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市場調查報告書
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1865397

全球專用積體電路 (ASIC) 市場：預測至 2032 年 - 按類型、設計方法、技術、封裝與測試、經營模式、最終用戶和地區進行分析

Application-Specific Integrated Circuits Market Forecasts to 2032 - Global Analysis By Type, Design Methodology, Technology, Packaging & Test, Business Model, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據，預計到 2025 年，全球 ASIC（專用積體電路）市場規模將達到 186 億美元，到 2032 年將達到 282 億美元，預測期內複合年成長率為 6.1%。

專用積體電路 (ASIC) 是一種為特定功能或應用而設計的客製化半導體晶片，具有最佳化的性能、能源效率和緊湊的外形規格。與通用處理器不同，ASIC 旨在以高精度和高速度執行預先定義的任務，因此非常適合通訊、汽車和家用電子電器等行業。其固定的架構提高了可靠性和吞吐量，但限制了靈活性。 ASIC 通常用於對特定功能要求極高的大量生產環境。

節能、高性能晶片的需求日益成長

隨著各行業向智慧基礎設施和物聯網生態系統轉型，對客製化、低延遲的晶片解決方案的需求日益成長。這些晶片旨在針對特定任務提供最佳化的效能，在提高處理速度的同時降低功耗。此外，由於專用積體電路 (ASIC) 在特定應用中優於通用處理器，因此在資料中心和人工智慧工作負載中越來越受歡迎。預計這一趨勢將持續推動對高性能專用晶片設計的長期需求。

設計複雜性與檢驗挑戰

與通用晶片不同，專用積體電路（ASIC）需要針對特定功能進行精確的架構設計，這增加了設計缺陷和延遲的風險。檢驗工具必須模擬各種場景以確保可靠性，從而增加了開發時間和成本。此外，缺乏跨行業的標準設計框架也使整合和擴充性變得更加複雜。滿足嚴格的性能標準和監管合規性要求進一步加劇了這些挑戰，這可能會限制中小企業進入市場。

量子運算、邊緣人工智慧和神經形態晶片的新興應用

量子運算領域正在探索利用專用積體電路（ASIC）來管理控制系統和糾錯通訊協定，從而最大限度地降低延遲。自動駕駛汽車和智慧監控系統等邊緣人工智慧應用需要低功耗的即時處理能力，這使得它們成為ASIC的理想應用場景。此外，模擬類腦架構的神經形態運算也依賴於客製化矽晶片來高效率地複製突觸行為。這些新興領域正在推動對高度專業化晶片的需求，並促進學術界和產業界之間的研發投資和策略合作。

地緣政治緊張局勢與出口限制

貿易限制、出口管制和外交衝突，尤其是在主要半導體生產國之間，可能會阻礙企業取得關鍵製造技術和原料。這些限制不僅會延誤生產進度，還會增加成本，進而影響盈利。此外，對智慧財產權和國家安全問題的監管力度加大，可能會限制跨國夥伴關係和技術轉移。這些風險正促使企業重新評估籌資策略，並投資於區域製造能力，以降低風險敞口。

新冠疫情的感染疾病：

新冠疫情擾亂了半導體供應鏈，導致多個產業出現晶片短缺和產品發布延遲。然而，這場危機也加速了數位轉型，提振了通訊、醫療診斷和雲端運算領域對專用積體電路（ASIC）的需求。封鎖措施和遠端辦公的普及增加了對資料中心和智慧型設備的依賴，而ASIC在最佳化效能方面發揮了關鍵作用。儘管初期生產瓶頸影響了收入，但隨著企業優先考慮彈性設計策略和供應商網路多元化，長期前景已有所改善。

