查看購物車
  • English
  • Japanese
  • Korean
封面
市場調查報告書
商品編碼
1904595

印刷基板(PCB) 和先進封裝化學品市場預測至 2032 年：按化學品類型、封裝類型、製程、技術、最終用戶和地區分類的全球分析

PCB & Advanced Packaging Chemicals Market Forecasts to 2032 - Global Analysis By Chemical Type, Packaging Type, Process, Technology, End User, and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的一項研究，全球印刷電路基板(PCB) 和先進封裝化學品市場預計在 2025 年達到 332 億美元，預計到 2032 年將達到 510 億美元，在預測期內以 6.3% 的複合年成長率成長。

印刷基板(PCB) 和先進封裝化學品是印刷電路基板和半導體封裝製造過程中不可或缺的材料。這些材料包括光阻劑、蝕刻劑、電鍍化學品、阻焊劑、底部填充劑和封裝。這些化學品能夠實現電子設備的微型化、高密度互連和可靠性能。扇出型晶圓級封裝和 3D 堆疊等先進封裝解決方案依賴精確的化學配方來實現黏合、絕緣和溫度控管。這些特性確保了電氣完整性、機械穩定性和抵禦環境應力的能力。

高密度電子設備的微型化

市場的主要驅動力是高密度電子設備的微型化，而微型化又源自於消費者對更小、更快、更有效率的電子產品和運算系統的需求。先進的半導體和封裝技術需要精確的化學解決方案才能滿足性能和可靠性標準。穿戴式裝置、物聯網和高效能運算的日益普及正在加速對創新化學材料的需求。這些因素共同推動了專用PCB和封裝化學品在多個高科技產業的開發和應用。

嚴格的半導體級品質標準

市場成長受到半導體級品質標準的嚴格限制，這些標準對化學純度、均勻性和性能提出了嚴格的要求。遵守這些標準會增加製造的複雜性和營運成本。即使品質上出現輕微偏差，也可能導致產品故障和裝置可靠性降低。此外，認證和檢驗過程耗時資源彙整。這些監管和技術障礙減緩了市場普及速度，並給希望進入高度專業化的PCB和封裝化學品市場的中小型供應商帶來了挑戰。

人工智慧處理器先進封裝

由於高效散熱、高速互連和小尺寸封裝的需求，人工智慧處理器先進封裝領域蘊藏著巨大的機會。人工智慧、機器學習和資料中心應用的興起，催生了對尖端封裝解決方案的需求。化學品製造商和半導體公司的合作，推動了創新材料的研發。人們對3D封裝、晶片組和異構整合的日益關注，進一步拓展了市場潛力。這些趨勢為印刷電路基板（PCB）和先進封裝化學品領域的收入成長和技術進步提供了重要途徑。

化學品供應鏈中斷

化學品供應鏈中斷對市場構成威脅，可能影響生產計畫和原料供應。對特殊原料的依賴以及地緣政治不穩定可能導致成本上升和供應受限。價格波動和運輸延誤進一步加劇了營運風險。此外，替代材料和新型化學品的競爭可能導致市場佔有率下降。這些因素共同作用，為製造商和終端用戶帶來不確定性，威脅市場穩定，因此需要製定穩健的供應鏈策略，以降低印刷電路板和包裝化學品市場潛在的中斷風險​​。

新冠疫情的感染疾病

新冠疫情擾亂了印刷電路基板(PCB) 和先進封裝化學品的全球供應鏈、生產營運和物流。生產停擺影響了半導體製造，並導致關鍵材料的交付延遲。然而，遠距辦公、資料中心和消費性電子產品需求的成長加速了高密度、高效能封裝解決方案的普及。各國政府和產業相關人員已實施了供應鏈多元化和在地化生產等復甦措施。整體而言，儘管短期內遭遇挫折，但疫情凸顯了電子製造業中韌性化學品供應鏈的重要性。

