查看購物車
  • Simplified Chinese
  • English
  • Japanese
封面
市場調查報告書
商品編碼
1833601

2032 年雷射和微波輔助剝離市場預測：按技術、應用和地區分類的全球分析

Laser & Microwave Assisted Delamination Market Forecasts to 2032 - Global Analysis By Technology, Application and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據，全球雷射和微波輔助剝皮市場預計在 2025 年達到 26.3 億美元，到 2032 年將達到 55.4 億美元，預測期內的複合年成長率為 11.2%。

雷射和微波輔助脫鍵是一種先進的分離技術，可有效地從廢棄電子組件中回收半導體材料、晶片和分層組件。該方法利用高精度雷射和微波工藝，最大限度地減少損傷，減少化學品使用，並支持對有價值材料的環保回收。隨著各行各業優先考慮永續電子製造、資源回收和減少電子廢棄物，該市場正在不斷擴大。消費性電子、汽車和可再生能源應用領域的日益普及推動了該技術的需求，使其成為循環經濟主導的半導體加工解決方案的關鍵組成部分。

精準高效

與傳統機械方法不同，這些先進技術能夠實現精準的非接觸式材料分離，從而顯著減少對貴重底層零件的損壞。這在電子產品回收和半導體製造等行業至關重要，因為在這些行業中，保持回收材料和精密電路的完整性對於盈利至關重要。由此帶來的更高產量比率和更少的廢棄物直接轉化為顯著的營運成本節約和製程可靠性的提升，促使製造商紛紛採用這些技術。

初期投資高

雷射和微波脫鍵設備所需的巨額資本支出阻礙了市場擴張。這些系統整合了複雜的組件，包括高功率雷射和精密控制設備，製造成本高。對於中小型企業而言，高昂的入門成本構成了採用這些設備的巨大經濟障礙。此外，總擁有成本不僅包括初始購買價格，還包括專業操作員的培訓和維護，這使得投資的商業可行性成為一個重大障礙，並減緩了市場採用，尤其是在成本敏感的地區。

電動汽車（EV）市場的成長

雷射和微波輔助脫鍵設備所需的巨額資本支出阻礙了市場擴張。這些系統整合了高功率雷射和精密控制設備等複雜組件，製造成本高。對於中小型企業而言，高昂的入門成本構成了採用這些設備的巨大經濟障礙。此外，總擁有成本不僅包括初始購買價格，還包括專業操作員的培訓和維護，這使得投資的商業可行性成為一個重大障礙，並可能減緩市場採用速度，尤其是在成本敏感的地區。

與替代技術的競爭

競爭技術，例如先進的化學製程和改進的機械分離技術，正在不斷改進，以提高成本效益和效率。如果這些替代技術能夠以顯著降低的成本實現相當的性能，它們就有可能獲得市場佔有率，尤其是在對超高精度要求不高的應用中。這種競爭壓力迫使雷射和微波技術供應商不斷創新，並證明其高階價值提案性，以保持競爭力。

COVID-19的影響：

疫情最初擾亂了市場，導致嚴重的供應鏈瓶頸和汽車、電子製造等關鍵終端行業的暫時停工，導致計劃延期，並導致資本設備採購短期減少。然而，這場危機也加速了自動化的普及，凸顯了非接觸式高效流程的價值。隨著全球市場復甦，強勁的需求以及對高科技回收和先進電子製造的重新關注，推動了強勁的復甦，為疫情後市場的成長奠定了基礎。

雷射輔助剝離細分市場預計將成為預測期內最大的細分市場

雷射輔助脫鍵技術憑藉其卓越的精度和在高價值行業中成熟的應用歷史，預計將在預測期內佔據最大的市場佔有率。對於需要絕對控制的複雜任務，例如半導體晶圓回收和電子顯示器的精密維修，它是首選技術。此外，它能夠無縫整合到自動化生產和回收生產線中，這使得它在大規模工業應用中越來越具有吸引力。這種廣泛的適用性和成熟的技術確保了其主導地位。

預計汽車（電動車電池拆卸）領域在預測期內將實現最高的複合年成長率。

預計汽車（電動車電池拆解）領域將在預測期內達到最高成長率。這直接源自於全球電氣化進程，這催生了對高效安全的電池回收解決方案的迫切需求。雷射脫粘技術非常適合這項任務，因為它可以精確地分離電池單元和模組，而不會造成短路或熱失控。此外，新推出的嚴格環境法規強制要求電池回收，這迫使汽車製造商和回收商投資這項先進技術，從而刺激了該領域的顯著成長。

