查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
晶片雷射開蓋機市場預測至2030年：按類型、應用和地區分類的全球分析
市場調查報告書
商品編碼
1383376

晶片雷射開蓋機市場預測至2030年：按類型、應用和地區分類的全球分析

Chip Laser Decapping Machine Market Forecasts to 2030 - Global Analysis By Type, Application (Integrated Circuits Trays, Plastic Packaged Devices, Printed Circuit Board Boards, Power Devices and Other Applications) and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據Stratistics MRC的資料，2023年全球晶片雷射開蓋機市場規模為3.048億美元，預計到2030年將達到4.927億美元，預測期內CAGR為7.1%。

半導體產業使用的一種複雜工具稱為晶片雷射開蓋機，用於精確去除積體電路（IC）晶片上的保護塗層，例如環氧模塑膠和陶瓷封裝。該設備使用聚焦雷射光束根據需要去除封裝，同時保護底層 IC，使工程師和科學家能夠檢查晶片的內部結構，以進行品質保證、設計分析和缺陷查找。

對非破壞性開蓋的需求不斷增加

非破壞性開蓋允許打開並分析積體電路（IC）等半導體零件，而不會影響其結構完整性。此外，它對於故障分析、品管和逆向工程非常重要，因為它可以恢復有價值、昂貴或稀有的 IC。此外，這種非破壞性能力在鑑識調查中的證據保存或需要拆卸和重新組裝 IC 時受到高度歡迎，無需新樣本即可進行更徹底的檢查。此外，它還透過減少更換昂貴 IC 的需要來降低成本。因此，該策略將提高半導體分析和研究的有效性和適應性，推動市場成長。

高成本

晶片雷射開蓋設備市場由於需要大量的初始投資而存在許多困難。最初，小型和大型半導體公司都可能對採用這項技術猶豫不決，因為它帶來了巨大的財務負擔。此外，高昂的初期成本阻礙了新進入者和新興企業進入市場。此外，由於阻礙市場競爭和創新的高資本要求，採用率可能會下降。

技術進步

對小型化、提高性能和擴大效用的需求推動半導體封裝技術的快速發展。此外，當包括到覆晶、球柵陣列（BGA）和晶圓級封裝等各種晶片封裝的開蓋時，晶片雷射壓蓋機提供了尖端的解決方案來支援先進半導體裝置的設計和測試。此外，消費者對電子產品、汽車電子和物聯網（IoT）應用的需求不斷成長，推動全球電子製造業的成長。

缺乏技術專長和意識

晶片雷射開蓋機是一項相對較新且專業的技術。由於市場對其功能和優點的了解不足，這些機器可能不會廣泛採用。另外，晶片雷射開蓋機是一種先進的機器，需要技術專業知識來進行操作和維護，所以要操作機器、解決問題、提高機器的性能，需要有熟練的人力資源。因此，這些因素阻礙了市場的拓展。

COVID-19 的影響

晶片雷射開蓋機市場受到COVID-19疫情的多方面不利影響。此外，供應鏈和製造業的中斷以及封鎖和旅行限制導致生產延誤、獲得重要零件的機會有限以及維修和維護機器的困難。此外，隨著資源轉向與 COVID-19 相關的研究和診斷，其他技術領域，例如晶片雷射開蓋機等半導體分析工具，必須應對資金和關注度下降的問題。因此，由於疫情帶來的經濟不確定性所帶來的預算限制，許多企業無法購買和使用如此先進的機械，抑制了市場的擴張。

半自動化部門預計將成為預測期內最大的細分市場

半自動區隔估計佔有最大佔有率，因為存在以半自動區隔代表的結合手動和自動功能的開蓋型態。儘管這些儀器的開蓋程序是自動化的，但設置和樣品製備仍需要操作員的參與。此外，半自動機器具有多功能性、高效性以及創建客製化解決方案的能力，使其成為某些需要高度控制的半導體分析和逆向工程應用的絕佳選擇。因此，這些方面都大大推動了市場的擴張。

