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市場調查報告書
商品編碼
1489379
到 2030 年線上測試市場預測:按產品、組件、技術、應用、最終用戶和地區進行的全球分析In-Circuit Test Market Forecasts to 2030 - Global Analysis By Product (Bare Board Testing, In-Circuit Functional Testing, Analog Testing, Mixed Signal Testing and Other Products), Component, Technology, Application, End User and By Geography |
根據 Stratistics MRC 的數據,2023 年全球線上測試市場規模將達到 13.2 億美元,預計到 2030 年將達到 16.4 億美元,預測期內複合年成長率為 4.6%。
線上測試是電子製造中用於檢查印刷基板組件 (PCBA) 品質的方法。測試是透過連接到 PCB 的組件進行的。 ICT 有助於識別元件值不正確、開路和短路等缺陷。 ICT 是一種在 PCBA 投入生產之前驗證其完整性的快速有效方法,有助於提高整體產品可靠性和品管。
根據台灣電路板協會(TPCA)的深入分析,日韓PCB產業憑藉其終端產品設計能力,策略性地從低階產品向中階產品轉移,市場佔有率已達到15.31%。
電子設備的複雜性不斷增加
隨著電子設備變得越來越複雜,元件密集且功能先進,傳統的檢測方法可能無法準確檢測缺陷。 ICT 提供精確的測試能力,可以識別複雜電路中的缺陷,確保電子組件的品質和可靠性。這種日益增加的複雜性突顯了 ICT 滿足消費者和行業要求的嚴格品質標準的重要性,從而刺激了市場擴張。
測試複雜零件的局限性
由於存取點有限、設計複雜以及無法測試積體電路等不可存取的元件等因素,線上測試 (ICT) 在測試複雜元件方面面臨限制。這些挑戰阻礙了 ICT 檢測某些類型缺陷的能力,例如間歇性缺陷或複雜零件內的缺陷。因此,ICT 可能無法為高度複雜的電子元件組件提供全面的測試範圍。隨著製造商尋求更全面的測試解決方案,這種限制可能會阻礙市場成長。
電子元件的小型化
電子元件小型化的趨勢正在推動線上測試的發展,這需要更精確和可靠的測試方法。隨著電子元件變得越來越小且電路基板的封裝越來越密集,缺陷和故障的風險也隨之增加。 ICT 提供了一種高精度的方法來檢測這些問題,確保小型電子組件的品質和可靠性。因此,隨著小型化趨勢的發展,對 ICT 解決方案的需求也不斷增加。
相容性問題
線上測試中的相容性問題源自於 ICT 系統需要與不同的電子元件和元件有效連接。缺乏相容性會導致效率低下、不準確並增加測試時間,從而降低生產效率並增加製造商的成本。此外,不斷發展的行業標準和技術使相容性挑戰更加複雜化,這可能會限制 ICT 解決方案的有效性和採用,從而阻礙市場成長。
COVID-19 的影響
COVID-19 的疫情對線上測試市場產生了各種影響。最初,由於全球供應鏈和製造業務中斷,對 ICT 解決方案的需求放緩。然而,隨著各行業適應遠距工作和數位轉型的加速,ICT技術的需求不斷增加。此外,對支援遠端工作和線上活動的通訊基礎設施和電子設備的日益重視進一步增加了對 ICT 解決方案的需求。
模擬測試部分預計將成為預測期內最大的部分
模擬測試領域預計將出現良好的成長。 ICT 中的類比測試涉及檢驗印刷基板(PCB) 上的電阻器、電容器和放大器等類比元件的功能和性能。此測試可確保類比電路符合指定的容差和性能標準。它們在確保類比電子組件的品質和可靠性方面發揮關鍵作用,特別是在需要精確類比訊號處理的應用中,例如音訊、視訊和基於感測器的系統。
設計檢驗測試領域預計在預測期內複合年成長率最高。
預計設計檢驗測試領域在預測期內將出現最高的複合年成長率。 DVT 中利用 ICT 在產品開發的早期階段檢驗電子設計的功能和性能。透過對原型和早期設計進行 ICT 測試,工程師可以識別並糾正潛在的設計缺陷,並確保最終產品符合性能規格和品質標準。 ICT 透過及早發現問題來簡化產品開發流程,減少製造週期後期昂貴的設計修改的需要,並最終縮短上市時間並提高整體產品可靠性。
由於電子製造業強勁,預計亞太地區在預測期內將佔據最大的市場佔有率。中國、日本、韓國和台灣等國家是主要貢獻者,擁有大量電子製造商和組裝廠。該地區受益於技術熟練的勞動力、技術進步以及支持電子產業的有利政府政策等因素。此外,消費性電子、汽車電子和通訊基礎設施的需求不斷成長,進一步推動亞太地區ICT解決方案的採用,維持該地區的成長和在全球ICT市場的主導地位。
由於其強大的電子製造生態系統和技術創新,預計北美在預測期內將呈現最高的複合年成長率。該地區擁有大量領先的 ICT 解決方案提供商和電子公司,尤其是在美國和加拿大。嚴格的品質標準、對先進電子產品的高需求以及對研發的重視等因素促進了北美ICT市場的穩定成長。
According to Stratistics MRC, the Global In-Circuit Test Market is accounted for $1.32 billion in 2023 and is expected to reach $1.64 billion by 2030 growing at a CAGR of 4.6% during the forecast period. In-Circuit Test is a method used in electronics manufacturing to verify the quality of printed circuit board assemblies (PCBAs). It involves testing components while they are still mounted on the PCB. ICT helps identify faults such as incorrect component values, open circuits, and shorts. It's a fast and efficient way to ensure the integrity of PCBAs before they move to further stages of production, contributing to overall product reliability and quality control.
