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2109331

智慧車輛區域控制單元（ZCU）市場（2026 年）

Intelligent Vehicle Zone Control Unit (ZCU) Research Report, 2026
出版日期: | 出版商: ResearchInChina | 英文 500 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

ZCU 調查 - 跨域整合 ZCU 正在成為下一代基於區域的架構的邊緣運算節點。

目前，主流的區域架構是半集中式+區域架構，主要由多個中央運算平台和2到4個區域控制單元（ZCU）組成。現階段，所謂的「面向車身」的ZCU主要處理車身相關功能，但動力傳動系統和底盤相關的功能並未分離，而是透過專用的、獨立的功能域控制器來實現。

根據中央運算平台的整合程度，下一階段歐洲經濟區將出現兩條主要發展路徑。

路線一：基於區域的跨域整合架構－整合式駕駛座和駕駛電腦進一步增強，形成基於區域的跨域整合架構。在這個架構中，與車身、動力傳動系統和底盤相關的所有功能都被分解、分佈並整合到相鄰的區域控制單元（ZCU）中。目前，跨域整合的ZCU已成為主流，主要部署在L3+場景中。它們需要輕量級的邊緣預處理能力、高效能多核心MCU、大容量儲存、強大的通訊能力以及虛擬化支援。

路徑二——基於區域的架構，高度整合中央運算能力——中央運算能力進一步整合，架構也精簡。 ZCU顯著降低了本地運算能力，並向「中央大腦+智慧控制小腦+I/O區域控制」的模式演進，旨在進一步降低成本並提高整合度。在此階段，ZCU定位為純粹的邊緣I/O節點。面向I/O的ZCU不再執行應用邏輯，僅保留電源分配、協定傳輸和驅動功能。其差異化程度降低，對MCU運算能力和儲存的要求也降低，但I/O介面的豐富性被強調。

跨域整合 ZCU - 運動域中的車輛控制策略提升到 HPC，I/O 執行委託給 ZCU。

進階自動駕駛能力要求自動駕駛域同時呼叫垂直控制，以實現扭力、煞車、轉向和懸吊控制。這給動力傳動系統和底盤的協調控制提出了嚴格的要求，需要極低的確定性延遲。在傳統的運動域控制方案中，動力傳動系統網域控制站和底盤網域控制器獨立執行控制功能。它們同時處理車輛控制演算法、大規模I/O採集、電磁閥驅動、功率分配和閘道器傳輸等功能。在自動駕駛領域，這兩個網域控制器需要跨域連接。大量的鏈路、較長的通訊延遲和複雜的介面使得軟硬體分離和車輛控制功能的更新變得不適用。因此，在L3及以上等級的高階自動駕駛車輛中，動力傳動系統和底盤域的整合變得至關重要。

將動力傳動系統和底盤域整合到 ZCU 中，本質上是將網域控制器的兩大主要角色分開：控制策略被提升到更高層級，而 I/O 執行則被卸載到更低層級。它並非將所有動力傳動系統和底盤功能都塞進單一 ZCU，而是將動力傳動系統和底盤域的即時 I/O、本地執行、子封閉回路型、電源分配和閘道器功能卸載到更靠近它們的 ZCU 上。諸如 EPS、EPB 和 CDC 等子功能被遷移到 ZCU 軟體堆疊中，獨立的底盤 ECU 被取消，而 VMC 邏輯則被提升到中央 HPC。

動力傳動系統和底盤領域的執行器非常適合整合到ZCU中。運動領域相關的感測器和執行器，例如車輪速度感測器、煞車馬達和方向盤馬達，大多位於車輪或底盤附近，因此與ZCU的物理距離最短。由於運動領域執行器連接到附近的ZCU，因此通訊鏈路極短，從而確保了智慧駕駛功能所需的高即時性。

因此，跨域整合 ZCU 對 MCU 的處理能力、周邊設備介面、虛擬化機制和功能安全提出了相對較高的要求。

目前，整合運動域的跨域整合式零缺陷控制單元（ZCU）正成為歐洲經濟區（EEA）下一階段的主流解決方案。大多數國內主要整車廠商（OEM）正在規劃整合動力傳動系統和底盤域功能的下一代ZCU解決方案，而主要的一級供應商也在推出跨域整合式ZCU系統解決方案。

例如，精威海萊恩在2026年北京國際車展上展示了「Re-ZCU」。這是一款整合式零螺絲控制單元（ZCU），它採用單一MCU，將底盤域和車身域的功能整合在一起。在保留單通道EPB（電子停車煞車）、雙腔空氣彈簧和雙閥CDC減震器等底盤控制功能的同時，它還整合了後行李箱門開關、後座調整、後排空調調整和尾燈調整等常用車身控制功能。

Re-ZCU 將底盤功能與部分車身功能整合於後車廂，打破了傳統獨立 ECU 的功能界限。這種設計無需在後部車廂內單獨安裝底盤域控制器和車身控制器，簡化了車輛電路佈局，有助於降低車輛重量和成本。

ZCU 支援分散式音訊架構，並基於 AVB+TSN 乙太網路傳輸音訊串流。

除了整合運動域之外，下一代 ZCU 還將整合音訊放大器，從而實現獨立的音訊分區管理。在傳統的音訊解決方案中，功率放大器模組集中在一個獨立的功率放大器 ECU 或駕駛座域控制器中。所有揚聲器和麥克風訊號都匯集到專用的功率放大器或駕駛座域控制器，用於 DAC 轉換、功率放大和音訊效果處理。區域間的佈線使用專用的 A2B 音訊總線，但這帶來了一些挑戰，例如線束過長、佈線路徑複雜以及訊號衰減。

隨著區域架構的演進和用戶對駕駛座音訊體驗日益成長的需求，分散式音訊架構正採用一種將功率放大器功能分佈在各個區域控制單元（ZCU）上的方法，從而省去了獨立的功率放大器ECU，並將揚聲器連接到相鄰的ZCU。這是業界應該共同探索的方向。在分散式音訊架構中，功率放大器電路整合在ZCU內部。駕駛座SoC解碼音訊演算法，並透過AVB/TSN乙太網路將數位音訊傳輸到各區域的ZCU。透過驅動近距離的揚聲器，可以實現靈活的管理、同步傳輸以及個人化的多區域音訊體驗。

硬體整合：ZCU 整合了多通道音訊轉碼器、AVB/TSN 乙太網路音訊橋接器、小型資料庫（用於預先載入音訊效果演算法）以及基於 DSP 的功率放大器。 ZCU 直接取樣和處理來自本地麥克風、揚聲器和功率放大器的音訊節點訊號，並透過骨幹網路與中央域控制器交換資料。

軟體隔離：透過服務導向的架構 (SOA)，音訊功能被抽象化為獨立的服務（例如「音量控制服務」和「音效模式服務」）。每個 ZCU 按需調用，中央網域控制器全權負責編配整個策略。