預計積體電路（IC）托盤細分市場在預測期內CAGR最高

由於用於對托盤中的 IC 進行開蓋的專用設備，預計積體電路（IC）托盤細分市場在預測期內將出現最高的CAGR。此外，這些托盤經常用於半導體測試和製造中，以處理和儲存 IC 晶片。 IC 托盤章節涵蓋了準確且非破壞性地對托盤中的 IC 晶片進行開蓋的要求，以實現品管、故障分析和逆向工程。此外，這些機器使用雷射技術去除封裝，同時保持 IC 的完整性。因此，確保半導體品質、高效有序發展尖端晶片技術非常重要。

佔有率最大的地區

北美擁有豐富的政府政策和援助，包括稅收優惠、補貼以及研發資助計劃，支持北美半導體產業。此外，這些舉措目的是培養創造力、推動半導體技術並增加行業競爭。此外，美國國家科學基金會（NSF）和國防部（DoD）等政府機構可能為半導體技術研究提供資金，以及晶片雷射開蓋機等專用工具的開發和應用也產生影響。因此，這些是推動市場規模擴大的一些因素。

CAGR最高的地區

由於致力於精度、自動化和效率的創新開蓋設備，預計歐洲在預測期內將出現最高的CAGR。這些創新還包括卓越的雷射技術，可實現更有選擇性和更精確的開蓋。此外，符合國際環境目標的環保開蓋技術的開發也受到歐洲對永續性的重視的影響。此外，透過學術機構和區域產業領導者之間的合作，故障評估和逆向工程能力得到了極大的提升。因此，歐洲在晶片雷射開蓋機市場的地位因其在這些領域的技術領先地位而得到加強。

提供免費客製化

訂閱此報告的客戶可以存取以下免費自訂選項之一：

  • 公司簡介
    • 其他市場參與企業的綜合分析（最多 3 家公司）
    • 主要企業SWOT分析（最多3家企業）
  • 區域細分
    • 根據客戶興趣對主要國家的市場估計/預測/CAGR（註：基於可行性檢查）
  • 競爭基準化分析
    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章 執行摘要

第2章 前言

  • 概述
  • 利害關係人
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 調查來源
    • 主要調查來源
    • 二次調查來源
    • 先決條件

第3章 市場趨勢分析

  • 介紹
  • 促進因素
  • 抑制因素
  • 機會
  • 威脅
  • 應用分析
  • 新興市場
  • 新型冠狀病毒感染疾病（COVID-19）的影響

第4章 波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭公司之間的敵對關係

第5章 全球晶片雷射開蓋機市場：依類型

  • 介紹
  • 半自動
  • 全自動
  • 其他類型

第6章 全球晶片雷射開蓋機市場：依應用分類

  • 介紹
  • 積體電路（IC）托盤
  • 塑膠包裝設備
  • 印刷基板（PCB）板
  • 功率元件
  • 其他用途

第7章 全球晶片雷射開蓋機市場：依地區

  • 介紹
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 歐洲其他地區
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 中東和非洲其他地區

第8章 進展

  • 合約、夥伴關係、協作和合資企業
  • 收購和合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第9章 公司簡介

  • Nisene Technology Group, Inc
  • Kaimeiwo Laser
  • Plasma-Therm LLC
  • Han's Laser
  • Rudolph Technologies
  • Wuhan Keyi Laser
  • Huacong Technology
  • Hamamatsu Photonics
  • Xcerra Corporation
  • Accurex Measurement
Product Code: SMRC24226

According to Stratistics MRC, the Global Chip Laser Decapping Machine Market is accounted for $304.8 million in 2023 and is expected to reach $492.7 million by 2030 growing at a CAGR of 7.1% during the forecast period. A complex tool used in the semiconductor industry is known as chip laser decapping machine, which is used to precisely remove protective coatings from integrated circuit (IC) chips like epoxy molding compounds or ceramic packaging. The device uses a concentrated laser beam to remove encapsulating materials on demand while protecting the underlying IC, and it gives engineers and scientists access to the interior workings of the chip for quality assurance, design analysis, and defect finding.

