUV lithography processes.

Market Dynamics

Driver:

Growing demand for advanced node manufacturing

Increasing production of advanced node semiconductors using EUV lithography for AI, 5G, and high-performance computing applications is driving demand for EUV lithography materials. EUV lithography enables patterning of features below 7nm, which is essential for continued Moore's Law scaling. Growing number of EUV layers per device increases material consumption per wafer. Rising EUV scanner installations drive demand for compatible photoresists and ancillary materials. Demand for improved resolution and reduced defects at advanced nodes supports premium material adoption.

Restraint:

High material costs and process complexity

High costs of EUV photoresists and ancillary materials present significant barriers to adoption, particularly for cost-sensitive applications. Process complexity of EUV lithography requires specialized expertise and extensive process optimization. Stochastic defects and line edge roughness challenges require continuous material innovation. Limited availability of qualified EUV material suppliers constrains supply chain flexibility. Environmental and safety requirements for metal-containing resists add to total cost of ownership.

Opportunity:

Metal oxide resist adoption and new chemistry development

Growing adoption of metal oxide resists for advanced nodes presents significant opportunities for material suppliers. Development of new photoresist chemistries for sub-2nm nodes creates differentiation opportunities. Expansion of EUV lithography to memory manufacturing creates new material demand. Growth in EUV patterning for advanced packaging applications expands addressable markets. Sustainability initiatives drive demand for environmentally friendly EUV material alternatives.

Threat:

Technology transitions and high-volume manufacturing challenges

Technology transitions may render existing EUV material formulations obsolete, requiring continuous innovation investment. High-volume manufacturing challenges for metal oxide resists may limit adoption timelines. Economic cyclicality in semiconductor markets affects EUV material demand. Geopolitical tensions may disrupt supply chains for critical EUV materials. Competition from alternative patterning technologies may limit growth in certain applications.

Covid-19 Impact:

The COVID-19 pandemic accelerated digital transformation and semiconductor demand, driving investment in advanced node manufacturing capacity and EUV lithography adoption. Supply chain disruptions highlighted the importance of EUV material supply security, accelerating regional production initiatives. The post-pandemic period has witnessed sustained investment in EUV lithography capacity, supporting material demand. Growing government support for semiconductor manufacturing continues driving market growth. EUV material innovation remains critical for enabling next-generation device architectures.

The EUV photoresists segment is expected to be the largest during the forecast period

The EUV photoresists segment is expected to account for the largest market share during the forecast period as photoresists are the critical material enabling EUV patterning. Growing demand for advanced node manufacturing drives increased photoresist consumption and performance requirements. Advances in photoresist chemistry enable improved resolution and reduced defects. Established supply relationships and application expertise support segment leadership. EUV photoresists are essential for achieving required pattern fidelity at advanced nodes.

The metal oxide resists segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the metal oxide resists segment is predicted to witness the highest growth rate driven by increasing adoption for critical layers at advanced nodes. Metal oxide resists offer higher etch resistance and improved resolution compared to chemically amplified resists. Growing demand for sub-2nm patterning supports segment growth. Advances in metal oxide resist formulation improve performance and reduce defects. Metal oxide resists are increasingly preferred for challenging EUV applications.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share owing to dominant advanced node manufacturing base in Taiwan, South Korea, and Japan. The region hosts the world's leading foundries and memory manufacturers with extensive EUV lithography adoption. Major semiconductor manufacturers drive substantial demand for EUV materials. Government support for semiconductor manufacturing reinforces regional market leadership. Continued advanced node capacity expansion drives EUV material demand.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR driven by continued advanced node capacity expansion and EUV adoption across the region. South Korea and Taiwan are expanding EUV lithography capacity for memory and logic devices. China is investing in domestic EUV development, creating long-term demand potential. Growing investment in advanced node production accelerates demand for EUV materials. Regional supply chain development supports market growth.

Key players in the market

Some of the key players in the EUV Lithography Materials Market include Japan Advanced Semiconductor Technology Co., Ltd., Japan Electronic Materials Corporation, Japan Synthetic Rubber Co., Ltd., TOKYO OHKA KOGYO CO., LTD., JSR Corporation, Shin-Etsu Chemical Co., Ltd., Fujifilm Holdings Corporation, Merck KGaA, DuPont de Nemours, Inc., SCREEN Holdings Co., Ltd., Entegris, Inc., AGC Inc., Resonac Holdings Corporation, ArF Monomer Co., Ltd., and Inpria Corporation.

