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市場調查報告書
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1933081

晶片先進溫度控管，全球市場預測至2034年：按晶片類型、材料類型、散熱技術、技術、最終用戶和地區分類

Advanced Thermal Management for Chips Market Forecasts to 2034 - Global Analysis By Chip Type, Material Type, Thermal Technique, Technology, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的一項研究，預計到 2026 年，全球晶片先進溫度控管市場規模將達到 99.4 億美元，到 2034 年將達到 281.6 億美元，預測期內複合年成長率為 13.9%。

晶片先進溫度控管是指將材料、系統和控制技術結合，以高效散發高性能半導體裝置產生的熱量。這包括被動式解決方案（例如散熱器和導熱界面材料）、主動式系統（例如液冷和熱電模組）以及先進技術（例如浸沒式冷卻和微通道冷卻）。這些解決方案能夠維持最佳動作溫度，從而提高可靠性並防止效能下降。隨著先進節點技術的出現，晶片功率密度不斷提高，因此，有效的溫度控管對於確保裝置的長壽命、能源效率以及在資料中心、汽車電子和人工智慧應用中的穩定運作至關重要。

半導體需求爆炸性成長

全球半導體需求的爆炸性成長是推動市場發展的主要動力。人工智慧工作負載、高效能運算、電動車和先進消費性電子產品的快速發展，正顯著提升晶片的功率密度。隨著處理能力的提升，散熱已成為影響性能和可靠性的關鍵阻礙因素。先進的散熱解決方案對於維持穩定的動作溫度、防止熱感降頻以及確保性能穩定至關重要，因此，溫度控管已成為現代半導體設計和部署的基本要求。

高額資本支出及研發成本

高昂的資本支出和密集的研發成本是限制市場成長的重要阻礙因素。包括液冷、浸沒式系統和新材料在內的先進溫度控管技術，需要在設計、測試和製造方面前期投資。與複雜晶片結構的整合進一步增加了開發的複雜性和成本。這些財務障礙可能會限制技術的普及，尤其是在中小製造商中，並延長商業化週期，從而抑制市場擴張。

消費性電子產品的擴張

不斷擴張的消費性電子市場為先進的溫度控管解決方案提供了巨大的成長機會。高效能智慧型手機和小型運算設備的普及加劇了小型外形規格內部的散熱挑戰。製造商正在加速整合高效散熱器和先進的冷卻解決方案，以提高設備的可靠性和用戶體驗。隨著消費者對速度更快、功能更強大的電子產品的需求持續成長，溫度控管技術的創新將在維持產品永續性和實現產品差異化方面發揮關鍵作用。

材料和製造方面的挑戰

材料和製造方面的挑戰對市場構成重大威脅。開發高性能導熱材料需要精密製造、穩定的品質和可靠的供應鏈。材料性能的波動以及與先進半導體封裝的兼容性問題會影響效率和成本。此外，微通道和浸沒式冷卻技術的引入增加了製造的複雜性，可能導致更高的缺陷率和更慢的普及速度，從而阻礙其廣泛應用。

新冠疫情的影響：

新冠疫情透過供應鏈中斷、生產延誤和原料供應受限等方式暫時擾亂了市場。資料中心和半導體工廠的計劃進度也受到勞動力短缺的影響。然而，疫情加速了數位轉型、雲端運算和遠距辦公的普及，從而推動了對高效能晶片的長期需求。疫情後的復甦階段，對支持系統彈性、能源效率和高密度計算環境的先進散熱解決方案的投資顯著增加。

在預測期內，風冷式空調細分市場將佔據最大的市場佔有率。

由於其成本效益高、可靠性強，且在各種半導體應用中廣泛應用，預計在預測期內，風冷散熱領域將佔據最大的市場佔有率。風冷散熱解決方案包括散熱器、風扇和導熱介面材料，無需複雜的基礎設施即可實現高效散熱。其易於整合、維護需求低且性能可靠，使其適用於消費性電子、汽車電子和工業系統，即使在先進散熱技術不斷湧現的情況下，市場需求仍然強勁。

