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市場調查報告書
商品編碼
1716300
2032 年 SOI(絕緣體上矽)市場預測:按產品、晶圓類型、厚度、晶圓尺寸、技術、最終用戶和地區進行的全球分析Silicon on Insulators Market Forecasts to 2032 - Global Analysis By Product, Wafer Type, Thickness, Wafer Size, Technology, End User and By Geography |
根據 Stratistics MRC 的數據,全球絕緣體上矽 (SOI) 市場預計在 2025 年達到 17.8 億美元,到 2032 年將達到 54.6 億美元,預測期內的複合年成長率為 17.3%。
SOI(絕緣體上矽)製造製程涉及在絕緣基板(通常是二氧化矽)上沉積一層薄矽。透過降低寄生元件耦合元件的電容,該結構在性能和功率效率方面優於傳統的體矽。 RF應用、高速或低功耗積體電路以及先進的微處理器都廣泛使用SOI技術。它能夠降低漏電流並提高開關速度,使其成為小型化和能源效率至關重要的現代電子設備的理想選擇。
根據半導體產業協會(SIA)預測,2024年全球半導體產業銷售額將達6,276億美元,與前一年同期比較成長19.1%。
擴大汽車電子產品的使用
自動駕駛技術、聯網汽車生態系統以及電動車(EV)的出現正在改變汽車產業。這些發展主要依賴即使在惡劣環境下也能可靠運作的半導體裝置。 SOI 晶片具有出色的導熱性、抗閂鎖性和抗軟錯誤能力,使其成為煞車、轉向和導航等安全關鍵系統的理想選擇。此外,SOI 裝置的堅固性和長期可靠性越來越受到 AEC-Q100 等汽車標準的認可。
生產和材料成本過高
阻礙SOI技術廣泛應用的主要障礙之一是其製造成本相對較高。與傳統的體矽晶圓製造相比,製造SOI晶圓需要更多資源密集且複雜的工藝,例如SIMOX和Smart-Cut™。此外,SOI基板需要精確控制層厚度,並具有額外的絕緣氧化層,因此價格更昂貴。此外,中小型半導體公司也因研發預算有限而受到成本限制,阻礙了產業應用。
自動駕駛汽車和電動車的使用日益增多
SOI 設備最大的成長機會之一是向電動車 (EV) 和自動駕駛技術的快速轉變。這些車輛需要高度可靠且能在惡劣條件和寬溫度範圍內運作的電子設備。 SOI 具有出色的高溫性能以及抗閂鎖和軟錯誤的能力,是 ADAS(高級駕駛輔助系統)感知器、電源管理整合電路和汽車微控制器的理想選擇。此外,隨著電動車的普及以及對可靠、節能半導體的需求不斷成長,SOI 技術很可能在長期內創造巨大的商機,特別是隨著車載電子設備變得更加軟體主導和連網。
其他半導體技術的競爭加劇
儘管 SOI 具有許多優勢,但其他半導體技術,尤其是 FinFET 和先進的體矽 CMOS,卻構成了嚴重威脅。在先進的製程節點上,FinFET 因其卓越的功率效率和可擴展性而廣泛應用。台積電和英特爾等大型代工廠已針對大批量生產最佳化了其 FinFET 工藝,使其在成熟度、規模成本效益和生態系統支援方面具有競爭優勢。此外,隨著體矽技術不斷控制洩漏並提供更好的性能,SOI 的獨特價值提案正受到威脅,特別是在成本敏感的大量和消費性電子產品中。
COVID-19 疫情以多種方式影響了絕緣體上矽 (SOI) 市場。半導體生產和SOI晶圓交付的延遲最初是由於勞動力短缺、工廠關閉和全球供應鏈中斷造成的,影響了消費性電子和汽車等終端產業。然而,疫情加速了數位轉型,增加了對資料中心、5G基礎設施和連網型設備的需求。此外,隨著遠距工作、線上服務和邊緣運算的興起,SOI 市場的長期前景也得到了改善。
預計預測期內射頻(RF)設備部分將成為最大的部分。
預計預測期內射頻 (RF) 設備部分將佔據最大的市場佔有率。這種主導地位主要歸功於智慧型手機、平板電腦和 5G通訊系統中基於 SOI 的射頻晶片的使用日益增多。 RF-SOI技術具有高頻高效能、低功耗和優異的隔離性,使其成為無線通訊前端模組的理想選擇。全球行動數據流量的增加以及 5G 基礎設施和物聯網連接的發展推動了對 RF-SOI 設備的需求。此外,RF應用在擴大整體SOI市場方面發揮關鍵作用。
預計在預測期內,智慧切割部分將以最高的複合年成長率成長。
預計智慧切割部分將在預測期內呈現最高的成長率。 SmartCut 技術實現的精確層轉移可以在絕緣基板上創建薄而均勻的矽層,精度高,缺陷少。該技術經常用於生產具有更高可擴展性、更低功耗和更優異電氣性能的複雜 SOI 晶圓,這對於 5G、人工智慧和高速運算等下一代半導體應用至關重要。此外,其在射頻設備、電力電子和高性能邏輯電路的應用日益廣泛,推動了全球 SOI 市場的快速成長。
預計北美地區將在預測期內佔據最大的市場佔有率。這是由於整體廣泛採用最尖端科技、知名半導體公司的存在以及先進的研究設施。該地區將受益於消費電子、自動駕駛汽車、國防系統和 5G 基礎設施等行業對基於 SOI 的產品的強勁需求。美國在半導體製造和設計方面投入了大量資金,是主要的技術創新中心,尤其是在射頻設備、MEMS 和功率半導體領域。此外,政府支持國內晶片製造和 5G 網路發展的舉措進一步加強了北美在 SOI 市場的主導地位。
預計亞太地區在預測期內的複合年成長率最高。該地區不斷成長的電子製造業基礎、對半導體製造業不斷增加的投資以及 SOI 技術在 5G、物聯網和電動汽車等尖端應用中的日益廣泛使用都是推動這一快速成長的因素。中國、韓國、台灣和日本等國家擁有大量研發預算、政府支持和優惠政策。此外,消費性電子和工業自動化領域對高性能、節能晶片的需求不斷成長,進一步推動了亞太地區對 SOI 的採用。
According to Stratistics MRC, the Global Silicon on Insulators Market is accounted for $1.78 billion in 2025 and is expected to reach $5.46 billion by 2032 growing at a CAGR of 17.3% during the forecast period. In the silicon on insulator (SOI) fabrication process, a thin layer of silicon is deposited on top of an insulating substrate, usually silicon dioxide. By lowering parasitic device capacitance, this structure outperforms traditional bulk silicon in terms of performance and power efficiency. RF applications, high-speed or low-power integrated circuits, and sophisticated microprocessors all make extensive use of SOI technology. It is perfect for contemporary electronic devices where compactness and energy efficiency are crucial because of its capacity to reduce leakage current and increase switching speed.