預計在預測期內，可程式ASIC細分市場將佔據最大的市場佔有率。

由於可程式專用積體電路 (ASIC) 在原型製作和中等批量生產方面具有靈活性和成本效益，預計在預測期內，ASIC 細分市場將佔據最大的市場佔有率。其適應性使其適用於家用電子電器、工業自動化和無線通訊等領域不斷發展的應用。隨著可配置硬體（尤其是在邊緣運算和嵌入式系統領域）的需求不斷成長，可程式 ASIC 正成為尋求效能和擴充性之間平衡的製造商的首選。

預計在預測期內，軟硬體協同設計領域將呈現最高的複合年成長率。

由於系統級性能的提升、調試週期的縮短以及在人工智慧推理引擎和自主系統等複雜應用中加速部署等因素，預計硬體-軟體協同設計領域在預測期內將實現最高的成長率。整合系統日益成長的複雜性正在推動採用由先進模擬工具和協同開發平台支援的協同設計框架。隨著行業尋求縮短創新周期和提高功能效率，預計該領域將快速擴張。

佔比最大的地區：

亞太地區預計將在預測期內佔據最大的市場佔有率，這主要得益於其強大的半導體製造基礎設施和龐大的電子產品產量。中國、韓國、台灣和日本等國家和地區擁有許多大型晶圓代工廠和設計公司，從而實現了成本效益高的製造和創新。該地區在消費性電子、汽車和通訊領域的強大影響力進一步推動了對客製化晶片的需求。政府支持數位轉型和工業自動化的措施也促進了市場成長，使亞太地區成為全球ASIC晶片應用中心。

複合年成長率最高的地區：

預計亞太地區在預測期內將實現最高的複合年成長率，這主要得益於研發投入的增加和先進技術的日益普及。印度和越南等新興經濟體對智慧型設備、物聯網解決方案和人工智慧平台的需求激增，而這些都需要專用積體電路（ASIC）來實現高效處理。當地企業與全球半導體巨頭之間的策略合作正在推動創新和能力建設。

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目錄

第1章執行摘要

第2章 引言

  • 概述
  • 相關利益者
  • 分析範圍
  • 分析方法
    • 資料探勘
    • 數據分析
    • 數據檢驗
    • 分析方法
  • 分析材料
    • 原始研究資料
    • 二手研究資訊來源
    • 先決條件

第3章 市場趨勢分析

  • 介紹
  • 促進要素
  • 抑制因素
  • 市場機遇
  • 威脅
  • 終端用戶分析
  • 新興市場
  • 新冠疫情的感染疾病

第4章 波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代產品的威脅
  • 新參與企業的威脅
  • 公司間的競爭

第5章 全球專用積體電路 (ASIC) 市場（按類型分類）

  • 介紹
  • 完全客製化的ASIC晶片
  • 半客製化ASIC
  • 可程式專用積體電路
  • 基於閘陣列的專用積體電路
  • 標準單元型專用積體電路
  • 其他類型

6. 全球ASIC市場依設計方法分類

  • 介紹
  • RTL 到 GDSII 流
  • 以IP為中心的設計
  • 基於平台的設計
  • 硬體和軟體協同設計
  • 測試導向的設計（DFT）
  • 專為產量比率和可製造性而設計

7. 按技術節點分類的全球專用積體電路 (ASIC) 市場

  • 介紹
  • 先進製程（7nm及以下）
  • 主要製程（8-14nm）
  • 成熟節點（16-28nm）
  • 傳統製程節點（28-65nm）
  • 較舊的製程（65nm以上）

8. 全球專用積體電路 (ASIC) 市場（依封裝和測試分類）

  • 介紹
  • 傳統打線接合封裝
  • 先進封裝（2.5D、3D-IC、SiP）
  • 覆晶和BGA
  • 測試服務（晶圓探針測試、最終測試）
  • 老化測試和可靠性測試
  • 其他軟體包測試

9. 全球ASIC市場依經營模式

  • 介紹
  • 無晶圓廠ASIC公司
  • 整合裝置製造商（IDM）
  • 晶圓代工廠服務/客製化製造
  • 承包設計和智慧財產權授權模式
  • 設計服務和ASIC即服務
  • 其他經營模式

