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1836406

複合半導體材料市場預測至2032年：依產品形態、材料類型、加工服務、應用、最終用戶和地區的全球分析

Compound Semiconductor Materials Market Forecasts to 2032 - Global Analysis By Product Form, Material Type, Process Service, Application, End User, and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據，全球化合物半導體材料市場預計在 2025 年達到 381 億美元，到 2032 年將達到 589 億美元，預測期內的複合年成長率為 6.4%。

化合物半導體材料包括GaAs、GaN、InP和SiC等材料，用於高頻、光電和電力應用。與矽相比，這些材料具有更優異的電子遷移率、熱導率和效率。主要應用包括5G通訊、電力電子、LED和射頻設備。對速度更快、更節能的電子元件的需求不斷成長，材料合成技術的進步，以及通訊和電動汽車行業的擴張，正在推動市場成長。

擴大5G和電動車基礎設施

5G 和電動車 (EV) 基礎設施的擴張是 GaN、GaAs 和 InP 等化合物半導體材料的主要需求促進因素，因為它們與矽相比具有更優異的高頻工作性能、功率效率和熱性能。通訊業者正在升級其網路以支援毫米波、大規模 MIMO 和小型基地台，擴大將這些材料指定用於功率放大器和射頻前端。此外，電動車和電力電子製造商需要 GaN 和 SiC 元件來製造高效能逆變器、車載充電器和 DC-DC 轉換器，以支援其在汽車和工業領域的快速應用。

原料供應有限

鎵、鍺和銦等關鍵原料供應有限，限制複合半導體材料市場的成長。密集的開採和精煉、出口限制以及近期的政策措施導致供應緊張，價格上漲，迫使製造商尋求稀缺原料或重新設計產品以使用替代品。此外，複雜的純化和晶體生長流程延長了晶圓製造商的前置作業時間和資本密集度，更長的認證週期增加了營運成本需求，而供應商則正在推行供應鏈多元化策略，從而推高了營運成本。

半導體技術的進步

半導體材料和製程的進步為化合物半導體市場帶來了新的機會。改進的外延生長、更高產量比率的MOCVD和MBE技術、SiC晶圓的雷射切片以及先進的晶體拉製技術，正在提高晶圓品質並降低單位成本。此外，異質整合、晶片架構和先進封裝的進步，使得射頻、光子和功率應用能夠實現更小、更高性能的模組，從而提升了複合材料的價值。這些發展正在加速產品商業化，拓寬其在電訊、汽車和資料通訊的應用範圍，加速其在電訊、國防、汽車和資料通訊市場的普及。

地緣政治緊張局勢

關鍵礦產和製造設備的出口限制可能會突然限制鎵、鍺、先進晶圓和專用工具的獲取，從而加劇價格波動和採購風險。國家安全主導的在岸生產和補貼計畫可能會分割市場，並隨著供應商在地理上重新配置其產能而增加製造成本。此外，出口許可證的不可預測性可能會阻礙長期合約的簽訂，並推遲產能擴張。這種不確定性可能會迫使買家採取保守的資本支出策略，導致買家持有更多庫存，並投資於多採購策略，從而推高單位成本。

COVID-19的影響：

新冠疫情導致工廠停工、物流瓶頸和資本計劃延期，擾亂了化合物半導體供應鏈，同時也加速了對連接和遠端辦公基礎設施的需求。早期晶圓和組裝能的短缺導致前置作業時間緊張，並引發了庫存採購。復甦需要增加資本支出、實施回流舉措以及供應商多元化。這些轉變壓縮了投資週期，促使企業調整籌資策略，並大幅提升區域產能。

晶圓市場預計將成為預測期內最大的市場

晶圓領域預計將在預測期內佔據最大的市場佔有率，因為晶圓生產構成了化合物半導體裝置的基礎價值鏈，並帶來材料、外延和基板的收益。電信、電力電子、汽車和LED應用對GaN、GaAs和SiC晶圓的巨大需求，支撐著晶圓廠的運作並推動產能擴張。此外，隨著運轉率的提高，晶圓製造的規模經濟正在降低單位成本，從而鼓勵對上游設施的進一步投資。這使得晶圓成為供應商的主要利潤來源。

設備整合和封裝領域預計將在預測期內實現最高的複合年成長率

由於先進的封裝技術能夠實現更高密度的化合物半導體裝置、更佳的溫度控管和更短的互連，預計設備整合與封裝領域將在預測期內實現最高成長率。為了滿足人工智慧、高速資料通訊、覆晶鍵合、晶圓層次電子構裝和基於晶片的架構的需求正在成長。此外，在封裝層級整合射頻、光子和功率功能可提高系統效能並降低 BOM 成本。這些進步加快了產品上市時間，並證明了對專業組裝能力的投資是合理的。