佔比最大的地區：

在預測期內，北美預計將佔據最大的市場佔有率，這得益於其強大的研發基礎設施、自動化技術的早期應用以及電子和航太行業領先企業的存在。此外，鼓勵電子廢棄物回收的明確法律規範和強大的電動車生態系統為雷射和微波剝離系統的部署創造了有利條件。該地區在技術創新方面的大量投資和成熟的工業基礎，為其提供了一個穩定、高價值的市場，確保了其在全球市場的主導地位。

複合年成長率最高的地區：

預計亞太地區在預測期內將呈現最高的複合年成長率，這得益於其作為全球電子製造中心的地位以及電動車生產的快速擴張，尤其是在中國、韓國和日本。這些國家的政府正積極支持國內電動車和半導體供應鏈的發展，包括對先進回收技術的投資。龐大的工業基礎，加上日益增強的環保意識和扶持政策，為雷射和微波分離系統的應用創造了極高的成長環境。

免費客製化服務：

訂閱此報告的用戶可獲得以下免費自訂選項之一：

  • 公司簡介
    • 對最多三家其他市場公司進行全面分析
    • 主要企業的SWOT分析（最多3家公司）
  • 區域細分
    • 根據客戶興趣對主要國家進行的市場估計、預測和複合年成長率（註：基於可行性檢查）
  • 競爭基準化分析
    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 數據分析
    • 數據檢驗
    • 研究途徑
  • 研究材料
    • 主要研究資料
    • 次級研究資訊來源
    • 先決條件

第3章市場走勢分析

  • 驅動程式
  • 抑制因素
  • 機會
  • 威脅
  • 技術類型
  • 應用分析
  • 新興市場
  • COVID-19的影響

第4章 波特五力分析

  • 供應商的議價能力
  • 買方的議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭對手之間的競爭

5. 全球雷射和微波輔助剝離市場（按技術）

  • 雷射輔助脫粘
  • 微波輔助去皮

6. 全球雷射和微波輔助剝離市場（依應用）

  • 電子製造和半導體封裝
  • 電子設備回收（電子廢棄物）
  • 汽車（電動車電池拆卸）
  • 航太與國防（複合材料修復）
  • 其他用途

7. 全球雷射和微波輔助剝離市場（按地區）

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲地區

第8章：主要進展

  • 協議、夥伴關係、合作和合資企業
  • 收購與合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第9章：企業概況

  • TRUMPF
  • Laserax
  • Laser Photonics
  • IPG Photonics
  • Coherent
  • nLIGHT
  • Han's Laser
  • HGLASER
  • Adapt Laser
  • Laser Technologies Inc.
  • Sairem
  • GR3N
  • Resynergi
  • ScanCAD Intl.
  • Hymson Laser
Product Code: SMRC31434

According to Stratistics MRC, the Global Laser & Microwave Assisted Delamination Market is accounted for $2.63 billion in 2025 and is expected to reach $5.54 billion by 2032 growing at a CAGR of 11.2% during the forecast period. Laser & Microwave Assisted Delamination involves advanced separation technologies enabling efficient recovery of semiconductor materials, chips, and layered components from used electronic assemblies. Utilizing high-precision laser and microwave processes, this method minimizes damage, reduces chemical usage, and supports eco-friendly recycling of valuable materials. The market is expanding as industries prioritize sustainable electronics manufacturing, resource recovery, and reduced e-waste. Growing adoption across consumer electronics, automotive, and renewable energy applications is fueling demand, positioning this technology as a cornerstone for circular economy-driven semiconductor processing solutions.

Market Dynamics:

Driver:

Precision and Efficiency

Unlike traditional mechanical methods, these advanced techniques enable targeted, non-contact material separation, drastically minimizing damage to valuable underlying components. This is critical in sectors like electronics recycling and semiconductor manufacturing, where preserving the integrity of reclaimed materials or delicate circuits is paramount for profitability. The resulting higher yield rates and reduced waste translate directly into significant operational cost savings and enhanced process reliability, compelling manufacturers to adopt these technologies.