資料中心和高效能運算領域在預測期內將呈現最高的複合年成長率。

由於人工智慧伺服器、雲端運算基礎設施和進階分析平台的快速普及，資料中心和高效能運算 (HPC) 領域預計將在預測期內實現最高成長率。這些環境會產生巨大的熱負荷，因此需要超越傳統空氣冷卻系統的先進冷卻解決方案。對能源效率、降低營運成本和確保不間斷性能的日益重視，正在加速液冷和浸沒式冷卻技術的應用，從而推動該領域的強勁成長。

佔比最大的地區：

由於亞太地區擁有強大的半導體製造生態系統和高度集中的電子產品生產，預計該地區將在預測期內佔據最大的市場佔有率。中國、台灣、韓國和日本等國家和地區持續增加對先進晶片製造、封裝和測試設施的投資。在政府利好政策的支持下，消費性電子產品、電動車和資料中心基礎設施需求的不斷成長，正推動先進溫度控管解決方案在全部區域廣泛應用。

年複合成長率最高的地區：

預計亞太地區在預測期內將實現最高的複合年成長率。該地區擁有最集中的半導體晶圓廠、先進封裝設施和人工智慧硬體生產基地，因此散熱效率至關重要。晶片功率密度的不斷提高正在推動液冷、先進基板和高性能介面材料的快速應用。強力的政府獎勵、積極的產能擴張以及緊密的供應商生態系統正在加速商業化進程，使亞太地區成為溫度控管創新成果從實驗室到生產車間轉化速度最快的地區。

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目錄

第1章執行摘要

第2章 前言

  • 概括
  • 相關利益者
  • 調查範圍
  • 調查方法
  • 研究材料

第3章 市場趨勢分析

  • 促進要素
  • 抑制因素
  • 機會
  • 威脅
  • 技術分析
  • 終端用戶分析
  • 新興市場
  • 新冠疫情的感染疾病

第4章 波特五力分析

  • 供應商的議價能力
  • 買方的議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭對手之間的競爭

5. 全球晶片先進溫度控管市場（以晶片類型分類）

  • 微處理器/CPU
  • GPU
  • ASIC
  • SoC
  • 記憶體晶片
  • 功率積體電路
  • 其他

6. 全球晶片先進溫度控管市場（依材料類型分類）

  • 金屬基材料
  • 聚合物基材料
  • 陶瓷基材料
  • 複合材料
  • 石墨烯和先進材料

7. 全球晶片先進溫度控管市場（依熱技術分類）

  • 空冷式
  • 液冷
  • 熱電冷卻
  • 微通道/噴霧冷卻
  • 浸沒式冷卻

8. 全球晶片先進溫度控管市場（依技術分類）

  • 被動式溫度控管
    • 散熱器
    • 熱感墊
    • 導熱界面材料（TIM）
    • 相變材料
    • 黏合劑
  • 主動溫度控管
    • 風扇/鼓風機
    • 液冷系統
    • 珀爾帖元件/熱電冷卻器
    • 熱管/蒸氣腔
    • 低溫冷卻系統
  • 混合熱解決方案
  • 軟體和控制系統
  • 新興技術

9. 全球晶片先進溫度控管市場（依最終用戶分類）

  • 消費性電子產品
  • 汽車（包括電動車）
  • 資料中心和高效能運算
  • 通訊/5G設備
  • 工業與自動化
  • 航太/國防
  • 醫療保健和醫療設備
  • 物聯網和智慧設備

第10章 全球晶片先進溫度控管市場（按地區分類）

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 亞太其他地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美國家
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲地區

第11章 重大進展

  • 協議、夥伴關係、合作和合資企業
  • 併購
  • 新產品發布
  • 業務拓展
  • 其他關鍵策略

第12章：企業概況

  • Honeywell International Inc.
  • Vertiv Group Corp.
  • Henkel AG &Co. KGaA
  • Rogers Corporation
  • 3M Company
  • CoolIT Systems Inc.
  • Advanced Cooling Technologies, Inc.
  • Wakefield-Vette, Inc.
  • Boyd Corporation
  • CUI Devices
  • Laird Thermal Systems
  • Parker Hannifin Corporation
  • Fujipoly America Corporation
  • TE Connectivity Ltd.
  • Delta Electronics, Inc.
Product Code: SMRC33649