最大佔有率區域：

在預測期內，亞太地區預計將佔據最大的市場佔有率，這得益於集中製造、強大的供應商生態系統以及龐大的終端市場需求。晶圓廠、外延、基板生產和封裝能力由台灣、韓國、日本和中國大陸共同支援。政府激勵措施、晶片設備的大量資本投資以及5G和電氣化的快速普及將透過縮短上市時間和降低物流成本來加速產品部署。因此，亞太地區將佔據市場價值的主導地位。

複合年成長率最高的地區：

在預測期內，亞太地區預計將實現最高的複合年成長率，這得益於積極的產能擴張、有針對性的產業政策以及國內對電訊、汽車和資料通訊應用不斷成長的需求。對氮化鎵 (GaN)、碳化矽 (SiC) 和先進封裝工廠的大規模投資，加上強大的供應商生態系統和熟練的製造群，正在加快產品上市週期並降低單位成本。這些因素正在推動產能的快速擴張，並吸引全球大規模的國內外投資。

免費客製化服務：

此報告的訂閱者可以使用以下免費自訂選項之一：

  • 公司簡介
    • 全面分析其他市場參與者（最多 3 家公司）
    • 主要企業的SWOT分析（最多3家公司）
  • 區域細分
    • 根據客戶興趣對主要國家進行的市場估計、預測和複合年成長率（註：基於可行性檢查）
  • 競爭基準化分析
    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 數據分析
    • 數據檢驗
    • 研究途徑
  • 研究材料
    • 主要研究資料
    • 次級研究資訊來源
    • 先決條件

第3章市場走勢分析

  • 驅動程式
  • 抑制因素
  • 機會
  • 威脅
  • 應用分析
  • 最終用戶分析
  • 新興市場
  • COVID-19的影響

第4章 波特五力分析

  • 供應商的議價能力
  • 買方的議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭對手之間的競爭

第5章全球化合物半導體材料市場（依產品類型）

  • 晶圓
  • 外延晶圓（EpiReady）
  • 薄膜/外延層
  • 粉末和前驅

6. 全球化合物半導體材料市場（依材料類型）

  • 氮化鎵（GaN）
  • 砷化鎵（GaAs）
  • 碳化矽（SiC）
  • 磷化銦（InP）
  • 氮化銦鎵
  • 其他材料類型

7. 全球化合物半導體材料市場（依製程服務）

  • 外延服務
  • 基板製造
  • 裝置整合與封裝

第8章全球化合物半導體材料市場（依應用）

  • 射頻和微波元件
  • 電力電子
  • 光電子學
  • 光電和光纖通訊
  • 感測器和成像
  • 光電及特種光電發電
  • 航太和國防
  • 其他應用

9. 全球複合半導體材料市場（依最終用戶）

  • 通訊
  • 車
  • 家電
  • 工業和電力系統
  • 醫療保健和醫療設備
  • 其他最終用戶

第10章全球化合物半導體材料市場（按地區）

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲地區

第11章 重大進展

  • 協議、夥伴關係、合作和合資企業
  • 收購與合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第12章 公司概況

  • Wolfspeed, Inc.
  • Qorvo, Inc.
  • Skyworks Solutions, Inc.
  • Infineon Technologies AG
  • STMicroelectronics NV
  • Nichia Corporation
  • Samsung Electronics Co., Ltd.
  • ams OSRAM AG
  • GaN Systems Inc.
  • IQE plc
  • Sumitomo Electric Industries, Ltd.
  • MACOM Technology Solutions Holdings, Inc.
  • II-VI Incorporated
  • AIXTRON SE
  • Veeco Instruments Inc.
  • Applied Materials, Inc.
  • Entegris, Inc.
  • ON Semiconductor Corporation
  • Mitsubishi Electric Corporation
Product Code: SMRC31530

According to Stratistics MRC, the Global Compound Semiconductor Materials Market is accounted for $38.1 billion in 2025 and is expected to reach $58.9 billion by 2032 growing at a CAGR of 6.4% during the forecast period. Compound semiconductor materials involve materials such as GaAs, GaN, InP, and SiC, used for high-frequency, optoelectronic, and power applications. These materials offer superior electron mobility, thermal conductivity, and efficiency compared to silicon. Key applications include 5G communications, power electronics, LEDs, and RF devices. Rising demand for faster, energy-efficient electronic components, advancements in material synthesis and expansion of telecommunications and electric vehicle sectors are driving market growth.

