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自動駕駛感知器晶片市場（2026 年）

Autonomous Driving Sensor Chip Research Report, 2026

出版日期: 2026年08月06日 | 出版商:

ResearchInChina | 英文 380 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

自動駕駛感測器晶片研究－感測器晶片透過提供對物理世界的深刻理解，在智慧領域發揮主導作用。

2026年，自動駕駛感應器晶片產業將迎來關鍵轉捩點。隨著L3級自動駕駛政策的正式實施，高階智慧駕駛將進入大規模實用化階段。本報告聚焦於感測器晶片的技術演進，詳細闡述了自動駕駛感測器晶片在三大核心變革下的技術發展方向：法規推動感知功能提升、L3級自動駕駛從概念驗證測試走向大規模部署，以及硬體市場重新評估週期。本報告系統說明了五大類感測器晶片（包括車載攝影機、LiDAR、普通雷達、超音波雷達和超近距離感測）的技術演進、市場競爭格局和產業結構，並涵蓋了主要供應商的產品更新以及各OEM廠商的採用情況。

以下幾點是感測器晶片在五大類技術進步中值得注意的：

相機 CIS 晶片正在從「簡單的成像」發展成為能夠實現「整合感測和運算」的智慧感測設備。

LiDAR晶片正在開啟「數千個通道」和 6D 全彩感知的新時代；

雷達晶片正在從「邊緣處理」轉向衛星架構和高通道設計。

超音波和超寬頻晶片——從「輔助感知」發展成為能夠處理任何場景的協作節點。

攝影機感測器晶片－解析度更高，整合更智慧

預計到 2026 年，汽車攝影機晶片市場將出現以下三大主要趨勢：

1.背照式（BSI）和多層結構的廣泛應用。

根據結構技術，CIS（相機指示器）可分為正面照明（FSI）、背面照明（BSI）和堆疊式結構，其中堆疊式架構代表了未來的主流趨勢。汽車級CIS對影像解析度、動態範圍、低照度成像能力和多攝影機協同處理能力的要求更高，並且必須滿足車規級認證和功能安全標準。 2025年，BSI+3D堆疊式結構將佔全球量產CIS的75%以上，且單像素尺寸將超過0.6微米。

以SmartSens SC860AT為例。 SC860AT基於SmartSens最新的CARSens®-XR Gen 2技術平台，採用單像素架構，並整合了Lofic HDR® 2.0和SFCPixel®等先進技術，同時支援AB-Exposure™雙幀曝光控制。憑藉高影格速率、高靈敏度和寬動態範圍等性能優勢，它能夠滿足汽車前視、側視和後視攝影機、車載乘員監測系統（OMS）攝影機以及E-Mirror電子後視鏡等應用對影像品質提升的全新需求。

2. 高解析度：8MP 正在成為標準，12MP 正在迅速普及。

到 2026 年，隨著 ADAS 的廣泛應用，8 兆像素感測器將成為高級自動駕駛的標準規格，1,200 萬像素產品也將面世。

以 OmniVision 的 OX08D20 為例。這款 8 百萬畫素 CMOS 感光元件專為車載外接相機而設計，適用於高級駕駛輔助系統 (ADAS) 和自動駕駛 (AD)。它採用與 Mobileye 合作開發的創新成像解決方案，影格速率最高可達 60 fps，並且透過採用非晶矽 (a-CSP) 技術，與同類外部感測器相比，尺寸縮小了 50%。

3. HDR 和 LFM 技術的整合 - 140dB 或更高是強制性標準。

在高級駕駛輔助系統 (ADAS) 中，超過 140 dB 的高動態範圍 (HDR) 和 LED 閃爍抑制 (LFM) 已成為汽車 CMOS 影像感測器 (CIS) 的嚴格技術標準。這項整合技術可應對極端光照條件下的成像挑戰，確保車輛能夠準確識別交通號誌並防止視覺誤判。

以SmartSens SC126AT為例。 SC126AT基於CARSens®-XR Plus技術平台開發，採用單像素架構設計，整合了SFCPixel®、PixGain HDR®等先進技術。它擁有高靈敏度、寬動態範圍和低雜訊等優異性能指標，並支援片上ISP功能。

LiDAR感測器晶片——開啟了數千通道和 6D 全彩感知的新時代。

預計到 2026 年，汽車攝影機晶片市場將出現以下三大主要趨勢：

1. 頻道數量呈指數級成長，從幾百個成長到幾千個。

2026年4月，RoboSense發表了全球首款原生2160通道的車規級SPAD-SoC「Phoenix」。合賽科技也發布了擁有高達4320通道的6D全彩晶片「Picasso」，華為則發布了896通道雙光路影像級雷射雷達。至此，車規LiDAR的感知能力正式從「點雲級」躍升至「影像級」。

舉例來說，以 RoboSense 的兩款旗艦晶片為例：

這款名為「鳳凰」（Phoenix）的晶片是全球首款單晶片整合原生2160通道車規級SPAD-SoC。它擁有超過400萬像素的超高解析度和600公尺的超遠探測距離，將雷射雷達的感知精度和覆蓋範圍提升至前所未有的高度。該晶片已獲得車規級認證，計劃於2026年量產並應用於車輛。這將使其成為L3級及以上高級自動駕駛的超高清感知基礎。

「孔雀晶片」是業界首款可量產的全固態大面積SPAD-SoC ，成本績效。該晶片計畫於2026年第三季開始量產，目標市場包括汽車側視和盲點偵測雷射雷達、機器人和空間智慧，旨在推動高性能感知技術的大規模應用。

2. 數位架構完全取代類比架構。

2024年至2025年間，汽車LiDAR產業的核心架構經歷了世代變革。以SPAD-SoC（單光子崩潰式二極體系統晶片）為代表的數位架構完全取代了傳統的類比架構，成為高性能汽車雷射雷達的標準解決方案。