預計在預測期內，光阻劑細分市場將佔據最大的市場佔有率。

由於光刻製程對半導體和印刷基板製造至關重要，光阻劑預計將在預測期內佔據最大的市場佔有率。光阻劑具有高精度、高解析度和化學穩定性等優點，是晶圓和基板上精細微影術製作的關鍵材料。對小型化裝置和高密度電路日益成長的需求進一步推動了光阻的應用。光阻抗蝕劑的不斷改進，包括深紫外線 (DUV) 和極紫外線 (EUV) 版本，正在不斷提升其性能。這些因素鞏固了光阻在印刷電路基板(PCB) 和先進封裝化學品市場的領先地位。

預計在預測期內，表面黏著技術（SMT）細分市場將呈現最高的複合年成長率。

預計在預測期內，表面黏著技術(SMT) 領域將實現最高成長率，這主要得益於自動化組裝、緊湊型設計和高速電子產品需求的不斷成長。 SMT 化學品能夠實現元件貼裝所需的精確可靠的焊接、助焊和黏合製程。家電、汽車電子和工業自動化領域需求的成長將推動該領域的發展。 SMT 材料的技術進步，包括無鉛和環保材料的出現，將提升其性能。因此，該領域已成為印刷電路基板(PCB) 和先進封裝化學品領域內的一個高成長領域。

比最大的地區

由於半導體製造、印刷基板製造和電子組裝基地集中在中國、日本、韓國和台灣地區，預計亞太地區將在預測期內佔據最大的市場佔有率。家用電器、物聯網設備和工業自動化的日益普及正在推動對化學品的需求。完善的供應鏈和研發投入正在增強該地區的競爭力。政府支持半導體和電子產品生產的舉措進一步鞏固了亞太地區的市場領導地位，使其成為印刷電路基板(PCB) 和先進封裝化學品領域的關鍵區域。

複合年均成長率最高的地區

在預測期內，由於人工智慧處理器、高效能運算和先進電子設備的日益普及，北美地區預計將實現最高的複合年成長率。對半導體研發、封裝創新和本地化學品生產的投資將推動市場成長。科技公司、化學品製造商和研究機構之間的緊密合作將為創新封裝解決方案提供支援。資料中心、電動車和航太電子產品需求的成長將進一步推動市場擴張。這些因素使北美成為印刷電路基板(PCB) 和先進封裝化學品領域快速成長且潛力巨大的市場。

免費客製化服務

購買此報告的客戶可享有以下免費自訂選項之一：

  • 公司概況
    • 最多三家新增市場參與企業進行全面分析
    • 主要企業SWOT分析（最多3家公司）
  • 區域細分
    • 根據客戶要求，對主要國家進行市場估算和預測，並計算複合年成長率（註：可行性需確認）。
  • 競爭標竿分析
    • 從產品系列、地域覆蓋範圍和策略聯盟等方面對主要參與企業進行基準分析

目錄

第1章執行摘要

第2章 前言

  • 摘要
  • 相關利益者
  • 調查範圍
  • 調查方法
  • 研究材料

第3章 市場趨勢分析

  • 促進要素
  • 抑制因素
  • 機會
  • 威脅
  • 技術分析
  • 終端用戶分析
  • 新興市場
  • 新冠疫情的感染疾病

第4章 波特五力分析

  • 供應商的議價能力
  • 買方的議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭對手之間的競爭

5. 全球印刷電路基板(PCB) 與先進封裝化學品市場（依化學品類型分類）

  • 光阻劑
  • 電鍍化學品
  • 蝕刻化學品
  • 阻焊劑化學品
  • 清潔和剝離化學品
  • 介電和絕緣材料

6. 全球印刷電路基板(PCB) 與先進封裝化學品市場（依封裝類型分類）

  • 表面黏著技術（SMT）
  • 通孔技術
  • 覆晶構裝
  • 晶片級封裝（CSP）
  • 系統級封裝（SiP）
  • 3D IC封裝

7. 全球印刷電路基板(PCB) 與先進封裝化學品市場（依製程分類）

  • 成像和圖形化
  • 電鍍/沉積
  • 蝕刻清洗
  • 表面處理
  • 封裝/保護

8. 全球印刷電路基板(PCB) 與先進封裝化學品市場（依技術分類）

  • 傳統包裝
  • 先進包裝
  • 扇出包裝
  • 異質整合

9. 全球印刷電路基板(PCB) 和先進封裝化學品市場（依最終用戶分類）

  • 電子製造服務 (EMS)
  • 半導體晶圓代工廠
  • OEM
  • OEM
  • 航太/國防
  • 醫療設備製造商

10. 全球印刷電路基板(PCB) 和先進封裝化學品市場（按地區分類）

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 亞太其他地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美國家
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲地區