According to the Semiconductor Industry Association (SIA), global semiconductor industry sales totaled $627.6 billion in 2024, reflecting a 19.1% increase compared to the previous year.
Growing use of automotive electronics
The emergence of autonomous driving technologies, connected car ecosystems, and electric vehicles (EVs) is transforming the automotive industry. These developments mainly depend on semiconductor devices that are dependable and high-performing even in harsh environments. SOI chips are ideal for safety-critical systems like braking, steering, and navigation because of their exceptional thermal conductivity, resistance to latch-up, and immunity to soft errors. Furthermore, the durability and long-term dependability that SOI devices offer are becoming more and more valued by automotive standards like AEC-Q100.
Exorbitant production and material expenses
One of the main obstacles preventing SOI technology from being widely used is the comparatively high cost of fabrication. Compared to traditional bulk silicon wafer manufacturing, the production of SOI wafers requires more resource-intensive, complex processes like SIMOX and the Smart Cut(TM) method. Furthermore, because SOI substrates require precise control over layer thickness and have an extra insulating oxide layer, their cost is much higher. Moreover, the limited R&D budgets of small and medium-sized semiconductor companies are also impacted by cost constraints, which prevent wider industry penetration.
Growing use of autonomous and electric vehicles
One of the biggest growth opportunities for SOI devices is the rapidly accelerating shift to electric vehicles (EVs) and autonomous driving technologies. These cars need electronics that are highly reliable and able to function in harsh conditions and a wide range of temperatures. SOI is the perfect choice for advanced driver-assistance systems (ADAS) sensors, power management integrated circuits, and automotive microcontrollers due to its exceptional high-temperature performance and resistance to latch-up and soft errors. Additionally, a strong long-term opportunity for SOI technology will arise as EV adoption increases and the demand for reliable and power-efficient semiconductors rises, particularly as vehicle electronics become more software-driven and networked.
Increasing rivalry with other semiconductor technologies
Despite SOI's benefits, other semiconductor technologies-most notably FinFET and advanced bulk CMOS-are a serious threat. At advanced process nodes, FinFET in particular is widely used due to its exceptional power efficiency and scalability. Large foundries like TSMC and Intel have a competitive edge in terms of maturity, cost-effectiveness at scale, and ecosystem support because they have optimized their FinFET processes for mass production. Furthermore, bulk silicon technologies keep getting better at controlling leaks and performing better, which puts SOI's distinctive value proposition in jeopardy, particularly in high-volume manufacturing and consumer electronics that are cost-sensitive.