SPAD-SoC採用整合感測和運算架構設計，將SPAD陣列和完整的數位訊號處理系統整合到單一晶片上。 SPAD-SoC能夠同時完成包括光子偵測、時間測量、訊號處理和資料輸出在內的整個工作流程，並在光子入射後立即輸出深度/影像資料。

與傳統的獨立式解決方案相比，SPAD-SoC 具有高整合度、低功耗、小型化和快速回應等優勢。由於它們是遠程高通道LiDAR和短程閃光LiDAR的核心組件，對LiDAR的性能影響巨大，因此正在發展成為所有LiDAR供應商競相爭奪的關鍵技術中心。

3. 基於晶片的6D全彩感知

到 2026 年，基於晶片的 6D 全彩感知技術將使雷射雷達從「色盲測量儀器」轉變為「全彩觀察器」。這意味著它將從簡單地輸出3D空間座標 (XYZ) 升級到具有六維感知能力，能夠同步輸出空間座標和顏色資訊 (RGB)。

在晶片層面，彩色光感（RGB）和飛行時間（XYZ）融合實現了原生像素級整合，直接生成彩色點雲。這意味著每個產生的資料點都固有地具備精確的空間定位和真實的色彩訊息，無需拼接、校準或額外的推斷。

以和賽的「畢卡索6D全彩雷射雷達晶片」為例。和賽將RGB彩色光感功能直接整合到雷射雷達接收晶片中。「畢卡索SPAD-SoC」採用「全融合」設計，在單晶片上同時處理近紅外線雷射測距和可見光感測。每個像素單元既可以發射雷射測量距離，也可以捕捉光線識別顏色。換句話說，當雷射光束被物體反射時，晶片可以立即捕捉到每個點的空間位置和顏色資訊。

雷達感測器晶片—衛星架構和高通道設計

1. 衛星架構的適應趨勢

到2026年，衛星架構將成為汽車雷達感測器晶片的核心技術轉型方向。這種架構顛覆了傳統的「邊緣智慧」設計概念，將雷達從一個孤立的黑盒子演變為一個開放的感知前端。

衛星架構的精髓在於自動駕駛感知系統中的「分工模式」。雷達作為「衛星」，專門負責前端感知（射頻發射和接收以及原始數據採集），而複雜的訊號處理、目標檢測和追蹤演算法則全部由中央域控制器處理。

衛星雷達解決方案主要分為兩種類型：

專用 RSP IC 解決方案 - 由雷達模組供應商主導，採用具有高能源效率和柔軟性的專用雷達橋接晶片。

RSP IP 整合 ADAS SoC 解決方案 - 由 OEM主導，該解決方案透過將雷達訊號處理器 IP 整合到 ADAS SoC 中來實現最大程度的整合。

2. 8T8R成像雷達的部署正在加速。

2026年將是8T8R成像雷達晶片量產的第一年。隨著恩智浦半導體（NXP）的TEF8388和英飛凌的CTRX8188F等單晶片8T8R解決方案的出現，4D雷達正從高階選擇走向大規模應用。 8T8R架構具有低成本、高整合度和卓越的能源效率等優勢，是連接中階6T8R解決方案和高階16T16R/24T24R解決方案的關鍵橋樑。單晶片8T8R解決方案採用CMOS技術，高度整合式射頻前端和訊號處理，實現了效能、成本和量產之間的最佳平衡。預計未來三年內，它將迅速普及到15萬元人民幣價位的主流車型，並成為先進自動駕駛感知系統的「必備配置」。

以英飛凌的RASIC™ CTRX8188F為例。這款8T8R車用雷達收發器面向成像雷達和高階ADAS應用。這種高通道雷達晶片不僅應用於傳統雷達模組，還應用於中央處理架構，可將豐富的原始雷達資料傳輸到後端運算平台。

CTRX8188F 具備多項業界領先的射頻性能指標。其 14.5 dBm 的發射功率確保了遠距離雷達偵測能力，-100 dBc/Hz 的低相位雜訊提供了出色的信噪比，而 10.2 dB 的雜訊係數則實現了業界領先的接收靈敏度。此外，它還具備 4 GHz 超寬頻，可實現厘米級距離解析度，以及高達 200 MHz/µs 的調製速率，足以滿足快速移動目標的探測需求。

超音波和超寬頻近距離感知晶片－從輔助功能到核心感知功能的演變

1.超音波雷達感測器晶片的核心技術趨勢：整合架構

邊緣人工智慧推理能力的整合：到 2026 年，主流超音波雷達模組將整合微控制器和神經處理單元 (NPU)，從而能夠全面支援輕量級深度學習模型的即時推理。

感測器模態對齊與融合－超音波雷達晶片的協同能力正從感測器間協調發展到多模態融合。在2026年的高階自動駕駛架構中，來自超音波雷達的短程高精度距離資料、來自攝影機的豐富紋理資訊以及來自雷達的速度向量資料將透過具有跨模態注意力機制的變壓器架構進行融合。

2. 汽車超寬頻近距離感知晶片的關鍵技術趨勢：多功能整合

透過結合毫米波和超寬頻（UWB）技術，UWB技術旨在實現車輛使用中的「全場景安全防護」。這涵蓋了ADAS（高級駕駛輔助系統）中的車輛搜尋、解鎖和避障，以及停車和車門鎖定/解鎖等功能。這並非簡單的功能疊加，而是對系統效率和成本結構的重建。 UWB正在從簡單的「智慧鑰匙」演變為連接車輛內外感知網路的「智慧神經網路」。

從「通訊晶片」到整合式通訊與感知SoC的演變

由於晶片結構的「三合一」整合，主流的UWB晶片已從單純支援測距的通訊晶片發展成為集定位、雷達和通訊三種功能於一體的SoC解決方案。

從「單點感知」到「協作感知」的演變。

傳統的超寬頻雷達錨點獨立運行，導致近距離存在盲區。 Calterah公司採用符合IEEE 802.15.4ab標準的感測技術，實現了多錨點雷達模式。當後錨點R1發射訊號時，R2接收訊號，反之亦然。這使得原本孤立的超寬頻雷達轉變為可以協同工作的連網雷達。

