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市場調查報告書

商品編碼

1806653

汽車用PMIC·信號連鎖晶片產業(2025年)

Automotive Power Management ICs and Signal Chain Chips Industry Research Report, 2025

出版日期: 2025年08月01日 | 出版商:

ResearchInChina | 英文 710 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

中央運算平台電源策略：高效能SoC採用多相控制器+DrMOS，結合大型PMIC+小型PMIC

系統單晶片（SoC）將運算、儲存、通訊和感測器介面整合在單一晶片上。例如，智慧駕駛SoC通常整合CPU、GPU、NPU/BPU、DSP/ISP、儲存、介面單元和安全模組等元件。這些SoC需要處理大量資料並執行複雜的計算，使車輛能夠做出即時決策。這需要先進的電源管理解決方案，尤其是核心電壓軌的電源管理解決方案。

區域控制+中央運算架構以及人工智慧的快速發展，對SoC的運算能力和效能提出了更高的要求。 SoC需要大規模平行運算能力、更高的時脈頻率和更快的動態反應時間。運算能力和效能的提升意味著發熱量、功耗和電流消耗的增加。同時，隨著GPU效能的提升，對電源穩定性的要求也日益提高。因此，高效能SoC需要更完善的電源管理方案，以實現更高的轉換效率、動態負載自適應能力、更精細的功率分配和控制策略，甚至在一定程度上降低發熱量。

在SoC中，單一GPU模組的電流需求接近100A，其他多個電路的電流需求接近50A。為了為SoC內部高功耗的NPU、GPU和CPU核心供電，SoC的高功率核心軌通常採用多相控制器+DrMOS的配電方案，以支援SoC的高算力需求。

區域控制器供電策略：PMIC/SBC部分取代LDO和DC/DC轉換器，領先企業推出一站式解決方案

區域控制單元（ZCU）的PCB板主要由主控MCU、電源管理單元、通訊電路、介面電路等組成。電源管理單元（PMU）包含DC/DC轉換器、LDO、PMIC、SBC等晶片，為MCU、CAN/LIN/乙太網路收發器等設備供電。在介面電路中，ZCU透過高低邊驅動晶片、電子保險絲、馬達驅動晶片、閘極驅動晶片以及分離式MOSFET等元件驅動車輛的電子負載。

ZCU 主控 MCU 的供電相對複雜。其核心、數位週邊裝置以及 ADC 都需要獨立的電源，所需電壓範圍包括 1.25V、3.3V、5V 等等。此外，由於 ZCU 本質上整合了網關功能，因此還需要為乙太網路交換器和 PHY 提供電源，通常額定電壓為 3.3V，電流為 2-3A，或額定電壓為 0.9V 或 1.1V，電流小於 1A。 ZCU 還包含座椅和車門的馬達控制功能。由於這些馬達的傳感器通常不在 ZCU 主機板上，因此需要一個追蹤器 LDO 來追蹤 MCU 的電源，以實現更精確的傳感器數據收集。

隨著區域控制架構的發展，透過 LDO 為分散的小型 ECU 中的 MCU 供電的功能可能會整合到 PMIC 中，用於區域控制器的供電。 LDO 與 DC/DC 轉換器一起整合到 PMIC 中，為 ZCU 提供系統級電源解決方案。目前，大多數 ZCU 的電源解決方案使用 PMIC 或 SBC，少數使用 DC/DC 轉換器和 LDO。

本報告對中國汽車 PMIC 和訊號鏈晶片產業進行了調查和分析，提供了全球及中國汽車類比晶片市場規模、配電架構發展趨勢以及國內外供應商的資訊。

Analog chips are used to process continuous analog signals from the natural world, such as light, sound, electricity/magnetism, position/speed/acceleration, and temperature. They are mainly composed of resistors, capacitors, transistors, integrated circuits, etc. According to their functions, analog chips can be divided into two major categories: power management chips and signal chain chips.

Signal Chain Chips: They process the analog signals (sound, light, electricity, speed, position, etc.) collected by sensors through transmission, reception, analog-to-digital conversion, amplification, filtering, and other operations, converting them into digital signals for further storage and processing. The main product types include amplifiers/comparators, data converters, isolation/interfaces, and clock chips.

Power Management Chips: They are often used for the management, monitoring, and distribution of power supplies in electronic devices. Their functions generally include voltage conversion, current control, low-dropout voltage regulation, power supply selection, dynamic voltage adjustment, and power switch timing control. They can be divided into AC/DC, DC/DC, LDO, battery management chips (BMIC), driver chips, multi-channel power management integrated circuits (PMIC), and system basis chips (SBC).

Power Supply Strategy for Central Computing Platforms: High-Performance SoCs Adopt Multi-Phase Controllers + DrMOS, Combined with Large PMICs + Small PMICs

A System-on-Chip (SoC) integrates computing, storage, communication, and sensor interfaces into a single chip. Taking an intelligent driving SoC as an example, it usually integrates components such as a CPU, GPU, NPU/BPU, DSP/ISP, storage and interface units, and security modules. These SoCs can process large amounts of data and perform complex calculations that enable vehicles to make real-time decisions. Therefore, advanced power management solutions are required, especially for core voltage rails.

With the rapid development of Zonal control + central computing architecture and AI, higher requirements are put forward for the computing power and performance of SoCs. SoCs need a large amount of parallel computing capabilities, higher clock frequencies, and faster dynamic response speeds. Higher computing power and performance mean greater heat generation, higher power consumption, and larger currents. At the same time, with the improvement of GPU performance, its requirements for power supply stability are also higher. Therefore, high-performance SoCs need more sophisticated power management solutions to achieve better conversion efficiency, dynamic load adaptation capabilities, more refined power distribution and control strategies, and also reduce heat generation to a certain extent.

In the SoC, current requirement of a single GPU module is close to 100A, and the currents of several other circuits are also close to 50A. In order to supply power to the power-hungry NPU, GPU, and CPU cores in the SoC, the high-power core rails of the SoC usually adopt a power distribution scheme of multi-phase controllers + DrMOS to support the high-computing-power requirements of the SoC.

Taking MPS's SoC power supply solution for central computing platforms as an example: For central computing platforms, MPS has launched the MPSafe central computing unit power solution suitable for high-performance SoCs. The solution of MPQ2967-AEC1 (multi-phase controller) + MPQ86960 (DrMOS) is specially designed for core power supply of high-computing-power and high-current main chips. This solution can achieve higher power density and efficiency, and realize a timing controller and monitoring that comply with the ISO 26262 ASIL functional safety standard.

MPQ2967-AEC1: As a multi-phase digital PWM controller, it can be configured as a four-phase two-rail controller at most, with fast transient response, programmability, and scalability.

MPQ86960-AEC1: As a high-performance DrMOS device, it is a monolithic half-bridge that integrates a power MOSFET and a gate driver. It can achieve a continuous output current (IOUT) of up to 50A within a wide input voltage (VIN) range.

The power management of central computing platform is extremely complex. In addition to the power supply for the SoC, devices such as MCUs, LPDDR, Flash, Ethernet switches, and SerDes also need power supply. Generally speaking, in addition to battery protection devices, primary power supplies, and "multi-phase controllers + DrMOS", the power supply of the entire central computing platform will also use large PMICs + small PMICs as supplements to ensure the stable transition of the system, automatic power-on and power-off, and help integrate functional safety. PMICs are very closely coupled with SoCs. Generally, manufacturers of SoCs and MCUs will design their own matching PMICs, and at most, an external ASIL-D power supply will be used as a "gatekeeper" for functional safety.

Taking NXP's central computing platform solution as an example: If the S32N series of processors is adopted, it can be combined with NXP's own PMIC power management chips PF53 and FS04. FS04 is a high-voltage ASIL-D PMIC for S32N processors, integrating 1 HV BUCK, 5 LV BUCKs, and 1 LDO. The FS04 PMIC improves accuracy through an analog-to-digital converter and complies with the ASIL D safety standard. The PF53 POL regulator supplies power to the S32N core, providing high-power support while optimizing material costs.

Power Supply Strategy for Zonal Controllers: PMICs/SBCs Will Replace Some LDOs and DC/DCs, and Leading Enterprises Launch One-Stop Solutions

PCB board of a Zone Control Unit (ZCU) is mainly composed of a main control MCU, a power management unit, a communication circuit, an interface circuit, etc. Among them, the power management unit includes chips such as DC/DC, LDO, PMIC, and SBC, which supply power to devices such as MCUs and CAN/LIN/Ethernet transceivers. In the interface circuit, the ZCU drives the electronic loads of the vehicle body through high/low-side driver chips, electronic fuses, motor driver chips, gate driver chips, and discrete MOSFETs.

The power supply for main control MCU of ZCU is relatively complex. The core, digital peripherals, and ADC all need independent power supplies, and the required voltages are 1.25V, 3.3V, 5V, etc. In addition, ZCUs basically integrate gateway functions, so they also need to supply power to Ethernet switches and PHYs, usually 3.3V with a current of 2-3A, and 0.9V and 1.1V with a current of less than 1A. Because the ZCU includes motor control for seats and doors, and the sensors of such motors are generally not on the ZCU main board, a tracker LDO is required to follow the power supply of the MCU to obtain sensor data more accurately.

In line with the changes in zonal control architecture, power supply demand of MCUs in scattered small ECUs through LDOs may be integrated into PMICs for zonal controller power supply. LDOs will be integrated with DC/DCs into PMICs to provide system-level power solutions for ZCUs. At present, most of the power supply solutions for ZCUs use PMICs or SBCs, and a small part use DC/DCs and LDOs.

Taking Infineon's zonal controller solution as an example: For zonal controllers, Infineon can provide one-stop solutions including the OPTIREG(TM) product series, supplementary NOR Flash solutions, microcontroller solutions, PROFET(TM) intelligent power switches, MOSFETs, and corresponding gate drivers.

In addition to power supply, SBCs also integrate other functions such as CAN/LIN transceivers, watchdog timers, LIMP HOME, and high-side drivers. In some designs, to simplify system design and reduce PCB area, DC/DC, LDO, Tracking LDO, watchdog, voltage monitoring, communication, and diagnostic functions are integrated into a single chip, facilitating functional redundancy and reducing PCB size.

Taking Novosense Microelectronics as an example, to meet the integrated needs of intelligent control modules in the next-generation automotive electronic architecture for power supply, communication, and driving functions, in July 2025, Novosense Microelectronics launched the new NSR926X series of automotive-grade SBC system basis chips. Adopting an all-in-one platform-level design, it integrates three low-dropout regulators (LDOs), four high-side drivers (HSS), a LIN transceiver, and a high-speed CAN transceiver with Partial Networking (PN) function.

Steer-by-Wire Systems: Transition from 12V to 48V Power Supply, and Development towards Full-Link Solutions for Sensing, Communication, Driving, and Control

Since steer-by-wire systems eliminate the mechanical connection between the steering wheel and the steering wheels and rely entirely on electronic signals and electric drives to perform steering operations, they not only need to drive high-torque steering motors (six-phase dual-motor redundancy design) but also support high-power consumption components such as road feel simulation motors, sensors, and controllers, and must meet the ASIL-D functional safety level. Therefore, the requirements of steer-by-wire systems for power management chips and driver chips are much higher than those of traditional steering systems.

In a steer-by-wire system, the power supply system is responsible for supplying power to two redundant six-phase steering motors, two redundant torque feedback motors, the electronic control unit in the system, and other vehicle electrical appliances, so the power supply bears a huge load. If the 12V power supply is still used, a larger current is required to obtain greater power, and excessive current will have an adverse impact on the overall stability of the system. Therefore, the power supply voltage of the steer-by-wire system can be increased, and a 48V power supply can be used to solve this problem. Compared with the 12V system, the 48V system can make the redundant actuators of high-peak load devices such as steer-by-wire systems lighter and more cost-effective.

Taking ON Semiconductor's steer-by-wire system solution as an example: For 48V steer-by-wire systems, ON Semiconductor has built a full-link technology from sensing and communication to driving and control, covering various products such as sensors, power supplies, signal chains, and isolation protection.

NIV3071: NIV3071 is an electronic fuse (e-Fuse) that integrates 4 independent channels in one package, supporting a continuous output current of up to 10A, and is suitable for a wide range of automotive applications from 12V to 48V.

NCV51511: It is an automotive-grade low-side gate driver with high driving current capability and options, optimized for DC-DC power supplies and inverters. NCV51511 can be used to drive MOSFETs in half-bridge or synchronous buck architectures.

T10 MOSFET Series: Based on the new shielded gate trench technology, the T10 MOSFET series significantly improves efficiency and effectively reduces output capacitance, RDS (ON), and gate charge compared with traditional designs. The T10-M is designed with extremely low RDS (ON), equipped with a soft recovery body diode, and also effectively reduces ringing, overshoot, and electromagnetic interference noise during switching. It is particularly suitable for application scenarios that require high switching speed and efficiency, such as motor drives and load switches.

NCV77320: It is an inductive position sensor for automotive applications, which can measure angle or linear position. NCV77320 has strong anti-interference ability and can be used in places such as pedals, throttles, chassis heights, and actuator position feedback. In 48V steer-by-wire systems, it can be used as a steer-by-wire sensor.

NCV7041: It is a high-voltage, high-resolution current sensing amplifier with a common-mode input range of-5.0V to + 80V, which can perform one-way or two-way current measurement across a sensing resistor in various applications.

1 Overview of Automotive Analog Chips and Vehicle Power Distribution Architecture

1.1 Classification and Market of Automotive PMICs and Signal Chain Chips
Analog Chips: Working Principles
Functional Classification of Analog Chips: Signal Chain Chips, Power Management Chips
Applications of Analog Chips in Automotive Electronics
Power Management Chips: Definition
Power Management Chips: Product Classification
Signal Chain Chips: Definition and Product Classification
Overview of Vehicle Chip Types, Processes, and Per-Vehicle Usage
Global Analog Chip Market Size
Chinese Analog Chip Market Size
Chinese Analog Chip Market: Localization Substitution Process
Chinese Automotive Analog Chip Market Size

2024 Global and Chinese Analog Chip Market Patterns

1.2 Vehicle Power Supply Strategies and Evolution Trends
Development Trends of Vehicle Power Distribution Architecture:
Traditional Power Distribution Architecture
Domain Controller Power Distribution Architecture
Zonal Power Distribution Architecture
Two Forms of Low-Voltage Power Distribution for Zonal Controllers
Low-Voltage Power Distribution Solutions for Zonal Controllers
Requirements for Future Intelligent Power Distribution Architecture

2 Application Automotive Analog Chips (by Sub-Scenarios)

2.1 Scenario 1: Intelligent Driving
- 2.1.1 Intelligent Driving Domain Controllers
Intelligent Driving Domain Controllers: Hardware Structure
Four Core Requirements of ADAS Systems for Power Management Chips
Power Management and Power Distribution Design of Intelligent Driving Domain Controllers (1)
Power Management and Power Distribution Design of Intelligent Driving Domain Controllers (2)
Power Management and Power Distribution Design of Intelligent Driving Domain Controllers (3)
Power Supply Design of Central Computing Platforms (1)
Power Supply Design of Central Computing Platforms (5)
Power Management Chip Products for Central Computing Platforms (1)
Power Management Chip Products for Central Computing Platforms (2)
Power Management Solutions for Intelligent Driving Domain Controllers (1)
Power Management Solutions for Intelligent Driving Domain Controllers (5)

2.1.2 Intelligent Driving Sensors
- 2.1.2.1 ADAS Cameras

Power Management Links of ADAS Cameras (1)
Power Management Links of ADAS Cameras (2)
Three Power Architecture Designs of ADAS Camera Modules (1)
Three Power Architecture Designs of ADAS Camera Modules (2)
Three Power Architecture Designs of ADAS Camera Modules (3)
Mainstream Power Supply Architectures for ADAS Cameras
Four Major Power Supply Challenges of ADAS Front-view Cameras (1)
Four Major Power Supply Challenges of ADAS Front-view Cameras (2)
Four Major Power Supply Challenges of ADAS Front-view Cameras (3)
ADAS Camera PMIC Chips (1)
ADAS Camera PMIC Chips (2)
Power Management Solutions for Automotive Cameras (1)
Power Management Solutions for Automotive Cameras (4)

2.1.2.2 Radar

In-vehicle Radar: Hardware Structure
Power Architecture Design of In-vehicle Radar (1)
Power Architecture Design of In-vehicle Radar (2)
Three Major Power Supply Design Challenges of Corner Radar
Power Management Solutions for In-vehicle Radar (1)
Power Management Solutions for In-vehicle Radar (2)
Teardown Cases of In-vehicle Radar

2.1.2.3 LiDAR

LiDAR: Hardware Composition
LiDAR: Power Management Link
LiDAR Power Management Chips:
LiDAR Power Management Solutions
Teardown Cases of In-vehicle LiDAR (1)
Teardown Cases of In-vehicle LiDAR (2)
2.2 Scenario 2: Intelligent Cockpit
- 2.2.1 Intelligent Cockpit Domain Controller
Cockpit Domain Controller: Hardware Structure
Typical Power Architecture of Cockpit Domain Controller
Power Supply Architecture and Performance Requirements of Cockpit Domain Controller
Primary Power Supply Design for Cockpit Domain Controller Based on Qualcomm 8295 (1)
Primary Power Supply Design for Cockpit Domain Controller Based on Qualcomm 8295 (5)
Power Management Chip Products for Cockpit Domain Controller
Power Management/Signal Chain Solutions for Cockpit Domain Controller (1)
Power Management/Signal Chain Solutions for Cockpit Domain Controller (2)
Power Management/Signal Chain Solutions for Cockpit Domain Controller (3)

2.2.2 In-vehicle Display

In-vehicle Display: Chip Composition
Power Supply Design Solutions for In-vehicle Display (1)
Power Supply Design Solutions for In-vehicle Display (2)
Power Management Chips for In-vehicle Display (1)
Power Management Chips for In-vehicle Display (2)
Power Management Chips for In-vehicle Display (3)
Teardown Cases of In-vehicle Display

2.2.3 Automotive Audio

Automotive Audio: Transmission Link
Power Management/Signal Chain Solutions for Automotive Audio Systems (1)
Power Management/Signal Chain Solutions for Automotive Audio Systems (2)
Power Management/Signal Chain Solutions for Automotive Audio Systems (3)
2.3 Scenario 3: Body Electronics
- 2.3.1 Body (Zonal) Controller
  - 2.3.1.1 Body (Zonal) Power Supply Module
Zonal Controller: Hardware Composition
Power Supply Design Challenges of Zonal Controller
Power Supply Module Design of Zonal Controller (1)
Power Supply Module Design of Zonal Controller (2)
Power Management Chips for Body (Zonal) Controller (1)
Power Management Chips for Body (Zonal) Controller (2)
Power Management Chips for Body (Zonal) Controller (3)

2.3.1.2 Body (Zonal) Drive Module

Drive Module Design of Zonal Controller (1)
Drive Module Design of Zonal Controller (4)
Power Supply Solutions for Off-board Capacitive Loads in Zonal Controllers (1)
Power Supply Solutions for Off-board Capacitive Loads in Zonal Controllers (2)
Power Supply Solutions for Off-board Capacitive Loads in Zonal Controllers (3)
Summary of Manufacturers and Products of HSD Chips for Body (Zonal) Controllers (1)
Summary of Manufacturers and Products of HSD Chips for Body (Zonal) Controllers (2)
Summary of Manufacturers and Products of HSD Chips for Body (Zonal) Controllers (3)
HSD Chips for Body (Zonal) Controllers (1)
HSD Chips for Body (Zonal) Controllers (2)
Summary of Manufacturers and Products of LSD Chips for Body (Zonal) Controllers (1)
Summary of Manufacturers and Products of LSD Chips for Body (Zonal) Controllers (2)
LSD Chips for Body (Zonal) Controllers (1)
LSD Chips for Body (Zonal) Controllers (2)
Summary of Manufacturers and Products of Half-bridge Driver Chips for Body (Zonal) Controllers (1)
Summary of Manufacturers and Products of Half-bridge Driver Chips for Body (Zonal) Controllers (2)
Half-bridge Driver Chips for Body (Zonal) Controllers (1)
Half-bridge Driver Chips for Body (Zonal) Controllers (2)
Summary of Manufacturers and Products of H-bridge Driver Chips for Body (Zonal) Controllers (1)
Summary of Manufacturers and Products of H-bridge Driver Chips for Body (Zonal) Controllers (2)
H-bridge Driver Chips for Body (Zonal) Controllers (1)
H-bridge Driver Chips for Body (Zonal) Controllers (2)
Summary of Manufacturers and Products of e-Fuse Chips for Body (Zonal) Controllers (1)
Summary of Manufacturers and Products of e-Fuse Chips for Body (Zonal) Controllers (2)
Summary of Manufacturers and Products of e-Fuse Chips for Body (Zonal) Controllers (3)
eFuse Chips for Body (Zonal) Controllers (1)
eFuse Chips for Body (Zonal) Controllers (2)

2.3.1.3 Chip Solutions and Teardown Case Body (Zonal) Controllers

Power Management/Signal Chain Solutions for Body (Zonal) Controllers (1)
Power Management/Signal Chain Solutions for Body (Zonal) Controllers (4)
PCBA Teardown Cases of Body (Zonal) Controllers (1)
PCBA Teardown Cases of Body (Zonal) Controllers (4)

2.3.2 Automotive Lighting

Automotive Lighting Electronic System: Hardware Composition
Power Architecture of Automotive Headlights (1)
Power Architecture of Automotive Headlights (2)
Power Architecture of Automotive Headlights (3)
Automotive Headlights: Solution Requirements and Summary of Common Chips
Automotive Taillights: LED Requirements
Power Architecture of Automotive Taillights (1)
Power Architecture of Automotive Taillights (2)
Power Architecture of Automotive Taillights (3)
Automotive Through-type Taillights: Solution Requirements and Summary of Common Chips
Selection Logic of Automotive LED Lighting Driver Chips
Selection Strategy of LED Driver Chips for Headlights
Selection Strategy of LED Driver Chips for Taillights, Ambient Lights, and ISD (Intelligent Interactive Lights)
Power Management Chips for Automotive Lighting Systems (1)
Power Management Chips for Automotive Lighting Systems (4)
Power Management Solutions for Automotive Lighting (1)
Power Management Solutions for Automotive Lighting (4)
2.4 Scenario 4: Vehicle Control
- 2.4.1 Vehicle Controller/Powertrain Domain Controller
Powertrain Domain Controller: Hardware Composition
Power Circuit Design of Powertrain Domain Controller
Power Management Solutions for Powertrain Domain Controller (1)
Power Management Solutions for Powertrain Domain Controller (2)
Power Management Solutions for Powertrain Domain Controller (3)
PCBA Teardown Cases of Vehicle Controller/Powertrain Domain Controller

2.4.2 Motor Controller

Motor Controller: Hardware Structure
Power Architectures for Different Functional Safety Requirements of Motor Controllers (1)
Power Architectures for Different Functional Safety Requirements of Motor Controllers (2)
Traditional Power Supply Design of Inverters
Next-generation Power Supply Design of Inverters
Power Management Chips for Motor Controllers
Power Management/Signal Chain Solutions for Motor Controllers
PCBA Teardown Cases of Motor Controllers (1)
PCBA Teardown Cases of Motor Controllers (2)

2.4.3 OBC/DC-DC

On-board Charger (OBC): Main Components
On-board DC-DC Converter: Main Components
Integrated On-board Power Supply (OBC + DC-DC): Isolated Driving Required for High-voltage PFC Stage
Power Management Solutions for On-board OBC/DC-DC (1)
Power Management Solutions for On-board OBC/DC-DC (2)
PCBA Teardown Cases of Integrated Two-in-one On-board Power Supply

2.4.4 Battery Management System (BMS)

Battery Management System (BMS): Working Principle and Composition
Battery Pack Control Unit (BCU/BMU): Working Principle and Component Composition
Cell Supervision Unit (CSC/CSU): Working Principle
Battery Disconnect Unit (BDU): Working Principle and Component Composition
Classification of BMS System Chips
BMS Pure Hardware Solutions
Power Distribution System Design for BMS
Power Management Chips for BMS
Summary of Foreign Manufacturers and Products of BMS Analog Front-end (AFE) Chips
Summary of Domestic Manufacturers and Products of BMS Analog Front-end (AFE) Chips (1)
Summary of Domestic Manufacturers and Products of BMS Analog Front-end (AFE) Chips (2)
Summary of Domestic Manufacturers and Products of BMS Analog Front-end (AFE) Chips (3)
Battery Management IC (BMIC) Products (1)
Battery Management IC (BMIC) Products (2)
Battery Management IC (BMIC) Products (3)
Power Management Solutions for BMS (1)
Power Management Solutions for BMS (2)
PCBA Teardown Cases of BMS (1)
PCBA Teardown Cases of BMS (2)

2.4.5 Steering System

Electric Power Steering (EPS): Working Principle and Composition
Power Management/Signal Chain Solutions for EPS Steering Systems (1)
Power Management/Signal Chain Solutions for EPS Steering Systems (2)
Steer-by-Wire (SBW): Working Principle and Composition
Steer-by-Wire (SBW): Controller Hardware Architecture
Power Management/Signal Chain Solutions for Steer-by-Wire Systems (1)
Power Management/Signal Chain Solutions for Steer-by-Wire Systems (2)
Power Management/Signal Chain Solutions for Steer-by-Wire Systems (3)
Case Power Architecture for Steering Systems
2.5 Scenario 5: 48V Low-voltage Power Supply
- 2.5.1 Impact of 48V Low-voltage Power Supply Architecture on Components
Development History of Automotive Low-voltage Power Supply Architectures
Phased Conversion of 48V Low-voltage System Components
Summary of Component Upgrades for 48V Low-voltage Power Supply Network Architecture
Component Efficiency of 48V Low-voltage Power Supply Network Architecture
High-power Loads of Components in 48V Low-voltage Power Supply Network Architecture
Development Process and Trends of Components in 48V Low-voltage Power Supply Network Architecture
Priority Evaluation for Component Development in 48V Low-voltage Power Supply Network Architecture (1)
Priority Evaluation for Component Development in 48V Low-voltage Power Supply Network Architecture (2)
Priority Evaluation for Component Development in 48V Low-voltage Power Supply Network Architecture (3)
Priority Evaluation for Component Development in 48V Low-voltage Power Supply Network Architecture (4)

2.5.2 Summary of 48V Component Manufacturers and Product Solutions

Summary of Maturity of 48V Component Supply Chain
Mainstream Power Management Solutions for 48V Applications
Summary of 48V DC-DC Manufacturers and Products (1)
Summary of 48V DC-DC Manufacturers and Products (2)
48V DC-DC Products (1)
48V DC-DC Products (2)
48V DC-DC Products (3)
Summary of 48V LDO Manufacturers and Products
48V LDO Products
Summary of Manufacturers and Products of 48V Application SBC (System Basis Chip)
48V SBC Chip Products
Summary of 48V e-Fuse Manufacturers and Products
48V e-Fuse Products (1)
48V e-Fuse Products (2)
48V e-Fuse Products (3)
Summary of Manufacturers and Products of 48V BLDC (Brushless DC Motor) Drivers (1)
Summary of Manufacturers and Products of 48V BLDC (Brushless DC Motor) Drivers (2)
Summary of Manufacturers and Products of 48V BDC (Brushed DC Motor) Drivers
Summary of 48V Gate Driver Manufacturers and Products (1)
Summary of 48V Gate Driver Manufacturers and Products (2)
Summary of 48V HSD Chip Manufacturers and Products
48V Driver Chip Products (1)
48V Driver Chip Products (2)
48V Driver Chip Products (3)
Chip Solutions for 48V Applications (1)
Chip Solutions for 48V Applications (4)

3 Application and Market Automotive Analog Chips (by Product Type)

3.1 Power Management Chain: DC-DC Chips
DC-DC Switching Regulators: Working Principle
DC-DC Switching Regulators: Classification, Main Functions, Key Parameters, Application Scenarios
Foreign Automotive-grade DC-DC Chip Manufacturers and Product Selection (1)
Foreign Automotive-grade DC-DC Chip Manufacturers and Product Selection (2)
Foreign Automotive-grade DC-DC Chip Manufacturers and Product Selection (3)
Foreign Automotive-grade DC-DC Chips (1)
Foreign Automotive-grade DC-DC Chips (2)
Foreign Automotive-grade DC-DC Chips (3)
Domestic Automotive-grade DC-DC Chip Manufacturers and Product Selection (1)
Domestic Automotive-grade DC-DC Chip Manufacturers and Product Selection (5)
Domestic Automotive-grade DC-DC Chips (1)
Domestic Automotive-grade DC-DC Chips (4)
Market Size of DC-DC Chips for China's Passenger Cars (2022-2030E) (1)
Market Size of DC-DC Chips for China's Passenger Cars (2022-2030E) (2)
3.2 Power Management Chain: LDO Chips
LDO Linear Regulators: Working Principle and Structural Composition
LDO Linear Regulators: Classification, Key Indicators, Application Scenarios
Main Automotive Application Scenarios of Tracking LDO: Power Supply for Off-board Sensors
Key Selection Criteria for Automotive-grade LDO Linear Regulators (1)
Key Selection Criteria for Automotive-grade LDO Linear Regulators (2)
Foreign Automotive-grade LDO Chip Manufacturers and Product Selection
Domestic Automotive-grade LDO Chip Manufacturers and Product Selection (1)
Domestic Automotive-grade LDO Chip Manufacturers and Product Selection (4)
Market Size of LDO Chips for China's Passenger Cars (2023-2030E)
3.3 Power Management Chain: Driver Chips
Driver Chips: Classification by Circuit Topology
Driver Chips: Classification by Load Type (1)
Driver Chips: Classification by Load Type (2)
Driver Chips: Classification by Load Type (3)
LED Lighting Driver Chips: Working Principle
LED Display Driver Chips: Working Principle
Foreign Automotive-grade LED Driver Chip Manufacturers and Product Selection
Domestic Automotive-grade LED Driver Chip Manufacturers and Product Selection (1)
Domestic Automotive-grade LED Driver Chip Manufacturers and Product Selection (4)
Domestic Automotive-grade LED Driver Chips (1)
Domestic Automotive-grade LED Driver Chips (2)
Domestic Automotive-grade LED Driver Chips (3)
Upgrade Directions of LED Lighting Driver Chips (1)
Upgrade Directions of LED Lighting Driver Chips (2)
Gate Driver Chips: Working Principle
Gate Driver Chips: Automotive Application Scenarios
Domestic Automotive-grade Gate Driver Chip Manufacturers and Product Selection (1)
Domestic Automotive-grade Gate Driver Chip Manufacturers and Product Selection (4)
Domestic Automotive-grade Gate Driver Chips
Motor Driver Chips: Working Principle
Motor Driver Chips: Automotive Application Scenarios
Main Application Scenarios of DC Motors (1)
Main Application Scenarios of DC Motors (2)
Domestic Automotive-grade Motor Driver Chip Manufacturers and Product Selection (1)
Domestic Automotive-grade Motor Driver Chip Manufacturers and Product Selection (2)
Domestic Automotive-grade Motor Driver Chips
Driver Chips: Quantity per Vehicle
Market Size of Driver Chips for China's Passenger Cars (2023-2030E)
3.4 Power Management Chain: Battery Management IC (BMIC)
Battery Management IC (BMIC): Working Principle
Battery Management IC (BMIC): Classification, Main Functions
BMS AFE Chips: Working Principle
Foreign Automotive-grade Analog Front-end (AFE) Chip Manufacturers and Product Selection (1)
Foreign Automotive-grade Analog Front-end (AFE) Chip Manufacturers and Product Selection (2)
Foreign Automotive-grade Analog Front-end (AFE) Chip Manufacturers and Product Selection (3)
Domestic Automotive-grade Analog Front-end (AFE) Chip Manufacturers and Product Selection (1)
Domestic Automotive-grade Analog Front-end (AFE) Chip Manufacturers and Product Selection (2)
Domestic Automotive-grade Analog Front-end (AFE) Chip Manufacturers and Product Selection (3)
Domestic Automotive-grade BMS AFE Chips (1)
Domestic Automotive-grade BMS AFE Chips (2)
Domestic Automotive-grade BMS AFE Chips (3)
Market Size of AFE Chips for Chinese New Energy Passenger Cars (2022-2030E) (1)
Market Size of AFE Chips for Chinese New Energy Passenger Cars (2022-2030E) (2)
Market Pattern of Automotive-grade AFE Chips
3.5 Power Management Chain: PMIC/SBC
Multi-channel Power Integrated PMIC: Working Principle
Automotive-grade PMIC: Application Scenarios
Foreign Automotive-grade PMIC Chip Manufacturers and Product Selection (1)
Foreign Manufacturers and Product Selection of Automotive-grade PMIC Chips (4)
Domestic Manufacturers and Product Selection of Automotive-grade PMIC Chips (1)
Domestic Manufacturers and Product Selection of Automotive-grade PMIC Chips (2)
Domestic Manufacturers and Product Selection of Automotive-grade PMIC Chips (3)
Domestic Automotive-grade PMIC Chips (1)
Domestic Automotive-grade PMIC Chips (2)
Market Size of PMIC Chips in China's Passenger Car Market (2022-2030E)
SBC (System Basis Chip): Working Principle
SBC (System Basis Chip): Assisting MCU Operation
SBC (System Basis Chip): Automotive Application Scenarios
Foreign Manufacturers and Product Selection of Automotive-grade SBC Chips (1)
Foreign Manufacturers and Product Selection of Automotive-grade SBC Chips (2)
Foreign Automotive-grade SBC Chips (1)
Foreign Automotive-grade SBC Chips (2)
Domestic Manufacturers and Product Selection of Automotive-grade SBC Chips (1)
Domestic Manufacturers and Product Selection of Automotive-grade SBC Chips (2)
Domestic Automotive-grade SBC Chips (1)
Domestic Automotive-grade SBC Chips (2)
Market Size of SBC Chips in China's Passenger Car Market (2022-2030E)
Market Pattern of SBC Chips in China's Passenger Car Market
3.6 Signal Chain: Amplifier
Amplifier: Classification
Operational Amplifier: Working Principle, Key Performance Indicators
Audio Amplifier: Working Principle
Amplifier: Automotive Application Scenarios
Domestic Manufacturers and Product Selection of Automotive-grade Current-sensing Amplifiers (1)
Domestic Manufacturers and Product Selection of Automotive-grade Current-sensing Amplifiers (2)
Domestic Automotive-grade Current-sensing Amplifiers (1)
Domestic Automotive-grade Current-sensing Amplifiers (2)
Domestic Manufacturers and Product Selection of Automotive-grade Operational Amplifiers (1)
Domestic Manufacturers and Product Selection of Automotive-grade Operational Amplifiers (2)
Domestic Manufacturers and Product Selection of Automotive-grade Operational Amplifiers (3)
Domestic Automotive-grade Operational Amplifiers (1)
Domestic Automotive-grade Operational Amplifiers (2)
Summary of Domestic Manufacturers and Products of Automotive-grade Audio Amplifiers
Domestic Automotive-grade Audio Amplifiers (1)
Domestic Automotive-grade Audio Amplifiers (2)
Market Size of Amplifier Chips in China's Passenger Car Market (2022-2030E) (1)
Market Size of Amplifier Chips in China's Passenger Car Market (2022-2030E) (2)
3.7 Signal Chain: Data Converter
Data Converter: Working Principle
Data Converter: Classification, Key Performance Indicators and Automotive Application Scenarios
Types of Analog-to-Digital Converters (ADC) Used in Automotive Systems
Enhancing Safety and Performance of Automotive Systems with ADC
Scheme Comparison of ADC Chips: Built-in VS Standalone
Domestic Manufacturers and Product Selection of Automotive-grade Analog-to-Digital Converters (ADC) (1)
Domestic Manufacturers and Product Selection of Automotive-grade Analog-to-Digital Converters (ADC) (2)
Market Size of Analog-to-Digital Converters (ADC) in China's Passenger Car Market (2022-2030E) (1)
Market Size of Analog-to-Digital Converters (ADC) in China's Passenger Car Market (2022-2030E) (2)
3.8 Signal Chain: Clock Chip
Clock Chip: Working Principle
Clock Chip: Product Classification
Clock Chip: Automotive Application Scenarios
Automotive-grade Clock Oscillator: Technical Classification, Working Principle, Key Performance
Major Manufacturers and Product Selection of Automotive-grade Oscillators
Real-Time Clock (RTC) Chip: Automotive Application Scenarios (1)
Real-Time Clock (RTC) Chip: Automotive Application Scenarios (2)
Application of RTC in Intelligent Cockpit
Application of RTC in BMS
Manufacturers and Product Selection of Automotive-grade RTC Chips (1)
Manufacturers and Product Selection of Automotive-grade RTC Chips (2)
Manufacturers and Product Selection of Automotive-grade RTC Chips (3)
Domestic Automotive-grade Clock Chips (1)
Domestic Automotive-grade Clock Chips (2)
Application Schemes of Clock Chips in Automobiles (1)
Application Schemes of Clock Chips in Automobiles (2)
Market Size of Clock Oscillators in China's Passenger Car Market (2022-2030E)
Market Size of RTC Chips in China's Passenger Car Market (2022-2030E)