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市場調查報告書
商品編碼
1679293
系統晶片(SoC)市場至2030年的預測:按類型、技術、應用、最終用戶和地區的全球分析System-on-Chip (SoC) Market Forecasts to 2030 - Global Analysis By Type (Digital SoC, Analog SoC, Mixed-Signal SoC, Application-Specific SoC, Programmable SoC and Other Types), Technology, Application, End User and By Geography |
根據 Stratistics MRC 的資料,全球系統晶片(SoC)市場在2024年達到 1,879億美元,到2030年將達到 3,566億美元,預測期內的年複合成長率為 10.5%。
系統晶片(SoC)是一種積體電路,它將電子系統或電腦所需的所有組件組合到一塊小晶片上。這些元素通常包括記憶體、輸入/輸出埠、中央處理單元(CPU)、圖形處理單元(GPU)和其他周邊設備。 SoC 可最大限度地提高效能和功率效率,使其成為穿戴式技術、嵌入式系統、行動裝置和物聯網裝置等應用的理想選擇。 SoC 透過減少對多個獨立組件的需求並實現更輕、更緊湊的設計,促進了現代電子產品的發展和智慧連網設備的普及。
根據Ericsson最新的行動報告,預計到2023年底,全球 5G 行動用戶將超過 15億,這將對能夠支援高資料速度和高效電源管理的先進 SoC 解決方案產生巨大的需求。
對高效能運算和人工智慧整合的需求不斷成長
消費性電子、醫療保健和汽車行業等各個領域的人工智慧應用的成長,推動了對具有更高處理能力的更先進的SoC 的需求。為了最佳化機器學習工作負載並實現即時決策和提高效率,最新的SoC 配備了專用的AI 加速器、GPU 和 NPU。此外,資料中心和雲端處理基礎設施的成長推動了對能夠管理具有挑戰性的運算任務的高效能處理器的需求。
先進製造製程高成本
設計、檢驗和測試晶片需要大量的研發投入,這可能會為中小企業進入市場設置障礙。隨著半導體技術發展到 5nm 和 3nm 等更小的製程節點,製造複雜性增加,導致資本和營運成本增加。此外,對極紫外線(EUV)技術等先進微影術設備的需求進一步增加了製造成本,阻礙了市場成長。
連網設備的興起
由於數十億連網裝置需要小型、高效的處理單元,SoC 正成為促進順暢通訊和資料處理的越來越受歡迎的選擇。低功耗 SoC 正用於在醫療保健、工業自動化和智慧家庭等領域提供複雜的功能和即時監控。 5G網路的推出進一步推動了對提供高速連接和低延遲操作的整合晶片解決方案的需求。
持續的半導體短缺和地緣政治風險
嚴重依賴三星和台積電等幾家主要半導體製造商,造成了供應限制,影響了各個領域的SoC 供應。全球生產和分配受到美國和中國等主要經濟體之間爭端導致的貿易限制的影響。此外,地震或停電等自然災害導致生產停頓可能會進一步對半導體供應鏈造成壓力。
COVID-19的影響
COVID-19 疫情對 SoC 市場產生了多種影響。一方面,封鎖期間對遠距工作、線上教育和數位娛樂的需求增加,推動了對先進運算解決方案的需求,刺激了對 SoC 的需求。加速數位轉型舉措和雲端服務的採用進一步推動市場成長。同時,疫情擾亂了供應鏈,導致生產延誤,同時也透過增加成本和減少消費者支出對市場產生了影響。
預計數位 SoC 領域在預測期內將佔據最大佔有率
由於其高處理能力和多功能性,數位 SoC 領域預計將在預測期內佔據最大的市場佔有率。對智慧型手機、平板電腦和其他連網型設備的需求不斷成長,推動了數位 SoC 的採用。此外,將人工智慧和機器學習功能整合到數位 SoC 中增強其性能和能力,促進市場成長。
在預測期內,晶片結構區隔將以最高的年複合成長率成長。
推動先進 SoC 需求的晶片結構區隔預計將在預測期內見證最高成長率。不斷增加的應用複雜性和效能要求晶片結構不斷演進。此外,RISC-V 和其他開放原始碼架構的日益普及,由於其靈活性和成本優勢,進一步推動了該市場的快速成長。
由於家電行業的擴張、都市化的加快以及智慧型設備的普及,預計亞太地區將在預測期內佔據最大的市場佔有率。在政府措施和半導體製造業投資的支持下,中國、日本和韓國等國家在先進 SoC 的採用方面處於領先地位。對高效能運算和人工智慧應用的需求不斷成長,進一步推動了亞太地區的市場成長。
預計北美地區在預測期內將呈現最高的年複合成長率。同時,汽車、醫療保健和通訊等行業對先進運算解決方案的需求不斷成長,推動了北美對 SoC 的採用。此外,對人工智慧和數位轉型的日益關注也將推動該地區半導體製造能力對先進 SoC 的需求,進一步推動市場成長。
According to Stratistics MRC, the Global System-on-Chip (SoC) Market is accounted for $187.9 billion in 2024 and is expected to reach $356.6 billion by 2030 growing at a CAGR of 10.5% during the forecast period. A System-on-Chip (SoC) is a single integrated circuit that combines all of the necessary parts of an electronic system or computer into a single, small chip. These elements usually include of memory, input/output ports, a central processing unit (CPU), a graphics processing unit (GPU), and other peripherals. SoCs are perfect for applications in wearable technology, embedded systems, mobile devices, and Internet of Things devices because of their ability to maximize performance and power efficiency. SoCs aid in the development of contemporary electronics and the spread of intelligent, networked devices by reducing the need for several separate components and enabling lighter, more compact designs.