簡化的線束：ZCU 透過本機電源和音訊匯流排連接本地區域中的音訊節點。這有效地縮短了揚聲器線束的長度，顯著降低了車載線束的重量和佈線的複雜性。這降低了硬體物料清單成本、車輛製造成本，並在確保系統功能的同時減輕了車輛的整體重量。此外，它還支援軟體定義音頻，並允許在不同車型之間進行靈活的平台迭代。

以英飛凌基於ZCU的AVB分散式音訊解決方案為例。其「中央運算+分散式ZCU」設計將乙太網路的高頻寬和低延遲特性與汽車區域音訊的要求相結合，實現了多區域音訊的靈活管理和控制、同步傳輸以及個人化體驗。

中央處理器和乙太網路切換器負責處理音訊資料、管理網路和調度流量。它們透過乙太網路連接各區域的音訊控制器，建構車載音訊和視訊傳輸的「骨幹網路」。同時，基於AVB協定的時間同步（gPTP）和服務品質（QoS）機制確保多區域音訊串流的低延遲、無卡頓同步傳輸。

去中心化 ZCU：

區域音訊功能 - 每個實體 ZCU 透過乙太網路接收 AVTP 音訊數據，並獨立控制音訊輸出，從而為每個區域實現個人化的音訊體驗。

音訊轉碼器作為區域音訊的「本地處理中心」，負責處理音訊訊號的編碼（類比數位轉換）、解碼（數位類比轉換）、混音和放大等過程。其中，I2S 是一種車規級序列音訊匯流排，適用於短距離、高可靠性的音訊傳輸。 TDM 支援在同一鏈路上進行多通道音訊傳輸，從而提高頻寬利用率。

MCU：本設備採用英飛凌的AURIX™ TC4x晶片。此晶片設計有專用的AVB周邊設備支援。它支援諸如IEEE 802.1AS和IEEE 802.1Qav之類的AVB協議，以及諸如IEEE 802.1Qbu、IEEE 802.1Qbv和IEEE 802.1CB之類的TSN協議。

跨領域整合 ZCU 正在重塑經營模式——硬體標準化和 OEM主導的軟體差異化。

在軟體定義車輛（SDV）時代，汽車電子架構透過模組化設計和軟體配置，實現了跨車型和等級的快速冗餘。 ZCU 在這種「硬體標準化+軟體差異化」的方法中發揮核心作用。

跨域整合式ZCU不再只是車身I/O、電源分配和閘道器功能的簡單單元，而是一個整合了車身、閘道器、電源分配、部分底盤/動力傳動系統運行、音訊放大器以及其他多種功能的本地邊緣計算單元。它必須同時符合ASIL-B和ASIL-D標準，並且必須透過虛擬機器管理程序實現安全隔離。因此，傳統的Tier 1黑盒模式正在逐步被淘汰，新的模式將轉向深度多方研究、軟硬體分離和分層協調、基於平台的預研，以及OEM廠商對更高層次SOA和車輛架構定義的掌握。

目前，ZCU產業鏈上的所有相關人員都在尋求更靈活的合作方式。晶片廠商正在拓展業務領域，涵蓋底層軟體和考試平台；核心軟體廠商正在提升自身地位；OEM廠商正在掌控車輛架構/SOA/應用層；一級供應商和EMS廠商則負責系統整合和硬體實現。例如，Flex、英飛凌和Vector共同推出了一款可擴展的ZCU開發套件；ST和AutoCore也共同發布了以乙太網路為基礎的ZCU分散式音訊解決方案；UAES則發布了一款「模組化」平台解決方案。這使得OEM廠商能夠靈活地選擇從硬體到完整解決方案的各種供應層級。

例如，Flex、英飛凌和Vector在2026年國際消費性電子展(CES)上合作推出了一款可擴充的ZCU開發套件。此解決方案的核心在於其模組化設計和可擴展架構，由約30個模組組成。開發人員可以根據具體的車型和功能需求靈活組合配置。這為後續的大規模生產提供了清晰的路線圖，使其能夠快速適應從入門級到豪華級、從傳統燃油車到高階自動駕駛汽車等各種車型。該解決方案是一個整合了晶片、軟體和EMS的一站式承包模型。英飛凌提供涵蓋MCU、功率半導體和安全晶片的核心半導體解決方案；Vector提供高效能內建軟體和開發工具；Flex則負責ZCU的硬體設計、製造和量產。

此開發套件的最高配置版本採用雙MCU冗餘架構，確保故障安全運作。它搭載英飛凌TC4x MCU，即時效能高達2 x 6,810 DMIPS。此外，它還配備2 x 10MB內存和2 x 21MB非揮發性內存，為L4級自動駕駛和高安全性應用提供了充足的性能空間。這種設計保證了功能安全，並為「軟體定義車輛」提供了強大的硬體基礎。 OEM廠商可以透過在標準化硬體上進行軟體更新和配置，不斷添加新功能並最佳化現有性能，從而顯著縮短新車的開發週期。

此外，也提供單MCU版本。開發人員可以根據實際專案和預算靈活選擇解決方案，充分體現「可擴展性和冗餘性」的核心理念。

在通訊介面方面，此ZCU解決方案幾乎涵蓋了目前汽車網路中所有主流協定。乙太網路介接包括兩個1000BASE-T1連接埠（其中一個可升級至2500BASE-T1）、兩個100BASE-T1連接埠和兩個10BASE-T1S連接埠。 CAN方面，它提供兩個支援部分連網的5 Mbit/s CAN-FD埠，以及18個用於車身和底盤通訊的非部分連網的5 Mbit/s CAN-FD埠。此外，它還整合了16個LIN介面、一個10 Mbit/s FlexRay介面、兩個125 kbit/s雙向PSI5介面、四個DSI3介面（最多支援12個超音波感測器）、兩個SENT介面（可升級至主觸發SPC協定）以及四個三線WSS（車輪速度感測器）介面（可升級至兩線方案）。

在訊號和電源控制層面，此 ZCU 解決方案具有四個下拉數位輸入、十個上拉數位輸入、二十四個上拉類比輸入和兩個 5V 類比輸出介面，可直接連接到各種汽車感測器和執行器。

電源控制方面，它整合了八個硬體級I²T保護的電子熔斷器、42個高側開關、四個低側開關、八個馬達半橋和一個有刷馬達全橋。它最多可為63個ECU或致動器供電，連續電流轉換能力為85A，總分佈式電流最高可達688A。

目錄

第1章：ZCU概要及市場

  • ZCU產品形態開發路徑
  • 下一階段分區建築的兩條路徑
  • ZCU的下一個發展方向
  • ZCU產品配置的三種類型比較
  • 集中整合架構中以 I/O 為導向的 ZCU 的應用邏輯
  • 各汽車製造商車輛型號中 ZCU 安裝情況的統計資料。
  • 各汽車製造商車輛機型中ZCU安裝情況的統計數據
  • ZCU市場格局及市場規模預測
  • 中國乘用車零能耗單元（ZCU）的安裝現況及市場規模預測（2023-2030 年）。
  • 中國乘用車零碳單元供應商的OEM市佔率（2026年1月至5月）
  • 中國乘用車用零碳單元供應商的OEM市佔率（2025年）
  • 中國獨立汽車品牌乘用車車身控制模組（BCM，包括中控單元）供應商的OEM市場佔有率（2024-2025年）