Restraint:

High Initial Investment

Market expansion is tempered by the substantial capital expenditure required for laser and microwave delamination equipment. These systems incorporate sophisticated components, including high-power lasers and precise control units, which incur significant manufacturing costs. For small and medium-sized enterprises, this high entry cost presents a major financial barrier to adoption. Furthermore, the total cost of ownership extends beyond the initial purchase to include specialized operator training and maintenance, making the return-on-investment calculation a considerable hurdle that can slow down widespread market penetration, particularly in cost-sensitive regions.

Opportunity:

Growth in Electric Vehicle (EV) Market

Market expansion is tempered by the substantial capital expenditure required for laser and microwave delamination equipment. These systems incorporate sophisticated components, including high-power lasers and precise control units, which incur significant manufacturing costs. For small and medium-sized enterprises, this high entry cost presents a major financial barrier to adoption. Furthermore, the total cost of ownership extends beyond the initial purchase to include specialized operator training and maintenance, making the return-on-investment calculation a considerable hurdle that can slow down widespread market penetration, particularly in cost-sensitive regions.

Threat:

Competition from Alternative Technologies

Competing technologies, such as advanced chemical processes or improved mechanical separation techniques, are constantly being refined to become more cost-effective and efficient. If these alternatives achieve performance parity at a significantly lower cost, they could capture market share, especially in applications where ultra-high precision is less critical. This competitive pressure forces laser and microwave technology providers to continuously innovate and justify their premium value proposition to maintain relevance.

Covid-19 Impact:

The pandemic initially disrupted the market through severe supply chain bottlenecks and temporary shutdowns in key end-use industries like automotive and electronics manufacturing. This led to project delays and a short-term decline in capital equipment purchases. However, the crisis also accelerated the adoption of automation, highlighting the value of contactless, efficient processes. As global markets recovered, pent-up demand and a renewed focus on high-tech recycling and advanced electronics manufacturing spurred a strong rebound, positioning the market for post-pandemic growth.

The laser-assisted delamination segment is expected to be the largest during the forecast period

The laser-assisted delamination segment is expected to account for the largest market share during the forecast period attributed to its superior precision and established application history in high-value industries. It is the technology of choice for intricate tasks such as semiconductor wafer reclamation and the delicate repair of electronic displays, where absolute control is non-negotiable. Furthermore, its ability to be seamlessly integrated into automated production and recycling lines enhances its appeal for large-scale industrial applications. This widespread applicability and technological maturity ensure its leading position.

The automotive (EV Battery Disassembly) segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the automotive (EV Battery Disassembly) segment is predicted to witness the highest growth rate. This is a direct consequence of the global push towards electrification, creating an urgent need for efficient and safe battery recycling solutions. Laser delamination is uniquely suited for this task, as it allows for the precise separation of battery cells and modules without causing short circuits or thermal runaway. Moreover, stringent new environmental regulations mandating battery recycling are compelling automakers and recyclers to invest in this advanced technology, fueling its remarkable growth rate.

Region with largest share:

During the forecast period, the North America region is expected to hold the largest market share driven by a strong confluence of advanced R&D infrastructure, the early adoption of automation technologies, and the presence of major electronics and aerospace industry players. Additionally, well-defined regulatory frameworks promoting electronics waste recycling and a robust electric vehicle ecosystem create a fertile ground for the deployment of laser and microwave delamination systems. The region's significant investment in technological innovation and its mature industrial base provide a stable and high-value market, ensuring its dominant position in the global landscape.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR fueled by its position as the global hub for electronics manufacturing and its rapidly expanding electric vehicle production, particularly in China, South Korea, and Japan. Governments in these countries are actively supporting the development of domestic EV and semiconductor supply chains, which includes investing in advanced recycling technologies. This massive industrial base, combined with increasing environmental awareness and supportive policies, creates an exceptionally high-growth environment for the adoption of laser and microwave delamination systems.

Key players in the market

Some of the key players in Laser & Microwave Assisted Delamination Market include TRUMPF, Laserax, Laser Photonics, IPG Photonics, Coherent, nLIGHT, Han's Laser, HGLASER, Adapt Laser, Laser Technologies Inc., Sairem, GR3N, Resynergi, ScanCAD Intl., and Hymson Laser.

Key Developments:

In June 2025, IPG Photonics launched new high-power rack-integrated (RI) fiber lasers requiring 60% less floor space. These lasers provide consistent processing results, reduced setup time, and robust operation in humid environments.

In April 2025, TRUMPF introduced a new AI-driven "Cutting Assistant" application that improves laser cutting edge quality by optimizing parameters based on edge photos, targeting better productivity and precision in laser manufacturing.