第11章 重大進展

  • 協議、夥伴關係、合作和合資企業
  • 併購
  • 新產品發布
  • 業務拓展
  • 其他關鍵策略

第12章 企業概況

  • DuPont de Nemours, Inc.
  • BASF SE
  • Dow Inc.
  • Atotech（MKS Instruments）
  • MacDermid Alpha Electronics Solutions
  • Entegris, Inc.
  • JCU Corporation
  • Hitachi Chemical（Showa Denko）
  • Rohm and Haas Electronic Materials
  • Mitsubishi Chemical Group
  • Shin-Etsu Chemical Co., Ltd.
  • JSR Corporation
  • TOKYO OHKA KOGYO CO., LTD.
  • AGC Inc.
  • Merck KGaA
  • Sumitomo Bakelite Co., Ltd.
  • Henkel AG & Co. KGaA
  • Kanto Chemical Co., Inc.
Product Code: SMRC33061

According to Stratistics MRC, the Global PCB & Advanced Packaging Chemicals Market is accounted for $33.2 billion in 2025 and is expected to reach $51.0 billion by 2032 growing at a CAGR of 6.3% during the forecast period. PCB & Advanced Packaging Chemicals are materials essential for fabricating printed circuit boards and semiconductor packaging. They include photoresists, etchants, plating chemicals, solder masks, underfills, and encapsulants. These chemicals enable miniaturization, high-density interconnects, and reliable performance in electronics. Advanced packaging solutions, such as fan-out wafer-level and 3D stacking, rely on precise chemical formulations for adhesion, insulation, and thermal management. They ensure electrical integrity, mechanical stability, and protection against environmental stresses.

Market Dynamics:

Driver:

Miniaturization of high-density electronic devices

The market is primarily driven by the miniaturization of high-density electronic devices, fueled by the demand for smaller, faster, and more efficient consumer electronics and computing systems. Advanced semiconductor and packaging technologies require precise chemical solutions to meet performance and reliability standards. Increasing adoption of wearable devices, IoT, and high-performance computing accelerates the need for innovative chemical materials. These factors collectively propel the development and integration of specialized PCB and packaging chemicals across multiple high-tech industries.

Restraint:

Stringent semiconductor-grade quality standards

Market growth is restrained by stringent semiconductor-grade quality standards, which impose rigorous requirements on chemical purity, consistency, and performance. Compliance with these standards increases manufacturing complexity and operational costs. Any deviation in quality can result in product failure or reduced device reliability. Furthermore, certification and testing processes are time-consuming and resource-intensive. These regulatory and technical barriers slow adoption rates and pose challenges for smaller suppliers seeking entry into the highly specialized PCB and packaging chemicals market.

Opportunity:

Advanced packaging for AI processors

Opportunities exist in advanced packaging for AI processors, driven by the need for efficient heat dissipation, high-speed interconnects, and miniaturized form factors. Increasing AI, machine learning, and data center applications create demand for cutting-edge packaging solutions. Collaborations between chemical manufacturers and semiconductor companies enable innovative materials development. Growing interest in 3D packaging, chiplets, and heterogeneous integration further expands the market potential. These trends offer significant avenues for revenue growth and technological advancement within the PCB and advanced packaging chemicals sector.

Threat:

Supply chain disruptions in chemicals

The market faces threats from supply chain disruptions in chemicals, which can affect production schedules and material availability. Dependence on specialized raw materials and geopolitical instability can increase costs and limit access. Fluctuating prices and transportation delays exacerbate operational risks. Additionally, competition from alternative materials or new chemical innovations could reduce market share. These factors collectively create uncertainty for manufacturers and end users, challenging market stability and necessitating robust supply chain strategies to mitigate potential disruptions in the PCB and packaging chemicals market.