According to Stratistics MRC, the Global Advanced Thermal Management for Chips Market is accounted for $9.94 billion in 2026 and is expected to reach $28.16 billion by 2034 growing at a CAGR of 13.9% during the forecast period. Advanced Thermal Management for Chips refers to the integrated use of materials, systems, and control technologies designed to efficiently dissipate heat generated by high performance semiconductor devices. It includes passive solutions such as heat sinks and thermal interface materials, active systems like liquid cooling and thermoelectric modules, and advanced techniques including immersion and micro channel cooling. These solutions maintain optimal operating temperatures, enhance reliability, and prevent performance degradation. As chip power densities rise with advanced nodes, effective thermal management becomes critical for ensuring device longevity, energy efficiency, and stable operation across data centers, automotive electronics, and AI-driven applications.

Market Dynamics:

Driver:

Explosive Growth in Semiconductor Demand

The explosive growth in global semiconductor demand is a key driver of the market. Rapid expansion of AI workloads, high-performance computing, electric vehicles, and advanced consumer electronics has significantly increased chip power densities. As processing capabilities scale upward, heat dissipation becomes a critical performance and reliability constraint. Advanced thermal solutions are essential to maintain stable operating temperatures, prevent thermal throttling, and ensure consistent performance, making thermal management a fundamental requirement in modern semiconductor design and deployment.

Restraint:

High Capital & R&D Costs

High capital expenditure and intensive research and development costs present a significant restraint to market growth. Advanced thermal management technologies, including liquid cooling, immersion systems, and novel materials, require substantial upfront investment in design, testing, and manufacturing. Integration with complex chip architectures further increases development complexity and cost. These financial barriers can limit adoption, particularly among smaller manufacturers, and extend commercialization timelines, thereby moderating market expansion.

Opportunity:

Consumer Electronics Expansion

The expanding consumer electronics market offers substantial growth opportunities for advanced thermal management solutions. Increasing adoption of high-performance smartphones and compact computing devices has intensified thermal challenges within smaller form factors. Manufacturers are increasingly integrating efficient heat sinks and advanced cooling solutions to enhance device reliability and user experience. As consumer demand for faster and more powerful electronics grows, thermal management innovations will play a crucial role in enabling sustained performance and product differentiation.

Threat:

Material & Manufacturing Challenges

Material and manufacturing challenges pose a notable threat to the market. The development of high-performance thermal materials requires precision manufacturing, consistent quality, and reliable supply chains. Variability in material performance and compatibility issues with advanced semiconductor packaging can impact efficiency and cost. Additionally, manufacturing complexity increases with micro channel and immersion cooling technologies, potentially leading to higher defect rates and delayed deployments, which may hinder widespread adoption.

Covid-19 Impact:

The COVID-19 pandemic temporarily disrupted the market through supply chain interruptions, delayed manufacturing activities, and restricted access to raw materials. Project timelines for data centers and semiconductor facilities were impacted due to workforce limitations. However, the pandemic accelerated digital transformation, cloud computing, and remote work adoption, driving long-term demand for high-performance chips. Post-pandemic recovery has strengthened investments in advanced thermal solutions to support resilient, energy-efficient, and high-density computing environments.

The air cooling segment is expected to be the largest during the forecast period

The air cooling segment is expected to account for the largest market share during the forecast period, due to its cost effectiveness, reliability, and widespread adoption across diverse semiconductor applications. Air cooling solutions, including heat sinks, fans and thermal interface materials, offer efficient heat dissipation without requiring complex infrastructure. Their ease of integration, low maintenance requirements, and proven performance make them suitable for consumer electronics, automotive electronics, and industrial systems, sustaining strong demand despite the emergence of advanced cooling technologies.