以Calterah的UWB產品系列為例，該公司推出了兩款功能齊全的開發套件：一款用於車載「兒童存在檢測（CPD）」系統，另一款用於基於4ab感測技術的泊車輔助系統。這些套件為一級供應商和OEM廠商提供了一整套硬體參考設計、軟體SDK、AI模型和工具鏈。

這些開發套件整合了數位鑰匙、腳踢式尾門、車內兒童偵測、外部停車輔助和哨兵模式等多種功能整合解決方案，形成可快速部署的工程解決方案。透過復用車身上的一組UWB錨點，可以實現多種智慧感知和互聯場景。

汽車自動駕駛感應器晶片概述
自動駕駛感應器晶片概述及分類
攝影機辨識晶片的工作原理、訊號處理環節及核心技術指標
LiDAR晶片的功能原理、訊號處理環節和核心技術指標
雷達晶片功能原理、訊號處理環節及核心技術指標
超音波雷達晶片的功能原理、訊號處理環節及核心技術指標
比較各種自動駕駛感應器晶片的優點、缺點和互補感知邏輯。
自動駕駛感測器的整合策略和功能映射
中國自動駕駛車輛運行分類
2022-2030年中國乘用車L1至L3智慧駕駛系統（含硬體整合系統）的搭載率。
不同等級的自動駕駛感應器配置
智慧駕駛解決方案、感測器配置、OEM供應商
OEM目前主流智慧駕駛解決方案的感測器配置及下一代部署計劃
產業政策與標準
中國自動駕駛感測器法規和標準的發展趨勢

第2章：汽車攝影機感應器晶片

新型汽車攝影機感測器晶片產品概述及發展趨勢
新型汽車攝影機感測器晶片產品概述
汽車攝影機感測器晶片發展趨勢概述
新型汽車攝影機感測器晶片產品
汽車攝影機感測器晶片的技術發展趨勢
汽車攝影機感測器晶片產品的分類和市場規模預測。
汽車攝影機感測器核心晶片產品分類 - CMOS影像感測器（CIS）
CMOS影像感測器（CIS）的性能規格指標
CMOS影像感測器（CIS）結構配置
汽車攝影機感測器核心晶片產品的分類
影像訊號處理器（ISP）的效能規格指標
影像訊號處理器（ISP）IP
影像訊號處理器（ISP）IP：來自海外和中國國內供應商的汽車級產品和認證。
2022-2030年中國乘用車攝影機晶片（1-3MP、5MP、8MP以上）出貨量（預測）

第3章：汽車LiDAR感測器晶片

新型汽車LiDAR感測器晶片產品概況及發展趨勢
新型汽車LiDAR感測器晶片產品概述
新型汽車LiDAR感測器晶片產品
汽車LiDAR感測器晶片的技術趨勢
汽車LiDAR感測器晶片產品的分類和市場規模預測。
汽車LiDAR感測器晶片產品的分類
汽車LiDAR感測器晶片的運行機制
中國乘用車雷射雷達安裝現況及市場規模（2022-2030年預測）
中國乘用車雷射雷達市場規模（2022-2030 年預測），計算表附後。

第4章：汽車雷達感測器晶片

新型汽車雷達感測器晶片產品概述及發展趨勢
新型汽車雷達感測器晶片產品概述
新型汽車雷達感測器晶片產品
汽車雷達感測器晶片的技術趨勢
汽車雷達感測器晶片產品的分類和市場規模預測。
汽車雷達感測器晶片產品的分類
汽車雷達晶片產業鏈
中國乘用車雷達系統（常規雷達、4D成像雷達和分散式雷達）安裝現況（2022-2030年預測），附計算表。

第5章其他感測器晶片

新型汽車超音波雷達感測器晶片產品的發展趨勢和市場規模預測。
新型汽車超音波雷達感測器晶片產品概述。
新型汽車超音波雷達感測器晶片產品
汽車超音波雷達感測器晶片的技術發展趨勢
新型汽車用超近距離感測晶片產品的趨勢和市場規模預測
新型汽車級超近距離感測晶片產品概述
超寬頻汽車應用場景
UWB功能擴充
新產品：用於汽車應用的超近距離感測晶片
汽車超近距離感測晶片的技術發展趨勢

第6章：感測器晶片在OEM廠商的應用及未來趨勢

Geely
Changan
Chery
BYD
Li Auto
Xpeng
NIO
Leapmotor
Xiaomi Auto
SAIC Motor
GAC
FAW Hongqi
Dongfeng Motor
Huawei
Tesla

第7章：感測器晶片供應商的生產現況及未來趨勢

OmniVision
onsemi
Sony
SmartSens
Samsung
GalaxyCore
Hesai Technology
RoboSense
Huawei
Seyond
Calterah
TI
STMicroelectronics
Desay SV
NXP
Infineon
Novosense

簡介目錄

Product Code: HP001

Research on Autonomous Driving Sensor Chips: Deeply Perceiving the Physical World, Sensor Chips Are Playing A "Leading Role" in Intelligence

In 2026, the autonomous driving sensor chip industry hits a critical turning point. The access policy for L3 autonomous driving is officially implemented, and high-level intelligent driving enters the large-scale application phase. Centered on the technological evolution trend of sensor chips, this report elaborates on the technological direction of autonomous driving sensor chips under three core transformations: perception upgrading driven by regulations, large-scale rollout of L3 from pilot trials, and revaluation cycle of hardware market. It systematically sorts out the technological evolution, market competition and industrial pattern of five major categories of sensor chips including automotive camera, LiDAR, radar, ultrasonic radar and UWB near-field sensing, covering product updates of major suppliers and application status of OEMs.