Market Dynamics:

Driver:

Expansion of 5G and EV Infrastructure

Expansion of 5G and electric vehicle (EV) infrastructure is a major demand driver for compound semiconductor materials such as GaN, GaAs and InP because they deliver higher-frequency operation, greater power efficiency, and superior thermal performance compared with silicon. Telecom operators upgrading networks for mmWave, massive MIMO and small cells increasingly specify these materials for power amplifiers and RF front-ends. Additionally, EV and power electronics manufacturers require GaN and SiC components for efficient inverters, onboard chargers and DC-DC converters, supporting rapid adoption across automotive and industrial segments.

Restraint:

Limited Raw Material Availability

Limited availability of critical raw materials such as gallium, germanium and indium is constraining growth of the compound semiconductor materials market. Concentrated mining and refining, export controls and recent policy moves have tightened supplies and elevated prices, forcing manufacturers to secure scarce feedstock or redesign products to use alternatives. Moreover, complex purification and crystal-growth processes raise lead times and capital intensity for wafer producers, and longer qualification cycles increase working capital needs while suppliers pursue supply-chain diversification strategies, raising operating costs.

Opportunity:

Advancements in Semiconductor Technology

Advancements in semiconductor materials and processing are opening new opportunities across the compound semiconductor market. Improved epitaxial growth, higher-yield MOCVD and MBE techniques, laser-slicing for SiC wafers, and refined crystal-pulling raise wafer quality and lower unit costs. Moreover, progress in heterogeneous integration, chiplet architectures and advanced packaging increases the value of compound materials by enabling smaller, higher-performance modules for RF, photonic and power applications. These developments accelerate product commercialization, broaden application scope in telecom, automotive and datacom, and accelerate adoption in telecom, defense, automotive, and datacom markets.

Threat:

Geopolitical Tensions

Export controls on critical minerals or fabrication equipment can abruptly limit access to gallium, germanium, advanced wafers and specialized tools, increasing price volatility and procurement risk. National security-driven onshoring and subsidy programs may fragment markets and raise manufacturing costs as suppliers reconfigure capacity geographically. Moreover, export licensing unpredictability can deter long-term contracts and slow capacity expansion. This uncertainty forces conservatism in capital expenditure pushes buyers to hold larger inventories, compelling investment in multi-source strategies that raise unit costs.

Covid-19 Impact:

The COVID-19 pandemic disrupted compound semiconductor supply chains through plant shutdowns, logistics bottlenecks, and delayed capital projects while simultaneously accelerating demand for connectivity and remote-work infrastructure. Early shortages of wafers and assembly capacity strained lead times and prompted inventory hoarding. Recovery involved increased CAPEX, reshoring initiatives and supplier diversification to bolster resilience. These shifts shortened some timelines for investment and encouraged firms to redesign sourcing strategies and expand regional capacity, significantly.

The wafers segment is expected to be the largest during the forecast period

The wafers segment is expected to account for the largest market share during the forecast period because wafer production forms the foundational value chain for compound semiconductor devices, capturing material, epitaxy and substrate revenues. High-volume demand for GaN, GaAs and SiC wafers from telecom, power electronics, automotive and LED applications sustains wafer fabs and drives capacity expansion. Moreover, economies of scale in wafer manufacturing reduce per-unit costs as utilization rises, encouraging further investment in upstream capacity. This makes wafers the primary profit pool for suppliers.

The device integration & packaging segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the device integration & packaging segment is predicted to witness the highest growth rate as advanced packaging technologies unlock higher density, improved thermal management and shorter interconnects for compound semiconductor devices. Demand for 2.5D/3D stacking, flip-chip bonding, wafer-level packaging and chiplet-based architectures is rising to meet AI, high-speed datacom, mmWave and power-conversion requirements. Additionally, package-level co-integration of RF, photonic and power functions enhances system performance and reduces BOM cost. These advances shorten time-to-market and justify investment in specialized assembly capacity.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share driven by concentrated manufacturing, strong supplier ecosystems, and heavy end-market demand. Taiwan, South Korea, Japan and China together support wafer fabs, epitaxy, substrate production and packaging capacity, while regional OEMs and telecom operators create substantial local consumption. Government incentives, large-scale capital spending on chip equipment and rapid adoption of 5G and electrification reduce time to commercialization and lower logistics costs, accelerating product roll-out. Consequently, Asia Pacific will dominate market value.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR because of aggressive capacity expansion, targeted industrial policies, and rising domestic demand for telecom, automotive and datacom applications. Major investments in GaN, SiC and advanced packaging fabs, coupled with robust supplier ecosystems and skilled manufacturing clusters, are accelerating commercialization cycles and lowering unit costs. These factors drive rapid capacity additions and attract large-scale domestic and foreign investment globally.