The data centers & HPC segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the data centers & HPC segment is predicted to witness the highest growth rate, due to rapidly increasing deployment of AI servers, cloud computing infrastructure, and advanced analytics platforms. These environments generate extremely high thermal loads, necessitating advanced cooling solutions beyond traditional air-based systems. Rising focus on energy efficiency, reduced operational costs, and uninterrupted performance is accelerating adoption of liquid and immersion cooling technologies, driving strong growth in this segment.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, due to its strong semiconductor manufacturing ecosystem and high concentration of electronics production. Countries such as China, Taiwan, South Korea, and Japan continue to invest heavily in advanced chip fabrication, packaging, and testing facilities. Growing demand for consumer electronics, electric vehicles, and data center infrastructure, supported by favorable government policies, is driving widespread adoption of advanced thermal management solutions across the region.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR, owing to highest concentration of semiconductor fabs, advanced packaging facilities, and AI hardware production, thermal efficiency becomes non-negotiable. Rising chip power densities force rapid adoption of liquid cooling, advanced substrates, and high-performance interface materials. Strong government incentives, aggressive capacity expansions, and tightly knit supplier ecosystems accelerate commercialization, making Asia Pacific the region where thermal innovations move fastest from lab to fab floor.

Key players in the market

Some of the key players in Advanced Thermal Management for Chips Market include Honeywell International Inc., Vertiv Group Corp., Henkel AG & Co. KGaA, Rogers Corporation, 3M Company, CoolIT Systems Inc., Advanced Cooling Technologies, Inc., Wakefield-Vette, Inc., Boyd Corporation, CUI Devices, Laird Thermal Systems, Parker Hannifin Corporation, Fujipoly America Corporation, TE Connectivity Ltd., and Delta Electronics, Inc.

Key Developments:

In November 2025, Honeywell Aerospace and Global Aerospace Logistics (GAL) signed a three year agreement to streamline defense repair and overhaul services in the UAE, enhancing end to end logistics for military components like T55 engines and environmental systems, reducing downtime and improving mission readiness for the UAE Joint Aviation Command and Air Force.

In October 2025, Honeywell and LS ELECTRIC have entered a global partnership to accelerate innovation for data centers and battery energy storage systems (BESS), combining Honeywell's building automation and power control expertise with LS ELECTRIC's energy storage capabilities. The collaboration aims to deliver integrated power management, intelligent controls, and resilient energy solutions that improve uptime, manage electricity demand and support microgrid creation.

Chip Types Covered:

  • Microprocessors / CPUs
  • GPUs
  • ASICs
  • SoCs
  • Memory Chips
  • Power ICs
  • Other Chip Types

Material Types Covered:

  • Metal-based Materials
  • Polymer-based Materials
  • Ceramic-based Materials
  • Composite Materials
  • Graphene & Advanced Materials

Thermal Techniques Covered:

  • Air Cooling
  • Liquid Cooling
  • Thermoelectric Cooling
  • Microchannel / Spray Cooling
  • Immersion Cooling

Technologies Covered:

  • Passive Thermal Management
  • Active Thermal Management
  • Hybrid Thermal Solutions
  • Software & Control Systems
  • Emerging Technologies

End Users Covered:

  • Consumer Electronics
  • Automotive (incl. EVs)
  • Data Centers & HPC
  • Telecommunications & 5G Equipment
  • Industrial & Automation
  • Aerospace & Defense
  • Healthcare & Medical Devices
  • IoT & Smart Devices

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2023, 2024, 2025, 2026, 2027, 2028, 2030, 2032 and 2034
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Advanced Thermal Management for Chips Market, By Chip Type

  • 5.1 Introduction
  • 5.2 Microprocessors / CPUs
  • 5.3 GPUs
  • 5.4 ASICs
  • 5.5 SoCs
  • 5.6 Memory Chips
  • 5.7 Power ICs
  • 5.8 Other Chip Types

6 Global Advanced Thermal Management for Chips Market, By Material Type

  • 6.1 Introduction
  • 6.2 Metal-based Materials
  • 6.3 Polymer-based Materials
  • 6.4 Ceramic-based Materials
  • 6.5 Composite Materials
  • 6.6 Graphene & Advanced Materials

7 Global Advanced Thermal Management for Chips Market, By Thermal Technique

  • 7.1 Introduction
  • 7.2 Air Cooling
  • 7.3 Liquid Cooling
  • 7.4 Thermoelectric Cooling
  • 7.5 Microchannel / Spray Cooling
  • 7.6 Immersion Cooling