Covid-19 Impact:

The Covid-19 pandemic disrupted global supply chains, manufacturing operations, and logistics for PCB and advanced packaging chemicals. Production halts affected semiconductor fabrication and delayed deliveries of critical materials. However, rising demand for remote work, data centers, and consumer electronics accelerated the adoption of high-density and high-performance packaging solutions. Governments and industry players implemented recovery measures, such as supply chain diversification and localized production. Overall, while short-term setbacks occurred, the pandemic highlighted the critical importance of resilient chemical supply chains for electronics manufacturing.

The photoresists segment is expected to be the largest during the forecast period

The photoresists segment is expected to account for the largest market share during the forecast period, resulting from widespread usage in photolithography processes essential for semiconductor and PCB fabrication. High precision, resolution, and chemical stability make photoresists critical for producing fine patterns on wafers and substrates. Rising demand for miniaturized devices and high-density circuits further strengthens adoption. Continuous advancements in resist formulations, including deep ultraviolet (DUV) and extreme ultraviolet (EUV) variants, enhance performance. These factors reinforce the segment's dominant position within the PCB and advanced packaging chemicals market.

The surface mount technology (SMT) segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the surface mount technology (SMT) segment is predicted to witness the highest growth rate, propelled by growing adoption of automated assembly, compact designs, and high-speed electronics. SMT chemicals facilitate soldering, fluxing, and adhesion processes for precise, reliable component placement. Increasing demand from consumer electronics, automotive electronics, and industrial automation drives segment growth. Technological advancements in SMT materials, including lead-free and environmentally friendly options, enhance performance. Consequently, this segment emerges as a high-growth area within PCB and advanced packaging chemicals.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, attributed to the concentration of semiconductor fabrication, PCB manufacturing, and electronics assembly hubs in China, Japan, South Korea, and Taiwan. High adoption of consumer electronics, IoT devices, and industrial automation fuels chemical demand. Well-established supply chains and investments in R&D enhance regional capabilities. Government initiatives supporting semiconductor and electronics production further consolidate Asia Pacific's market leadership, making it the dominant region for PCB and advanced packaging chemicals.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR associated with growing adoption of AI processors, high-performance computing, and advanced electronics. Investments in semiconductor R&D, packaging innovations, and localized chemical production accelerate market growth. Strong collaboration between technology firms, chemical manufacturers, and research institutions supports innovative packaging solutions. Rising demand for data centers, electric vehicles, and aerospace electronics further drives expansion. These factors position North America as a rapidly growing market with significant potential in PCB and advanced packaging chemicals.

Key players in the market

Some of the key players in PCB & Advanced Packaging Chemicals Market include DuPont de Nemours, Inc., BASF SE, Dow Inc., Atotech (MKS Instruments), MacDermid Alpha Electronics Solutions, Entegris, Inc., JCU Corporation, Hitachi Chemical (Showa Denko), Rohm and Haas Electronic Materials, Mitsubishi Chemical Group, Shin-Etsu Chemical Co., Ltd., JSR Corporation, TOKYO OHKA KOGYO CO., LTD., AGC Inc., Merck KGaA, Sumitomo Bakelite Co., Ltd., Henkel AG & Co. KGaA, and Kanto Chemical Co., Inc.

Key Developments:

In November 2025, Rohm and Haas Electronic Materials unveiled advanced photoresists and etchants for semiconductor packaging. The company emphasized precision, durability, and sustainability, reinforcing its leadership in advanced packaging chemicals.

In October 2025, Hitachi Chemical (Showa Denko) launched new encapsulants and dielectric materials for advanced packaging. The company emphasized durability, sustainability, and innovation, strengthening its role in PCB and semiconductor chemicals.

In February 2025, JSR Corporation unveiled new photoresists and lithography materials for advanced packaging. The company emphasized precision, durability, and sustainability, strengthening its role in PCB and semiconductor chemicals.

