有機基板包裝材料市場規模、佔有率、成長分析（按技術、應用和地區）- 2025-2032 年產業預測

Organic Substrate Packaging Material Market Size, Share, and Growth Analysis, By Technology (Small Thin Outline Packages, Pin Grid Array (PGA) Packages), By Application (Consumer Electronics, Automotive), By Region - Industry Forecast 2025-2032

出版日期: 2025年05月04日 | 出版商:

SkyQuest | 英文 192 Pages | 商品交期: 3-5個工作天內

價格

簡介目錄

2023 年全球有機基板包裝材料市場規模為 138 億美元，預計將從 2024 年的 143.7 億美元成長到 2032 年的 198.1 億美元，預測期內（2025-2032 年）的複合年成長率為 4.1%。

由於對先進消費性電子產品的需求不斷增加以及更小、功能更強大的設備的普及，基板封裝行業正在經歷強勁成長。隨著業界採用更小、功能更強的元件來支援從智慧型手機到物聯網設備的各種應用，對強大、高密度互連解決方案的需求正在增加。雲端運算、AI技術、5G基礎設施的興起將進一步拉動高階基板材料的需求。同時，汽車產業正在採用更多的電子設備來實現先進的安全系統、資訊娛樂和電動動力傳動系統，這增加了對可靠封裝技術的需求。然而，高額的前期資本投入、原料價格波動、供應鏈問題和監管障礙等挑戰使行業動態變得複雜，迫使製造商有效平衡性能、成本和永續性。

北美洲
- 美國
- 加拿大
歐洲
- 德國
- 西班牙
- 法國
- 英國
- 義大利
- 其他歐洲國家地區
亞太地區
- 中國
- 印度
- 日本
- 韓國
- 其他亞太地區
拉丁美洲
- 巴西
- 其他拉丁美洲
中東和非洲
- 海灣合作理事會國家
- 南非
- 其他中東和非洲地區

競爭資訊

前五大公司對比
主要企業市場定位（2024年）
主要市場參與者所採取的策略
近期市場趨勢
公司市場佔有率分析（2024年）
主要企業簡介
- 公司詳情
- 產品系列分析
- 公司分部佔有率分析
- 收益與前一年同期比較對比（2022-2024 年）

主要企業簡介

Amkor Technology Inc.（USA）
Kyocera Corporation（Japan）
Microchip Technology Inc.（USA）
Texas Instruments Incorporated（USA）
ASE Kaohsiung（Advanced Semiconductor Engineering Inc.）（Taiwan）
Simmtech Co., Ltd.（South Korea）
Shinko Electric Industries Co., Ltd.（Japan）
LG Innotek Co., Ltd.（South Korea）
AT&S（Austria Technologie & Systemtechnik AG）（Austria）
Daeduck Electronics Co., Ltd.（South Korea）
WUS Printed Circuit Co., Ltd.（Taiwan）
STATS ChipPAC Pte. Ltd.（Singapore）
Compass Technology Co., Ltd.（Hong Kong）
Hitachi Chemical Company Ltd.（Japan）
NGK Spark Plug Co., Ltd.（Japan）
Mitsubishi Corporation（Japan）
Samsung Electro-Mechanics Co., Ltd.（South Korea）
Sumitomo Bakelite Co., Ltd.（Japan）
TTM Technologies, Inc.（USA）
DuPont de Nemours, Inc.（USA）

結論和建議

簡介目錄

Product Code: SQMIG45N2114

Global Organic Substrate Packaging Material Market size was valued at USD 13.8 billion in 2023 and is poised to grow from USD 14.37 billion in 2024 to USD 19.81 billion by 2032, growing at a CAGR of 4.1% during the forecast period (2025-2032).

The substrate packaging industry is experiencing significant growth driven by the increasing demand for advanced consumer electronics and the proliferation of compact, high-functioning devices. As industries embrace smaller components with enhanced functionality to support a diverse range of applications-from smartphones to IoT devices-the need for robust high-density interconnect solutions escalates. The rise of cloud computing, AI technologies, and 5G infrastructures further propels the demand for high-end substrate materials. Concurrently, the automotive sector's adoption of electronics for advanced safety systems, infotainment, and electric powertrains enhances the necessity for reliable packaging technologies. However, challenges such as high initial capital investments, fluctuating raw material prices, supply chain issues, and regulatory hurdles complicate industry dynamics, urging manufacturers to balance performance, cost, and sustainability effectively.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Organic Substrate Packaging Material market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Organic Substrate Packaging Material Market Segments Analysis

Global Organic Substrate Packaging Material Market is segmented by Technology, Application and region. Based on Technology, the market is segmented into Small Thin Outline Packages, Pin Grid Array (PGA) Packages, Flat no-leads Packages, Quad Flat Package (QFP), Dual in-line Package (GIP) and Others. Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial, Manufacturing, Healthcare and Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Organic Substrate Packaging Material Market

One of the key drivers behind the Global Organic Substrate Packaging Material market is the rapid expansion of the consumer electronics and automotive sectors. The increasing demand for smartphones, wearables, electric vehicles, and infotainment systems necessitates the use of efficient and high-performance packaging solutions. Prominent companies such as Apple, Samsung, and Tesla are at the forefront of this trend, actively promoting the adoption of organic substrates to facilitate lightweight, stable, and reliable chip stacking. This pivotal movement is significantly contributing to the heightened demand for organic substrate packaging materials, underscoring their essential role in modern technology applications.