8 Global Advanced Thermal Management for Chips Market, By Technology

  • 8.1 Introduction
  • 8.2 Passive Thermal Management
    • 8.2.1 Heat Sinks
    • 8.2.2 Thermal Pads
    • 8.2.3 Thermal Interface Materials (TIMs)
    • 8.2.4 Phase-Change Materials
    • 8.2.5 Thermal Adhesives
  • 8.3 Active Thermal Management
    • 8.3.1 Fans & Blowers
    • 8.3.2 Liquid Cooling Systems
    • 8.3.3 Peltier Devices / Thermoelectric Coolers
    • 8.3.4 Heat Pipes & Vapor Chambers
    • 8.3.5 Cryogenic Cooling Systems
  • 8.4 Hybrid Thermal Solutions
  • 8.5 Software & Control Systems
  • 8.6 Emerging Technologies

9 Global Advanced Thermal Management for Chips Market, By End User

  • 9.1 Introduction
  • 9.2 Consumer Electronics
  • 9.3 Automotive (incl. EVs)
  • 9.4 Data Centers & HPC
  • 9.5 Telecommunications & 5G Equipment
  • 9.6 Industrial & Automation
  • 9.7 Aerospace & Defense
  • 9.8 Healthcare & Medical Devices
  • 9.9 IoT & Smart Devices

10 Global Advanced Thermal Management for Chips Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Honeywell International Inc.
  • 12.2 Vertiv Group Corp.
  • 12.3 Henkel AG & Co. KGaA
  • 12.4 Rogers Corporation
  • 12.5 3M Company
  • 12.6 CoolIT Systems Inc.
  • 12.7 Advanced Cooling Technologies, Inc.
  • 12.8 Wakefield-Vette, Inc.
  • 12.9 Boyd Corporation
  • 12.10 CUI Devices
  • 12.11 Laird Thermal Systems
  • 12.12 Parker Hannifin Corporation
  • 12.13 Fujipoly America Corporation
  • 12.14 TE Connectivity Ltd.
  • 12.15 Delta Electronics, Inc.