Chemical Types Covered:

  • Photoresists
  • Electroplating Chemicals
  • Etching Chemicals
  • Solder Mask Chemicals
  • Cleaning & Stripping Chemicals
  • Dielectric & Insulating Materials

Packaging Types Covered:

  • Surface Mount Technology (SMT)
  • Through-Hole Technology
  • Flip Chip Packaging
  • Chip Scale Packaging (CSP)
  • System-in-Package (SiP)
  • 3D IC Packaging

Processes Covered:

  • Imaging & Patterning
  • Plating & Deposition
  • Etching & Cleaning
  • Surface Finishing
  • Encapsulation & Protection

Technologies Covered:

  • Conventional Packaging
  • Advanced Packaging
  • Fan-Out Packaging
  • Heterogeneous Integration

End Users Covered:

  • Electronics Manufacturing Services (EMS)
  • Semiconductor Foundries
  • Original Equipment Manufacturers (OEMs)
  • Automotive Manufacturers
  • Aerospace & Defense
  • Healthcare Device Manufacturers

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global PCB & Advanced Packaging Chemicals Market, By Chemical Type

  • 5.1 Introduction
  • 5.2 Photoresists
  • 5.3 Electroplating Chemicals
  • 5.4 Etching Chemicals
  • 5.5 Solder Mask Chemicals
  • 5.6 Cleaning & Stripping Chemicals
  • 5.7 Dielectric & Insulating Materials

6 Global PCB & Advanced Packaging Chemicals Market, By Packaging Type

  • 6.1 Introduction
  • 6.2 Surface Mount Technology (SMT)
  • 6.3 Through-Hole Technology
  • 6.4 Flip Chip Packaging
  • 6.5 Chip Scale Packaging (CSP)
  • 6.6 System-in-Package (SiP)
  • 6.7 3D IC Packaging

7 Global PCB & Advanced Packaging Chemicals Market, By Process

  • 7.1 Introduction
  • 7.2 Imaging & Patterning
  • 7.3 Plating & Deposition
  • 7.4 Etching & Cleaning
  • 7.5 Surface Finishing
  • 7.6 Encapsulation & Protection

8 Global PCB & Advanced Packaging Chemicals Market, By Technology

  • 8.1 Introduction
  • 8.2 Conventional Packaging
  • 8.3 Advanced Packaging
  • 8.4 Fan-Out Packaging
  • 8.5 Heterogeneous Integration

9 Global PCB & Advanced Packaging Chemicals Market, By End User

  • 9.1 Introduction
  • 9.2 Electronics Manufacturing Services (EMS)
  • 9.3 Semiconductor Foundries
  • 9.4 Original Equipment Manufacturers (OEMs)
  • 9.5 Automotive Manufacturers
  • 9.6 Aerospace & Defense
  • 9.7 Healthcare Device Manufacturers

10 Global PCB & Advanced Packaging Chemicals Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 DuPont de Nemours, Inc.
  • 12.2 BASF SE
  • 12.3 Dow Inc.
  • 12.4 Atotech (MKS Instruments)
  • 12.5 MacDermid Alpha Electronics Solutions
  • 12.6 Entegris, Inc.
  • 12.7 JCU Corporation
  • 12.8 Hitachi Chemical (Showa Denko)
  • 12.9 Rohm and Haas Electronic Materials
  • 12.10 Mitsubishi Chemical Group
  • 12.11 Shin-Etsu Chemical Co., Ltd.
  • 12.12 JSR Corporation
  • 12.13 TOKYO OHKA KOGYO CO., LTD.
  • 12.14 AGC Inc.
  • 12.15 Merck KGaA
  • 12.16 Sumitomo Bakelite Co., Ltd.
  • 12.17 Henkel AG & Co. KGaA
  • 12.18 Kanto Chemical Co., Inc.