According to the insightful analysis provided by the Taiwan Printed Circuit Association (TPCA), Japanese and South Korean PCB industries, by leveraging their design prowess in terminal products, have strategically transitioned from low to mid-range products with a market share of 15.31%.
Increasing complexity of electronic devices
As electronic devices become more intricate with densely packed components and advanced functionalities, traditional testing methods may fall short in detecting defects accurately. ICT offers precise testing capabilities that can identify faults within complex circuitry, ensuring the quality and reliability of electronic assemblies. This growing complexity underscores the importance of ICT in meeting the stringent quality standards demanded by consumers and industries, thereby fueling its market expansion.
Limitations in testing complex components
In-Circuit Test (ICT) faces limitations in testing complex components due to factors like limited access points, intricate designs, and the inability to test non-accessible components like integrated circuits. These challenges hinder ICT's ability to detect certain types of defects, such as intermittent faults or defects within complex components. Consequently, ICT may not provide comprehensive testing coverage for highly complex electronic assemblies. This limitation can hamper market growth as manufacturers seek more comprehensive testing solutions.
Miniaturization of electronic components
The rising trend of miniaturization in electronic components fuels the growth of the in-circuit test by necessitating more precise and reliable testing methods. As electronic components become smaller and more densely packed on circuit boards, the risk of defects and faults increases. ICT offers a highly accurate means of detecting these issues, ensuring the quality and reliability of miniaturized electronic assemblies. Consequently, the demand for ICT solutions rises in tandem with the miniaturization trend.
Compatibility issues
Compatibility issues in in-circuit test arise due to the need for ICT systems to interface effectively with a wide range of electronic components and assemblies. Lack of compatibility can lead to inefficiencies, inaccuracies, and increased testing times, hampering productivity and increasing costs for manufacturers. Moreover, evolving industry standards and technologies further compound compatibility challenges, potentially limiting the effectiveness and adoption of ICT solutions, thereby impeding market growth.
Covid-19 Impact
The covid-19 pandemic has had a mixed impact on the in-circuit test market. Initially, disruptions in global supply chains and manufacturing operations led to a slowdown in demand for ICT solutions. However, as industries adapted to remote work and digital transformation accelerated, there was a subsequent increase in demand for ICT technologies. Additionally, the growing emphasis on telecommunication infrastructure and electronic devices to support remote work and online activities further boosted the demand for ICT solutions, albeit with some fluctuations due to ongoing economic uncertainties.
The analog testing segment is expected to be the largest during the forecast period
The analog testing segment is estimated to have a lucrative growth. Analog testing in ICT involves verifying the functionality and performance of analog components such as resistors, capacitors, and amplifiers on a printed circuit board (PCB). This testing ensures that analog circuits meet specified tolerances and performance criteria. It plays a crucial role in ensuring the quality and reliability of analog electronic assemblies, especially in applications where precise analog signal processing is essential, such as audio, video, and sensor-based systems.
The design verification testing segment is expected to have the highest CAGR during the forecast period
The design verification testing segment is anticipated to witness the highest CAGR growth during the forecast period. ICT is utilized in DVT to validate the functionality and performance of electronic designs during the early stages of product development. By subjecting prototypes or initial designs to ICT, engineers can identify and rectify potential design flaws, ensuring that the final product meets performance specifications and quality standards. It helps streamline the product development process by detecting issues early, reducing the need for costly design revisions later in the production cycle, and ultimately improving time-to-market and overall product reliability.
Asia Pacific is projected to hold the largest market share during the forecast period due to its robust electronics manufacturing sector. Countries like China, Japan, South Korea, and Taiwan are key contributors, hosting numerous electronics manufacturers and assembly plants. The region benefits from factors such as skilled labor, technological advancements, and favorable government policies supporting the electronics industry. Additionally, the increasing demand for consumer electronics, automotive electronics, and telecommunications infrastructure further drives the adoption of ICT solutions in the Asia-Pacific region, sustaining its growth and prominence in the global ICT market.
North America is projected to have the highest CAGR over the forecast period, owing to its robust electronics manufacturing ecosystem and technological innovation. The region boasts a significant presence of leading ICT solution providers and electronics companies, particularly in the United States and Canada. Factors such as stringent quality standards, high demand for advanced electronic products, and a focus on research and development contribute to the steady growth of the ICT market in North America.
Key players in the market
Some of the key players profiled in the In-Circuit Test Market include Keysight Technologies, Teradyne, Advantest Corporation, SPEA S.p.A., Test Research Inc. (TRI), Digitaltest GmbH, JTAG Technologies, Seica S.p.A., Hioki E.E. Corporation, ASSET InterTech, Averna, Acculogic Inc. and Konrad GmbH.
In November 2020, Hioki launched the In-Circuit Tester FA1220-02. It is the space-saving design system generating pass/fail judgments for circuit boards that are populated with electronic components. Its slide-in mechanism simplifies installation and removal of test fixtures, reducing man-hours and workload and improving productivity in populated board testing and production environments.
In February 2020, Test Research, Inc. (TRI) launched the TR5001 SII LED Series, a multicore In-Circuit Test (ICT) solution for LED lighting. The TR5001 SII LED Series is an ICT+FCT innovation that can test up to 1080 LED channels for color and brightness simultaneously. It has up to four independent cores for multi-core parallel testing and a quick disconnection interface.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.