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市場調查報告書
商品編碼
1403360
2030年全球半導體雙面曝光機市場預測:按類型、技術、應用和地區分析Double-Sided Exposure Machine for Semiconductor Market Forecasts to 2030 - Global Analysis By Type (Semi Automatic and Fully Automatic), Technology (Photolithography and E-beam Lithography), Application and By Geography |
根據 Stratistics MRC 的數據,全球半導體雙面曝光機市場預計在預測期內將以 5.5% 的複合年成長率成長。
用於半導體生產的專用工具稱為半導體雙面曝光機。它採用先進的光學元件和光源將複雜的電路圖案投影到晶圓的抗蝕劑塗層表面上。其精度和效率對於維持半導體製造所需的高標準至關重要,其中奈米級特徵和精確對準對於成功生產尖端電子設備至關重要。
據聯華電子稱,該工廠也將成為新加坡最先進的半導體代工廠之一,將生產22奈米和28奈米晶片。
雙面曝光機能夠生產滿足這些新興技術(例如 5G、邊緣運算和電動車)要求的半導體。這些持續的技術進步正在汽車、醫療保健和通訊等多個行業中實施。我們也致力於生產這些應用所需的高密度、高效能晶片,支援市場擴張。
由於這些先進系統的集中密集性質,製造商,特別是中小型企業面臨財務挑戰。有限的競爭可能會導致價格上漲。此外,行業成本敏感度和要求可能會降低持續技術進步的廣泛採用,這對市場成長構成了主要障礙。
具有垂直堆疊半導體層的 3D 積體電路 (IC) 需要在晶圓的兩側進行精確且同步的曝光。將機器學習和人工智慧融入曝光機有助於提高對準精度、錯誤偵測和校正精度。此外,這些技術旨在提高整體生產力並滿足不斷發展的電子行業的需求,該行業越來越依賴 3D IC 來提高性能和小型化,從而不斷成長的市場正在推動
專利糾紛會拖延新產品的開發和市場的開拓。這些機器中包含的複雜技術很容易受到專利糾紛和法律挑戰。法律模糊性為投資者和製造商創造了一個困難的環境,並透過影響產品價格、盈利和監管機構的潛在阻力來影響市場潛力。此外,對智慧財產權的擔憂也可能減少產業合作和收購,阻礙市場擴張。
半導體雙面曝光設備市場受到COVID-19爆發的負面影響。製造流程受到鎖定和限制、勞動力供應中斷、遠端工作挑戰和健康問題的影響,導致先進機械的開發和部署延遲和效率低下。此外,旅行限制使得國際合作和安裝變得困難,經濟挑戰迫使一些公司推遲或取消擴建計劃。
半自動部分估計佔最大佔有率。這是指將手動控制與先進自動化功能結合的設備,包括提高曝光過程的準確性和效率的自動化功能,提供一定程度的彈性和人為控制。隨著技術的進步,這些設備不斷發展,將提高準確性、速度和整體性能的技術融入到尋求可自訂和適應性流程的半導體製造商的經濟高效的解決方案中,這支持了該領域的擴展。
光刻產業預計在預測期內將出現最高的複合年成長率,因為它涉及將複雜電路圖案精確轉移到半導體晶圓上所需的設備。 EUV 微影、高解析度成像和先進半導體元件等多種圖案化技術的進步對於從通訊和電子到人工智慧和物聯網等新興技術的廣泛應用至關重要。此外,這些設備使用先進的光學技術來確保晶圓兩面同時精確對準和曝光,這顯著推動了市場成長。
由於影響半導體生產的政府法律和法規,歐洲在預測期內佔據了最大的市場佔有率。歐盟(EU)重視研究、技術和創新,為半導體產業的發展創造了有利的環境。德國、英國、荷蘭等國家處於半導體技術發展的前端。政府計劃以及學術機構和行業相關人員之間的合作有助於該地區在半導體創新方面的領導地位,從而推動該地區的成長。
由於現代半導體研究、自動化、材料和精密光學的持續發展,預計北美在預測期內將呈現最高的複合年成長率。尼康公司、ASML Holding NV、佳能公司和上海微電子設備(集團)有限公司等大公司為該地區的卓越技術做出了貢獻。由熟練的專業人員、研究設施和機械組成的強大生態系統滿足了推動市場擴張的行業不斷變化的需求。
According to Stratistics MRC, the Global Double-Sided Exposure Machine for Semiconductor Market is accounted for growing at a CAGR of 5.5% during the forecast period. A specialized tool used in the production of semiconductors is known as double-sided exposure machine for semiconductors. It employs advanced optics and light sources to project intricate circuit patterns onto the photoresist-coated surfaces of the wafer. Its precision and efficiency are essential for maintaining the high standards required in semiconductor manufacturing, where nanoscale features and precise alignment are paramount for the successful production of cutting-edge electronic devices.