Key Developments:

In July 2026, JSR Corporation launched a new metal oxide EUV photoresist for sub-2nm logic applications, offering improved resolution and reduced stochastic defects.

In March 2026, TOKYO OHKA KOGYO CO., LTD. expanded its EUV photoresist production capacity in Japan to meet growing demand from advanced node manufacturers.

In November 2025, Shin-Etsu Chemical Co., Ltd. introduced a new chemically amplified EUV resist with improved sensitivity and resolution for critical layer patterning.

In June 2025, Merck KGaA announced the launch of a new underlayer material for EUV lithography, offering improved adhesion and etch performance for advanced node manufacturing.

Material Types Covered:

  • EUV Photoresists
  • Underlayer Materials
  • Topcoat Materials
  • Developer Solutions
  • Ancillary Lithography Chemicals
  • Other EUV Materials

Photoresist Chemistries Covered:

  • Chemically Amplified Resists
  • Metal Oxide Resists
  • Molecular Glass Resists
  • Non-Chemically Amplified Resists
  • Hybrid Resists
  • Other Photoresist Chemistries

Layers Covered:

  • Critical Metal Layers
  • Interconnect Layers
  • Contact Layers
  • Via Layers
  • Cut and Block Layers
  • Other Layers

Technology Nodes Covered:

  • 7 nm-Class Nodes
  • 5 nm-Class Nodes
  • 3 nm-Class Nodes
  • 2 nm-Class Nodes
  • Sub-2 nm Nodes

End Users Covered:

  • Logic Device Manufacturers
  • Memory Manufacturers
  • Foundries
  • Integrated Device Manufacturers
  • Research and Development Facilities
  • Other End Users

Regions Covered:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Spain
    • Netherlands
    • Belgium
    • Sweden
    • Switzerland
    • Poland
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Thailand
    • Malaysia
    • Singapore
    • Vietnam
    • Rest of Asia Pacific
  • South America
    • Brazil
    • Argentina
    • Colombia
    • Chile
    • Peru
    • Rest of South America
  • Rest of the World (RoW)
    • Middle East
  • Saudi Arabia
  • United Arab Emirates
  • Qatar
  • Israel
  • Rest of Middle East
    • Africa
  • South Africa
  • Egypt
  • Morocco
  • Rest of Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2023, 2024, 2025, 2026, 2027, 2028, 2030, 2032 and 2034
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

  • 1.1 Market Snapshot and Key Highlights
  • 1.2 Growth Drivers, Challenges, and Opportunities
  • 1.3 Competitive Landscape Overview
  • 1.4 Strategic Insights and Recommendations

2 Research Framework

  • 2.1 Study Objectives and Scope
  • 2.2 Stakeholder Analysis
  • 2.3 Research Assumptions and Limitations
  • 2.4 Research Methodology
    • 2.4.1 Data Collection (Primary and Secondary)
    • 2.4.2 Data Modeling and Estimation Techniques
    • 2.4.3 Data Validation and Triangulation
    • 2.4.4 Analytical and Forecasting Approach

3 Market Dynamics and Trend Analysis

  • 3.1 Market Definition and Structure
  • 3.2 Key Market Drivers
  • 3.3 Market Restraints and Challenges
  • 3.4 Growth Opportunities and Investment Hotspots
  • 3.5 Industry Threats and Risk Assessment
  • 3.6 Technology and Innovation Landscape
  • 3.7 Emerging and High-Growth Markets
  • 3.8 Regulatory and Policy Environment
  • 3.9 Impact of COVID-19 and Recovery Outlook

4 Competitive and Strategic Assessment

  • 4.1 Porter's Five Forces Analysis
    • 4.1.1 Supplier Bargaining Power
    • 4.1.2 Buyer Bargaining Power
    • 4.1.3 Threat of Substitutes
    • 4.1.4 Threat of New Entrants
    • 4.1.5 Competitive Rivalry
  • 4.2 Market Share Analysis of Key Players
  • 4.3 Product Benchmarking and Performance Comparison