Market Dynamics:

Driver:

Rising demand in Non-destructive Decapping

It enables the opening and analysis of semiconductor components, such as integrated circuits (ICs), without affecting their structural integrity. Additionally, this is crucial for failure analysis, quality control, and reverse engineering, as it enables the recovery of valuable, expensive, or rare ICs. Moreover, in order to preserve evidence in forensic investigations or for ICs that need to be deconstructed and put back together again, this non-destructive capacity is highly sought because it eliminates the need for new samples and enables more thorough investigations. Furthermore, by reducing the need to replace priceless ICs, it also saves money. Thus, this strategy improves semiconductor analysis and research's effectiveness and adaptability, thereby drive the market growth.

Restraint:

High cost

There are a number of difficulties caused by the significant initial investment needed in the market for chip laser decapping machines. Initially, both small and major semiconductor companies may be discouraged from implementing this technology by the substantial financial burden it can cause. Furthermore, the significant beginning costs also prevent new and emerging enterprises from entering the market. Moreover, slower adoption rates might be caused by high capital needs, hence which also hinder market competition and innovation.

Opportunity:

Technological advancements

The requirements for downsizing, improved performance, and expanded usefulness are driving a rapid evolution in semiconductor packaging technology. Additionally, when it comes to decapping different chip packages, such as flip-chip, ball grid array (BGA), and wafer-level packages, chip laser decapping machines offer a cutting-edge solution that supports the design and testing of sophisticated semiconductor devices. Furthermore, increased consumer demand for electronic products, automotive electronics, and Internet of Things (IoT) applications is fueling the growth of the worldwide electronics manufacturing sector.

Threat:

Lack of technical expertise and awareness

Machines for chip laser decapping are a relatively new and specialized technology. These machines may not be widely adopted because of the market's inadequate knowledge of their capabilities and advantages. Additionally, chip laser decapping machines are sophisticated machines that demand technical expertise to operate and maintain, so to operate the machinery, resolve problems, and improve machine performance, skilled individuals are required. Hence, these factors hindering market expansion.

COVID-19 Impact

The chip laser decapping machine market was adversely affected by the COVID-19 epidemic in a number of ways. Additionally, production delays, limited access to essential components, and difficulties with machine repair and maintenance were caused by the global disruption of supply chains and manufacturing, as well as lockdowns and travel restrictions. Moreover, other technological fields, such as semiconductor analysis tools like chip laser decapping machines, had to deal with a reduction in funding and attention as resources were shifted to COVID-19-related research and diagnosis. Therefore, as a result of budget constraints brought on by the pandemic's economic uncertainty, many businesses were unable to purchase and use such advanced machinery, which restrained the market's expansion.

The semi-automatic segment is expected to be the largest during the forecast period

The semi-automatic segment is estimated to hold the largest share, due to a form of decapping equipment that combines manual and automated features is represented by the semi-automatic segment. Although the decapping procedure on these devices is automated, some operator involvement is necessary for setup or sample preparation. Furthermore, semi-automatic machines are the best option for certain semiconductor analysis and reverse engineering applications when a high level of control is required because they offer versatility, efficiency, and the ability to create customized solutions. Therefore, these aspects significantly boost the market expansion.

The integrated circuits (IC) trays segment is expected to have the highest CAGR during the forecast period

The integrated circuits (IC) trays segment is anticipated to have highest CAGR during the forecast period, due to specialized equipment made for decapping ICs contained in trays. Additionally, these trays are frequently used in semiconductor testing and manufacturing for handling and storing IC chips. The chapter on IC Trays deals with the requirement for precise, non-destructive decapsulation of chips inside of their trays, enabling quality control, failure analysis, and reverse engineering. Moreover, while maintaining the integrity of the ICs, these machines use laser technology to remove the encapsulating materials. Therefore, they are essential for ensuring semiconductor quality and the efficient and regulated development of cutting-edge chip technology.