The technological evolution of the five major categories of sensor chips highlights the following:

Camera CIS chips: Evolving from "merely imaging" to "sensing-computing integration" intelligent perception terminals;

LiDAR chips: Entering a new era of "thousands of channels" and 6D full-color perception;

Radar chips: Moving from "edge processing" towards satellite architecture and high-channel count design;

Ultrasonic and UWB chips: Upgrading from "auxiliary perception" to full-scenario collaborative nodes.

Camera Sensor Chips: Resolution Improvement and Intelligent Integration

In 2026, the automotive camera chip market presents three major trends:

1. Mass Popularization of Back-side-illuminated (BSI) and Stacked Structures

CIS is categorized by structural technology into Front-Side Illuminated (FSI), Back-Side Illuminated (BSI) and Stacked structures, and the stacked architecture represents the mainstream direction for the future. Automotive CIS imposes higher requirements on image resolution, dynamic range, low-light imaging capability and multi-camera collaborative processing capability, and needs to meet automotive-grade certification and functional safety standards. In 2025, BSI + 3D stacked structures accounted for over 75% of mass-produced CIS worldwide, with single-pixel size breaking through 0.6 micrometers.

Take SmartSens SC860AT as an example: Built on SmartSens' brand-new CARSens(R)-XR Gen 2 technology platform, SC860AT adopts a single-pixel architecture, integrated with advanced technologies including Lofic HDR(R)2.0 and SFCPixel(R), and supports AB-Exposure(TM) dual-frame exposure control. It has performance advantages such as high frame rate, high sensitivity and wide dynamic range, catering to brand-new image upgrade requirements of automotive front-view, side-view, rear-view cameras, in-cabin occupancy monitoring system (OMS) cameras and E-Mirror electronic rearview mirrors.

2.High Resolution: 8MP Becomes Standard, and 12MP Gathers Pace

In 2026, with the popularization of ADAS, 8-megapixel sensors have become standard configuration for high-level intelligent driving, and 12-megapixel products make a debut.

Take OmniVision OX08D20 as an example: This 8-megapixel CMOS sensor is specially designed for exterior automotive cameras in Advanced Driver Assistance Systems (ADAS) and Autonomous Driving (AD). Via an innovative shooting solution co-developed with Mobileye, it boosts frame rate up to 60 fps, and adopts a-CSP that reduces its size by 50% compared with peer exterior sensors.

3.Integration of HDR and LFM Technologies - 140dB+ Becomes A Mandatory Threshold

For Advanced Driver Assistance Systems (ADAS), high dynamic range (HDR) exceeding 140dB and LED Flicker Mitigation (LFM) have become rigid technical thresholds for automotive CMOS image sensors (CIS). This integrated technology addresses imaging challenges under extreme lighting conditions, ensuring vehicles accurately identify traffic signals and avoid visual misjudgments.

Take SmartSens SC126AT as an example: Developed on the CARSens(R)-XR Plus technology platform, SC126AT features a single-pixel architecture design integrated with SFCPixel(R), PixGain HDR(R) and other advantageous technologies. It boasts high sensitivity, wide dynamic range, low noise and other superior performance metrics, and supports on-chip ISP functions.

LiDAR Sensor Chips: Era of Thousands of Channels and 6D Full-Color Perception

In 2026, the automotive camera chip market witnesses three major trends:

1.Exponential Surge in Channel Count from Hundreds to Thousands

In April 2026, RoboSense launched Phoenix, the world's first native 2160-channel automotive-grade SPAD-SoC; Hesai released Picasso, a 6D full-color chip with up to 4320 channels; Huawei rolled out an 896-channel dual optical path image-level LiDAR. The perception capability of automotive LiDAR has formally transitioned from "point cloud level" to "image level".

Take RoboSense's dual flagship chips as examples:

The Phoenix Chip is the world's first monolithically integrated native 2160-channel automotive-grade SPAD-SoC. It delivers ultra-high resolution of over 4 megapixels and an ultra-long detection range of 600 meters, elevating the perception precision and coverage of LiDAR to an unprecedented level. The chip now has obtained automotive-grade certification and is scheduled for mass production and vehicle integration within 2026, serving as the ultra-high-definition perception foundation for L3 and above high-level intelligent driving.

The Peacock Chip is the industry's first production-ready all-solid-state large-area SPAD-SoC with a resolution of 640X480. With an ultra-wide field of view of 180°X135° and millimeter-level accuracy, it enables short-range, blind-spot-free point, ultra high-density point cloud coverage, offering unprecedented cost-effectiveness. Scheduled for mass production in Q3 2026, it will be mainly oriented to automotive side and blind-spot detection LiDAR, robotics and spatial intelligence markets to drive large-scale adoption of high-performance perception.

2.Digital Architecture Fully Replaces Analog Architecture

From 2024 to 2025, the automotive LiDAR industry underwent a generational transformation of core architectures. Digital architectures represented by SPAD-SoC (Single-Photon Avalanche Diode - System-on-Chip) have fully replaced traditional analog architectures and become the standard solution for high-performance automotive LiDAR.

SPAD-SoC adopts a sensing-computing integrated architectural design, integrating SPAD arrays and a complete digital signal processing system on a single chip. SPAD-SoC can complete the full workflow including photon detection, time measurement, signal processing and data output simultaneously, directly outputting depth/image data upon photon incidence.

Compared with traditional discrete solutions, SPAD-SoC features high integration, low power consumption, compact size and fast response speed. It acts as the core component for long-range high-channel LiDAR and short-range Flash LiDAR, exerting the most significant impact on LiDAR performance, thus evolving into a critical technological highland contested by all LiDAR suppliers.

3.Chip-Based 6D Full-Color Perception

In 2026, chip-based 6D full-color perception marks LiDAR evolves from a "color-blind measuring instrument" to a "full-color observer". It upgrades from merely outputting three-dimensional spatial coordinates (XYZ) to six-dimensional perception capability that synchronously outputs spatial coordinates and color information (RGB).