In November 2024, nLIGHT announced the global launch of a 2 kW dynamic beam-shaping laser (Corona(TM) AFX-2000) designed for significantly faster laser powder bed fusion metal printing with high stability and multiple beam profiles.

Technologies Covered:

  • Laser-Assisted Delamination
  • Microwave-Assisted Delamination

Applications Covered:

  • Electronics Manufacturing & Semiconductor Packaging
  • Electronics Recycling (E-Waste)
  • Automotive (EV Battery Disassembly)
  • Aerospace & Defense (Composite Repair)
  • Other Applications

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Type
  • 3.7 Application Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Laser & Microwave Assisted Delamination Market, By Technology

  • 5.1 Introduction
  • 5.2 Laser-Assisted Delamination
  • 5.3 Microwave-Assisted Delamination

6 Global Laser & Microwave Assisted Delamination Market, By Application

  • 6.1 Introduction
  • 6.2 Electronics Manufacturing & Semiconductor Packaging
  • 6.3 Electronics Recycling (E-Waste)
  • 6.4 Automotive (EV Battery Disassembly)
  • 6.5 Aerospace & Defense (Composite Repair)
  • 6.6 Other Applications

7 Global Laser & Microwave Assisted Delamination Market, By Geography

  • 7.1 Introduction
  • 7.2 North America
    • 7.2.1 US
    • 7.2.2 Canada
    • 7.2.3 Mexico
  • 7.3 Europe
    • 7.3.1 Germany
    • 7.3.2 UK
    • 7.3.3 Italy
    • 7.3.4 France
    • 7.3.5 Spain
    • 7.3.6 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 Japan
    • 7.4.2 China
    • 7.4.3 India
    • 7.4.4 Australia
    • 7.4.5 New Zealand
    • 7.4.6 South Korea
    • 7.4.7 Rest of Asia Pacific
  • 7.5 South America
    • 7.5.1 Argentina
    • 7.5.2 Brazil
    • 7.5.3 Chile
    • 7.5.4 Rest of South America
  • 7.6 Middle East & Africa
    • 7.6.1 Saudi Arabia
    • 7.6.2 UAE
    • 7.6.3 Qatar
    • 7.6.4 South Africa
    • 7.6.5 Rest of Middle East & Africa

8 Key Developments

  • 8.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 8.2 Acquisitions & Mergers
  • 8.3 New Product Launch
  • 8.4 Expansions
  • 8.5 Other Key Strategies

9 Company Profiling

  • 9.1 TRUMPF
  • 9.2 Laserax
  • 9.3 Laser Photonics
  • 9.4 IPG Photonics
  • 9.5 Coherent
  • 9.6 nLIGHT
  • 9.7 Han's Laser
  • 9.8 HGLASER
  • 9.9 Adapt Laser
  • 9.10 Laser Technologies Inc.
  • 9.11 Sairem
  • 9.12 GR3N
  • 9.13 Resynergi
  • 9.14 ScanCAD Intl.
  • 9.15 Hymson Laser

List of Tables

  • Table 1 Global Laser & Microwave Assisted Delamination Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Laser & Microwave Assisted Delamination Market Outlook, By Technology (2024-2032) ($MN)
  • Table 3 Global Laser & Microwave Assisted Delamination Market Outlook, By Laser-Assisted Delamination (2024-2032) ($MN)
  • Table 4 Global Laser & Microwave Assisted Delamination Market Outlook, By Microwave-Assisted Delamination (2024-2032) ($MN)
  • Table 5 Global Laser & Microwave Assisted Delamination Market Outlook, By Application (2024-2032) ($MN)
  • Table 6 Global Laser & Microwave Assisted Delamination Market Outlook, By Electronics Manufacturing & Semiconductor Packaging (2024-2032) ($MN)
  • Table 7 Global Laser & Microwave Assisted Delamination Market Outlook, By Electronics Recycling (E-Waste) (2024-2032) ($MN)
  • Table 8 Global Laser & Microwave Assisted Delamination Market Outlook, By Automotive (EV Battery Disassembly) (2024-2032) ($MN)
  • Table 9 Global Laser & Microwave Assisted Delamination Market Outlook, By Aerospace & Defense (Composite Repair) (2024-2032) ($MN)
  • Table 10 Global Laser & Microwave Assisted Delamination Market Outlook, By Other Applications (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.