第10章：全球ASIC（專用積體電路）市場（依最終用戶分類）

  • 介紹
  • 通訊與網路
  • 資料中心和雲端基礎設施
  • 家用電器
  • 車
  • 工業自動化和物聯網
  • 醫療設備和藥品
  • 航太/國防
  • 安全與監控
  • 其他最終用戶

第11章：全球ASIC（專用積體電路）市場（按地區分類）

  • 介紹
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 亞太其他地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美洲
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲地區

第12章：主要趨勢

  • 合約、商業夥伴關係和合資企業
  • 企業合併（M&A）
  • 新產品發布
  • 業務拓展
  • 其他關鍵策略

第13章：企業概況

  • Broadcom Inc.
  • Qualcomm Incorporated
  • NVIDIA Corporation
  • Intel Corporation
  • Advanced Micro Devices（AMD）
  • Samsung Electronics
  • MediaTek Inc.
  • Marvell Technology Group
  • Xilinx（AMD）
  • Lattice Semiconductor
  • NXP Semiconductors
  • STMicroelectronics
  • Renesas Electronics
  • Infineon Technologies
  • Analog Devices
  • ON Semiconductor
  • Microchip Technology
  • Texas Instruments
  • Taiwan Semiconductor Manufacturing Company
Product Code: SMRC32095

According to Stratistics MRC, the Global Application-Specific Integrated Circuits Market is accounted for $18.6 billion in 2025 and is expected to reach $28.2 billion by 2032 growing at a CAGR of 6.1% during the forecast period. Application-Specific Integrated Circuits (ASICs) are custom-designed semiconductor chips tailored for a specific function or application, offering optimized performance, power efficiency, and compact form factor. Unlike general-purpose processors, ASICs are engineered to execute predefined tasks with high precision and speed, making them ideal for industries such as telecommunications, automotive, and consumer electronics. Their fixed architecture enhances reliability and throughput, though it limits flexibility. ASICs are commonly used in high-volume production environments where specialized functionality is critical.

Market Dynamics:

Driver:

Rising demand for energy-efficient and high-performance chips

As industries transition toward smart infrastructure and IoT ecosystems, the need for customized, low-latency silicon solutions is intensifying. These chips are engineered to deliver optimized performance for specific tasks, reducing power consumption while enhancing processing speed. Moreover, ASICs are increasingly preferred in data centers and AI workloads due to their ability to outperform general-purpose processors in targeted applications. This trend is expected to sustain long-term demand for high-performance, application-specific designs.

Restraint:

Design complexity and verification challenges

Unlike general-purpose chips, ASICs require precise architectural planning tailored to specific functions, which increases the risk of design flaws and delays. Verification tools must simulate a wide range of scenarios to ensure reliability, adding to development time and cost. Additionally, the lack of standardized design frameworks across industries complicates integration and scalability. These challenges are further amplified by the need to meet stringent performance benchmarks and regulatory compliance, which can deter smaller players from entering the market.

Opportunity:

Emerging applications in quantum computing, edge AI, and neuromorphic chips

In quantum computing, ASICs are being explored to manage control systems and error correction protocols with minimal latency. Edge AI applications, such as autonomous vehicles and smart surveillance, demand real-time processing with low power footprints-an ideal use case for ASICs. Furthermore, neuromorphic computing, which mimics brain-like architectures, relies on custom silicon to replicate synaptic behavior efficiently. These emerging domains are fostering demand for highly specialized chips, encouraging R&D investments and strategic collaborations across academia and industry.

Threat:

Geopolitical tensions and export restrictions

Trade restrictions, export controls, and diplomatic conflicts particularly between major chip-producing nations can hinder access to critical fabrication technologies and raw materials. Such constraints not only delay production timelines but also inflate costs, affecting profitability. Additionally, regulatory scrutiny over intellectual property and national security concerns may limit cross-border partnerships and technology transfers. These risks are prompting companies to reassess sourcing strategies and invest in regional manufacturing capabilities to mitigate exposure.

