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1916797

導熱界面材料市場預測至2032年：按產品類型、填充材、導熱係數、應用和地區分類的全球分析

Thermally Conductive Interface Materials Market Forecasts to 2032 - Global Analysis By Product Type, Filler Material, Thermal Conductivity, Application, and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的一項研究，預計到 2025 年，全球導熱界面材料市場價值將達到 46 億美元，到 2032 年將達到 103 億美元。

預計在預測期內，該市場將以12.3%的複合年成長率成長。導熱界面材料包括化合物、墊片、膠帶、凝膠等，它們能夠提高電子元件與冷卻系統之間的熱傳遞效率。這些材料廣泛應用於家用電子電器、電動汽車電池、電力電子產品和通訊設備等領域。推動這一成長的因素包括：裝置小型化程度的不斷提高、電子產品性能的不斷增強、電動汽車的興起、5G的部署以及先進電子系統對高效溫度控管日益成長的需求。

根據 ASTM 標準和材料科學文獻，導熱界面材料的導熱係數為 1 至 15 W/m·K 或更高，這在電子設備和電力系統中極為重要。

電子設備功率密度的增加和小型化會導致發熱量增加。

隨著智慧型手機、穿戴式裝置和伺服器處理器等設備尺寸的不斷縮小，這些組件內部的功率密度卻急劇增加，導致局部熱通量顯著升高。這種現象使得使用先進的導熱界面材料（TIM）來彌合熱源和冷卻方案之間的熱差距變得特別必要。此外，積體電路日益複雜，也使得傳統的冷卻方法難以滿足需求。因此，各行各業對高效材料的需求持續成長。

高導熱性先進熱界面材料高成本。

液態金屬、特殊相變材料和碳基複合材料等尖端材料通常需要昂貴的原料和複雜的製造流程。此外，精確分配和應用這些材料所需的專用設備也增加了原始設備製造商 (OEM) 的整體擁有成本。這種經濟負擔迫使對價格敏感的細分市場的製造商選擇性能較差的傳統替代方案。

開發新型高性能填料

對氮化硼、氮化鋁和石墨烯基填料的研究正在推動新型導熱界面材料（TIM）的開發，這些材料在提供卓越導熱性能的同時，仍能保持良好的電絕緣性。這些新型填料能夠製造出符合新興技術（例如5G基地台和電動車逆變器）嚴苛要求的複合材料。此外，結合不同顆粒形狀的混合填料的開發有助於最佳化導熱路徑。這些進展也使製造商能夠為特定的先進溫度控管應用打造客製化解決方案。

設計轉型為整合式冷卻解決方案

設計理念向整合冷卻方向轉變，例如將微流體通道直接嵌入半導體封裝或採用先進的浸沒式冷卻技術，可望減少對傳統分離式介面材料的依賴。這些系統級冷卻策略旨在徹底消除與多種材料界面相關的熱阻。此外，隨著晶片製造商向3D IC堆疊技術發展，內部散熱需求可能會優先考慮結構改進而非表面塗覆型導熱界面材料（TIM）。另外，主動冷卻技術效率的提升可能會限制標準TIM產品的銷售成長。

新冠疫情的感染疾病：

新冠疫情初期擾亂了全球供應鏈，導致製造業暫時停工，原料經銷也出現延誤。然而，隨後遠端辦公和數位轉型的激增加速了對筆記型電腦、資料中心基礎設施和通訊設備的需求。這一轉變在很大程度上抵消了疫情初期的下滑，因為對電腦硬體強大溫度控管的需求成為重中之重。此外，疫情後的復甦也促使人們重新關注彈性供應鏈和國內製造業。疫情也凸顯了導熱界面材料（TIM）在診斷和醫療用電子設備領域的重要性。