List of Tables

  • Table 1 Global Advanced Thermal Management for Chips Market Outlook, By Region (2026-2034) ($MN)
  • Table 2 Global Advanced Thermal Management for Chips Market Outlook, By Chip Type (2026-2034) ($MN)
  • Table 3 Global Advanced Thermal Management for Chips Market Outlook, By Microprocessors / CPUs (2026-2034) ($MN)
  • Table 4 Global Advanced Thermal Management for Chips Market Outlook, By GPUs (2026-2034) ($MN)
  • Table 5 Global Advanced Thermal Management for Chips Market Outlook, By ASICs (2026-2034) ($MN)
  • Table 6 Global Advanced Thermal Management for Chips Market Outlook, By SoCs (2026-2034) ($MN)
  • Table 7 Global Advanced Thermal Management for Chips Market Outlook, By Memory Chips (2026-2034) ($MN)
  • Table 8 Global Advanced Thermal Management for Chips Market Outlook, By Power ICs (2026-2034) ($MN)
  • Table 9 Global Advanced Thermal Management for Chips Market Outlook, By Other Chip Types (2026-2034) ($MN)
  • Table 10 Global Advanced Thermal Management for Chips Market Outlook, By Material Type (2026-2034) ($MN)
  • Table 11 Global Advanced Thermal Management for Chips Market Outlook, By Metal-based Materials (2026-2034) ($MN)
  • Table 12 Global Advanced Thermal Management for Chips Market Outlook, By Polymer-based Materials (2026-2034) ($MN)
  • Table 13 Global Advanced Thermal Management for Chips Market Outlook, By Ceramic-based Materials (2026-2034) ($MN)
  • Table 14 Global Advanced Thermal Management for Chips Market Outlook, By Composite Materials (2026-2034) ($MN)
  • Table 15 Global Advanced Thermal Management for Chips Market Outlook, By Graphene & Advanced Materials (2026-2034) ($MN)
  • Table 16 Global Advanced Thermal Management for Chips Market Outlook, By Thermal Technique (2026-2034) ($MN)
  • Table 17 Global Advanced Thermal Management for Chips Market Outlook, By Air Cooling (2026-2034) ($MN)
  • Table 18 Global Advanced Thermal Management for Chips Market Outlook, By Liquid Cooling (2026-2034) ($MN)
  • Table 19 Global Advanced Thermal Management for Chips Market Outlook, By Thermoelectric Cooling (2026-2034) ($MN)
  • Table 20 Global Advanced Thermal Management for Chips Market Outlook, By Microchannel / Spray Cooling (2026-2034) ($MN)
  • Table 21 Global Advanced Thermal Management for Chips Market Outlook, By Immersion Cooling (2026-2034) ($MN)
  • Table 22 Global Advanced Thermal Management for Chips Market Outlook, By Technology (2026-2034) ($MN)
  • Table 23 Global Advanced Thermal Management for Chips Market Outlook, By Passive Thermal Management (2026-2034) ($MN)
  • Table 24 Global Advanced Thermal Management for Chips Market Outlook, By Heat Sinks (2026-2034) ($MN)
  • Table 25 Global Advanced Thermal Management for Chips Market Outlook, By Thermal Pads (2026-2034) ($MN)
  • Table 26 Global Advanced Thermal Management for Chips Market Outlook, By Thermal Interface Materials (TIMs) (2026-2034) ($MN)
  • Table 27 Global Advanced Thermal Management for Chips Market Outlook, By Phase-Change Materials (2026-2034) ($MN)
  • Table 28 Global Advanced Thermal Management for Chips Market Outlook, By Thermal Adhesives (2026-2034) ($MN)
  • Table 29 Global Advanced Thermal Management for Chips Market Outlook, By Active Thermal Management (2026-2034) ($MN)
  • Table 30 Global Advanced Thermal Management for Chips Market Outlook, By Fans & Blowers (2026-2034) ($MN)
  • Table 31 Global Advanced Thermal Management for Chips Market Outlook, By Liquid Cooling Systems (2026-2034) ($MN)
  • Table 32 Global Advanced Thermal Management for Chips Market Outlook, By Peltier Devices / Thermoelectric Coolers (2026-2034) ($MN)
  • Table 33 Global Advanced Thermal Management for Chips Market Outlook, By Heat Pipes & Vapor Chambers (2026-2034) ($MN)
  • Table 34 Global Advanced Thermal Management for Chips Market Outlook, By Cryogenic Cooling Systems (2026-2034) ($MN)
  • Table 35 Global Advanced Thermal Management for Chips Market Outlook, By Hybrid Thermal Solutions (2026-2034) ($MN)
  • Table 36 Global Advanced Thermal Management for Chips Market Outlook, By Software & Control Systems (2026-2034) ($MN)
  • Table 37 Global Advanced Thermal Management for Chips Market Outlook, By Emerging Technologies (2026-2034) ($MN)
  • Table 38 Global Advanced Thermal Management for Chips Market Outlook, By End User (2026-2034) ($MN)
  • Table 39 Global Advanced Thermal Management for Chips Market Outlook, By Consumer Electronics (2026-2034) ($MN)
  • Table 40 Global Advanced Thermal Management for Chips Market Outlook, By Automotive (incl. EVs) (2026-2034) ($MN)
  • Table 41 Global Advanced Thermal Management for Chips Market Outlook, By Data Centers & HPC (2026-2034) ($MN)
  • Table 42 Global Advanced Thermal Management for Chips Market Outlook, By Telecommunications & 5G Equipment (2026-2034) ($MN)
  • Table 43 Global Advanced Thermal Management for Chips Market Outlook, By Industrial & Automation (2026-2034) ($MN)
  • Table 44 Global Advanced Thermal Management for Chips Market Outlook, By Aerospace & Defense (2026-2034) ($MN)
  • Table 45 Global Advanced Thermal Management for Chips Market Outlook, By Healthcare & Medical Devices (2026-2034) ($MN)
  • Table 46 Global Advanced Thermal Management for Chips Market Outlook, By IoT & Smart Devices (2026-2034) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.