Covid-19 Impact:

The COVID-19 pandemic disrupted semiconductor supply chains, leading to chip shortages and delayed product launches across multiple industries. However, the crisis also accelerated digital transformation, boosting demand for ASICs in remote communication, healthcare diagnostics, and cloud computing. Lockdowns and remote work environments intensified reliance on data centers and smart devices, where ASICs play a pivotal role in optimizing performance. While initial production bottlenecks affected revenue streams, the long-term outlook improved as companies prioritized resilient design strategies and diversified supplier networks.

The programmable ASIC segment is expected to be the largest during the forecast period

The programmable ASIC segment is expected to account for the largest market share during the forecast period propelled by, their flexibility and cost-effectiveness in prototyping and mid-volume production. Their adaptability makes them suitable for evolving applications in consumer electronics, industrial automation, and wireless communication. As demand for configurable hardware grows, especially in edge computing and embedded systems, programmable ASICs are emerging as the preferred choice for manufacturers seeking balance between performance and scalability.

The hardware-software co-design segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the hardware-software co-design segment is predicted to witness the highest growth rate, influenced by, enhanced system-level performance, reduces debugging cycles, and accelerates deployment in complex applications such as AI inference engines and autonomous systems. The rising complexity of integrated systems is driving adoption of co-design frameworks, supported by advanced simulation tools and collaborative development platforms. As industries seek to shorten innovation cycles and improve functional efficiency, this segment is poised for rapid expansion.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, driven by robust semiconductor manufacturing infrastructure and high-volume electronics production. Countries like China, South Korea, Taiwan, and Japan are home to leading foundries and design houses, enabling cost-effective fabrication and innovation. The region's strong presence in consumer electronics, automotive, and telecom sectors further amplifies demand for customized chips. Government initiatives supporting digital transformation and industrial automation are also contributing to market growth, positioning Asia Pacific as the global hub for ASIC deployment.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR, attributed to, expanding R&D investments and increasing adoption of advanced technologies. Emerging economies such as India and Vietnam are witnessing a surge in demand for smart devices, IoT solutions, and AI-powered platforms, all of which rely on ASICs for efficient processing. Strategic partnerships between local firms and global semiconductor leaders are fostering innovation and capacity building.

Key players in the market

Some of the key players in Application-Specific Integrated Circuits Market include Broadcom Inc., Qualcomm Incorporated, NVIDIA Corporation, Intel Corporation, Advanced Micro Devices (AMD), Samsung Electronics, MediaTek Inc., Marvell Technology Group, Xilinx (AMD), Lattice Semiconductor, NXP Semiconductors, STMicroelectronics, Renesas Electronics, Infineon Technologies, Analog Devices, ON Semiconductor, Microchip Technology, Texas Instruments, and Taiwan Semiconductor Manufacturing Company.

Key Developments:

In October 2025, Qualcomm unveiled its AI200 and AI250 chips to compete with AMD and NVIDIA in server-grade AI workloads. These chips support liquid-cooled rack-scale systems for enterprise AI.

In October 2025, Intel unveiled Panther Lake, its first AI PC platform built on 18A process, targeting hybrid AI workloads. This marks a leap in consumer AI computing.

In January 2025, Qualcomm partnered with Samsung to launch the Galaxy S25 series powered by Snapdragon 8 Elite, optimized for Gemini AI experiences. This marks a strategic alignment in mobile AI performance.