List of Tables

  • Table 1 Global PCB & Advanced Packaging Chemicals Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global PCB & Advanced Packaging Chemicals Market Outlook, By Chemical Type (2024-2032) ($MN)
  • Table 3 Global PCB & Advanced Packaging Chemicals Market Outlook, By Photoresists (2024-2032) ($MN)
  • Table 4 Global PCB & Advanced Packaging Chemicals Market Outlook, By Electroplating Chemicals (2024-2032) ($MN)
  • Table 5 Global PCB & Advanced Packaging Chemicals Market Outlook, By Etching Chemicals (2024-2032) ($MN)
  • Table 6 Global PCB & Advanced Packaging Chemicals Market Outlook, By Solder Mask Chemicals (2024-2032) ($MN)
  • Table 7 Global PCB & Advanced Packaging Chemicals Market Outlook, By Cleaning & Stripping Chemicals (2024-2032) ($MN)
  • Table 8 Global PCB & Advanced Packaging Chemicals Market Outlook, By Dielectric & Insulating Materials (2024-2032) ($MN)
  • Table 9 Global PCB & Advanced Packaging Chemicals Market Outlook, By Packaging Type (2024-2032) ($MN)
  • Table 10 Global PCB & Advanced Packaging Chemicals Market Outlook, By Surface Mount Technology (SMT) (2024-2032) ($MN)
  • Table 11 Global PCB & Advanced Packaging Chemicals Market Outlook, By Through-Hole Technology (2024-2032) ($MN)
  • Table 12 Global PCB & Advanced Packaging Chemicals Market Outlook, By Flip Chip Packaging (2024-2032) ($MN)
  • Table 13 Global PCB & Advanced Packaging Chemicals Market Outlook, By Chip Scale Packaging (CSP) (2024-2032) ($MN)
  • Table 14 Global PCB & Advanced Packaging Chemicals Market Outlook, By System-in-Package (SiP) (2024-2032) ($MN)
  • Table 15 Global PCB & Advanced Packaging Chemicals Market Outlook, By 3D IC Packaging (2024-2032) ($MN)
  • Table 16 Global PCB & Advanced Packaging Chemicals Market Outlook, By Process (2024-2032) ($MN)
  • Table 17 Global PCB & Advanced Packaging Chemicals Market Outlook, By Imaging & Patterning (2024-2032) ($MN)
  • Table 18 Global PCB & Advanced Packaging Chemicals Market Outlook, By Plating & Deposition (2024-2032) ($MN)
  • Table 19 Global PCB & Advanced Packaging Chemicals Market Outlook, By Etching & Cleaning (2024-2032) ($MN)
  • Table 20 Global PCB & Advanced Packaging Chemicals Market Outlook, By Surface Finishing (2024-2032) ($MN)
  • Table 21 Global PCB & Advanced Packaging Chemicals Market Outlook, By Encapsulation & Protection (2024-2032) ($MN)
  • Table 22 Global PCB & Advanced Packaging Chemicals Market Outlook, By Technology (2024-2032) ($MN)
  • Table 23 Global PCB & Advanced Packaging Chemicals Market Outlook, By Conventional Packaging (2024-2032) ($MN)
  • Table 24 Global PCB & Advanced Packaging Chemicals Market Outlook, By Advanced Packaging (2024-2032) ($MN)
  • Table 25 Global PCB & Advanced Packaging Chemicals Market Outlook, By Fan-Out Packaging (2024-2032) ($MN)
  • Table 26 Global PCB & Advanced Packaging Chemicals Market Outlook, By Heterogeneous Integration (2024-2032) ($MN)
  • Table 27 Global PCB & Advanced Packaging Chemicals Market Outlook, By End User (2024-2032) ($MN)
  • Table 28 Global PCB & Advanced Packaging Chemicals Market Outlook, By Electronics Manufacturing Services (EMS) (2024-2032) ($MN)
  • Table 29 Global PCB & Advanced Packaging Chemicals Market Outlook, By Semiconductor Foundries (2024-2032) ($MN)
  • Table 30 Global PCB & Advanced Packaging Chemicals Market Outlook, By Original Equipment Manufacturers (OEMs) (2024-2032) ($MN)
  • Table 31 Global PCB & Advanced Packaging Chemicals Market Outlook, By Automotive Manufacturers (2024-2032) ($MN)
  • Table 32 Global PCB & Advanced Packaging Chemicals Market Outlook, By Aerospace & Defense (2024-2032) ($MN)
  • Table 33 Global PCB & Advanced Packaging Chemicals Market Outlook, By Healthcare Device Manufacturers (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.