5 Global EUV Lithography Materials Market, By Material Type

  • 5.1 EUV Photoresists
  • 5.2 Underlayer Materials
  • 5.3 Topcoat Materials
  • 5.4 Developer Solutions
  • 5.5 Ancillary Lithography Chemicals
  • 5.6 Other EUV Materials

6 Global EUV Lithography Materials Market, By Photoresist Chemistry

  • 6.1 Chemically Amplified Resists
  • 6.2 Metal Oxide Resists
  • 6.3 Molecular Glass Resists
  • 6.4 Non-Chemically Amplified Resists
  • 6.5 Hybrid Resists
  • 6.6 Other Photoresist Chemistries

7 Global EUV Lithography Materials Market, By Layer

  • 7.1 Critical Metal Layers
  • 7.2 Interconnect Layers
  • 7.3 Contact Layers
  • 7.4 Via Layers
  • 7.5 Cut and Block Layers
  • 7.6 Other Layers

8 Global EUV Lithography Materials Market, By Technology Node

  • 8.1 7 nm-Class Nodes
  • 8.2 5 nm-Class Nodes
  • 8.3 3 nm-Class Nodes
  • 8.4 2 nm-Class Nodes
  • 8.5 Sub-2 nm Nodes

9 Global EUV Lithography Materials Market, By End User

  • 9.1 Logic Device Manufacturers
  • 9.2 Memory Manufacturers
  • 9.3 Foundries
  • 9.4 Integrated Device Manufacturers
  • 9.5 Research and Development Facilities
  • 9.6 Other End Users

10 Global EUV Lithography Materials Market, By Geography

  • 10.1 North America
    • 10.1.1 United States
    • 10.1.2 Canada
    • 10.1.3 Mexico
  • 10.2 Europe
    • 10.2.1 United Kingdom
    • 10.2.2 Germany
    • 10.2.3 France
    • 10.2.4 Italy
    • 10.2.5 Spain
    • 10.2.6 Netherlands
    • 10.2.7 Belgium
    • 10.2.8 Sweden
    • 10.2.9 Switzerland
    • 10.2.10 Poland
    • 10.2.11 Rest of Europe
  • 10.3 Asia Pacific
    • 10.3.1 China
    • 10.3.2 Japan
    • 10.3.3 India
    • 10.3.4 South Korea
    • 10.3.5 Australia
    • 10.3.6 Indonesia
    • 10.3.7 Thailand
    • 10.3.8 Malaysia
    • 10.3.9 Singapore
    • 10.3.10 Vietnam
    • 10.3.11 Rest of Asia Pacific
  • 10.4 South America
    • 10.4.1 Brazil
    • 10.4.2 Argentina
    • 10.4.3 Colombia
    • 10.4.4 Chile
    • 10.4.5 Peru
    • 10.4.6 Rest of South America
  • 10.5 Rest of the World (RoW)
    • 10.5.1 Middle East
      • 10.5.1.1 Saudi Arabia
      • 10.5.1.2 United Arab Emirates
      • 10.5.1.3 Qatar
      • 10.5.1.4 Israel
      • 10.5.1.5 Rest of Middle East
    • 10.5.2 Africa
      • 10.5.2.1 South Africa
      • 10.5.2.2 Egypt
      • 10.5.2.3 Morocco
      • 10.5.2.4 Rest of Africa

11 Strategic Market Intelligence

  • 11.1 Industry Value Network and Supply Chain Assessment
  • 11.2 White-Space and Opportunity Mapping
  • 11.3 Product Evolution and Market Life Cycle Analysis
  • 11.4 Channel, Distributor, and Go-to-Market Assessment

12 Industry Developments and Strategic Initiatives

  • 12.1 Mergers and Acquisitions
  • 12.2 Partnerships, Alliances, and Joint Ventures
  • 12.3 New Product Launches and Certifications
  • 12.4 Capacity Expansion and Investments
  • 12.5 Other Strategic Initiatives

13 Company Profiles

  • 13.1 Japan Advanced Semiconductor Technology Co., Ltd.
  • 13.2 Japan Electronic Materials Corporation
  • 13.3 Japan Synthetic Rubber Co., Ltd.
  • 13.4 TOKYO OHKA KOGYO CO., LTD.
  • 13.5 JSR Corporation
  • 13.6 Shin-Etsu Chemical Co., Ltd.
  • 13.7 Fujifilm Holdings Corporation
  • 13.8 Merck KGaA
  • 13.9 DuPont de Nemours, Inc.
  • 13.10 SCREEN Holdings Co., Ltd.
  • 13.11 Entegris, Inc.
  • 13.12 AGC Inc.
  • 13.13 Resonac Holdings Corporation
  • 13.14 ArF Monomer Co., Ltd.
  • 13.15 Inpria Corporation