預計在預測期內，潤滑脂和膏狀物細分市場將佔據最大的市場佔有率。

預計在預測期內，潤滑脂和膏狀產品將佔據最大的市場佔有率。這項優勢主要歸功於其多功能性以及對不規則表面的黏附能力，從而確保最大的接觸面積和最小的熱阻。這些材料經濟高效，廣泛應用於家用電子電器和汽車組裝等大規模生產領域。此外，矽酮和非矽酮配方的進步提高了其長期穩定性，並使其更易於在自動化塗覆系統中應用。同時，其可返工性也使其成為注重可維護性和可修復性的製造商的首選。

預計高導電性細分市場在預測期內將呈現最高的複合年成長率。

預計在預測期內，高導熱材料領域將呈現最高的成長率。這一趨勢主要受5G和電動車日益成長的需求驅動，因為標準材料往往無法提供足夠的散熱性能。隨著功率模組和通訊晶片的動作溫度不斷升高，對導熱係數高於5 W/m·K的材料的需求也隨之激增。此外，液態金屬和奈米碳管導熱界面材料（TIM）在高效能運算（HPC）產業的應用也日益廣泛。

佔比最大的地區：

預計亞太地區將在預測期內佔據最大的市場佔有率。中國、台灣、日本和韓國等國家和地區大規模的電子製造業生態系統鞏固了這一地位。該地區是全球智慧型手機、半導體和汽車製造中心，對導熱介面材料的需求持續強勁。此外，政府的利好政策和對5G基礎設施的大量投資也推動了區域市場的成長。

年複合成長率最高的地區：

預計亞太地區在預測期內將實現最高的複合年成長率。中國電動車市場的快速擴張和印度工業自動化產業的蓬勃發展是推動這一加速成長的主要因素。隨著這些國家向高科技製造業轉型，先進溫度控管解決方案的應用呈指數級成長。此外，不斷壯大的中產階級及其對先進家用電器的需求也推動了市場發展。

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目錄

第1章執行摘要

第2章 前言

  • 概括
  • 相關利益者
  • 調查範圍
  • 調查方法
  • 研究材料

第3章 市場趨勢分析

  • 促進要素
  • 抑制因素
  • 機會
  • 威脅
  • 產品分析
  • 應用分析
  • 新興市場
  • 新冠疫情的感染疾病

第4章 波特五力分析

  • 供應商的議價能力
  • 買方的議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭對手之間的競爭

5. 全球導熱界面材料市場（依產品類型分類）

  • 油脂和膏體
  • 錄影帶和膠片
  • 縫隙填充物和墊片
  • 相變材料（PCM）
  • 液態間隙填充劑（LGP）和封裝
  • 金屬基導熱界面材料（TIM）
  • 產品類型

6. 全球導熱界面材料市場（依填充材）

  • 矽基
  • 不含矽
    • 烴
    • 環氧樹脂基

7. 全球導熱界面材料市場（依導熱係數分類）

  • 低導熱係數
  • 中等導熱係數
  • 高導熱性

8. 全球導熱界面材料市場（按應用分類）

  • 電腦和伺服器
  • 通訊及網路設備
  • 家用電子產品
  • 汽車電子
  • 醫療用電子設備
  • 工業機械和電力電子
  • LED照明和顯示器
  • 可再生能源系統
  • 航太/國防

9. 全球導熱界面材料市場（按地區分類）

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 亞太其他地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美國家
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲地區

第10章：重大進展

  • 協議、夥伴關係、合作和合資企業
  • 併購
  • 新產品發布
  • 業務拓展
  • 其他關鍵策略

第11章 企業概況

  • 3M Company
  • Henkel AG &Co. KGaA
  • Dow Inc.
  • Honeywell International Inc.
  • Indium Corporation
  • Parker-Hannifin Corporation
  • Momentive Performance Materials Inc.
  • DuPont de Nemours, Inc.
  • Shin-Etsu Chemical Co., Ltd.
  • Fujipoly America Corporation
  • Boyd Corporation
  • Wacker Chemie AG
Product Code: SMRC33372

According to Stratistics MRC, the Global Thermally Conductive Interface Materials Market is accounted for $4.6 billion in 2025 and is expected to reach $10.3 billion by 2032, growing at a CAGR of 12.3% during the forecast period. The thermally conductive interface materials consist of compounds, pads, tapes, and gels that help transfer heat better between electronic parts and cooling systems. It supports applications in consumer electronics, EV batteries, power electronics, and telecom equipment. The growth is fueled by smaller devices, more powerful electronics, the rise of electric vehicles, the rollout of 5G, and the increasing need for effective heat management in advanced electronic systems.