Key players in the market

Some of the key players in Compound Semiconductor Materials Market include Wolfspeed, Inc., Qorvo, Inc., Skyworks Solutions, Inc., Infineon Technologies AG, STMicroelectronics N.V., Nichia Corporation, Samsung Electronics Co., Ltd., ams OSRAM AG, GaN Systems Inc., IQE plc, Sumitomo Electric Industries, Ltd., MACOM Technology Solutions Holdings, Inc., II-VI Incorporated, AIXTRON SE, Veeco Instruments Inc., Applied Materials, Inc., Entegris, Inc., ON Semiconductor Corporation, and Mitsubishi Electric Corporation.

Key Developments:

In July 2025, Infineon Technologies AG is advancing on scalable 300mm GaN power wafer manufacturing expected to deliver samples in late 2025, strengthening its leadership in power systems based on silicon, SiC, and GaN compound semiconductors.

In March 2023, Wolfspeed, Inc. the global leader in Silicon Carbide technology, and North Carolina Agricultural and Technical State University, America's leading historically Black college or university, today announced their intent to apply for CHIPS and Science Act funding to build a new research and development facility on the North Carolina A&T campus. The R&D facility will be focused on Silicon Carbide to support the next generation of advanced compound semiconductors. Wolfspeed and A&T intend to submit the project for federal investment as part of the CHIPS and Science Act when the Notice of Funding Opportunity for R&D facilities is released this fall.

Product Forms Covered:

  • Wafers
  • Epitaxial wafers (epi-ready)
  • Thin films / epilayers
  • Powders & precursors

Material Types Covered:

  • Gallium Nitride (GaN)
  • Gallium Arsenide (GaAs)
  • Silicon Carbide (SiC)
  • Indium Phosphide (InP)
  • Indium Gallium Nitride
  • Other Material types

Process Services Covered:

  • Epitaxy Services
  • Substrate Manufacturing
  • Device Integration & Packaging

Applications Covered:

  • RF & Microwave Components
  • Power Electronics
  • Optoelectronics
  • Photonics & Optical Communications
  • Sensors & Imaging
  • Photovoltaics & Specialty Solar
  • Aerospace & Defense
  • Other Applications

End Users Covered:

  • Telecommunications
  • Automotive
  • Consumer Electronics
  • Industrial & Power Systems
  • Healthcare & Medical Devices
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Compound Semiconductor Materials Market, By Product Form

  • 5.1 Introduction
  • 5.2 Wafers
  • 5.3 Epitaxial wafers (epi-ready)
  • 5.4 Thin films / epilayers
  • 5.5 Powders & precursors

6 Global Compound Semiconductor Materials Market, By Material Type

  • 6.1 Introduction
  • 6.2 Gallium Nitride (GaN)
  • 6.3 Gallium Arsenide (GaAs)
  • 6.4 Silicon Carbide (SiC)
  • 6.5 Indium Phosphide (InP)
  • 6.6 Indium Gallium Nitride
  • 6.7 Other Material types

7 Global Compound Semiconductor Materials Market, By Process Service

  • 7.1 Introduction
  • 7.2 Epitaxy Services
  • 7.3 Substrate Manufacturing
  • 7.4 Device Integration & Packaging

8 Global Compound Semiconductor Materials Market, By Application

  • 8.1 Introduction
  • 8.2 RF & Microwave Components
  • 8.3 Power Electronics
  • 8.4 Optoelectronics
  • 8.5 Photonics & Optical Communications
  • 8.6 Sensors & Imaging
  • 8.7 Photovoltaics & Specialty Solar
  • 8.8 Aerospace & Defense
  • 8.9 Other Applications

9 Global Compound Semiconductor Materials Market, By End User

  • 9.1 Introduction
  • 9.2 Telecommunications
  • 9.3 Automotive
  • 9.4 Consumer Electronics
  • 9.5 Industrial & Power Systems
  • 9.6 Healthcare & Medical Devices
  • 9.7 Other End Users