第2章：建構ZCU系統解決方案

  • ZCU系統整合解決方案
  • ZCU系統解決方案
  • ZCU硬體構造
  • ZCU：硬體配置
  • ZCU：底層硬體整合到一個可以透過軟體管理的系統。
  • ZCU硬體平台解決方案
    • 電源管理積體電路及解決方案
  • ZCU功率模組設計
  • ZCU PMIC/SBC 的選擇與總結
  • ZCU PMIC
  • ZCU電源管理解決方案
    • 微控制器和解決方案
  • ZCU MCU 創新要求
  • 未來ZCU-MCU競賽
  • ZCU和MCU的概述和選擇
  • ZCU MCU
  • ZCU MCU 應用解決方案
  • ZCU MCU 技術趨勢：無 MCU 設計
    • 通訊介面晶片和解決方案
  • ZCU通訊網路建設
  • ZCU與外部節點（骨幹網路）之間的通訊：主流100M/1000M乙太網路晶片概述
  • 100BASE-T1 應用範例：ONVO L60 通訊架構
  • 1000 BASE-T1 應用範例：小鵬 XEEA3.5 汽車通訊架構
  • ZCU 與區域內節點之間的通訊（本地低速用例）：10BASE-T1S 晶片概述
  • 10BASE-T1S晶片（1個）
  • 10BASE-T1S晶片（3個）
  • ZCU 10M乙太網路應用解決方案
  • ZCU 與區域內節點之間的通訊（感測器連接）：10G+ SerDes 晶片概述
    • 驅動積體電路/功率元件及解決方案
  • ZCU驅動模組的設計
  • ZCU 中外部容性負載的電源解決方案
  • ZCU HSD IC供應商及產品概覽
  • ZCU HSD IC
  • ZCU LSD IC供應商和產品概述
  • ZCU LSD IC
  • 半橋驅動IC供應商及產品概述
  • ZCU半橋驅動IC
  • H橋驅動IC供應商及產品概述
  • ZCU H橋驅動IC
  • ZCU電子熔絲IC供應商和產品概覽
  • ZCU e-Fuse IC
  • ZCU軟體開發
  • ZCU軟體層架構
  • ZCU SOA 設計
  • ZCU SOA 開發流程
  • 面向OEM廠商的區域SOA解決方案
  • ZCU發展合作模式
  • ZCU發展與合作模式：五種模式的比較
  • ZCU發展與合作模式：ZCU合作中的主要風險
  • ZCU發展與合作模式：重構跨學科綜合ZCU經營模式

第3章：ZCU 的最尖端科技趨勢

  • ZCU跨域整合與運動域
  • 跨領域一體化歐洲經濟區形式
  • MCU跨域整合ZCU的新要求
  • 跨領域整合ZCU：架構層面的關鍵挑戰
  • 跨學科綜合 ZCU 項目
  • 跨領域整合ZCU：軟體架構解決方案
  • 跨域整合ZCU：基於SOA框架
  • 跨領域整合ZCU解決方案概述
  • 跨域整合ZCU應用解決方案
  • 48V ZCU
  • 48V區域架構技術發展背景
  • 48V 配電架構的演變
  • 48V ZCU 設計 - 電源架構選擇：分散式電源與集中式電源
  • 48V ZCU 設計 - 電源網路拓撲和功能安全設計
  • 48V ZCU 設計 - 48V 半導體裝置的選擇
  • 48V ZCU 設計 - 48-12V 雙向 DC-DC 拓樸結構選擇
  • 48V ZCU 設計 - 電網隔離開關設計
  • 48V ZCU 設計 - 智慧型電子保險絲
  • ZCU供應商和解決方案概述
  • 48V ZCU 解決方案
  • ZCU分散式音訊
  • 分散式音訊架構 - 將功率放大器整合到 ZCU 中，以實現分段音訊管理。
  • 分散式音訊架構 - 基於 AVB+TSN 乙太網路的音訊串流傳輸
  • ZCU分散式音訊解決方案概述
  • ZCU分散式音訊解決方案
  • 光纖 ZCU
  • 車載骨幹網路對光纖通訊的需求
  • 汽車光纖骨幹：架構配置
  • 汽車光纖骨幹網路：與銅纜乙太網路骨幹網路的比較
  • 光纖 ZCU：基於光纖乙太網路的骨幹網路。
  • 光纖ZCU：基於PON的骨幹網路
  • 光纖ZCU：光電混合網路架構的主流化
  • ZCU光纖通訊網路架構 - 製造商和解決方案概述
  • ZCU光纖通訊解決方案

第4章：OEM廠商的ZCU實施解決方案

  • Xiaomi Auto
  • Geely
  • ZEEKR
  • NIO
  • XPeng
  • Leapmotor
  • Voyah
  • FAW Hongqi
  • Li Auto
  • BYD
  • Chery Automobile
  • Changan Automobile
  • GAC
  • SAIC
  • Tesla
  • Volkswagen
  • BMW

第5章：來自一級供應商的ZCU解決方案

  • Jingwei Hirain
  • Joynext
  • Desay SV
  • Huawei
  • Steelmate
  • ATECH
  • G-Pulse
  • Autolink
  • UAES
  • AUMOVIO
  • Marelli
  • Aptiv
  • Huaqin Technology
  • Neusoft Reach
  • Flex
  • H&T
簡介目錄
Product Code: XX021

ZCU Research: Cross-domain integrated ZCUs are becoming the edge computing nodes of the next-generation zonal architecture

Currently, the mainstream zonal architecture is mainly the quasi-central + zonal architecture with multiple central computing platforms and 2~4 ZCUs. At this stage, the so-called body-oriented ZCU is predominantly tasked with body-related functions, while functions associated with the powertrain domain and chassis domain are not decoupled, and are implemented via dedicated separate functional domain controllers.

By the integration level of the central computing platform, two main EEA paths will emerge in the next stage:

Path 1 - Zonal architecture with cross-domain integration: Cockpit-driving integrated computer integration will be further improved to form a zonal architecture with cross-domain integration. In this architecture, the related functions of the body, powertrain and chassis are all disassembled and scattered, and integrated into their nearby ZCUs. ZCUs at this stage are dominated by cross-domain integrated ZCUs, which will be mainly deployed for L3+ scenarios. Featuring lightweight edge pre-processing capabilities, they require high performance multi-core MCUs with high computing power, high-capacity storage, robust communication capability and virtualization support.