According to ASTM standards and materials science literature, thermally conductive interface materials have thermal conductivities ranging 1-15 W/m*K+, critical for electronics and power systems.

Market Dynamics:

Driver:

Increasing power density and miniaturization of electronics generating more heat

As devices like smartphones, wearables, and server processors shrink in size, the power density within these components increases significantly, leading to higher localized heat flux. This phenomenon necessitates the use of advanced TIMs to bridge the thermal gap between heat sources and cooling solutions. Furthermore, the rising complexity of integrated circuits means that traditional cooling methods are no longer sufficient on their own. Consequently, the demand for high-efficiency materials continues to grow across all sectors.

Restraint:

High cost of advanced TIMs with high thermal conductivity

Advanced materials, such as liquid metals, specialized phase-change materials, and carbon-based composites, often involve expensive raw materials and intricate manufacturing processes. Additionally, the specialized equipment required for the precise dispensing and application of these materials adds to the total cost of ownership for OEMs. This financial burden often forces manufacturers in price-sensitive segments to opt for lower-performing, traditional alternatives.

Opportunity:

Development of novel, high-performance fillers

Research into boron nitride, aluminum nitride, and graphene-based fillers is paving the way for TIMs that offer exceptional thermal conductivity without compromising electrical insulation. These novel fillers allow for the creation of composites that can meet the rigorous demands of emerging technologies like 5G base stations and electric vehicle inverters. Additionally, the development of hybrid fillers that combine different particle geometries helps in optimizing the thermal path. Furthermore, these advancements enable manufacturers to create tailored solutions for specific high-heat applications.

Threat:

Design shifts towards integrated cooling solutions

Design shifts toward integrated cooling, such as microfluidic channels embedded directly into semiconductor packaging or advanced immersion cooling, may reduce the traditional reliance on discrete interface materials. These system-level cooling strategies aim to eliminate the thermal resistance associated with multiple material interfaces entirely. Furthermore, as chip manufacturers move toward 3D IC stacking, the internal heat dissipation requirements might favor structural changes over topical TIM applications. Additionally, the increasing efficiency of active cooling technologies could potentially limit the volume growth of standard TIM products.

Covid-19 Impact:

The COVID-19 pandemic initially disrupted the global supply chain, leading to temporary manufacturing halts and logistical delays for raw materials. However, the subsequent surge in remote work and digital transformation accelerated the demand for laptops, data center infrastructure, and telecommunications equipment. This shift largely offset the initial downturn, as the need for robust thermal management in computing hardware became paramount. Furthermore, the recovery phase saw a renewed focus on resilient supply chains and domestic manufacturing. The pandemic also brought attention to how important TIMs are to diagnostic and medical electronics.

The greases & pastes segment is expected to be the largest during the forecast period

The greases & pastes segment is expected to account for the largest market share during the forecast period. This dominance is primarily attributed to their versatility and ability to conform to irregular surfaces, ensuring maximum contact and minimal thermal resistance. These materials are cost-effective and widely used in high-volume applications such as consumer electronics and automotive assemblies. Furthermore, advancements in silicone and non-silicone formulations have improved their long-term stability and ease of application via automated dispensing systems. Additionally, their ability to be reworked makes them a preferred choice for manufacturers focusing on maintenance and repairability.