At the chip level, color light sensing (RGB) and TOF ranging (XYZ) achieve native pixel-level fusion, directly generating colored point clouds. This means every data point inherently carries precise spatial position and authentic color information upon generation - no stitching, calibration or supplementary deduction required.

Take Hesai's Picasso 6D full-color LiDAR chip as an example: Hesai embeds RGB color light sensing functionality directly into the receiving chip of LiDAR. The Picasso SPAD-SoC adopts an all-fusion design where a single chip handles both near-infrared laser ranging and visible light sensing. Each pixel unit can both emit lasers to measure distance and capture light to identify colors. This means that when laser beams reflect off objects, the chip instantly captures both the spatial position and color of each point.

Radar Sensor Chips: Satellite Architecture and High-Channel Design

1. Adaptation Trend of Satellite Architecture

In 2026, Satellite Architecture emerges as the core technological transformation direction for automotive radar sensor chips. This architecture subverts the traditional "edge intelligence" design philosophy, driving radars to evolve from independent black box to open perception frontend.

The essence of satellite architecture is a "division of labor model" for intelligent driving perception systems. Radars act as "satellites" dedicated to frontend perception (RF transceiving and raw data collection), while complex signal processing, target detection and tracking algorithms are entirely migrated upward to the central domain controller.

There are two primary satellite radar solutions:

Dedicated RSP IC Solution: Adopts dedicated Radar Bridge chips featuring high energy efficiency and flexibility, led by radar module suppliers;

RSP IP Integrated ADAS SoC Solution: Integrates radar signal processor IP into ADAS SoC for maximum integration, led by OEMs.

2. Popularization of 8T8R Imaging Radar Accelerates

2026 marks the inaugural year for the mass production of 8T8R imaging radar chips. The successive launch of single-chip 8T8R solutions including NXP TEF8388 and Infineon CTRX8188F is driving 4D radar from high-end optional configuration to large-scale popularization. Boasting lower cost, higher integration and superior power efficiency, the 8T8R architecture serves as a critical bridge between mid-end 6T8R and high-end 16T16R/24T24R solutions. Single-chip 8T8R solutions adopt CMOS technology to highly integrate RF frontends and signal processing, striking an optimal balance among performance, cost and mass producibility. It is projected to rapidly penetrate mainstream RMB150,000 vehicle models over the next three years and become a "rigid demand" for high-level intelligent driving perception systems.

Take Infineon RASIC(TM) CTRX8188F as an example: This 8T8R automotive radar transceiver targets imaging radar and high-level ADAS applications. Such high-channel radar chips apply not only to conventional radar modules but also central computing architectures, transmitting rich raw radar data to backend computing platforms.

The CTRX8188F delivers multiple industry-leading RF performance metrics: transmitting power of 14.5dBm ensuring long-distance radar detection; phase noise as low as -100 dBc/Hz for superior signal-to-noise ratio; noise figure of 10.2dB delivering industry-leading receiving sensitivity; 4GHz ultra wideband enabling centimeter-level distance resolution; modulation speed up to 200 MHz/µs meeting detection requirements for high-speed moving targets.

Ultrasonic and UWB Near Field Perception Chips: Upgraded from Auxiliary to Core Perception

1. Core Technological Trend of Ultrasonic Radar Sensor Chips: Integrated Architecture

Integration of Edge AI Inference Capability: In 2026, mainstream ultrasonic radar modules integrate microcontrollers equipped with Neural Processing Units (NPU), enough to support real-time inference of lightweight deep learning models.

Cross-Sensor Modal Alignment and Fusion: The collaborative capability of ultrasonic radar chips evolves from inter-sensor coordination to multi-modal fusion. In high-end intelligent driving architectures in 2026, short-range high-precision distance data from ultrasonic radars, rich texture information from cameras and velocity vector data from radars are fused via Transformer architecture with cross-modal attention mechanisms.

2. Core Technological Trend of Automotive UWB Near Field Perception Chips: Multi-Functional Integration

With the combination of millimeter-wave and UWB technologies, UWB technology is striving to deliver "full-scenario safety protection" for vehicle usage, covering from car search, unlocking, and obstacle avoidance in ADAS operation to parking, door opening and locking. This represents not merely superposition of functions, but a reconstruction of system efficiency and cost structure. UWB is evolving from a single "smart key" to an "intelligent neural network" connecting internal and external perception networks.

Evolution from "Communication Chips" to Communication-perception Integrated SoC

The "three-in-one" integration of chip architecture means that mainstream UWB chips have evolved from communication chips only supporting ranging to a "positioning + radar + communication" trinity SoC solution.

Evolution from "Single-Point Perception" to Collaborative Perception

Traditional UWB radar anchor points operate independently, creating near-field blind spots. By adopting the Sensing technology defined under IEEE 802.15.4ab standard, Calterah realizes multi-static radar mode - rear anchor R1 transmits while R2 receives and vice versa, transforming isolated UWB radars into networked radars operating in coordination.

Take Calterah's UWB product series as an example: Calterah launched two mature development kits: one for in-cabin Child Presence Detection (CPD), and the other for parking assist systems based on 4ab Sensing technology. These kits deliver a complete set of hardware reference design, software SDK, AI model and toolchain to Tier 1 suppliers and OEMs.

The development kits integrate multi-functional fusion solutions including digital key, kick-to-open tailgate, in-vehicle child detection, external parking assist and sentry mode to form an engineering solution ready for rapid deployment. By reusing a set of vehicle-body UWB anchor points, multiple intelligent perception and connectivity scenarios can be enabled.