According to UMC, it would also be one of the most advanced semiconductor foundries in Singapore and will produce 22 nm and 28 nm chips.
Double-Sided Exposure Machines enable the fabrication of semiconductors that meet the requirements of these emerging technologies, including 5G, edge computing, and electric vehicles. These ongoing technological advancements are implemented in various industries, including automotive, healthcare, and communications. In addition, they contribute to the production of high-density and high-performance chips needed for these applications, which is boosting market expansion.
Manufacturers, especially smaller ones, face financial challenges due to the capital-intensive nature of these advanced systems. Limited competition can contribute to higher prices, as manufacturers may have more control over pricing in the absence of extensive alternatives. In addition, the widespread adoption of ongoing technological advancements may be decreased by the industry's cost sensitivity and requirements, which significantly hamper the market's growth.
3D three-dimensional integrated circuits (ICs), with vertically stacked semiconductor layers, demand precise and simultaneous exposure on both sides of wafers. Incorporating machine learning and artificial intelligence into exposure machines can contribute to better alignment accuracy, error detection, and correction. Additionally, these technologies aimed at improving overall productivity, meeting the demands of an evolving electronics industry that increasingly relies on 3D ICs for improved performance and miniaturization, thereby driving market's expansion.
Patent disputes can cause delays in new product development and market launches. The complex technologies involved in these machines make them susceptible to patent disputes and legal challenges. Legal ambiguities affect the market's potential by creating a difficult environment for investors and manufacturers, influencing product pricing, profitability, and potential resistance from regulatory authorities. Furthermore, IP concerns may also decrease industry-player collaboration or acquisitions, which can hinder market expansion.
The market for double-sided exposure machines for semiconductors was adversely affected by the COVID-19 pandemic. Manufacturing processes were impacted by lockdowns and restrictions, disruptions to workforce availability, remote work challenges, and health concerns, which contributed to delays and inefficiencies in the development and deployment of advanced machinery. Additionally, travel restrictions made it more difficult to collaborate and install internationally, and economic challenges prompted some companies to delay or cancel expansion projects, which thereby hampered market growth.
The semi automatic segment is estimated to hold the largest share. It refers to equipment that combines advanced automation features with manual control including automated features to improve accuracy and exposure process efficiency, providing a certain amount of flexibility and human control. As technology advances, these machines continue to evolve, incorporating technologies to enhance precision, speed, and overall performance with cost-effective solutions for semiconductor manufacturers seeking customizable and adaptable processes which are boosting this segment expansion.
The photolithography segment is anticipated to have highest CAGR during the forecast period, due to it deals with devices that are necessary for accurately transferring complex circuit patterns onto semiconductor wafers. Advancements in multiple patterning techniques, such as EUV lithography, high-resolution imaging, and advanced semiconductor devices are essential for a wide range of applications, from telecommunications and electronics to emerging technologies like artificial intelligence and the Internet of Things. In addition, these devices use sophisticated optical methods to simultaneously assure precise alignment and exposure on both sides of the wafer which significantly drive market's growth.
Europe commanded the largest market share during the extrapolated period owing to government laws and regulations that affect the production of semiconductors. The European Union prioritizes research, technology, and innovation, creating an environment that is favorable for advancements in the semiconductor industry. Countries like Germany, the United Kingdom, and the Netherlands are at the forefront of semiconductor technology development. Government programs and collaborations between academic institutions and industry players contribute to the region's leadership in semiconductor innovation and thereby boosting the region's growth.
North America is expected to witness highest CAGR over the projection period, owing to modern semiconductor research and ongoing developments in automation, materials, and precision optics. Some of the major key players including Nikon Corporation, ASML Holding NV, Canon Inc. and Shanghai Micro Electronics Equipment (Group) Co., Ltd. are contributing in developing the region's technological excellence. Strong ecosystem of skilled professionals and research facilities, machines, are meeting the evolving needs of the industry which are propelling the market expansion.
Some of the key players in the Double-Sided Exposure Machine for Semiconductor Market include ORC Manufacturing, Ushio Lighting, Csun, Canon Inc, Orbotech Ltd., Neutronix Quintel, Idonus Sarl, Seimyung Vactron, Adtec Engineering and ASML Holding N.V.
In November 2023, Neutronix-Quintel, Inc., a leading provider of production photolithography equipment, announced the introduction of the NxQ 8000 CT mask aligner to be used for advanced applications.
In October 2023, Canon, a leader in production inkjet presses, announced a technology preview of the Canon varioPRINT iX1700, a new 170 A4 images per minute, sheetfed inkjet press, at Canon Expo in Yokohama, Japan.
In September 2023, Independent visual content provider, EPA Images, announced a five-year partnership with Canon Europe to renew and update its photography and videography equipment to confront the challenges in a changing world.