The high conductivity segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the high conductivity segment is predicted to witness the highest growth rate. The escalating requirements of the 5G and electric vehicle sectors fuel this trend, as standard materials often fail to provide sufficient heat dissipation. As power modules and telecommunications chips reach higher operating temperatures, the demand for materials with conductivity levels exceeding 5 W/m.k is surging. Furthermore, the adoption of liquid metal and carbon-nanotube-based TIMs is gaining momentum in the high-performance computing (HPC) industry.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share. The presence of a massive electronics manufacturing ecosystem in countries like China, Taiwan, Japan, and South Korea solidifies this position. The region serves as the global hub for smartphone, semiconductor, and automotive production, creating a constant and high-volume demand for thermal interface materials. Furthermore, favorable government policies and significant investments in 5G infrastructure are bolstering the regional market.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR. The rapid expansion of the electric vehicle market in China and the burgeoning industrial automation sector in India are key drivers of this accelerated growth. As these nations transition toward high-tech manufacturing, the adoption of advanced thermal management solutions is increasing exponentially. Furthermore, the rising middle-class population and the subsequent demand for sophisticated consumer electronics are fueling market dynamism.

Key players in the market

Some of the key players in Thermally Conductive Interface Materials Market include 3M Company, Henkel AG & Co. KGaA, Dow Inc., Honeywell International Inc., Indium Corporation, Parker-Hannifin Corporation, Momentive Performance Materials Inc., DuPont de Nemours, Inc., Shin-Etsu Chemical Co., Ltd., Fujipoly America Corporation, Boyd Corporation, and Wacker Chemie AG.

Key Developments:

In December 2025, 3M introduced the Thermally Conductive Acrylic Interface Pad 5571, a UL94 V 0 listed, silicone free TIM designed for electronics cooling with improved conformability.

In December 2025, Indium launched m2TIM(TM) hybrid metal TIMs, combining liquid metal with solid solder preforms to deliver ultra reliable conductivity and eliminate pump out risks.

In November 2025, Boyd announced the sale of its Thermal business to Eaton for $9.5 billion, positioning its TIM portfolio under Eaton's power management expansion.

In October 2025, Henkel launched Loctite TCF 14001, 14.5 W/m K silicone liquid gap filler for AI data center optical transceivers, enabling robust heat management in 800G and 1.6T modules.

Product Types Covered:

  • Greases & Pastes
  • Tapes & Films
  • Gap Fillers & Pads
  • Phase Change Materials (PCMs)
  • Liquid Gap Fillers (LGPs) & Encapsulants
  • Metal-Based TIMs
  • Product Types

Filler Materials Covered:

  • Silicone-Based
  • Non-Silicone Based

Thermal Conductivities Covered:

  • Low Conductivity
  • Medium Conductivity
  • High Conductivity

Applications Covered:

  • Computers & Servers
  • Telecom & Networking Equipment
  • Consumer Electronics
  • Automotive Electronics
  • Medical Electronics
  • Industrial Machinery & Power Electronics
  • LED Lighting & Displays
  • Renewable Energy Systems
  • Aerospace & Defense

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Application Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Thermally Conductive Interface Materials Market, By Product Type

  • 5.1 Introduction
  • 5.2 Greases & Pastes
  • 5.3 Tapes & Films
  • 5.4 Gap Fillers & Pads
  • 5.5 Phase Change Materials (PCMs)
  • 5.6 Liquid Gap Fillers (LGPs) & Encapsulants
  • 5.7 Metal-Based TIMs
  • 5.8 Product Types

6 Global Thermally Conductive Interface Materials Market, By Filler Material

  • 6.1 Introduction
  • 6.2 Silicone-Based
  • 6.3 Non-Silicone Based
    • 6.3.1 Hydrocarbon-Based
    • 6.3.2 Epoxy-Based

7 Global Thermally Conductive Interface Materials Market, By Thermal Conductivity

  • 7.1 Introduction
  • 7.2 Low Conductivity
  • 7.3 Medium Conductivity
  • 7.4 High Conductivity

8 Global Thermally Conductive Interface Materials Market, By Application

  • 8.1 Introduction
  • 8.2 Computers & Servers
  • 8.3 Telecom & Networking Equipment
  • 8.4 Consumer Electronics
  • 8.5 Automotive Electronics
  • 8.6 Medical Electronics
  • 8.7 Industrial Machinery & Power Electronics
  • 8.8 LED Lighting & Displays
  • 8.9 Renewable Energy Systems
  • 8.10 Aerospace & Defense