Region with largest share:

North America commanded the largest market share during the extrapolated period owing to wider government measures and assistance, like tax incentives, subsidies, and funding programs for R&D, has aided the semiconductor industry in North America. Additionally, these initiatives seek to promote creativity, advance semiconductor technologies, and strengthen industry competition. Moreover, funding for semiconductor technology research has occasionally been provided by government organizations like the National Science Foundation (NSF) and the Department of Defense (DoD), which has a subsequent impact on the creation and application of specialized tools like chip laser decapping machines. Therefore, these are some of the factors which help in driving the market size.

Region with highest CAGR:

Europe is expected to witness highest CAGR over the projection period, owing to innovative decapping equipment that focus on accuracy, automation, and efficiency. The decapping procedure has been made easier by these innovations, which also include better laser technology for more selective and precise decapping. Additionally, the development of eco-friendly decapping techniques that are in line with international environmental goals has also been impacted by Europe's emphasis on sustainability. Furthermore, capabilities for failure assessment and reverse engineering have been significantly improved through collaboration between academic institutions and regional leaders in industry. Therefore, Europe's position in the market for chip laser decapping machines is strengthened by its technological leadership in these fields.

Key players in the market

Some of the key players in the Chip Laser Decapping Machine Market include: Nisene Technology Group, Inc, Kaimeiwo Laser, Plasma-Therm LLC, Han's Laser, Rudolph Technologies, Wuhan Keyi Laser, Huacong Technology, Hamamatsu Photonics, Xcerra Corporation and Accurex Measurement.

Key Developments:

In June 2019, Nanometrics Signs Agreement for Merger of Equals Combination With Rudolph Technologies.

In November 2018, Rudolph Technologies, Inc. announced the availability of its NovusEdge™ system for edge, notch and backside inspection of un-patterned wafers.

Types Covered:

  • Semi-Automatic
  • Full-Automatic
  • Other Types

Applications Covered:

  • Integrated Circuits (IC) Trays
  • Plastic Packaged Devices
  • Printed Circuit Board (PCB) Boards
  • Power Devices
  • Other Applications

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 Emerging Markets
  • 3.8 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Chip Laser Decapping Machine Market, By Type

  • 5.1 Introduction
  • 5.2 Semi-Automatic
  • 5.3 Full-Automatic
  • 5.4 Other Types

6 Global Chip Laser Decapping Machine Market, By Application

  • 6.1 Introduction
  • 6.2 Integrated Circuits (IC) Trays
  • 6.3 Plastic Packaged Devices
  • 6.4 Printed Circuit Board (PCB) Boards
  • 6.5 Power Devices
  • 6.6 Other Applications

7 Global Chip Laser Decapping Machine Market, By Geography

  • 7.1 Introduction
  • 7.2 North America
    • 7.2.1 US
    • 7.2.2 Canada
    • 7.2.3 Mexico
  • 7.3 Europe
    • 7.3.1 Germany
    • 7.3.2 UK
    • 7.3.3 Italy
    • 7.3.4 France
    • 7.3.5 Spain
    • 7.3.6 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 Japan
    • 7.4.2 China
    • 7.4.3 India
    • 7.4.4 Australia
    • 7.4.5 New Zealand
    • 7.4.6 South Korea
    • 7.4.7 Rest of Asia Pacific
  • 7.5 South America
    • 7.5.1 Argentina
    • 7.5.2 Brazil
    • 7.5.3 Chile
    • 7.5.4 Rest of South America
  • 7.6 Middle East & Africa
    • 7.6.1 Saudi Arabia
    • 7.6.2 UAE
    • 7.6.3 Qatar
    • 7.6.4 South Africa
    • 7.6.5 Rest of Middle East & Africa

8 Key Developments

  • 8.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 8.2 Acquisitions & Mergers
  • 8.3 New Product Launch
  • 8.4 Expansions
  • 8.5 Other Key Strategies

9 Company Profiling

  • 9.1 Nisene Technology Group, Inc
  • 9.2 Kaimeiwo Laser
  • 9.3 Plasma-Therm LLC
  • 9.4 Han's Laser
  • 9.5 Rudolph Technologies
  • 9.6 Wuhan Keyi Laser
  • 9.7 Huacong Technology
  • 9.8 Hamamatsu Photonics
  • 9.9 Xcerra Corporation
  • 9.10 Accurex Measurement