List of Tables

  • Table 1 Global EUV Lithography Materials Market Outlook, By Region (2023-2034) ($MN)
  • Table 2 Global EUV Lithography Materials Market, By Material Type (2023-2034) ($MN)
  • Table 3 Global EUV Lithography Materials Market, By EUV Photoresists (2023-2034) ($MN)
  • Table 4 Global EUV Lithography Materials Market, By Underlayer Materials (2023-2034) ($MN)
  • Table 5 Global EUV Lithography Materials Market, By Topcoat Materials (2023-2034) ($MN)
  • Table 6 Global EUV Lithography Materials Market, By Developer Solutions (2023-2034) ($MN)
  • Table 7 Global EUV Lithography Materials Market, By Ancillary Lithography Chemicals (2023-2034) ($MN)
  • Table 8 Global EUV Lithography Materials Market, By Other EUV Materials (2023-2034) ($MN)
  • Table 9 Global EUV Lithography Materials Market, By Photoresist Chemistry (2023-2034) ($MN)
  • Table 10 Global EUV Lithography Materials Market, By Chemically Amplified Resists (2023-2034) ($MN)
  • Table 11 Global EUV Lithography Materials Market, By Metal Oxide Resists (2023-2034) ($MN)
  • Table 12 Global EUV Lithography Materials Market, By Molecular Glass Resists (2023-2034) ($MN)
  • Table 13 Global EUV Lithography Materials Market, By Non-Chemically Amplified Resists (2023-2034) ($MN)
  • Table 14 Global EUV Lithography Materials Market, By Hybrid Resists (2023-2034) ($MN)
  • Table 15 Global EUV Lithography Materials Market, By Other Photoresist Chemistries (2023-2034) ($MN)
  • Table 16 Global EUV Lithography Materials Market, By Layer (2023-2034) ($MN)
  • Table 17 Global EUV Lithography Materials Market, By Critical Metal Layers (2023-2034) ($MN)
  • Table 18 Global EUV Lithography Materials Market, By Interconnect Layers (2023-2034) ($MN)
  • Table 19 Global EUV Lithography Materials Market, By Contact Layers (2023-2034) ($MN)
  • Table 20 Global EUV Lithography Materials Market, By Via Layers (2023-2034) ($MN)
  • Table 21 Global EUV Lithography Materials Market, By Cut and Block Layers (2023-2034) ($MN)
  • Table 22 Global EUV Lithography Materials Market, By Other Layers (2023-2034) ($MN)
  • Table 23 Global EUV Lithography Materials Market, By Technology Node (2023-2034) ($MN)
  • Table 24 Global EUV Lithography Materials Market, By 7 nm-Class Nodes (2023-2034) ($MN)
  • Table 25 Global EUV Lithography Materials Market, By 5 nm-Class Nodes (2023-2034) ($MN)
  • Table 26 Global EUV Lithography Materials Market, By 3 nm-Class Nodes (2023-2034) ($MN)
  • Table 27 Global EUV Lithography Materials Market, By 2 nm-Class Nodes (2023-2034) ($MN)
  • Table 28 Global EUV Lithography Materials Market, By Sub-2 nm Nodes (2023-2034) ($MN)
  • Table 29 Global EUV Lithography Materials Market, By End User (2023-2034) ($MN)
  • Table 30 Global EUV Lithography Materials Market, By Logic Device Manufacturers (2023-2034) ($MN)
  • Table 31 Global EUV Lithography Materials Market, By Memory Manufacturers (2023-2034) ($MN)
  • Table 32 Global EUV Lithography Materials Market, By Foundries (2023-2034) ($MN)
  • Table 33 Global EUV Lithography Materials Market, By Integrated Device Manufacturers (2023-2034) ($MN)
  • Table 34 Global EUV Lithography Materials Market, By Research and Development Facilities (2023-2034) ($MN)
  • Table 35 Global EUV Lithography Materials Market, By Other End Users (2023-2034) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Rest of the World (RoW) are also represented in the same manner as above.