Path 2 - Zonal architecture with highly integrated central computing: Central computing is further integrated and the architecture continues to be streamlined. ZCUs completely weaken the local computing power and develop in the direction of central cerebrum + intelligent control cerebellum + I/O zone control, further reducing costs and improving integration. ZCUs at this stage are positioned as pure edge I/O nodes. I/O oriented ZCUs no longer execute application logic, and only retain power distribution, protocol forwarding and driver functions. Their differentiation is reduced, imposing lower requirements on MCU computing power and storage, with emphasis placed on the richness of I/O interfaces.

Cross-domain integrated ZCU: the vehicle control strategy of the motion domain is moved up to HPC, while I/O execution is moved down to ZCUs

High-level intelligent driving functions require the intelligent driving domain to simultaneously invoke torque, brake, steering and suspension vertical control. They impose stringent requirements on the coordinated control of powertrain and chassis, and demand extremely low deterministic latency. In traditional motion domain control solutions, the powertrain domain controller and chassis domain controller perform control functions separately. They are concurrently responsible for vehicle control algorithms, mass I/O acquisition, solenoid valve driving, power distribution, gateway forwarding and other functions. The intelligent driving domain needs to connect two domain controllers across domains. There are many links, longer communication delays, and complex interfaces, which are not conducive to software-hardware decoupling and vehicle control function updates. Therefore, in high-end autonomous vehicles of L3 and above, the integration of the powertrain domain and the chassis domain is highly necessary.

The integration of the powertrain domain and the chassis domain into a ZCU essentially decouples the two core responsibilities of domain controllers: control strategies are uplifted, and I/O execution is offloaded downwards. The cross-domain integrated ZCU does not stuff all powertrain and chassis functions, but offloads the real-time I/O, local execution, sub-closed loop, power distribution, and gateway capabilities of the powertrain domain and the chassis domain to their nearby ZCUs. Sub-functions such as EPS, EPB, CDC, etc. are migrated to the ZCU software stack, canceling the separate chassis ECU, and moving the VMC logic up to the central HPC.

Actuators of the powertrain domain and the chassis domain are well?suited for integration into ZCUs. Motion?domain?related sensors and actuators such as wheel?speed sensors, brake motors and steering motors are mostly located close to wheels and chassis, featuring the shortest physical distance to ZCUs. The actuator of the motion domain is connected to its nearby ZCU, so that the extremely short communication link can ensure the high real-time performance required by high-level intelligent driving functions.

Therefore, the cross-domain integrated ZCU places relatively high requirements on MCUs in terms of processing capabilities, peripheral interfaces, virtualization mechanisms, and functional security.

At present, the cross-domain integrated ZCU integrating the motion domain is the main solution for EEAs in the next stage. Most of the domestic mainstream OEMs have planned the next-generation ZCU solutions integrating powertrain and chassis domain functions, and major Tier 1 suppliers have also launched cross-domain integrated ZCU system solutions.

For example, Jingwei Hirain exhibited its Re-ZCU at the Beijing International Automotive Exhibition in 2026. This is a "chassis domain + body domain" integrated ZCU that uses a single MCU. On the basis of retaining chassis control functions such as single-channel EPB, dual-chamber air springs, and dual-valve CDC shock absorbers, it also integrates common body control functions like rear tailgate switch, rear seat adjustment, rear air conditioning adjustment, rear light adjustment, etc.

Re-ZCU integrates chassis functions and some body functions in the rear compartment, breaking the functional boundaries of traditional separate ECUs. This design eliminates the need for separate chassis domain controllers and body controllers in the rear compartment, helping to simplify the vehicle's circuit layout and reduce vehicle weight and cost.

ZCUs support distributed audio architectures and transmit audio streams based on AVB+TSN Ethernet

In addition to integrating the motion domain, ZCUs in the next stage will also integrate audio power amplifiers to achieve separate audio partition management. Traditional audio solutions centrally deploy power amplifier modules in a separate power amplifier ECU or cockpit domain controller. All speaker and microphone signals are aggregated to a dedicated power amplifier or cockpit domain controller for DAC conversion, power amplification and audio?effect processing. The A2B dedicated audio bus is adopted for daisy-chained cross-zone wiring, which brings challenges such as excessively long wire harnesses, complicated routing and signal attenuation.

With the development of the zonal architecture and higher user requirements for cockpit audio experience, the distributed audio architecture decentralizes power amplifier functions into ZCUs and eliminates separate power amplifier ECUs, with speakers connected to nearby ZCUs. It has become a direction for the industry to explore collectively. In the distributed audio architecture, power amplifier circuits are embedded within ZCUs. The cockpit SoC undertakes audio algorithm decoding, and digital audio is transmitted to ZCUs in each zone via AVB?TSN Ethernet. Speakers are driven in proximity to realize flexible management, synchronous transmission and personalized experience of multi-zone audio.

Hardware integration: ZCUs integrate multi-channel audio codecs, AVB/TSN Ethernet audio bridging, local storage (for pre-loading audio effect algorithms) and DSP?based power amplifiers. They directly sample and process audio?node signals from local microphones, speakers and power amplifiers, and exchange data with the central domain controller via the backbone network.

Software decoupling: Through a SOA, audio functions are abstracted into separate services (such as "volume adjustment service" and "sound effect mode service"). Each ZCU is invoked on demand, while the central domain controller is only responsible for strategy orchestration.

Wiring harness simplification: ZCUs connect local zone audio nodes via local power supply and audio buses, which effectively shortens speaker harness length and greatly reduces in-vehicle harness weight and routing complexity. While guaranteeing system functions, it cuts hardware BOM cost and lowers vehicle manufacturing cost as well as curb weight. At the same time, they enable software-defined audio and realize flexible platform iteration of different vehicle models.

Infineon's ZCU-based AVB distributed audio solution as an example: through the design of "central computing + distributed ZCUs", combined with the high bandwidth and low latency of Ethernet as well as automotive zone audio requirements, flexible management and control, synchronous transmission and personalized experience of multi-zone audio are achieved.

Central computing unit and Ethernet switch: they are responsible for audio data processing, network management and traffic scheduling. They connect each zone audio controller through Ethernet to build a "backbone network" for automotive audio and video transmission. At the same time, the time synchronization (gPTP) and quality of service (QoS) mechanisms based on the AVB protocol ensure low-latency, lag-free synchronous transmission of multi-zone audio streams;

Distributed ZCU:

Zone audio function: Each physical ZCU receives AVTP audio data through Ethernet and independently controls audio output to achieve zone-based personalized audio experience.

Audio Codec: It is the "local processing center" of zone audio, responsible for the encoding (analog -> digital), decoding (digital -> analog), mixing, amplification and other operations of audio signals. Wherein, I2S is an automotive-grade serial audio bus, suitable for short-distance, high-reliability audio transmission; TDM supports multi-channel audio transmission on the same link, improving bandwidth utilization.

MCU: Infineon AURIXTM TC4x is used. This chip is designed with specialized hardware peripheral support for AVB. It can support AVB protocols such as IEE802.1AS, IEEE802.1Qav, and TSN protocols like IEEE802.1 Qbu, IEEE802.1 Qbv, and IEE802.1 CB.