List of Tables

  • Table 1 Global Chip Laser Decapping Machine Market Outlook, By Region (2021-2030) ($MN)
  • Table 2 Global Chip Laser Decapping Machine Market Outlook, By Type (2021-2030) ($MN)
  • Table 3 Global Chip Laser Decapping Machine Market Outlook, By Semi-Automatic (2021-2030) ($MN)
  • Table 4 Global Chip Laser Decapping Machine Market Outlook, By Full-Automatic (2021-2030) ($MN)
  • Table 5 Global Chip Laser Decapping Machine Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 6 Global Chip Laser Decapping Machine Market Outlook, By Application (2021-2030) ($MN)
  • Table 7 Global Chip Laser Decapping Machine Market Outlook, By Integrated Circuits (IC) Trays (2021-2030) ($MN)
  • Table 8 Global Chip Laser Decapping Machine Market Outlook, By Plastic Packaged Devices (2021-2030) ($MN)
  • Table 9 Global Chip Laser Decapping Machine Market Outlook, By Printed Circuit Board (PCB) Boards (2021-2030) ($MN)
  • Table 10 Global Chip Laser Decapping Machine Market Outlook, By Power Devices (2021-2030) ($MN)
  • Table 11 Global Chip Laser Decapping Machine Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 12 North America Chip Laser Decapping Machine Market Outlook, By Country (2021-2030) ($MN)
  • Table 13 North America Chip Laser Decapping Machine Market Outlook, By Type (2021-2030) ($MN)
  • Table 14 North America Chip Laser Decapping Machine Market Outlook, By Semi-Automatic (2021-2030) ($MN)
  • Table 15 North America Chip Laser Decapping Machine Market Outlook, By Full-Automatic (2021-2030) ($MN)
  • Table 16 North America Chip Laser Decapping Machine Market Outlook, By Otrer Types (2021-2030) ($MN)
  • Table 17 North America Chip Laser Decapping Machine Market Outlook, By Application (2021-2030) ($MN)
  • Table 18 North America Chip Laser Decapping Machine Market Outlook, By Integrated Circuits (IC) Trays (2021-2030) ($MN)
  • Table 19 North America Chip Laser Decapping Machine Market Outlook, By Plastic Packaged Devices (2021-2030) ($MN)
  • Table 20 North America Chip Laser Decapping Machine Market Outlook, By Printed Circuit Board (PCB) Boards (2021-2030) ($MN)
  • Table 21 North America Chip Laser Decapping Machine Market Outlook, By Power Devices (2021-2030) ($MN)
  • Table 22 North America Chip Laser Decapping Machine Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 23 Europe Chip Laser Decapping Machine Market Outlook, By Country (2021-2030) ($MN)
  • Table 24 Europe Chip Laser Decapping Machine Market Outlook, By Type (2021-2030) ($MN)
  • Table 25 Europe Chip Laser Decapping Machine Market Outlook, By Semi-Automatic (2021-2030) ($MN)
  • Table 26 Europe Chip Laser Decapping Machine Market Outlook, By Full-Automatic (2021-2030) ($MN)
  • Table 27 Europe Chip Laser Decapping Machine Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 28 Europe Chip Laser Decapping Machine Market Outlook, By Application (2021-2030) ($MN)
  • Table 29 Europe Chip Laser Decapping Machine Market Outlook, By Integrated Circuits (IC) Trays (2021-2030) ($MN)
  • Table 30 Europe Chip Laser Decapping Machine Market Outlook, By Plastic Packaged Devices (2021-2030) ($MN)
  • Table 31 Europe Chip Laser Decapping Machine Market Outlook, By Printed Circuit Board (PCB) Boards (2021-2030) ($MN)
  • Table 32 Europe Chip Laser Decapping Machine Market Outlook, By Power Devices (2021-2030) ($MN)
  • Table 33 Europe Chip Laser Decapping Machine Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 34 Asia Pacific Chip Laser Decapping Machine Market Outlook, By Country (2021-2030) ($MN)