1 Overview of Automotive Autonomous Driving Sensor Chip Market

1.1 Overview of Automotive Autonomous Driving Sensor Chips
- 1.1.1 Types of Autonomous Driving Sensor Chips
Overview and Classification of Autonomous Driving Sensor Chips
Functional Principles, Signal Processing Links and Core Technical Indicators of Camera Perception Chips
Functional Principles, Signal Processing Links and Core Technical Indicators of LiDAR Chips
Functional Principles, Signal Processing Links and Core Technical Indicators of Radar Chips
Functional Principles, Signal Processing Links and Core Technical Indicators of Ultrasonic Radar Chips
Comparison of Advantages, Disadvantages and Complementary Perception Logic of Various Autonomous Driving Sensor Chips
Fusion Strategy and Function Mapping of Autonomous Driving Sensors

1.1.2 Sensor Configuration for Different Levels of Autonomous Driving

China's Taxonomy of Driving Automation for Vehicles
Installation Rate of L1-L3 Intelligent Driving Systems (Including Hardware Pre-Embedded) in Passenger Cars in China, 2022-2030E
Sensor Configuration of Autonomous Driving by Level
Intelligent Driving Solutions, Sensor Configurations and Suppliers of OEMs (1)
Intelligent Driving Solutions, Sensor Configurations and Suppliers of OEMs (2)
Intelligent Driving Solutions, Sensor Configurations and Suppliers of OEMs (3)
Intelligent Driving Solutions, Sensor Configurations and Suppliers of OEMs (8)
Intelligent Driving Solutions, Sensor Configurations and Suppliers of OEMs (9)
Sensor Configurations for Current Mainstream Intelligent Driving Solutions of OEMs and Their Next-Generation Deployment Plans (1)
Sensor Configurations for Current Mainstream Intelligent Driving Solutions of OEMs and Their Next-Generation Deployment Plans (2)
Sensor Configurations for Current Mainstream Intelligent Driving Solutions of OEMs and Their Next-Generation Deployment Plans (3)
Sensor Configurations for Current Mainstream Intelligent Driving Solutions of OEMs and Their Next-Generation Deployment Plans (4)
Sensor Configurations for Current Mainstream Intelligent Driving Solutions of OEMs and Their Next-Generation Deployment Plans (5)
Sensor Configurations for Current Mainstream Intelligent Driving Solutions of OEMs and Their Next-Generation Deployment Plans (6)
1.2 Industrial Policies and Standards
- 1.2.1 Dynamics in Autonomous Driving Sensor Standards
Dynamics in Chinese Regulations and Standards for Autonomous Driving Sensors

2 Automotive Camera Sensor Chips

2.1 Summary of New Automotive Camera Sensor Chip Products and Trends
Summary of New Automotive Camera Sensor Chip Products (1)
Summary of New Automotive Camera Sensor Chip Products (2)
Summary of New Automotive Camera Sensor Chip Products (3)
Summary of Development Trends of Automotive Camera Sensor Chips
New Automotive Camera Sensor Chip Products
Technical Trend 1 of Automotive Camera Sensor Chips
Technical Trend 2 of Automotive Camera Sensor Chips
Technical Trend 3 of Automotive Camera Sensor Chips
2.2 Classification and Market Size Forecast for Automotive Camera Sensor Chip Products
Classification of Core Chip Products for Automotive Camera Sensors - CMOS Image Sensor (CIS)
Performance Specification Indicators of CMOS Image Sensor (CIS)
Structural Composition of CMOS Image Sensor (CIS) (1)
Structural Composition of CMOS Image Sensor (CIS) (2)
Classification of Core Chip Products for Automotive Camera Sensors
Performance Specification Indicators of Image Signal Processors (ISP)
Image Signal Processor (ISP) IP
Image Signal Processor (ISP) IP: Automotive-Grade Products and Certifications of Overseas and China's Local Suppliers (1)
Image Signal Processor (ISP) IP: Automotive-Grade Products and Certifications of Overseas and China's Local Suppliers (2)
Shipments of Camera Chips (1-3MP, 5MP, 8MP and Above) for Chinese Passenger Cars, 2022-2030E
Shipments of Camera Chips (1-3MP, 5MP, 8MP and Above) for China's Local Passenger Cars, 2022-2030E (1)
Shipments of Camera Chips (1-3MP, 5MP, 8MP and Above) for China's Local Passenger Cars, 2022-2030E (2)
Shipments of Camera Chips (1-3MP, 5MP, 8MP and Above) for China's Local Passenger Cars, 2022-2030E (2)

3 Automotive LiDAR Sensor Chips

3.1 Summary of New Automotive LiDAR Sensor Chip Products and Trends
Summary of New Automotive LiDAR Sensor Chip Products (1)
Summary of New Automotive LiDAR Sensor Chip Products (2)
Summary of New Automotive LiDAR Sensor Chip Products (3)
New Automotive LiDAR Sensor Chip Products
Technical Trend 1 of Automotive LiDAR Sensor Chips
Technical Trend 2 of Automotive LiDAR Sensor Chips
Technical Trend 3 of Automotive LiDAR Sensor Chips
Technical Trend 4 of Automotive LiDAR Sensor Chips
3.2 Classification and Market Size Forecast for Automotive LiDAR Sensor Chip Products
Classification of Automotive LiDAR Sensor Chip Products (1)
Classification of Automotive LiDAR Sensor Chip Products (2)
Operating Mechanism of Automotive LiDAR Sensor Chips
Installations and Market Size of LiDAR for China's Local Passenger Cars, 2022-2030E
Market Size of LiDAR for China's Local Passenger Cars, 2022-2030E, Attached with Calculation Tables