Cross-domain integrated ZCU reconstructs business model: hardware standardization, OEM-led software differentiation

In the SDV era, automotive electronic architectures achieve rapid multiplexing across vehicle models and classes through modular design and software configuration. ZCUs serve as the core carrier for "standardized hardware + software differentiation".

The cross-domain integrated ZCU is no longer a simple unit for body I/O, power distribution and gateway functions. Instead, it is a local edge-computing unit integrating body, gateway, power distribution, partial chassis/powertrain actuation, audio power amplifiers and multiple other functions. It should comply with both ASIL-B and ASIL-D, with safety isolation implemented via Hypervisor. Therefore, the traditional Tier1 black box model will gradually phase out, while the new model will move towards in-depth multi-party research, software-hardware decoupling and hierarchical collaboration, platform-based pre-research, and OEMs' mastery of upper-layer SOA and vehicle architecture definition.

Currently, all parties in the ZCU industry chain are exploring more flexible cooperation modes. Chip vendors extend upward to the underlying software and reference platforms, basic software vendors improve their status, OEMs upwardly master the vehicle architecture/SOA/application layer, and Tier1 suppliers or EMS providers undertake system integration and hardware implementation. For example, Flex, Infineon, and Vector collaborated to launch a scalable ZCU development kit; ST and AutoCore jointly released an Ethernet-based ZCU distributed audio solution, and UAES launched a "building block"-style platform solution, allowing OEMs to flexibly choose different supply levels from hardware to complete solutions.

For example, Flex, Infineon, and Vector collaborated to launch a scalable ZCU development kit at CES 2026. The core of this solution lies in its modular design and scalable architecture. It consists of about 30 modules internally. Developers can flexibly combine configurations according to specific vehicle models and functional requirements. It provides a clear path for subsequent mass production, quickly adapting to various vehicle models from entry-level to luxury segments, from traditional fuel models to high-end autonomous models. The solution is a one-stop turnkey model of "chip + software + EMS". Infineon provides core semiconductor solutions covering MCUs, power semiconductors and security chips, Vector provides high-performance embedded software and development tools, and Flex is responsible for the hardware design, manufacturing and mass production of ZCUs.

The highest configuration version of the development kit adopts a dual-MCU redundant architecture to ensure fail-safe operation. It uses Infineon's TC4x MCU with a real-time performance of 2 X 6,810 DMIPS. It is also equipped with 2 X 10MB memory and 2 X 21MB non-volatile memory, leaving sufficient margin for L4 autonomous driving and high-security-level applications. This design guarantees functional safety and provides a solid hardware foundation for "software-defined vehicles". OEMs can continuously unlock new features or optimize existing performance through software updates and configurations on standardized hardware, greatly shortening the development cycle of new vehicle models.

A single-MCU version is also available. Developers can flexibly choose the solution according to the actual projects and costs, fully embodying the core concept of "scalability and multiplexing".

In terms of communication interfaces, this ZCU solution covers almost all mainstream protocols of the current automotive network. Ethernet interfaces include two 1000BASE-T1 ports (one upgradable to 2500BASE-T1), two 100BASE-T1 ports and two 10BASE-T1S ports. For CAN, two 5 Mbit/s CAN-FD ports supporting partial networking are provided, together with eighteen 5Mbit/s CAN-FD ports without partial networking support for general body and chassis communication. In addition, it integrates 16 LIN interfaces, one 10 Mbit/s FlexRay interface, two 125 kbit/s bi-directional PSI5 interfaces, four DSI3 interfaces (supporting up to 12 ultrasonic sensors), two SENT interfaces (upgradable to master triggered SPC protocol), and four 3-wire WSS (wheel-speed-sensor) interfaces (upgradable to a 2-wire solution).

At the signal and power supply control level, this ZCU solution provides four pull-down digital inputs, 10 pull-up digital inputs, 24 pull-up analog inputs and two 5V analog-output interfaces, enabling direct connection to various automotive sensors and actuators.

For power control, it incorporates eight electronic fuses with hardware-based i2t protection, 42 high-side switches, four low-side switches, eight motor half-bridges and one brushed motor full-bridge. It can supply power to up to 63 ECUs or actuators, with a continuous current conversion capability of 85A and a total distributed current up to 688A.

Table of Contents

1 Overview and Market of ZCU

  • 1.1 Product Form Development Path of ZCU
  • Two Paths for Zonal Architecture in the Next Stage
  • Development Direction of ZCU in the Next Stage
  • Comparison of Three ZCU Product Forms
  • Application Logic of I/O?oriented ZCU under Central Integrated Architecture
  • 1.2 Statistics on ZCU Installation in Vehicle Models of OEMs
  • Statistics on ZCU Installation in Vehicle Models of OEMs (1)
  • Statistics on ZCU Installation in Vehicle Models of OEMs (9)
  • 1.3 ZCU Market Pattern and Market Size Forecast
  • Passenger Car ZCU Installations and Market Size in China, 2023-2030E (1)
  • Passenger Car ZCU Installations and Market Size in China, 2023-2030E (2)
  • OEM Market Share of Passenger Car ZCU Suppliers in China, Jan-May 2026
  • OEM Market Share of Passenger Car ZCU Suppliers in China, 2025
  • OEM Market Share of Passenger Car BCM (including ZCU) Suppliers of Independent Auto Brands in China, 2024-2025