According to Ericsson's latest mobility report, 5G mobile subscriptions are expected to surpass 1.5 billion globally by the end of 2023, creating substantial demand for advanced SoC solutions that can support high-speed data processing and efficient power management.
Growing demand for high-performance computing & AI integration
The need for sophisticated SoCs with more processing capacity is being driven by the growth of AI-powered applications in a variety of sectors, including as consumer electronics, healthcare, and the automotive industry. In order to optimize machine learning workloads and provide real-time decision-making and increased efficiency, modern SoCs have specialized AI accelerators, GPUs, and NPUs. High-performance processors that can manage challenging computational processes are also becoming more and more necessary as data centers and cloud computing infrastructure growth.
High cost of advanced manufacturing processes
Chip design, verification, and testing require significant research and development (R&D) investments, which can be a barrier for smaller companies entering the market. The complexity of fabrication increases as semiconductor technology advances to smaller process nodes like 5nm and 3nm, resulting in higher capital expenditures and operational costs. Additionally, the need for sophisticated lithography equipment, such as extreme ultraviolet (EUV) technology, further adds to manufacturing expenses hampering the market growth.
Growing number of connected devices
SoCs are increasingly the go-to option for facilitating smooth communication and data processing as billions of networked devices demand small, effective processing units. Low-power SoCs are being used by sectors including healthcare, industrial automation, and smart homes to provide sophisticated features and real-time monitoring. The need for integrated chip solutions that provide high-speed connection and low-latency operations is being further fueled by the rollout of 5G networks.
Ongoing semiconductor shortage & geopolitical risks
The significant reliance on a small number of major semiconductor producers, namely Samsung and TSMC, has resulted in supply constraints that have an impact on the availability of SoCs in a variety of sectors. Global production and distribution have been impacted by trade restrictions resulting from disputes between major economies, such as the US and China. Additionally, natural calamities, such as manufacturing shutdowns due to earthquakes or power outages, can further strain semiconductor supply networks.
Covid-19 Impact
The COVID-19 pandemic has had a mixed impact on the SoC market. On one hand, the increased demand for remote work, online education, and digital entertainment during lockdowns has driven the need for advanced computing solutions, boosting the demand for SoCs. The acceleration of digital transformation initiatives and the adoption of cloud services have further supported market growth. On the other hand, the pandemic has disrupted supply chains, leading to delays in production and increased costs and reduced consumer spending have also affected the market.
The digital SoC segment is expected to be the largest during the forecast period
The digital SoC segment is expected to account for the largest market share during the forecast period due to their high processing power and versatility. The growing demand for smartphones, tablets, and other connected devices drives the adoption of digital SoCs. Additionally, the integration of AI and machine learning capabilities into digital SoCs enhances their performance and functionality contributing to the market growth.
The chip architecture segment is expected to have the highest CAGR during the forecast period
Over the forecast period, the chip architecture segment is predicted to witness the highest growth rate driving the demand for advanced SoCs. The increasing complexity of applications and the need for higher performance levels require continuous advancements in chip architecture. The adoption of RISC-V and other open-source architectures is also gaining traction, providing flexibility and cost advantages further support the rapid growth of this market.
During the forecast period, the Asia Pacific region is expected to hold the largest market share driven by the expanding consumer electronics industry, rising urbanization, and increasing adoption of smart devices. Countries like China, Japan, and South Korea are leading the adoption of advanced SoCs, supported by government initiatives and investments in semiconductor manufacturing. The growing demand for high-performance computing and AI applications further drives market growth in Asia Pacific.
Over the forecast period, the North America region is anticipated to exhibit the highest CAGR due to the growing demand for advanced computing solutions in industries such as automotive, healthcare, and telecommunications drives the adoption of SoCs in North America. Moreover, increasing focus on AI and digital transformation also boosts the demand for advanced SoCs in the region semiconductor manufacturing capabilities further support market growth.
Key players in the market
Some of the key players in System-on-Chip (SoC) market include Apple Inc., Broadcom Inc., HiSilicon, Huawei Technologies Co. Ltd, Infineon Technologies, Intel Corporation, Magna International Inc, Maxim Integrated Products, Inc, Mediatek Inc., Microchip Technology Inc., NXP Semiconductors NV, ON Semiconductor Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co. Ltd, STMicroelectronics NV, Taiwan Semiconductor (TSMC), Texas Instruments Incorporated and Toshiba Corporation.
In February 2025, Broadcom Inc announced availability of its end-to-end PCIe Gen 6 portfolio. Broadcom has further extended its multi-generational PCIe leadership by allowing early access to its PCIe Gen 6 Interop Development Platform (IDP), which simplifies interoperability and system design.
In February 2025, Algeria Telecom and Huawei announced the official launch of the national 400G WDM project, building an all-optical premium transmission foundation covering the whole country, helping Algeria accelerate the development of its national digital economy.
In January 2025, Infineon Technologies AG announced the formation of a new business unit to drive the company's growth in the area of sensors by combining the existing Sensor and Radio Frequency (RF) businesses into one dedicated organization.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.