  • Table 35 Asia Pacific Chip Laser Decapping Machine Market Outlook, By Type (2021-2030) ($MN)
  • Table 36 Asia Pacific Chip Laser Decapping Machine Market Outlook, By Semi-Automatic (2021-2030) ($MN)
  • Table 37 Asia Pacific Chip Laser Decapping Machine Market Outlook, By Full-Automatic (2021-2030) ($MN)
  • Table 38 Asia Pacific Chip Laser Decapping Machine Market Outlook, By Otrer Types (2021-2030) ($MN)
  • Table 39 Asia Pacific Chip Laser Decapping Machine Market Outlook, By Application (2021-2030) ($MN)
  • Table 40 Asia Pacific Chip Laser Decapping Machine Market Outlook, By Integrated Circuits (IC) Trays (2021-2030) ($MN)
  • Table 41 Asia Pacific Chip Laser Decapping Machine Market Outlook, By Plastic Packaged Devices (2021-2030) ($MN)
  • Table 42 Asia Pacific Chip Laser Decapping Machine Market Outlook, By Printed Circuit Board (PCB) Boards (2021-2030) ($MN)
  • Table 43 Asia Pacific Chip Laser Decapping Machine Market Outlook, By Power Devices (2021-2030) ($MN)
  • Table 44 Asia Pacific Chip Laser Decapping Machine Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 45 South America Chip Laser Decapping Machine Market Outlook, By Country (2021-2030) ($MN)
  • Table 46 South America Chip Laser Decapping Machine Market Outlook, By Type (2021-2030) ($MN)
  • Table 47 South America Chip Laser Decapping Machine Market Outlook, By Semi-Automatic (2021-2030) ($MN)
  • Table 48 South America Chip Laser Decapping Machine Market Outlook, By Full-Automatic (2021-2030) ($MN)
  • Table 49 South America Chip Laser Decapping Machine Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 50 South America Chip Laser Decapping Machine Market Outlook, By Application (2021-2030) ($MN)
  • Table 51 South America Chip Laser Decapping Machine Market Outlook, By Integrated Circuits (IC) Trays (2021-2030) ($MN)
  • Table 52 South America Chip Laser Decapping Machine Market Outlook, By Plastic Packaged Devices (2021-2030) ($MN)
  • Table 53 South America Chip Laser Decapping Machine Market Outlook, By Printed Circuit Board (PCB) Boards (2021-2030) ($MN)
  • Table 54 South America Chip Laser Decapping Machine Market Outlook, By Power Devices (2021-2030) ($MN)
  • Table 55 South America Chip Laser Decapping Machine Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 56 Middle East & Africa Chip Laser Decapping Machine Market Outlook, By Country (2021-2030) ($MN)
  • Table 57 Middle East & Africa Chip Laser Decapping Machine Market Outlook, By Type (2021-2030) ($MN)
  • Table 58 Middle East & Africa Chip Laser Decapping Machine Market Outlook, By Semi-Automatic (2021-2030) ($MN)
  • Table 59 Middle East & Africa Chip Laser Decapping Machine Market Outlook, By Full-Automatic (2021-2030) ($MN)
  • Table 60 Middle East & Africa Chip Laser Decapping Machine Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 61 Middle East & Africa Chip Laser Decapping Machine Market Outlook, By Application (2021-2030) ($MN)
  • Table 62 Middle East & Africa Chip Laser Decapping Machine Market Outlook, By Integrated Circuits (IC) Trays (2021-2030) ($MN)
  • Table 63 Middle East & Africa Chip Laser Decapping Machine Market Outlook, By Plastic Packaged Devices (2021-2030) ($MN)
  • Table 64 Middle East & Africa Chip Laser Decapping Machine Market Outlook, By Printed Circuit Board (PCB) Boards (2021-2030) ($MN)
  • Table 65 Middle East & Africa Chip Laser Decapping Machine Market Outlook, By Power Devices (2021-2030) ($MN)
  • Table 66 Middle East & Africa Chip Laser Decapping Machine Market Outlook, By Other Applications (2021-2030) ($MN)