9 Global Thermally Conductive Interface Materials Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 3M Company
  • 11.2 Henkel AG & Co. KGaA
  • 11.3 Dow Inc.
  • 11.4 Honeywell International Inc.
  • 11.5 Indium Corporation
  • 11.6 Parker-Hannifin Corporation
  • 11.7 Momentive Performance Materials Inc.
  • 11.8 DuPont de Nemours, Inc.
  • 11.9 Shin-Etsu Chemical Co., Ltd.
  • 11.10 Fujipoly America Corporation
  • 11.11 Boyd Corporation
  • 11.12 Wacker Chemie AG

List of Tables

  • Table 1 Global Thermally Conductive Interface Materials Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Thermally Conductive Interface Materials Market Outlook, By Product Type (2024-2032) ($MN)
  • Table 3 Global Thermally Conductive Interface Materials Market Outlook, By Greases & Pastes (2024-2032) ($MN)
  • Table 4 Global Thermally Conductive Interface Materials Market Outlook, By Tapes & Films (2024-2032) ($MN)
  • Table 5 Global Thermally Conductive Interface Materials Market Outlook, By Gap Fillers & Pads (2024-2032) ($MN)
  • Table 6 Global Thermally Conductive Interface Materials Market Outlook, By Phase Change Materials (2024-2032) ($MN)
  • Table 7 Global Thermally Conductive Interface Materials Market Outlook, By Liquid Gap Fillers & Encapsulants (2024-2032) ($MN)
  • Table 8 Global Thermally Conductive Interface Materials Market Outlook, By Metal-Based TIMs (2024-2032) ($MN)
  • Table 9 Global Thermally Conductive Interface Materials Market Outlook, By Filler Material (2024-2032) ($MN)
  • Table 10 Global Thermally Conductive Interface Materials Market Outlook, By Silicone-Based (2024-2032) ($MN)
  • Table 11 Global Thermally Conductive Interface Materials Market Outlook, By Non-Silicone Based (2024-2032) ($MN)
  • Table 12 Global Thermally Conductive Interface Materials Market Outlook, By Hydrocarbon-Based (2024-2032) ($MN)
  • Table 13 Global Thermally Conductive Interface Materials Market Outlook, By Epoxy-Based (2024-2032) ($MN)
  • Table 14 Global Thermally Conductive Interface Materials Market Outlook, By Thermal Conductivity (2024-2032) ($MN)
  • Table 15 Global Thermally Conductive Interface Materials Market Outlook, By Low Conductivity (2024-2032) ($MN)
  • Table 16 Global Thermally Conductive Interface Materials Market Outlook, By Medium Conductivity (2024-2032) ($MN)
  • Table 17 Global Thermally Conductive Interface Materials Market Outlook, By High Conductivity (2024-2032) ($MN)
  • Table 18 Global Thermally Conductive Interface Materials Market Outlook, By Application (2024-2032) ($MN)
  • Table 19 Global Thermally Conductive Interface Materials Market Outlook, By Computers & Servers (2024-2032) ($MN)
  • Table 20 Global Thermally Conductive Interface Materials Market Outlook, By Telecom Equipment (2024-2032) ($MN)
  • Table 21 Global Thermally Conductive Interface Materials Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 22 Global Thermally Conductive Interface Materials Market Outlook, By Automotive Electronics (2024-2032) ($MN)
  • Table 23 Global Thermally Conductive Interface Materials Market Outlook, By Medical Electronics (2024-2032) ($MN)
  • Table 24 Global Thermally Conductive Interface Materials Market Outlook, By Industrial Machinery (2024-2032) ($MN)
  • Table 25 Global Thermally Conductive Interface Materials Market Outlook, By LED Lighting (2024-2032) ($MN)
  • Table 26 Global Thermally Conductive Interface Materials Market Outlook, By Renewable Energy (2024-2032) ($MN)
  • Table 27 Global Thermally Conductive Interface Materials Market Outlook, By Aerospace & Defense (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.