10 Global Compound Semiconductor Materials Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Wolfspeed, Inc.
  • 12.2 Qorvo, Inc.
  • 12.3 Skyworks Solutions, Inc.
  • 12.4 Infineon Technologies AG
  • 12.5 STMicroelectronics N.V.
  • 12.6 Nichia Corporation
  • 12.7 Samsung Electronics Co., Ltd.
  • 12.8 ams OSRAM AG
  • 12.9 GaN Systems Inc.
  • 12.10 IQE plc
  • 12.11 Sumitomo Electric Industries, Ltd.
  • 12.12 MACOM Technology Solutions Holdings, Inc.
  • 12.13 II-VI Incorporated
  • 12.14 AIXTRON SE
  • 12.15 Veeco Instruments Inc.
  • 12.16 Applied Materials, Inc.
  • 12.17 Entegris, Inc.
  • 12.18 ON Semiconductor Corporation
  • 12.19 Mitsubishi Electric Corporation

List of Tables

  • Table 1 Global Compound Semiconductor Materials Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Compound Semiconductor Materials Market Outlook, By Product Form (2024-2032) ($MN)
  • Table 3 Global Compound Semiconductor Materials Market Outlook, By Wafers (2024-2032) ($MN)
  • Table 4 Global Compound Semiconductor Materials Market Outlook, By Epitaxial wafers (epi-ready) (2024-2032) ($MN)
  • Table 5 Global Compound Semiconductor Materials Market Outlook, By Thin films / epilayers (2024-2032) ($MN)
  • Table 6 Global Compound Semiconductor Materials Market Outlook, By Powders & precursors (2024-2032) ($MN)
  • Table 7 Global Compound Semiconductor Materials Market Outlook, By Material Type (2024-2032) ($MN)
  • Table 8 Global Compound Semiconductor Materials Market Outlook, By Gallium Nitride (GaN) (2024-2032) ($MN)
  • Table 9 Global Compound Semiconductor Materials Market Outlook, By Gallium Arsenide (GaAs) (2024-2032) ($MN)
  • Table 10 Global Compound Semiconductor Materials Market Outlook, By Silicon Carbide (SiC) (2024-2032) ($MN)
  • Table 11 Global Compound Semiconductor Materials Market Outlook, By Indium Phosphide (InP) (2024-2032) ($MN)
  • Table 12 Global Compound Semiconductor Materials Market Outlook, By Indium Gallium Nitride (2024-2032) ($MN)
  • Table 13 Global Compound Semiconductor Materials Market Outlook, By Other Material types (2024-2032) ($MN)
  • Table 14 Global Compound Semiconductor Materials Market Outlook, By Process Service (2024-2032) ($MN)
  • Table 15 Global Compound Semiconductor Materials Market Outlook, By Epitaxy Services (2024-2032) ($MN)
  • Table 16 Global Compound Semiconductor Materials Market Outlook, By Substrate Manufacturing (2024-2032) ($MN)
  • Table 17 Global Compound Semiconductor Materials Market Outlook, By Device Integration & Packaging (2024-2032) ($MN)
  • Table 18 Global Compound Semiconductor Materials Market Outlook, By Application (2024-2032) ($MN)
  • Table 19 Global Compound Semiconductor Materials Market Outlook, By RF & Microwave Components (2024-2032) ($MN)
  • Table 20 Global Compound Semiconductor Materials Market Outlook, By Power Electronics (2024-2032) ($MN)
  • Table 21 Global Compound Semiconductor Materials Market Outlook, By Optoelectronics (2024-2032) ($MN)
  • Table 22 Global Compound Semiconductor Materials Market Outlook, By Photonics & Optical Communications (2024-2032) ($MN)
  • Table 23 Global Compound Semiconductor Materials Market Outlook, By Sensors & Imaging (2024-2032) ($MN)
  • Table 24 Global Compound Semiconductor Materials Market Outlook, By Photovoltaics & Specialty Solar (2024-2032) ($MN)
  • Table 25 Global Compound Semiconductor Materials Market Outlook, By Aerospace & Defense (2024-2032) ($MN)
  • Table 26 Global Compound Semiconductor Materials Market Outlook, By Other Applications (2024-2032) ($MN)
  • Table 27 Global Compound Semiconductor Materials Market Outlook, By End User (2024-2032) ($MN)
  • Table 28 Global Compound Semiconductor Materials Market Outlook, By Telecommunications (2024-2032) ($MN)
  • Table 29 Global Compound Semiconductor Materials Market Outlook, By Automotive (2024-2032) ($MN)
  • Table 30 Global Compound Semiconductor Materials Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 31 Global Compound Semiconductor Materials Market Outlook, By Industrial & Power Systems (2024-2032) ($MN)
  • Table 32 Global Compound Semiconductor Materials Market Outlook, By Healthcare & Medical Devices (2024-2032) ($MN)
  • Table 33 Global Compound Semiconductor Materials Market Outlook, By Other End Users (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.