Types Covered:

  • Full Custom ASIC
  • Semi-Custom ASIC
  • Programmable ASIC
  • Gate Array-Based ASIC
  • Standard Cell-Based ASIC
  • Other Types

Design Methodologies Covered:

  • RTL-to-GDSII Flow
  • IP-Centric Design
  • Platform-Based Design
  • Hardware-Software Co-Design
  • Design for Testability (DFT)
  • Design for Yield and Manufacturability

Technology Nodes Covered:

  • Advanced Nodes (<=7nm)
  • Leading Nodes (8-14nm)
  • Mature Nodes (16-28nm)
  • Legacy Nodes (28-65nm)
  • Older Nodes (>65nm)

Packaging & Tests Covered:

  • Traditional Wire-Bond Packaging
  • Advanced Packaging (2.5D, 3D-IC, SiP)
  • Flip-Chip & BGA
  • Test Services (Wafer Probe, Final Test)
  • Burn-in & Reliability Testing
  • Other Packaging & Tests

Business Models Covered:

  • Fabless ASIC Companies
  • Integrated Device Manufacturers (IDMs)
  • Foundry Services / Custom Manufactures
  • Turnkey Design & IP Licensing Models
  • Design Services & ASIC-as-a-Service
  • Other Business Models

End Users Covered:

  • Telecom & Networking
  • Data Center & Cloud Infrastructure
  • Consumer Electronics
  • Automotive
  • Industrial Automation & IoT
  • Medical Devices & Healthcare
  • Aerospace & Defense
  • Security & Surveillance
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 End User Analysis
  • 3.7 Emerging Markets
  • 3.8 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Application-Specific Integrated Circuits Market, By Type

  • 5.1 Introduction
  • 5.2 Full Custom ASIC
  • 5.3 Semi-Custom ASIC
  • 5.4 Programmable ASIC
  • 5.5 Gate Array-Based ASIC
  • 5.6 Standard Cell-Based ASIC
  • 5.7 Other Types

6 Global Application-Specific Integrated Circuits Market, By Design Methodology

  • 6.1 Introduction
  • 6.2 RTL-to-GDSII Flow
  • 6.3 IP-Centric Design
  • 6.4 Platform-Based Design
  • 6.5 Hardware-Software Co-Design
  • 6.6 Design for Testability (DFT)
  • 6.7 Design for Yield and Manufacturability

7 Global Application-Specific Integrated Circuits Market, By Technology Node

  • 7.1 Introduction
  • 7.2 Advanced Nodes (<=7nm)
  • 7.3 Leading Nodes (8-14nm)
  • 7.4 Mature Nodes (16-28nm)
  • 7.5 Legacy Nodes (28-65nm)
  • 7.6 Older Nodes (>65nm)

8 Global Application-Specific Integrated Circuits Market, By Packaging & Test

  • 8.1 Introduction
  • 8.2 Traditional Wire-Bond Packaging
  • 8.3 Advanced Packaging (2.5D, 3D-IC, SiP)
  • 8.4 Flip-Chip & BGA
  • 8.5 Test Services (Wafer Probe, Final Test)
  • 8.6 Burn-in & Reliability Testing
  • 8.7 Other Packaging & Tests

9 Global Application-Specific Integrated Circuits Market, By Business Model

  • 9.1 Introduction
  • 9.2 Fabless ASIC Companies
  • 9.3 Integrated Device Manufacturers (IDMs)
  • 9.4 Foundry Services / Custom Manufactures
  • 9.5 Turnkey Design & IP Licensing Models
  • 9.6 Design Services & ASIC-as-a-Service
  • 9.7 Other Business Models

10 Global Application-Specific Integrated Circuits Market, By End User

  • 10.1 Introduction
  • 10.2 Telecom & Networking
  • 10.3 Data Center & Cloud Infrastructure
  • 10.4 Consumer Electronics
  • 10.5 Automotive
  • 10.6 Industrial Automation & IoT
  • 10.7 Medical Devices & Healthcare
  • 10.8 Aerospace & Defense
  • 10.9 Security & Surveillance
  • 10.10 Other End Users