The COVID-19 pandemic affected the silicon on insulators (SOI) market in a variety of ways. Delays in semiconductor production and SOI wafer deliveries were initially caused by workforce shortages, factory closures, and global supply chain disruptions, which had an impact on end-use industries like consumer electronics and the automotive sector. The pandemic did, however, also hasten digital transformation by raising demand for data centers, 5G infrastructure, and connected devices-all of which depend on high-performance, energy-efficient semiconductors, of which SOI technology is essential. Moreover, the long-term outlook for the SOI market improved as remote work, online services, and edge computing gained popularity.
The radio frequency (RF) devices segment is expected to be the largest during the forecast period
The radio frequency (RF) devices segment is expected to account for the largest market share during the forecast period. The growing use of SOI-based RF chips in smart phones, tablets, and 5G communication systems is primarily responsible for this dominance. RF-SOI technology is perfect for front-end modules used in wireless communication because it provides high performance at high frequencies, low power consumption, and excellent isolation. Demand for RF-SOI devices is still being driven by the increase in global mobile data traffic, as well as the development of 5G infrastructure and IoT connectivity. Furthermore, RF applications play a significant role in the expansion of the SOI market as a whole.
The smart cut segment is expected to have the highest CAGR during the forecast period
Over the forecast period, the smart cut segment is predicted to witness the highest growth rate. The precise layer transfer made possible by Smart Cut technology makes it possible to fabricate thin, homogeneous silicon layers on insulating substrates with great accuracy and few flaws. This technique is frequently used to create sophisticated SOI wafers with improved scalability, lower power consumption, and superior electrical performance-all of which are critical for next-generation semiconductor applications like 5G, artificial intelligence, and high-speed computing. Moreover, its quick rise in the global SOI market is being fueled by its expanding use in RF devices, power electronics, and high-performance logic circuits.
During the forecast period, the North America region is expected to hold the largest market share, driven by the widespread adoption of cutting-edge technologies across industries, the presence of prominent semiconductor companies, and sophisticated research facilities. Strong demand for SOI-based products in industries like consumer electronics, autonomous vehicles, defense systems, and 5G infrastructure benefits the region. With large investments in semiconductor fabrication and design, the U.S. in particular is a major center for innovation in RF devices, MEMS, and power semiconductors. Additionally, North America's dominance in the SOI market is being further cemented by government initiatives that support domestic chip manufacturing and the growth of 5G networks.
Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR. The region's growing electronics manufacturing base, increased investments in semiconductor fabrication and growing use of SOI technology in cutting-edge applications like 5G, IoT, and electric vehicles are all contributing factors to this quick growth. Leading the way are nations like China, South Korea, Taiwan, and Japan, who have substantial R&D expenditures, supportive governments, and advantageous policies. Furthermore, Asia-Pacific's adoption of SOI is further accelerated by the rise in demand for high-performance, energy-efficient chips in consumer electronics and industrial automation.
Key players in the market
Some of the key players in Silicon on Insulators Market include Murata Manufacturing Co., Ltd., IBM, Sumco Corporation, Qorvo, Inc., Shin-Etsu Chemical Co., Ltd., NXP Semiconductors N.V., Magnachip Semiconductor Inc, Qualcomm Inc., Wafer World Inc., Silicon Valley Microelectronics, Inc., United Microelectronics Corporation, STMicroelectronics N.V., Intel Corporation, Skyworks Solutions, Inc. and Ultrasil Corporation.
In February 2025, Murata Electronics (India) Private Limited, a subsidiary of Murata Manufacturing Co. Ltd., has signed an agreement to lease a factory at the OneHub Chennai Industrial Park, Tamil Nadu. The Japanese firm will commence full-scale operation in financial year 2026.
In February 2025, NXP Semiconductors N.V. announced it has entered into a definitive agreement to acquire Kinara, Inc., an industry leader in high performance, energy-efficient and programmable discrete neural processing units (NPUs). These devices enable a wide range of edge AI applications, including multi-modal generative AI models.
In September 2024, IBM and L&T Semiconductor Technologies (SiLT) have signed an agreement to co-develop advanced processors for edge devices, hybrid cloud systems and areas like mobility, industrial, energy, and servers. In a social media post, Union Minister for Information and Broadcasting and Electronics and IT Ashwini Vaishnaw said that this partnership will boost India's semiconductor capabilities by creating competitive products for global markets.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.