2 ZCU System Solution Construction

  • 2.1 ZCU System Integration Solutions
  • ZCU System Solution 1:
  • ZCU System Solution 2:
  • 2.2 ZCU Hardware Construction
    • 2.2.1 ZCU Hardware Platform Solutions
  • ZCU: Hardware Composition
  • ZCU: The Underlying Hardware Should Be Incorporated into a Software-Manageable System
  • ZCU Hardware Platform Solution 1:
  • ZCU Hardware Platform Solution 4:
    • 2.2.2 PMICs and Solutions
  • ZCU Power Supply Module Design (1):
  • ZCU Power Supply Module Design (2):
  • ZCU PMIC/SBC Selection and Summary (1)
  • ZCU PMIC/SBC Selection and Summary (2)
  • ZCU PMIC/SBC Selection and Summary (3)
  • ZCU PMIC 1:
  • ZCU PMIC 2:
  • ZCU PMIC 3:
  • ZCU Power Supply Management Solutions:
    • 2.2.3 MCUs and Solutions
  • ZCU MCU Innovation Requirements (1)
  • ZCU MCU Innovation Requirements (2)
  • ZCU MCU Innovation Requirements (3)
  • Future ZCU MCU Competition
  • ZCU MCU Summary and Selection (1)
  • ZCU MCU Summary and Selection (5)
  • ZCU MCU 1:
  • ZCU MCU 6:
  • ZCU MCU Application Solution 1:
  • ZCU MCU Application Solution 2:
  • ZCU MCU Application Solution 3:
  • ZCU MCU Technology Trend: MCU Less Design
    • 2.2.4 Communication Interface Chips and Solutions
  • ZCU Communication Network Construction (1)
  • ZCU Communication Network Construction (2)
  • Communication between ZCU and External Nodes (Backbone Network): Summary of Mainstream 100M/1000M Ethernet Chips
  • 100 BASE-T1 Application Case: ONVO L60 Communication Architecture
  • 1000 BASE-T1 Application Case: XPeng XEEA3.5 Vehicle Communication Architecture (1)
  • 1000 BASE-T1 Application Case: XPeng XEEA3.5 Vehicle Communication Architecture (2)
  • Communication between ZCU and Intra?Zone Nodes (Local Low?Speed Use?Cases): Summary of 10BASE?T1S Chips
  • 10BASE-T1S Chips (1):
  • 10BASE-T1S Chips (3)
  • ZCU 10M Ethernet Application Solutions
  • Communication between ZCU and Intra?Zone Nodes (Sensor Connectivity): Summary of 10G+ SerDes Chips
    • 2.2.5 Driver ICs/Power Devices and Solutions
  • ZCU Driver Module Design (1): Zone Load Types and Driver IC Selection
  • ZCU Driver Module Design (2): Semiconductor-Based Power Distribution
  • ZCU Driver Module Design (3)
  • ZCU Driver Module Design (4)
  • Power Supply Solutions for Off-board Capacitive Loads in ZCU (1)
  • Power Supply Solutions for Off-board Capacitive Loads in ZCU (2)
  • Power Supply Solutions for Off-board Capacitive Loads in ZCU (3)
  • Summary of ZCU HSD IC Vendors and Products (1)
  • Summary of ZCU HSD IC Vendors and Products (2)
  • Summary of ZCU HSD IC Vendors and Products (3)
  • ZCU HSD ICs (1)
  • ZCU HSD ICs (2)
  • Summary of ZCU LSD IC Vendors and Products (1)
  • Summary of ZCU LSD IC Vendors and Products (2)
  • ZCU LSD ICs (1)
  • ZCU LSD ICs (2)
  • Summary of Half-Bridge Driver IC Vendors and Products (1)
  • Summary of Half-Bridge Driver IC Vendors and Products (2)
  • ZCU Half-Bridge Driver ICs (1)
  • ZCU Half-Bridge Driver ICs (2)
  • Summary of H-Bridge Driver IC Vendors and Products (1)
  • Summary of H-Bridge Driver IC Vendors and Products (2)
  • ZCU H-Bridge Driver ICs (1)
  • ZCU H-Bridge Driver ICs (2)
  • Summary of ZCU e-Fuse IC Vendors and Products (1)
  • Summary of ZCU e-Fuse IC Vendors and Products (2)
  • Summary of ZCU e-Fuse IC Vendors and Products (3)
  • ZCU e-Fuse ICs (1)
  • ZCU e-Fuse ICs (2)
  • 2.3 ZCU Software Construction
  • Software Layered Architecture of ZCU
  • ZCU SOA Design
  • ZCU SOA Development Process
  • Zone SOA Solutions of OEMs (1)
  • Zone SOA Solutions of OEMs (3): Features of Cloud-link-edge Integrated SOA Software Platform of Z-One "Galaxy" Full-stack 3.0
  • 2.4 ZCU Development & Cooperation Models
  • Mainstream ZCU Development & Cooperation Models
  • ZCU Development & Cooperation Models: Comparison of Five Models
  • ZCU Development & Cooperation Models: Key Risks in ZCU Cooperation
  • ZCU Development & Cooperation Models: Business Model Reconstructed by Cross-Domain Integrated ZCU

3 Cutting-Edge ZCU Technology Trends

  • 3.1 ZCU Cross?Domain Integration with Motion Domain
  • Cross-Domain Integrated EEA Forms
  • New Requirements of Cross-domain integrated ZCU for MCU
  • Cross-Domain Integrated ZCU: Core Challenges at the Architectural Level
  • Cross-Domain Integrated ZCU - Challenges
  • Cross-Domain Integrated ZCU: Software Architecture Solutions (1)
  • Cross-Domain Integrated ZCU: Software Architecture Solutions (5)
  • Cross-Domain Integrated ZCU: Based on SOA Framework
  • Summary of Cross-Domain Integrated ZCU Solutions
  • Cross-Domain Integrated ZCU Application Solution 1
  • Cross-Domain Integrated ZCU Application Solution 2
  • Cross-Domain Integrated ZCU Application Solution 3
  • 3.2 48V ZCU
  • Background of 48V Zone Architecture Technology Development (1)
  • Background of 48V Zone Architecture Technology Development (2)
  • Background of 48V Zone Architecture Technology Development (3)
  • Evolution of 48V Power Distribution Architecture (1)
  • Evolution of 48V Power Distribution Architecture (2)
  • 48V ZCU Design - Power Supply Architecture Selection: Distributed and Centralized Power Supply
  • 48V ZCU Design - Power Network Topology and Functional Safety Design (1)
  • 48V ZCU Design - Power Network Topology and Functional Safety Design (2)
  • 48V ZCU Design - 48V Semiconductor Device Selection
  • 48V ZCU Design - 48-12V Bidirectional DCDC Topology Selection
  • 48V ZCU Design - Grid Isolation Switch Design
  • 48V ZCU Design - Smart e-Fuse
  • Summary of ZCU Vendors and Solutions (1)
  • Summary of ZCU Vendors and Solutions (2)
  • 48V ZCU Solution 1:
  • 48V ZCU Solution 7:
  • 3.3 ZCU Distributed Audio
  • Distributed Audio Architecture: Power Amplifiers Are Integrated into ZCU To Achieve Partitioned Audio Management
  • Distributed Audio Architecture: Audio Stream Transmission Based on AVB+TSN Ethernet
  • Summary of ZCU Distributed Audio Solutions
  • ZCU Distributed Audio Solution 1:
  • ZCU Distributed Audio Solution 2:
  • ZCU Distributed Audio Solution 3:
  • 3.4 Fiber Optic ZCU
  • Demand for Fiber Optic Communication in In-vehicle Backbone Networks
  • Automotive Optical Fiber Backbone Network: Architecture Composition
  • Automotive Optical Fiber Backbone Network: Comparison with Copper Cable Ethernet Backbone Network
  • Fiber Optic ZCU: Backbone Network Based on Fiber Optic Ethernet
  • Fiber Optic ZCU: Backbone Network Based on PON
  • Fiber Optic ZCU: Mainstream Adoption of Photoelectric Hybrid Network Architecture (1)
  • Fiber Optic ZCU: Mainstream Adoption of Photoelectric Hybrid Network Architecture (2)
  • ZCU Fiber Optic Communication Network Architecture: Summary of Manufacturers and Solutions
  • ZCU Fiber Optic Communication Solutions (1)
  • ZCU Fiber Optic Communication Solutions (7)