11 Global Application-Specific Integrated Circuits Market, By Geography

  • 11.1 Introduction
  • 11.2 North America
    • 11.2.1 US
    • 11.2.2 Canada
    • 11.2.3 Mexico
  • 11.3 Europe
    • 11.3.1 Germany
    • 11.3.2 UK
    • 11.3.3 Italy
    • 11.3.4 France
    • 11.3.5 Spain
    • 11.3.6 Rest of Europe
  • 11.4 Asia Pacific
    • 11.4.1 Japan
    • 11.4.2 China
    • 11.4.3 India
    • 11.4.4 Australia
    • 11.4.5 New Zealand
    • 11.4.6 South Korea
    • 11.4.7 Rest of Asia Pacific
  • 11.5 South America
    • 11.5.1 Argentina
    • 11.5.2 Brazil
    • 11.5.3 Chile
    • 11.5.4 Rest of South America
  • 11.6 Middle East & Africa
    • 11.6.1 Saudi Arabia
    • 11.6.2 UAE
    • 11.6.3 Qatar
    • 11.6.4 South Africa
    • 11.6.5 Rest of Middle East & Africa

12 Key Developments

  • 12.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 12.2 Acquisitions & Mergers
  • 12.3 New Product Launch
  • 12.4 Expansions
  • 12.5 Other Key Strategies

13 Company Profiling

  • 13.1 Broadcom Inc.
  • 13.2 Qualcomm Incorporated
  • 13.3 NVIDIA Corporation
  • 13.4 Intel Corporation
  • 13.5 Advanced Micro Devices (AMD)
  • 13.6 Samsung Electronics
  • 13.7 MediaTek Inc.
  • 13.8 Marvell Technology Group
  • 13.9 Xilinx (AMD)
  • 13.10 Lattice Semiconductor
  • 13.11 NXP Semiconductors
  • 13.12 STMicroelectronics
  • 13.13 Renesas Electronics
  • 13.14 Infineon Technologies
  • 13.15 Analog Devices
  • 13.16 ON Semiconductor
  • 13.17 Microchip Technology
  • 13.18 Texas Instruments
  • 13.19 Taiwan Semiconductor Manufacturing Company