Restraints in the Global Organic Substrate Packaging Material Market

One major challenge facing the Global Organic Substrate Packaging Material market is the inherent sensitivity of organic substrates to high temperatures and moisture. These vulnerabilities can lead to issues such as delamination or reduced electrical performance, particularly in high-power applications. With the rising use of more advanced chips, the packaging materials experience greater thermal loads that must be managed effectively, making thermal management a persistent concern. As a result, some users may be compelled to shift towards ceramics or inorganic materials to address these limitations, thereby hindering the growth and adoption of organic substrate solutions in various applications.

Market Trends of the Global Organic Substrate Packaging Material Market

In the Global Organic Substrate Packaging Material market, a notable short-term trend is the rapid adoption of advanced semiconductor packaging technologies fueled by the rise of AI, 5G, and IoT applications. Manufacturers are increasingly focusing on the development of ultra-thin and high-layer count organic substrates to accommodate rising frequency and velocity requirements. Moreover, the integration of passive components and the implementation of tightly patterned circuits are addressing the miniaturization challenges posed by contemporary electronic devices, such as wearables and smartphones. This shift emphasizes innovation in packaging solutions, positioning organic substrates at the forefront of the evolving electronics landscape.

Introduction

Objectives of the Study
Scope of the Report
Definitions

Research Methodology

Information Procurement
Secondary & Primary Data Methods
Market Size Estimation
Market Assumptions & Limitations

Executive Summary

Global Market Outlook
Supply & Demand Trend Analysis
Segmental Opportunity Analysis

Market Dynamics & Outlook

Market Overview
Market Size
Market Dynamics
- Drivers & Opportunities
- Restraints & Challenges
Porters Analysis
- Competitive rivalry
- Threat of substitute
- Bargaining power of buyers
- Threat of new entrants
- Bargaining power of suppliers

Key Market Insights

Key Success Factors
Degree of Competition
Top Investment Pockets
Market Ecosystem
Market Attractiveness Index, 2024
PESTEL Analysis
Macro-Economic Indicators
Value Chain Analysis
Pricing Analysis
Regulatory Landscape
Case Studies
Technology Analysis

Global Organic Substrate Packaging Material Market Size by Technology & CAGR (2025-2032)

Market Overview
Small Thin Outline Packages
Pin Grid Array (PGA) Packages
Flat no-leads Packages
Quad Flat Package (QFP)
Dual in-line Package (GIP)
Others

Global Organic Substrate Packaging Material Market Size by Application & CAGR (2025-2032)

Market Overview
Consumer Electronics
Automotive
Industrial
Manufacturing
Healthcare
Others

Global Organic Substrate Packaging Material Market Size & CAGR (2025-2032)

North America (Technology, Application)
- US
- Canada
Europe (Technology, Application)
- Germany
- Spain
- France
- UK
- Italy
- Rest of Europe
Asia Pacific (Technology, Application)
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
Latin America (Technology, Application)
- Brazil
- Rest of Latin America
Middle East & Africa (Technology, Application)
- GCC Countries
- South Africa
- Rest of Middle East & Africa

Competitive Intelligence

Top 5 Player Comparison
Market Positioning of Key Players, 2024
Strategies Adopted by Key Market Players
Recent Developments in the Market
Company Market Share Analysis, 2024
Company Profiles of All Key Players
- Company Details
- Product Portfolio Analysis
- Company's Segmental Share Analysis
- Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

Amkor Technology Inc. (USA)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Kyocera Corporation (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Microchip Technology Inc. (USA)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Texas Instruments Incorporated (USA)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
ASE Kaohsiung (Advanced Semiconductor Engineering Inc.) (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Simmtech Co., Ltd. (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Shinko Electric Industries Co., Ltd. (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
LG Innotek Co., Ltd. (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
AT&S (Austria Technologie & Systemtechnik AG) (Austria)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Daeduck Electronics Co., Ltd. (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
WUS Printed Circuit Co., Ltd. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
STATS ChipPAC Pte. Ltd. (Singapore)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Compass Technology Co., Ltd. (Hong Kong)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Hitachi Chemical Company Ltd. (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
NGK Spark Plug Co., Ltd. (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Mitsubishi Corporation (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Samsung Electro-Mechanics Co., Ltd. (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Sumitomo Bakelite Co., Ltd. (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
TTM Technologies, Inc. (USA)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
DuPont de Nemours, Inc. (USA)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments