全球及中國PCB（AI PCB）產業及供應鏈概覽（覆銅板、銅箔、電子樹脂、電子織物、專用設備）（2026年）

PCB市場規模：爆炸性的需求推動市場快速成長。

全球PCB產業呈現加速成長態勢。市場對全球PCB的需求持續擴大，主要PCB廠商未來的產能擴張計畫與設備升級需求將大幅推動PCB產業鏈的發展。到2024年，全球PCB產值達到735.6億美元，2010年至2023年的年複合成長率（CAGR）為2.2%。在通訊和消費性電子產業的帶動下，預計到2029年，全球PCB產值將成長至946.6億美元，2024年至2030年的年複合成長率（CAGR）預計為4.3%。

中國PCB產業持續引領全球，維持強勁成長動能。在PCB產能持續向中國轉移以及通訊、電腦、消費性電子、汽車電子產品、工業控制、醫療、航太等下游產業強勁需求的支撐下，近年來中國PCB產業成長普遍高於全球平均水準。作為全球最大的PCB生產基地，中國2022年PCB產值達438.4億美元。2010年至2022年，中國PCB產值年均複合成長率（CAGR）為6.6%，顯著高於全球平均成長率。預計到2028年，中國PCB產值將進一步達到464.7億美元，2023年至2028年年均複合成長率預估為4.2%。目前，中國PCB市場呈現穩定成長態勢，未來成長率預計將與全球整體平均水準大致相當。

從競爭格局來看，到2024年，Zhen Ding Technology以53.4億美元的營收位居全球第一，其次是Unimicron Technology和Dongshan Precision，營收分別為35.9億美元和34.1億美元。排名前十的廠商中，有三家來自中國當地，五家來自台灣地區。

趨勢 1：嵌入式製程克服了功率半導體封裝的瓶頸，實現了高整合度和高效散熱。

嵌入式PCB技術透過3D整合和半導體級製程將被動元件和功率晶片嵌入基板中，顯著提升了系統性能和整合度，同時克服了傳統封裝中使用寬能隙所帶來的散熱等挑戰。嵌入式PCB功率元件的製造主要有三種製程：基板上晶片（COS）、腔內晶片（CIC）和雙面微孔。

與傳統PCB製造不同，嵌入式功率晶片技術對生產環境提出了極高的要求，因此引進積體電路半導體製程並提供高性能的設備和製程非常重要。潔淨室要求和靜電放電防護是基本前提，並且必須在整個生產線上進行無損操作。因此，該工廠不再是傳統的PCB工廠，而更接近半導體封裝製造廠，這體現了PCB技術與封裝技術的深度融合。

趨勢2：積體電路基板是晶片封裝的核心材料，而中國龐大的市場加速國內生產。

IC基板是用於安裝IC晶片的基板，它保護裸晶片並提供外部連接。作為晶片封裝的核心材料，IC基板具有高密度、高精度、高性能、超薄和輕量化的特性。與一般PCB相比， 構裝基板對基板厚度、線寬/線間距和製造製程等多項技術參數的要求更高，代表了PCB產業最高水準的製造技術。目前，台灣、中國大陸、韓國和日本等地區的製造商主導全球IC基板市場，主要廠商著重FC-BGA/ABF等高階構裝基板。另一方面，國內IC基板製造商則著重FC-CSP和BT等低構裝基板產品，兩者之間仍存在顯著差距。然而，考慮到國內封裝製造商在產業中的主導地位、供應鏈自給自足和管理能力的必要性，以及人工智慧、工業智慧和自動駕駛等領域未來晶片需求的催化作用，預計國內IC封裝基板的生產進程將加快，為國內積體電路基板市場開闢廣闊前景。

本報告深入分析了全球和中國PCB產業，提供了市場規模、競爭格局、未來成長趨勢以及上下游產業趨勢等資訊。

目錄

第1章 PCB產業概覽

• PCB產業簡介
• PCB產業鏈

第2章 PCB產業資料及趨勢分析

• PCB市場規模及競爭格局
• PCB市場資料：依細分市場分類
• 多氯聯苯的未來成長趨勢
• 趨勢 1：CoWoP/正交背板對 PCB 製程/材料提出了新的要求，直接提高了整體價值。
• 趨勢 2：嵌入式製程克服了功率半導體封裝的瓶頸，實現了高整合度和高效散熱。
• 趨勢 3：積體電路基板是晶片封裝的核心材料，龐大的國內市場加速國內生產。
• 趨勢 4：在人工智慧時代，HDI正逐漸成為主流，其生產價值也逐漸提高。

第3章 PCB下游產業的資料與趨勢

• 人工智慧伺服器
• 消費性電子產品

第4章 PCB上游產業的資料與趨勢

• 電子樹脂
• 覆銅層壓板（CCL）
• 銅箔
• PCB專用設備
• 電子織物

第5章 PCB供應商

• WUS Group
• Shenghong Technology
• Kinwong
• Shengyi Electronics
• Shennan Circuits
• Dongshan Precision
• Avary Holding
• Shenzhen Fastprint Circuit Tech
• Xiamen Hongxin Electronics
• Aoshikang Technology
• Bomin Electronics
• Suntak Technologyy
• Olympic Circuit Technology
• Huizhou CEE Technology
• Delton Technology

PCB: The Core "Skeleton" and "Nerve Center" of Electronic Devices

Printed Circuit Board (PCB) refers to a circuit board that forms copper circuit patterns on a copper-clad laminate according to a predetermined design. It is mainly responsible for the circuit connection of various electronic components, playing the role of electrical connection. It is an indispensable component of most electronic devices and products, and is therefore also known as the "mother of electronic products". It is widely used in fields such as communication electronics, consumer electronics, computers, automotive electronics, industrial control, medical devices, national defense, and aerospace. PCB is not only a basic industry of modern information technology but also the industry with the largest proportion of output value in the global electronic component sub-industry.

PCB Classification: Adapt PCBs with different layers according to circuit complexity

PCBs can be classified into single-sided boards, double-sided boards, and multi-layer boards according to the number of circuit layers. Single-sided boards are the most basic type of PCB, used in basic electronic products such as common household appliances and electronic remote controls; double-sided boards, with the ability to route circuits on both sides, are widely used in consumer electronics, computers, automotive electronics, industrial control, and other fields. Multi-layer boards can be further divided into mid-low layer boards and high layer boards, suitable for relatively complex circuits, among which high layer boards are mainly used in communication equipment, high-end servers, military, and other fields.Meanwhile, based on the flexibility of the substrate material, PCBs can also be classified into three categories: rigid boards, flexible boards, and rigid-flex boards, each with its own unique characteristics and application scenarios.

PCB Industry Chain: A Complete Ecosystem from Basic Materials to High-End Applications

The PCB industry chain is closely linked and highly coordinated. The upstream mainly consists of core raw materials such as electrolytic copper foil, electronic-grade glass fiber Fabric, and epoxy resin, along with key auxiliary materials such as dry film, prepreg, ink, and chemical solutions. The midstream focuses on the core manufacturing and process steps of PCB, which involve multiple complex processes such as copper-clad laminate cutting, circuit imaging and etching, precision drilling, lamination, solder mask and silk screen printing, and electrical testing, ultimately producing diversified PCB products such as rigid boards, flexible boards, rigid-flex boards, and HDI boards. Downstream application scenarios are extremely extensive, ranging from core technology fields such as computers, semiconductors, and communication devices, to consumer electronics such as smartphones and home appliances, automotive electronics such as new energy vehicles and automotive radars in people's livelihood fields, and further to precision and high-end fields such as industrial control, high-end medical devices, and even aerospace and military, all of which rely on the support of PCBs, comprehensively enabling the intelligent and miniaturized development of various industries.

PCB Market Size: Explosive Demand Drives Rapid Market Growth

The global PCB industry is showing an accelerating growth trend. The market demand for the global PCB industry will further expand, and the future capacity expansion plans and equipment replacement needs of major PCB vendors will greatly promote the progress and development of the PCB industrial chain. In 2024, the global PCB output value reached 73.56 billion US dollars, and the CAGR of the global PCB output value from 2010 to 2023 reached 2.2%. It is expected that by 2029, driven by the communication and consumer electronics sectors, the global PCB output value will increase to 94.66 billion US dollars, with CAGR of 4.3% in 2024-2030.

China's PCB industry continues to lead the world with resilient growth. Benefiting from the continuous shift of PCB industry capacity to China and the strong growth in demand from downstream sectors such as communications, computers, consumer electronics, automotive electronics, industrial control and medical, aerospace, etc., the growth rate of China's PCB industry has generally been higher than the global level in recent years. As the world's largest PCB production base, China's PCB output value reached as high as $43.84 billion in 2022. During the period from 2010 to 2022, the CAGR of China's PCB output value reached 6.6%, far exceeding the global average growth rate. It is projected that by 2028, China's PCB output value will further climb to $46.47 billion, with a projected CAGR of 4.2% during the period of 2023-2028. Currently, the development of China's PCB market is stable, and its growth rate is expected to be basically on par with the global growth rate in the future.

From the perspective of the competitive landscape, in 2024, Zhen Ding Technology ranked first globally with revenue of $5.34 billion, followed by Unimicron Technology and Dongshan Precision, with revenues of $3.59 billion and $3.41 billion respectively. Among the top ten vendors, mainland Chinese vendors occupied 3 seats, and Taiwanese vendors occupied 5 seats.

Trend 1: Embedded process breaks through the bottleneck of power semiconductor packaging, achieving high integration and efficient heat dissipation

Embedded PCB technology embeds passive components and power chips into the board through three-dimensional integration and semiconductor-level processes, significantly enhancing system performance and integration, and overcoming issues such as heat dissipation in the application of wide-bandgap semiconductors in traditional packaging. There are mainly three mainstream processes for manufacturing embedded PCB power devices: Chip-on-Substrate, Chip-in-Cavity, and Double-side Microvia technologies.

Different from conventional PCB manufacturing, embedded power chip technology has extremely high requirements for the production environment, necessitating the introduction of IC semiconductor processes and the provision of high-performance machines and processes. Cleanroom requirements and ESD compliance have become basic prerequisites, and the entire production line needs to ensure non-destructive handling, which makes the factory no longer a traditional PCB factory but more like a semiconductor packaging manufacturing plant, reflecting the deep integration of PCB technology and packaging technology.

Trend 2: IC substrates are the core material for chip packaging, and China's vast market is accelerating domestic substitution

IC substrate is the base plate that carries IC chips, playing a role in protecting bare chips and connecting them to the outside world. As the core material for chip packaging, IC substrate features high density, high precision, high performance, thinness, and lightness. Compared with ordinary PCBs, IC packaging substrates have higher requirements for multiple technical parameters such as board thickness, line width/line spacing, and manufacturing processes, representing the highest manufacturing technology level in the PCB industry.Currently, manufacturers in regions such as Taiwan, China, South Korea, and Japan dominate the global IC substrate market, with leading manufacturers focusing mainly on high-end products such as FC-BGA/ABF packaging substrates. Domestic IC substrate manufacturers, on the other hand, focus on products with lower added value such as FC-CSP and BT packaging substrates, still showing a significant gap. However, considering the leading position of domestic packaging manufacturers in the industry, the need for self-reliance and controllability in the supply chain, as well as the catalytic effect of future demand for chips in fields such as AI, industrial intelligence, and intelligent driving, the progress of domestic substitution of IC packaging substrates is expected to accelerate, and the domestic IC substrate market has broad prospects.

Trend 3: HDI is gradually becoming the mainstream in the AI era, with its output value gradually increasing

With the development of modern electronic products towards miniaturization, thinness, and lightness, as well as the increasing requirements for circuit density and routing complexity due to chip performance upgrades, the demand for HDI (High Density Interconnect) is constantly being catalyzed. HDI, which stands for High Density Interconnect, is a type of circuit board with relatively high circuit distribution density that uses micro blind and buried via technology. Different from traditional multi-layer boards that are only connected through through-holes, HDI can also be connected through micro blind vias or buried blind vias in different internal layers, so its wiring density is also relatively higher. Currently, the mainstream process for HDI manufacturing is mainly the build-up method, which involves building up layers on both sides of the middle core board layer by layer, and then forming via holes through laser drilling for interlayer connection. The number of build-up layers corresponds to the order of HDI. With the rapid development of AI technology, HDI, with its high-density wiring, high heat dissipation efficiency, and good signal transmission performance, has gradually become the mainstream PCB technology type for AI servers. Moreover, HDI is evolving towards higher orders and finer line densities, and its value has also increased accordingly. Industrial chain enterprises with advantages in the HDI field have also achieved rapid growth in performance through this.Currently, domestic vendors represented by Shenghong Technology, relying on their technological and production capacity advantages, are continuously narrowing the gap in market share with overseas HDI vendors, and their industry status is steadily improving.

Vendor Dynamics (1): WUS Group Invests $300 Million to Develop High-Density Optoelectronic Integrated Circuit Boards

WUS Group plans to invest $300 million to launch the "High-Density Optoelectronic Integrated Circuit Board Project". According to the introduction, the "High-Density Optoelectronic Integrated Circuit Board Project" is planned to invest in the establishment of a Wholly-Owned Subsidiary in Jintan District, Changzhou City, build an incubation platform for cutting-edge technologies such as CoWoP and advanced processes such as mSAP, construct a closed-loop system of "R&D - Pilot - Verification - Application", lay out next-generation technology directions such as optical-copper integration, systematically enhance the signal transmission, power distribution, and functional integration capabilities of products, and after the relevant technical processes are verified to be mature and meet the industrialization conditions, invest in the construction of a large-scale production line for high-density optoelectronic integrated circuit boards.

CoWoP (Chip-on-Wafer-on-Platform PCB) is the next-generation packaging solution. Simply put, CoWoP technology is "CoWoS minus the packaging substrate", which means that after combining the silicon die with the silicon interposer, it is directly bonded to the enhanced-designed motherboard (Platform PCB), eliminating the traditional packaging substrate and BGA steps, forming an integrated structure of "chip-silicon interposer-PCB", achieving a thinner, lighter, and higher-bandwidth module design, while fully leveraging the high productivity and mature processes of large-size PCB production lines.

To achieve large-scale mass production of CoWoP, the key lies in the process that breaks through the precision limitations of traditional circuits-mSAP (Modified Semi-Additive Process), an advanced printed circuit board (PCB) manufacturing process, which is mainly applied to the advanced manufacturing technologies of substrate-like printed circuit boards (SLP) and BT substrates.Different from conventional processes that rely on subtractive etching, mSAP adopts an "additive-subtractive" approach: first, a layer of ultra-thin copper is coated on the substrate, then the circuit area is defined through photolithography, selectively electroplated for thickening, and finally the unnecessary thin copper layer is removed to form a fine circuit structure. Compared with traditional PCB processes, this process can achieve smaller line width/space (L/S), maintain high yield and excellent impedance consistency on large-area substrates, thereby meeting the stringent requirements of AI/HPC applications for high-speed signal transmission.

Vendor Dynamics(2): WUS Group Announces Breakthrough in M9 Hybrid Lamination Process

WUS Group announced on January 11, 2026, on the Interactive Easy Platform of the Shenzhen Stock Exchange that it has successfully mastered the hybrid pressing process of M9-grade high-speed materials and conventional materials. This technological breakthrough marks that China's high-end PCB manufacturing has entered the global leading level, and will provide core support for the upgrade of computing power infrastructure such as AI servers.

M9 material is currently the top-grade high-speed copper-clad laminate (CCL) material, specifically designed for 800G/1.6T ultra-high-speed transmission. Its core advantage lies in its extremely low dielectric loss (Df) (<=0.003), which can significantly reduce signal attenuation during transmission. Compared with previous-generation materials, M9 has achieved a qualitative leap in signal loss, thermal stability, and dielectric properties, comparable to an upgrade from a "green train" to a "high-speed rail".

Hybrid lamination process: On the same PCB board, the high-performance but costly M9 material is skillfully combined with conventional materials - using M9 to "pave the high-speed road" in critical areas and conventional materials to control costs in ordinary areas.

Technical challenges: The physical properties of different materials, such as thermal expansion coefficient, contraction rate, and pressing temperature, vary greatly, making it as difficult to perfectly integrate them on a single circuit board as to make people with very different personalities live in harmony. WUS Group successfully overcame this challenge thanks to its profound technical accumulation.

Latest Progress: WUS Group has passed NVIDIA's 78-layer M9-level orthogonal backplane certification, aiming to capture 50% of NVIDIA's orthogonal backplane market share.

Table of Contents

1 Overview of the PCB Industry

• 1.1 Introduction to the PCB Industry
• Overview: The Core "Skeleton" and "Nerve Center" of Electronic Devices
• Classification: PCB boards with different layers are adapted according to circuit complexity
• Classification: Batch boards feature both standardized products and can meet customized requirements
• Development History: From Technological Germination to Continuous Empowerment in the AI Era
• 1.2 PCB Industry Chain
• PCB Industry Chain: A Complete Ecosystem from Basic Materials to High-End Applications
• Upstream: Copper Clad Laminate (CCL) is the core raw material for manufacturing PCBs
• Upstream: Copper-clad laminates directly determine the electrical, mechanical, and thermal properties of PCBs
• Upstream: Copper foil is the core functional material for constructing the conductive pathways of PCBs
• Upstream: Electronic Fabric can enhance the mechanical strength and dimensional stability of copper-clad laminates
• Upstream: Electronic resin can affect the key characteristics of copper-clad laminates and PCBs
• Upstream: The glue formula determines the physical and chemical stability and insulation properties of copper-clad laminates
• Upstream: Functions and characteristics of other key materials such as copper balls and prepregs
• Midstream: Composition Structure and Interconnection Methods of PCB Boards
• Midstream: PCB manufacturing processes are complex and highly integrated in terms of technology
• Midstream: Production Process of Single/Double-Sided Boards and Multilayer Boards
• Midstream: Comparison of Three Processes for Inner Layer Circuit Processing
• Midstream: The industry standards of PCB ensure the consistency and reliability of products
• Midstream: AI Technology Boosts Quality and Efficiency in PCB Production and Design
• Midstream: 3D Printing Technology Empowers Innovation in Circuit Board Manufacturing
• Midstream: HDI technology drives the evolution of electronic devices towards high density and high performance
• Downstream: Ensuring servers achieve high computing power, high data processing, and stable operation
• Downstream : The replacement of traditional server chip platforms has led to the simultaneous upgrade of PCB specifications and materials
• Downstream: Enabling efficient signal transmission in communication devices
• Downstream: Achieving specification upgrades for switches
• Downstream: AI development is in full swing, and the upgrade and replacement of 800G are accelerating
• Downstream: Electrification, intelligentization, and lightweighting drive the value growth of automotive PCBs
• Downstream: The popularization and growth of ADAS have become a new growth point for automotive PCBs

2 PCB Industry Data and Trend Analysis

• 2.1 PCB Market Size and Competitive Landscape
• Market Size of PCB Industry, 2022 - 2030E
• Market Size of PCB Industry: Global PCB output value is showing an upward trend and is expected to reach $94.7 billion in 2029
• Market Size of PCB Industry: The global PCB industry is undergoing a shift in its industrial focus, with Chinese Mainland having become the world's largest production base in terms of output value
• Market Size of PCB Industry: China's Opportunities Amid the Global Eastward Shift of the PCB Industry
• Global PCB Regional Market Size Forecast, 2022~2030E
• Competition Landscape of the PCB Industry: Chinese Manufacturers Lead Globally, with Intense Competition in the Global PCB Industry
• Competition landscape in the PCB industry: There are numerous PCB manufacturers in China, with a significant head effect, and no monopoly has yet formed
• 2.2 PCB Segmented Market Data
• Forecast of the Market Size of the PCB Industry's Segmented Markets, 2022 - 2030E
• Market Size of Sub-segments in the PCB Industry: Standard multi-layer boards dominate the domestic PCB market, while HDI boards have great development potential
• Market Size of PCB Industry Segments: Driven by the demand for AI computing power, the global PCB industry is accelerating its upgrade towards high-complexity products
• Market Size of PCB Industry Segments: AI and High-Performance Computing (HPC) have become the core engines driving the growth of the global PCB market
• Global PCB Market Size Forecast by Type, 2022~2030E
• Global PCB Market Size Forecast by Application Area, 2022~2030E
• 2.3 Future Development Trends of PCB
• Trend 1: CoWoP/orthogonal backplane sets new requirements for PCB process/materials, directly increasing the overall value
• Trend 2: Embedded process breaks through the bottleneck of power semiconductor packaging, achieving high integration and efficient heat dissipation
• Trend 3: IC substrates are the core material for chip packaging, and the vast domestic market is accelerating domestic substitution
• Trend 4: HDI is gradually becoming the mainstream in the AI era, with its output value gradually increasing

3 PCB Downstream Industry Data and Trend

• 3.1 AI Server
• Overview: The Cornerstone of Computing Services
• Overview: CPU is the computing and control core of a computer
• Overview: X86 Architecture CPUs Became the Primary Choice for Early Servers
• Overview: GPU is currently the most widely used computing power chip in commercial applications
• Overview: FPGAs can define functions by changing configuration information
• Overview: ASICs are designed specifically for specific applications or algorithms
• Overview of AI Server Market: The "AI Computing Power Engine" with Explosive Growth
• Value Estimation of PCB in AI Servers
• Server PCB Specification Status
• AI Server Market Size: The market exhibits the distinct characteristics of "global resonance, China leading the way"
• AI Server Market Data: Server Shipment Volume
• PCB Applications in AI Servers
• Global Server PCB Market Size Forecast, 2022~2030E
• Global Server Market Size and Shipment, 2022~2030E
• PCB Market Drivers (1): Server and Switch Function Upgrades (1)
• PCB Market Drivers (1): Server and Switch Function Upgrades (5)
• 3.2 Consumer Electronics
• Market Size: China, as the world's largest single-country market and the largest manufacturing base for the consumer electronics industry
• Market Data (1): Smartphone Shipment Lifecycle
• Market Data (2): Smartphone Shipments and Brand Share
• Market Data (3): Smartphone Shipments and Brand Share
• Market Data (4): PC Shipment Lifecycle
• Market Data (5): PC Shipments and Brand Share
• Market Data (6): Tablet Shipment Lifecycle
• Market Data (7): Tablet Shipments and Brand Share
• Value Estimation of PCB in Consumer Electronics (1)
• Value Estimation of PCB in Consumer Electronics (2)
• Value Estimation of PCB in Consumer Electronics (3)
• Global Mobile Phone PCB Market Size, 2022~2030E
• Global Computer PCB Market Size , 2022 - 2030E
• Global Other Consumer Electronics PCB Market Size, 2022~2030E
• PCB Market Drivers (2): The explosive growth of AI phones and AI PCs drives both the volume and price of PCBs to rise
• PCB Market Drivers (2): Comparison of the Layouts of Major Participating Vendors in AI Phones
• PCB Market Drivers (2): AI Mobile Phone Ecosystem and Key Players
• PCB Market Drivers (2): The explosive growth of AI phones and AI PCs drives both the volume and price of PCBs to rise
• PCB Market Drivers (2): The explosive growth of AI phones and AI PCs drives both the volume and price of PCBs to rise

4 PCB Upstream Industry Data and Trend

• 4.1 Electronic Resin
• Overview: Electronic resin is an important raw material for copper-clad laminates
• Overview: Electronic resin can influence the key characteristics of copper-clad laminates and PCBs
• Overview: Electronic resin is continuously evolving and upgrading
• Introduction (1): Electronic Grade Epoxy Resin
• Introduction (2): Electronic Grade Phenolic Resin
• Introduction (3): Bismaleimide Resin BMI
• Introduction (4): Polyphenylene Oxide Resin PPO
• Introduction (5): Hydrocarbon Resin PCH
• Introduction (6): Polytetrafluoroethylene Resin PTFE
• Major producers of various types of electronic resins in China
• Market Data: Global Electronic Resin Market Size
• Market Data: Global Electronic Grade Epoxy Resin Market Size
• Market Data: Global Market Size of Electronic-Grade Phenolic Resin
• Market Data: Global Bismaleimide Resin Market Size
• Market Data: Global Polyphenylene Ether Resin Market Size
• Market Data: Global Hydrocarbon Resin Market Size
• Market Data: Global Polytetrafluoroethylene Resin Market Size
• Market Data: Competitive Landscape of Chinese Electronic Resin Enterprises
• Market Data: Key Enterprise Layout in China's Electronic Resin Industry
• Global Electronic Resin Shipment by Type, 2022-2030E
• Global Electronic Resin Market Size by Type, 2022-2030E
• Global Electronic Resin Competitive Landscape
• Development Trends (1): High-Frequency and High-Speed Upgrades Have Become the Irreversible Main Channel for Upgrading
• Development Trends (2): AI and the Communications Industry Become Core Growth Engines
• Development Trends (3): Deeply Linked to the High-End Process of Downstream Copper Clad Laminates/PCBs
• Electronic Resin Suppliers (1): Shengquan Group
• Electronic Resin Suppliers (2): Sichuan EM Technology
• 4.2 Copper Clad Laminate (CCL)
• Overview: CCL is the core raw material for manufacturing PCBs
• Overview: Internal Structure of Regular CCL Products
• Overview: CCL Product Types and Performance Requirements for Different Application Areas
• Overview: Classification of CCL Grades
• Market Data: High-End CCL Market Size
• Market Data: Production Capacity of Various Types of Copper Clad Laminates in China
• Market Data: Production and Growth of Various Types of Copper Clad Laminates in China
• Market Data: Estimation of Upstream Material Scale Expansion Driven by HDI Board Growth
• Global Output Value and Shipment of CCL by Type, 2022-2030E
• China's Output Value and Shipment of CCL by Type, 2022-2030E
• Global Competitive Landscape
• Competitive Landscape in China
• Development Trends (1): CCL is developing towards high frequency and high speed
• Development Trends (2): AI Drives Data Traffic Growth, High-Performance Materials and Multi-Layer HDI Become the Mainstream, Boosting the Value of CCLs
• Development Trends (3): AI Drives Data Traffic Growth, High-Performance Materials and Multi-Layer HDI Become the Mainstream, Boosting the Value of CCLs
• CCL Suppliers (1): Wazam New Materials
• CCL Suppliers (2): Nanya New Materials
• 4.3 Copper Foil
• Overview: Copper foil is a key raw material for PCBs
• Overview: The financial report of Mitsui, the leader in high-end PCB copper foil, shows that HVLP and carrier copper foil are expected to grow, with strong profitability
• Overview: High-End PCB Copper Foil - HVLP (1)
• Overview: High-End PCB Copper Foil - HVLP (4)
• Overview: High-End PCB Copper Foil - Carrier (1)
• Overview: High-End PCB Copper Foil - Carrier (2)
• Global Copper Foil Market Size
• Global HVLP Copper Foil Market Size
• Global Copper Foil Market Size and Shipment by Type, 2022-2030E
• Global Copper Foil Competitive Landscape
• China's Copper Foil Market Size
• China's HVLP Copper Foil Market Size
• China's Copper Foil Market Size and Shipment by Type, 2022-2030E
• Competition Landscape of China's Copper Foil
• Copper Foil Suppliers (1): Defu Technology
• Copper Foil Suppliers (2): Jiayuan Technology
• 4.4 PCB Special Equipment
• Overview: Drilling, Exposure, and Electroplating as Core Equipment
• Overview: PCB Production Processes and Their Required Equipment
• Introduction: Drilling Equipment (1)
• Introduction: Drilling Equipment (2)
• Introduction: Drilling Equipment (3)
• Introduction: Drilling Equipment (4)
• Introduction: Electroplating Equipment (1)
• Introduction: Electroplating Equipment (2)
• Introduction: Exposure Equipment (1)
• Introduction: Exposure Equipment (2)
• Global PCB Special Equipment Market Size, 2022-2030E
• China's PCB Special Equipment Market Size, 2022-2030E
• 4.5 Electronic Fabric
• Overview: Core Raw Material for Copper Clad Laminate Production
• Overview: Q fabric is one of the important materials for the next-generation ultra-low dielectric constant electronic fabric
• Overview: Copper clad laminates of M7 grade and above require the use of LowDk electronic fabric
• Overview: Quartz glass fiber is the material for LowDk Generation 3 fabric
• Overview: Quartz fiber is one of the Electronic Fabric reinforcement materials with the most excellent comprehensive performance
• Overview: Quartz fiber fabric is expected to become the core solution for NVIDIA's next-generation servers
• Overview: Quartz fiber fabric is expected to become the core solution for switches of 1.6T and above
• Overview: LowDk Electronic Fabric has a complex manufacturing process
• Overview: Chinese Manufacturers' LowDk Fabric Production Capacity Accelerates Catch-up
• Overview: The orthogonal backplane of NVIDIA's next-generation architecture Rubin Ultra may adopt M9 copper-clad laminates equipped with Q Fabric.
• Global Electronic Fabric Market Size
• Global Low-Dk Fabric Market Size
• Global Low-CTE Fabric Market Size
• Global Quartz Fabric (Q Fabric) Market Size
• Global Electronic Fabric Market Size and Shipment by Type, 2022-2030E (1)
• Global Electronic Fabric Market Size and Shipment by Type, 2022-2030E (2)
• Global Competition Landscape of Electronic Fabric
• Development Trends (1): Upgrade from LowDk-1 to LowDk-2
• Development Trends (2): Upgrading from High Thermal Expansion to Low Thermal Expansion (Low-CTE)
• Development Trends (3): Upgrading from Glass Fiber to Quartz Fiber
• Electronic Fabric Suppliers (1): China Jushi
• Electronic Fabric Suppliers (2): Grace Fabric Technology

5 PCB Vendors

• 5.1 WUS Group
• Overview
• Financial Data (1)
• Financial Data (2)
• Financial Data (3)
• Financial Data (4)
• Analysis of Advantageous Business
• Production Capacity (1)
• Production Capacity (2)
• Production Base (1)
• Production Base (2)
• Main Product (1)
• Main Products (2)
• 5.2 Shenghong Technology
• Company Overview
• Financial Data (1)
• Financial Data (2)
• Financial Data (3)
• Summary of Enterprise Financial Data
• R&D project
• Production Capacity Situation
• Production Base (1)
• Production Base (2)
• Main Products
• 5.3 Kinwong
• Overview
• Rich product matrix (1)
• Rich product matrix (2)
• Financial Data (1)
• Financial Data (2)
• Financial Data (2)
• Financial Data (3)
• Financial Data (4)
• List of Financial Data
• Production Capacity (1)
• Production Capacity (2)
• Production Base (1)
• Production Base (2)
• Main Products (1)
• Main Products (2)
• Main Products (3)
• 5.4 Shengyi Electronics
• Overview
• Financial Data (1)
• Financial Data (2)
• List of Financial Data
• Major Customers
• R&D Project (1)
• R&D Project (2)
• R&D Project (3)
• Production Capacity (1)
• Production Capacity (2)
• Production Base (1)
• Production Base (2)
• Main Products (1)
• Main Products (2)
• Main Products (3)
• 5.5 Shennan Circuits
• Overview
• Financial Data (1)
• Financial Data (2)
• List of Financial Data
• Main Products
• Product processing capacity
• Production Capacity (1)
• Production Capacity (2)
• Production Base (1)
• Production Base (2)
• Main Products (1)
• Main Products (2)
• 5.6 Dongshan Precision
• Overview
• Business Layout (1)
• Business layout (2)
• Financial Data (1)
• Financial Data (2)
• Financial Data (3)
• List of Financial Data
• Production Capacity
• Production Base
• Main Products (1)
• Main Products (2)
• 5.7 Avary Holding
• Overview
• Business Layout
• Financial Data (1)
• Financial Data (2)
• Financial Data (3)
• Financial Data (4)
• Business Analysis - Consumer Electronics Sector
• Business Analysis - Automotive & Server Sector
• List of Financial Data
• Production Capacity
• Production Base
• Main Products (1)
• Main Products (2)
• 5.8 Shenzhen Fastprint Circuit Tech
• Overview
• Business Layout (1)
• Business Layout (2)
• Financial Data (1)
• Financial Data (2)
• Summary of Financial Data
• Business Analysis
• Production Capacity (1)
• Production Capacity (2)
• Production Base
• Main Products (1)
• Main Products (2)
• 5.9 Xiamen Hongxin Electronics
• Overview
• Business Layout
• Financial Data (1)
• Financial Data (2)
• Financial Data (3)
• Summary of Financial Data
• Production Capacity (1)
• Production Capacity (2)
• Production Base (1)
• Production Base (2)
• Main Products (1)
• Main Products (2)
• 5.10 Aoshikang Technology
• Overview
• Business Layout (1)
• Business Layout (2)
• Business Layout (3)
• Financial Data (1)
• Financial Data (2)
• Financial Data (3)
• Summary of Financial Data
• Production Capacity
• Production Base
• Main Products (1)
• Main Products (2)
• 5.11 Bomin Electronics
• Overview
• Financial Data
• Production Capacity (1)
• Production Capacity (2)
• Production Base (1)
• Production Base (2)
• Main Products (1)
• Main Products (2)
• 5.12 Suntak Technologyy
• Overview
• Financial Data
• Production Capacity (1)
• Production Capacity (2)
• Production Base (1)
• Production Base (2)
• Main Products (1)
• Main Products (2)
• 5.13 Olympic Circuit Technology
• Overview
• Business Layout (1)
• Business Layout (2)
• Financial Data (1)
• Financial Data (2)
• Summary of Financial Data
• Production Capacity
• Production Base
• Main Products (1)
• Main Products (2)
• 5.14 Huizhou CEE Technology
• Overview
• Financial Data
• Production Capacity (1)
• Production Capacity (2)
• Production Base (1)
• Production Base (2)
• Main Products (1)
• Main Products (2)
• 5.15 Delton Technology
• Overview
• Business Layout
• Financial Data (1)
• Financial Data (2)
• Financial Data (3)
• Financial Data (4)
• Financial Data (5)
• Summary of Financial Data
• Production Capacity
• Production Base
• Main Products (1)
• Main Products (2)