4 Automotive Radar Sensor Chips

4.1 Summary of New Automotive Radar Sensor Chip Products and Trends
Summary of New Automotive Radar Sensor Chip Products (1)
Summary of New Automotive Radar Sensor Chip Products (2)
New Automotive Radar Sensor Chip Products
Technical Trend 1 of Automotive Radar Sensor Chips
Technical Trend 2 of Automotive Radar Sensor Chips (1)
Technical Trend 2 of Automotive Radar Sensor Chips (2)
Technical Trend 2 of Automotive Radar Sensor Chips (3)
Technical Trend 3 of Automotive Radar Sensor Chips (1)
Technical Trend 3 of Automotive Radar Sensor Chips (2)
4.2 Classification and Market Size Forecast for Automotive Radar Sensor Chip Products
Classification of Automotive Radar Sensor Chip Products
Industry Chain of Automotive Radar Chips
Installations of Radars (Traditional, 4D Imaging, Distributed Radars) for China's Local Passenger Cars, 2022-2030E, Attached with Calculation Tables

5 Other Sensor Chips

5.1 Trends and Market Size Forecast for New Automotive Ultrasonic Radar Sensor Chip Products
Summary of New Automotive Ultrasonic Radar Sensor Chip Products
New Automotive Ultrasonic Radar Sensor Chip Products
Technical Trend 1 of Automotive Ultrasonic Radar Sensor Chips
Technical Trend 2 of Automotive Ultrasonic Radar Sensor Chips
Technical Trend 3 of Automotive Ultrasonic Radar Sensor Chips
5.2 Trends and Market Size Forecast for New Automotive UWB Near-Field Sensing Chip Products
Summary of New Automotive UWB Near-Field Sensing Chip Products
Automotive Application Scenarios of UWB
UWB Function Expansion (1)
UWB Function Expansion (2)
New Automotive UWB Near-Field Sensing Chip Products
Technical Trend 1 of Automotive UWB Near-Field Sensing Chips
Technical Trend 2 of Automotive UWB Near-Field Sensing Chips

6 OEMs' Application and Future Trends of Sensor Chips

6.1 Geely
Summary of Intelligent Driving Platforms and Sensor Applications
Summary of Core Camera Sensor Chip Suppliers and Applications (Partial)
Summary of Core LiDAR Chip Suppliers and Applications (Partial)
Summary of Core Radar Chip Suppliers and Applications (Partial)
Intelligent Driving Solution Layout
LiDAR Chip Cooperation - RoboSense Eocene Digital Architecture and Dual Flagship Chips
Phoenix Chip Empowers Robotaxi Prototype Eva Cab (1)
Phoenix Chip Empowers Robotaxi Prototype Eva Cab (2)
LiDAR Chip Cooperation - Hesai FM C500 Main Control Chip Based on RISC-V Architecture
High-End Chips Empowers Intelligent Driving AI - G-ASD 4.0 (1)
High-End Chips Empowers Intelligent Driving AI - G-ASD 4.0 (2)
High-End Chips Empowers Intelligent Driving AI - G-ASD 4.0 (3)
6.2 Changan
Summary of Intelligent Driving Platforms and Sensor Applications
Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
Image Signal Processor (ISP) Cooperation - Fullhan FH8330E
LiDAR Chip Cooperation - Hesai FTX LiDAR
Ultrasonic Radar Chip Cooperation - Tinychip TCAU33 Automotive-Grade High-Voltage Direct-Drive Ultrasonic Sensor Chip
Radar Chip Cooperation - Calterah Andes-Pro and Andes Premium 8T8R Imaging Radar Solutions
Intelligent Driving AI - Tops AD
6.3 Great Wall Motor
Summary of Intelligent Driving Platforms and Sensor Applications
Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
Intelligent Driving Solution Layout
LiDAR Chip Cooperation - RoboSense Obtains OEM Designation Orders for New Vehicle Models
Image Signal Processor (ISP) Cooperation - Raytron Infrared Thermal Imaging System
LiDAR Chip Cooperation - Hesai Becomes Exclusive LiDAR Supplier for New-generation ORA Vehicle Models
Intelligent Sensor R&D Layout - RaboSensor
IC and Hardware Design
6.4 Chery
Summary of Intelligent Driving Platforms and Sensor Applications
Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
Intelligent Driving Solution Layout
CMOS Image Sensor (CIS) Chip Cooperation - SmartSens Automotive CIS
LiDAR Chip Cooperation - Hesai LiDAR
Multiple Sensors Empower Falcon Pilot System (1)
Multiple Sensors Empower Falcon Pilot System (2)
Multiple Sensors Empower Falcon Pilot System (3)
Multiple Sensors Empower Falcon Pilot System (4)
Multiple Sensors Empower Falcon Pilot System (5)
6.5 Volkswagen
Summary of Intelligent Driving Platforms and Sensor Applications (1)
Summary of Intelligent Driving Platforms and Sensor Applications (2)
Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
Summary of Core Sensor Chip Suppliers and Applications (Partial) (3)
Relying on System-on-Chips Independently Designed and Developed by CARIZON
Cooperation Update - Xheart X7 Chip
CARIZON C7H Intelligent Driving Chip (1)
CARIZON C7H Intelligent Driving Chip (2)
6.6 BYD
Summary of Intelligent Driving Platforms and Sensor Applications
Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
Intelligent Driving Solution Layout (1)
Intelligent Driving Solution Layout (2)
DiPilot High-Level Intelligent Driving System
Self-Developed Intelligent Driving Chip - Xuanji A3
Cooperation Update - RoboSense LiDAR Equipped with Phoenix Chip
6.7 Li Auto
Summary of Intelligent Driving Platforms and Sensor Applications
Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
Intelligent Driving Solution Layout
Self-Developed Chip - Mach M100 (1)
Self-Developed Chip - Mach M100 (2)
Self-Developed Chip - Mach M100 (3)
Self-Developed Automotive Chips - Autonomous Driving SoC, Intelligent Driving AI Inference Chip and SiC Power Chip for Motor Controllers
Cooperation Update - Hesai Technology Obtains LiDAR Designation Order for the Full Ragne of Li Auto's Vehicle Models with New-Generation Driving Assistance Platform
6.8 Xpeng
Summary of Intelligent Driving Platforms and Sensor Applications
Summary of Core Sensor Chip Suppliers and Applications (Partial)
Intelligent Driving Functions and Chip Application Trends (1)
Intelligent Driving Functions and Chip Application Trends (2)
Turing AI Chip (1)
Turing AI Chip (2)
Turing AI Chip (3)
Turing AI Chip (4)
6.9 NIO
Summary of Intelligent Driving Platforms and Sensor Applications
Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
Intelligent Driving Solution Layout
Strategic Cooperation with GigaDevice
Self-Developed LiDAR Chip - Yangjian Has Achieved Mass Production
Intelligent Driving SoC - Shenji NX9031
Intelligent Driving SoC - Performance Parameters of Shenji NX9031
6.10 Leapmotor
Summary of Intelligent Driving Platforms and Sensor Applications
Summary of Core Sensor Chip Suppliers and Applications (Partial)
LiDAR Chip Cooperation - Deepened Strategic Partnership with Hesai Technology
Cross-Domain Fusion Solution of Snapdragon(R) Cockpit Elite and Snapdragon Ride(TM) Elite
Intelligent Driving AI - Over 40 VLA Driving Assistance Functions
6.11 Xiaomi Auto
Summary of Intelligent Driving Platforms, and Core Sensor Chip Suppliers and Applications
Intelligent Driving Solution Layout
Hardware of Driving Assistance Sensors for New-Generation Xiaomi SU7 (Top-Spec for Full Range of the Model) (1)
Hardware of Driving Assistance Sensors for New-Generation Xiaomi SU7 (Top-Spec for Full Range of the Model) (2)
Hardware of Driving Assistance Sensors for New-Generation Xiaomi SU7 (Top-Spec for Full Range of the Model) (3)
Intelligent Driving Sensor Configuration Under EEA2.0 (Xiaomi YU7)
6.12 SAIC Motor
Summary of Intelligent Driving Platforms and Sensor Applications
Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
Intelligent Driving Solution Layout
IM AD 3.0 Intelligent Driving System
Innovative Cross-Domain Fusion Functions and Scenario Cases for Intelligent Driving - Peripheral Vision Perception Interaction (Intelligent Driving + Cockpit)
Innovative Cross-Domain Fusion Functions and Scenario Cases for Intelligent Driving - Falcon Smart Lighting System 2.0 (Lighting + Intelligent Driving + Cockpit + Chassis)
6.13 GAC
Summary of Intelligent Driving Platforms and Sensor Applications (1)
Summary of Intelligent Driving Platforms and Sensor Applications (2)
Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
Ultrasonic Radar Chip Cooperation - Geehy and GAC Jointly Develop China's First Mass-Produced Automotive-Grade Chip
LiDAR Chip Cooperation - Seyond Obtains LiDAR Designation Order for GAC Platform Vehicle Models
World Premiere and Mass Production of Horizon Journey(R) 6B Chip for Bz 3X
Hyptec GT Climb Edition - Hanyu M1 Chip
GAC Launches 12 Automotive-Grade Chips Together with Partners
6.14 FAW Hongqi
Summary of Intelligent Driving Platforms and Sensor Applications
Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
Feiren 1.X Architecture - Central Computing Platform - Self-Developed Five-Domain Fusion AI Chip "Hongqi No.1"
China's First Automotive-Grade Advanced Process Multi-Domain Fusion Chip - "Hongqi No.1"
Feiren 1.X Architecture Empowers Hongqi Sinan Intelligent Driving
6.15 Dongfeng Motor
Summary of Intelligent Driving Platforms and Sensor Applications
Summary of Core Sensor Chip Suppliers and Applications (Partial)
Chip Cooperation Update - Strategic Partnership with National New Energy Vehicle Technology Innovation Center
Intelligent Driving Solution Cooperation Update - SenseAuto and Dongfeng Motor Jointly Launches the Industry's First Generative Intelligent Driving Mass Production Solution
Multi-Sensor Fusion Empowers Tianyuan Intelligent Driving Technology Architecture R-AiD (1)
Multi-Sensor Fusion Empowers Tianyuan Intelligent Driving Technology Architecture R-AiD (2)
Multi-Sensor Fusion Empowers Tianyuan Intelligent Driving Technology Architecture R-AiD (3)
6.16 Huawei
Summary of Intelligent Driving Platforms, and Core Sensor Chip Suppliers and Applications
Summary of Core Sensor Chip Suppliers and Applications (Partial) (1)
Summary of Core Sensor Chip Suppliers and Applications (Partial) (2)
Iteration History and Continuous Evolution of Huawei ADS
MAEXTRO V800 Supporting 40 Sensors + Eightfold Redundancy
896-Chnnel LiDAR (1)
896-Chnnel LiDAR (2)
896-Chnnel LiDAR (3)
Partial Parameters of LiDAR/Radar Sensors for Qiankun Intelligent Driving
C-C Ring Network Architecture: Qiankun ADS 4.0
E/E Architecture: From Star Networking to Ethernet Ring Network
Luxeed - Luxeed S7 E/E Architecture Design: Intelligent Driving Domain Sensor Configuration (1)
Luxeed - Luxeed S7 E/E Architecture Design: Intelligent Driving Domain Sensor Configuration (2)
AITO - AITO M9 E/E Architecture Topology Diagram: MDC Autonomous Driving Domain Controller and Sensor Configuration
6.17 Tesla
Summary of Intelligent Driving Platform and Sensor Applications
Summary of Core Sensor Chip Suppliers and Applications (Partial)
Evolution of FSD Hardware Platform and Sensor Configuration
Implementation Stages of Autopilot/FSD Functions
Historical Iteration of Edge/Cloud Software and Hardware
Central Computing Module - Next-Generation HW5.0/AI 5.0 for Intelligent Driving
ISP IP of Automotive Chips for FSD Vision-only Solution
R&D Progress of AI5