List of Tables

  • Table 1 Global Application-Specific Integrated Circuits Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Application-Specific Integrated Circuits Market Outlook, By Type (2024-2032) ($MN)
  • Table 3 Global Application-Specific Integrated Circuits Market Outlook, By Full Custom ASIC (2024-2032) ($MN)
  • Table 4 Global Application-Specific Integrated Circuits Market Outlook, By Semi-Custom ASIC (2024-2032) ($MN)
  • Table 5 Global Application-Specific Integrated Circuits Market Outlook, By Programmable ASIC (2024-2032) ($MN)
  • Table 6 Global Application-Specific Integrated Circuits Market Outlook, By Gate Array-Based ASIC (2024-2032) ($MN)
  • Table 7 Global Application-Specific Integrated Circuits Market Outlook, By Standard Cell-Based ASIC (2024-2032) ($MN)
  • Table 8 Global Application-Specific Integrated Circuits Market Outlook, By Other Types (2024-2032) ($MN)
  • Table 9 Global Application-Specific Integrated Circuits Market Outlook, By Design Methodology (2024-2032) ($MN)
  • Table 10 Global Application-Specific Integrated Circuits Market Outlook, By RTL-to-GDSII Flow (2024-2032) ($MN)
  • Table 11 Global Application-Specific Integrated Circuits Market Outlook, By IP-Centric Design (2024-2032) ($MN)
  • Table 12 Global Application-Specific Integrated Circuits Market Outlook, By Platform-Based Design (2024-2032) ($MN)
  • Table 13 Global Application-Specific Integrated Circuits Market Outlook, By Hardware-Software Co-Design (2024-2032) ($MN)
  • Table 14 Global Application-Specific Integrated Circuits Market Outlook, By Design for Testability (DFT) (2024-2032) ($MN)
  • Table 15 Global Application-Specific Integrated Circuits Market Outlook, By Design for Yield and Manufacturability (2024-2032) ($MN)
  • Table 16 Global Application-Specific Integrated Circuits Market Outlook, By Technology Node (2024-2032) ($MN)
  • Table 17 Global Application-Specific Integrated Circuits Market Outlook, By Advanced Nodes (<=7nm) (2024-2032) ($MN)
  • Table 18 Global Application-Specific Integrated Circuits Market Outlook, By Leading Nodes (8-14nm) (2024-2032) ($MN)
  • Table 19 Global Application-Specific Integrated Circuits Market Outlook, By Mature Nodes (16-28nm) (2024-2032) ($MN)
  • Table 20 Global Application-Specific Integrated Circuits Market Outlook, By Legacy Nodes (28-65nm) (2024-2032) ($MN)
  • Table 21 Global Application-Specific Integrated Circuits Market Outlook, By Older Nodes (>65nm) (2024-2032) ($MN)
  • Table 22 Global Application-Specific Integrated Circuits Market Outlook, By Packaging & Test (2024-2032) ($MN)
  • Table 23 Global Application-Specific Integrated Circuits Market Outlook, By Traditional Wire-Bond Packaging (2024-2032) ($MN)
  • Table 24 Global Application-Specific Integrated Circuits Market Outlook, By Advanced Packaging (2.5D, 3D-IC, SiP) (2024-2032) ($MN)
  • Table 25 Global Application-Specific Integrated Circuits Market Outlook, By Flip-Chip & BGA (2024-2032) ($MN)
  • Table 26 Global Application-Specific Integrated Circuits Market Outlook, By Test Services (Wafer Probe, Final Test) (2024-2032) ($MN)
  • Table 27 Global Application-Specific Integrated Circuits Market Outlook, By Burn-in & Reliability Testing (2024-2032) ($MN)
  • Table 28 Global Application-Specific Integrated Circuits Market Outlook, By Other Packaging & Tests (2024-2032) ($MN)
  • Table 29 Global Application-Specific Integrated Circuits Market Outlook, By Business Model (2024-2032) ($MN)
  • Table 30 Global Application-Specific Integrated Circuits Market Outlook, By Fabless ASIC Companies (2024-2032) ($MN)
  • Table 31 Global Application-Specific Integrated Circuits Market Outlook, By Integrated Device Manufacturers (IDMs) (2024-2032) ($MN)
  • Table 32 Global Application-Specific Integrated Circuits Market Outlook, By Foundry Services / Custom Manufactures (2024-2032) ($MN)
  • Table 33 Global Application-Specific Integrated Circuits Market Outlook, By Turnkey Design & IP Licensing Models (2024-2032) ($MN)
  • Table 34 Global Application-Specific Integrated Circuits Market Outlook, By Design Services & ASIC-as-a-Service (2024-2032) ($MN)
  • Table 35 Global Application-Specific Integrated Circuits Market Outlook, By Other Business Models (2024-2032) ($MN)
  • Table 36 Global Application-Specific Integrated Circuits Market Outlook, By End User (2024-2032) ($MN)
  • Table 37 Global Application-Specific Integrated Circuits Market Outlook, By Telecom & Networking (2024-2032) ($MN)
  • Table 38 Global Application-Specific Integrated Circuits Market Outlook, By Data Center & Cloud Infrastructure (2024-2032) ($MN)
  • Table 39 Global Application-Specific Integrated Circuits Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 40 Global Application-Specific Integrated Circuits Market Outlook, By Automotive (2024-2032) ($MN)
  • Table 41 Global Application-Specific Integrated Circuits Market Outlook, By Industrial Automation & IoT (2024-2032) ($MN)
  • Table 42 Global Application-Specific Integrated Circuits Market Outlook, By Medical Devices & Healthcare (2024-2032) ($MN)
  • Table 43 Global Application-Specific Integrated Circuits Market Outlook, By Aerospace & Defense (2024-2032) ($MN)
  • Table 44 Global Application-Specific Integrated Circuits Market Outlook, By Security & Surveillance (2024-2032) ($MN)
  • Table 45 Global Application-Specific Integrated Circuits Market Outlook, By Other End Users (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.