4 ZCU Deployment Solutions of OEMs

  • 4.1 Xiaomi Auto
  • ZCU Evolution Roadmap (1)
  • ZCU Evolution Roadmap (2)
  • EEA 2.0 ZCU Platform: Three ZCUs (Front/Left/Right) Improve Integration
  • EEA 2.0 ZCU Platform: ZCU Function Integration Strategy
  • EEA 1.0 ZCU Platform: EEA Has Three ZCUs
  • EEA 1.0 ZCU Platform: ZCU Locations
  • EEA 1.0 ZCU Platform: ZCU Functional Block Diagram
  • EEA 1.0 ZCU Platform: ZCU Breakdown of Xiaomi SU7
  • EEA 1.0 ZCU Platform: Summary of ZCUs
  • 4.2 Geely
  • ZCU Evolution Roadmap
  • GEEA 3.0 ZCU Platform: Left/Right ZCU Solution
  • GEEA 3.0 ZCU Platform:
  • 4.3 ZEEKR
  • ZCU Evolution Roadmap
  • ZEEA 3.0 ZCU Platform: Intelligent Power Distribution Design (1)
  • ZEEA 3.0 ZCU Platform: Intelligent Power Distribution Design (2)
  • ZEEA 3.0 ZCU Platform: ZCU Anti-Pinch Software
  • ZEEA 3.0 ZCU Platform: ZCU Cooperative Development Model
  • ZEEA 3.0: Driving ZCU PCMU (1)
  • ZEEA 3.0: Driving ZCU PCMU (2) - Functional Levels and Classification
  • ZEEA 3.0: Driving ZCU PCMU (3) - Future Evolution Route
  • ZEEA 3.0: Driving ZCU PCMU (4) - Common Development Issues and Key Technologies
  • ZEEA 3.0 - Driving ZCU R&D Strategy 1
  • ZEEA 3.0 - Driving ZCU R&D Strategy 12
  • 4.4 NIO
  • ZCU Evolution Roadmap
  • ZCU Evolution Roadmap
  • NT3.0 ZCU Platform (High Performance) 1: 1*Central Supercomputing Platform + 2*ZCU
  • NT3.0 ZCU Platform (High Performance) 2:
  • NT3.0 ZCU Platform (High Performance) 3:
  • NT3.0 ZCU Platform (High Performance) - ES8: Front ZCU Function Integration Strategy
  • NT3.0 ZCU Platform (High Performance) - ES8: Rear ZCU Function Integration Strategy
  • NT3.0 ZCU Platform (ONVO): 1*Central Computing Platform + 3~4*ZCU
  • NT3.0 ZCU Platform (ONVO): ZCU Function Integration Strategy of ONVO L60
  • NT3.0 ZCU Platform - Software:
  • NT3.0 ZCU Platform - Software: SkyOS-based Intelligent Vehicle Control Software Platform (1)
  • NT3.0 ZCU Platform - Software: SkyOS-based Intelligent Vehicle Control Software Platform (4)
  • NT3.0 ZCU Platform - Software:
  • 4.5 Harmony Intelligent Mobility Alliance (HIMA)
  • ZCU Evolution Roadmap
  • VIU (Integration of Body Domain + Motion Domain):
  • ZCU Platform (STELATO S9):
  • ZCU Platform (STELATO S9):
  • ZCU Platform (AITO M7):
  • ZCU Platform (AITO M7):
  • ZCU Platform (AITO M9):
  • ZCU Platform (AITO M9): Left ZCU (VIU 1) - Body Functional Block Diagram and Network Architecture
  • ZCU Platform (AITO M9): Right ZCU (VIU 2) - Body Functional Block Diagram and Network Architecture
  • ZCU Platform (AITO M9): Rear ZCU (VIU 3) - Body Functional Block Diagram and Network Architecture
  • ZCU Platform (AITO M9): Right Domain Controller Disassembly (1)
  • ZCU Platform (AITO M9): Right Domain Controller Disassembly (4)
  • 4.6 XPeng
  • ZCU Evolution Roadmap
  • XEEA 4.0 ZCU Platform (G7)
  • XEEA 3.5 ZCU Platform: Functional Integration
  • XEEA 3.5 ZCU Platform: Network Topology
  • XEEA 3.5 ZCU Platform: System Development Capability Building
  • XEEA 3.5 ZCU Platform: Zone Control Hardware Development
  • XEEA 3.5 ZCU Platform: Zone Control Software Development
  • XEEA 3.5 ZCU Platform: Vehicle Cross-Domain Communication Middleware
  • XEEA 3.5 ZCU Platform: G9 - Right ZCU Disassembly (1)
  • XEEA 3.5 ZCU Platform: G9 - Right ZCU Disassembly (4)
  • XEEA 3.5 ZCU Platform Development Trends: Zone Control Hardware
  • XEEA 3.5 ZCU Platform Development Trends: Zone Control Software
  • 4.7 Leapmotor
  • ZCU Evolution Roadmap
  • LEAP 3.5 ZCU Platform:
  • LEAP 3.0 ZCU Platform:
  • ZCU Platform Design:
  • 4.8 Voyah
  • ZCU Evolution Roadmap
  • Tianyuan Intelligent Architecture ZCU 2.0 Platform:
  • Tianyuan Intelligent Architecture ZCU 2.0 Platform: Cross-Domain Function Integration (1)
  • Tianyuan Intelligent Architecture ZCU 2.0 Platform: Cross-Domain Function Integration (5)
  • Tianyuan Intelligent Architecture ZCU 2.0 Platform: Vehicle OTA Update Solution
  • Tianyuan Architecture ZCU 1.0 Platform: Based on SOA
  • Tianyuan Architecture ZCU 1.0 Platform: Hardware
  • Tianyuan Architecture ZCU 1.0 Platform: Function Allocation Logic
  • Tianyuan Architecture ZCU 1.0 Platform: VIU Integration
  • Tianyuan Architecture ZCU 1.0 Platform: 300+ SOA Open Interfaces Support Scenario Customization
  • 4.9 FAW Hongqi
  • ZCU Evolution Roadmap
  • FEEA3.0 ZCU Platform: EH7 Uses Three ZCUs (Front, Middle and Rear)
  • FEEA3.0 ZCU Platform: Body Function Breakdown of Hongqi EH7 (1)
  • FEEA3.0 ZCU Platform: Body Function Breakdown of Hongqi EH7 (4)
  • FEEA3.0 ZCU Platform: FAW.OS
  • FEEA3.0 ZCU Platform: Intelligent HIS Vehicle-Cloud Integrated Architecture
  • 4.10 Li Auto
  • ZCU Evolution Roadmap
  • Next-Generation Fiber Optic Communication ZCU Platform:
  • LEEA3.0 ZCU Platform (1):
  • LEEA3.0 ZCU Platform (7):
  • LEEA2.5 BCM Platform:
  • 4.11 BYD
  • ZCU Evolution Roadmap
  • Xuanji Architecture ZCU Platform (1):
  • Xuanji Architecture ZCU Platform (2):
  • e3.0 Evo Body Controller Platform (1):
  • e3.0 Evo Body Controller Platform (2):
  • 4.12 Chery Automobile
  • ZCU Evolution Roadmap
  • EEA5.0 ZCU Platform (1):
  • EEA5.0 ZCU Platform (2):
  • EEA5.0 ZCU Platform: Left ZCU Disassembly of STERRA ES/ET (1)
  • EEA5.0 ZCU Platform: Left ZCU Disassembly of STERRA ES/ET (5)
  • 4.13 Changan Automobile
  • ZCU Evolution Roadmap
  • SDA2.0 ZCU Platform (1):
  • SDA2.0 ZCU Platform (2):
  • 4.14 GAC
  • ZCU Evolution Roadmap
  • X-Soul4.0 ZCU Platform:
  • X-Soul3.0 ZCU Platform:
  • X-Soul3.0 ZCU Platform: ZCU Function Integration Strategy of Hyptec GT (1)
  • X-Soul3.0 ZCU Platform: ZCU Function Integration Strategy of Hyptec GT (2)
  • X-Soul3.0 ZCU Platform: ZCU Function Integration Strategy of Hyptec GT (3)
  • 4.15 SAIC
  • ZCU Evolution Roadmap
  • Galaxy Full Stack 4.0 ZCU Platform (1):
  • Galaxy Full Stack 4.0 ZCU Platform (2):
  • Galaxy Full Stack 4.0 ZCU Platform (3):
  • Galaxy Full Stack 3.0 ZCU Platform:
  • Galaxy Full Stack 3.0 ZCU Platform: ZCU Function Integration Strategy
  • Galaxy Full Stack 3.0 ZCU Platform: SOA (1)
  • Galaxy Full Stack 3.0 ZCU Platform: SOA (2)
  • Galaxy Full Stack 3.0 ZCU Platform: Right ZCU Disassembly (1)
  • Galaxy Full Stack 3.0 ZCU Platform: Right ZCU Disassembly (6)
  • 4.16 Great Wall Motor (GWM)
  • ZCU Evolution Roadmap
  • GEEA4.0 ZCU Platform:
  • GEEA4.0 ZCU Platform: Hardware Platform
  • GEEA4.0 ZCU Platform: SOA
  • 4.17 Tesla
  • ZCU Evolution Roadmap (1)
  • ZCU Evolution Roadmap (2)
  • Cybertruck ZCU Platform (1):
  • Cybertruck ZCU Platform (4): ZCU Function Distribution
  • Cybertruck ZCU Platform (5): EPB Integration
  • Model3/Y ZCU Platform (1):
  • Model3/Y ZCU Platform (2): Communication Architecture
  • Model3/Y ZCU Platform (3): Power Distribution Architecture
  • Model3/Y ZCU Platform (4): Function Integration Strategy - Front Body Zone
  • Model3/Y ZCU Platform (5): Function Integration Strategy - Left/Right Body Zone
  • Model3/Y ZCU Platform (6): Summary of body ZCU Technical Features
  • Model3/Y ZCU Platform (7): Front ZCU Disassembly
  • Model3/Y ZCU Platform (8): Left ZCU Disassembly
  • Model3/Y ZCU Platform (9): Right ZCU Disassembly
  • 4.18 Volkswagen
  • ZCU Evolution Roadmap
  • CEA ZCU Platform (1):
  • CEA ZCU Platform (2):
  • 4.19 BMW
  • ZCU Evolution Roadmap
  • Neue Klasse ZCU Platform:
  • Neue Klasse ZCU Platform: Next-Generation Software Platform (1)
  • Neue Klasse ZCU Platform: Next-Generation Software Platform (2)
  • Neue Klasse Architecture ZCU Platform: Functional Integration Strategy
  • Neue Klasse Architecture ZCU Platform: Cybersecurity
  • Neue Klasse ZCU Platform: ZCU Integrates Ambient Lighting (1)
  • Neue Klasse ZCU Platform: ZCU Integrates Ambient Lighting (4)

5 ZCU Solutions of Tier1 Suppliers

  • 5.1 Jingwei Hirain
  • ZCU Product Evolution Roadmap
  • ZCU: Diversified Cooperation Models
  • ZCU Product Solution 1:
  • ZCU Product Solution 2:
  • ZCU System Solution Design 1:
  • ZCU System Solution Design 6:
  • 5.2 Joynext
  • ZCU Product Evolution Roadmap
  • ZCU Product Solution:
  • ZCU System Solution Design 1:
  • ZCU System Solution Design 4:
  • 5.3 Desay SV
  • ZCU Product Evolution Roadmap
  • ZCU Product Solution:
  • Cross-Domain Integrated ZCU System Solution Design 1:
  • Cross-Domain Integrated ZCU System Solution Design 6:
  • 5.4 Huawei
  • ZCU Product Evolution Roadmap
  • ZCU Product Solution 1:
  • ZCU Product Solution 2:
  • ZCU Platform Software: Development & Cooperation Model
  • 5.5 Steelmate
  • ZCU Product Evolution Roadmap
  • ZCU Product Solution:
  • 5.6 ATECH
  • ZCU Product Evolution Roadmap
  • ZCU Product Solution:
  • Next-generation ZCU Research Project:
  • 5.7 G-Pulse
  • ZCU Product Evolution Roadmap
  • ZCU Product Solution 1:
  • ZCU Product Solution 2:
  • ZCU System Solution Design 1:
  • ZCU System Solution Design 2:
  • ZCU System Solution Design 3:
  • 5.8 Autolink
  • ZCU Product Evolution Roadmap
  • ZCU Product Solution 1:
  • ZCU Product Solution 2:
  • 5.9 UAES
  • ZCU Product Evolution Roadmap
  • ZCU Product Supply Model
  • ZCU Product Solution 1:
  • ZCU Product Solution 2:
  • ZCU System Software Platform:
  • 5.10 AUMOVIO
  • ZCU Product Evolution Roadmap
  • ZCU: Scalable And Modular Product Development Model
  • ZCU Product Solution:
  • Cross-Domain Integrated ZCU System Solution Design 1:
  • Cross-Domain Integrated ZCU System Solution Design 2:
  • 5.11 Marelli
  • ZCU Product Evolution Roadmap
  • ZCU Product Solution 1:
  • ZCU Product Solution 2:
  • ZCU Product Solution 3:
  • 5.12 Aptiv
  • ZCU Product Evolution Roadmap
  • ZCU Product Solution 1:
  • ZCU Product Solution 2:
  • ZCU System Solution Design:
  • 5.13 Huaqin Technology
  • ZCU Product Evolution Roadmap
  • ZCU Product Solution:
  • ZCU:
  • 5.14 Neusoft Reach
  • ZCU Product Evolution Roadmap
  • ZCU Product Solution 1:
  • ZCU Product Solution 2:
  • 5.15 Flex
  • ZCU Product Evolution Roadmap
  • ZCU Product Solution:
  • ZCU product business model:
  • 5.16 H&T
  • ZCU Product Evolution Roadmap
  • ZCU Product Solution: