日本汽車一級先進技術與產品（2024-2025）

在汽車電動化、智慧化方面，中國主機廠和解決方案供應商正在引領潮流，尤其在智慧化應用的加速普及方面。但日本的汽車業和零件供應商正在加緊步伐追趕中國和西方汽車製造商。該公司在繼續努力加強在某些電氣化領域的技術領先地位的同時，也在擴大對人工智慧開發、軟體定義汽車（SDV）和智慧（包括晶片）的投資。它也致力於推動與中國智慧汽車產業的聯繫，以穩定全球銷售成長為前提。

2024年5月，日本經濟產業省和國土交通省發佈了未來10年日本汽車產業數位轉型策略計劃，重點介紹軟體定義汽車（SDV）、機器人計程車和車輛數據的價值。其中，SDV的研發被視為重中之重。日本政府預測2030年全球SDV市場規模將達到4,100萬輛，其中日本廠商將佔30%的佔有率，約1,100萬至1,200萬輛。這是一個雄心勃勃的目標。

1、日本Tier1車企將加強對外合作，鞏固電氣化領域優勢，並不遺餘力地接受智慧化。

人工智慧電動車（AIEV）的開發除了需要內部在人工智慧開發支援、汽車SoC和OS（作業系統）等領域的研發和創新之外，自然也需要來自Tier 1的外部合作。

在AI開發方面，TURING、TIER IV、Sakana AI、Digital Realty、NTT、Denso、Alps Alpine等日本企業正致力於AI技術、世界模型、LLM記憶體管理技術等開發，加速與汽車產品的融合，推動L4自動駕駛在日本的大規模普及。例如，有以下幾種：

2024年11月，Denso和Quadric宣佈將共同開發專門用於AI計算處理的半導體NPU（神經處理單元）。根據該協議，Denso 將獲得 Quadric 的 Chimera GPNPU IP 核的許可，兩家公司將共同開發基於該核的高性能汽車半導體。

阿爾卑斯阿爾派 + 高通：2025年1月，兩家公司宣佈擴大技術合作，將高通科技公司最新一代的驍龍(R) Cockpit平台整合到阿爾卑斯阿爾派的汽車產品中。

自動駕駛開源軟體供應商 TIER IV 和松尾研究所已著手開展針對 Autonomy 2.0 的生成式人工智慧項目，旨在大幅擴展 4 級自動駕駛的操作設計領域 (ODD)。

在晶片研發方面，日本廠商積極與台積電、Nvidia、英特爾、微軟等大公司合作。

台積電：其在日本的第一座晶圓廠預計將於2024年底開始量產，第二座晶圓廠預計將於2027年投入營運。

微軟：2024年11月，在東京開設了日本第一家研究中心。

英特爾：2024年9月，英特爾計畫與AIST合作，興建專門生產先進晶片的新研發中心。

NVIDIA：2024年4月，AIST與NVIDIA聯手打造量子運算系統。

本報告對中國和日本的汽車產業進行調查和分析，並提供有關日本一級汽車研發、產品和與海外公司的關係的資訊。

目錄

第1章：日本一級汽車企業與中國的關係

• 中國與日本汽車 Tier1/OEM 之間的產業關係（1）
• 中國與日本汽車一級供應商/OEM廠商的產業關係（2）
• 中日汽車 Tier1/OEM 之間的產業關係（3）
• 中國與日本汽車 Tier1/OEM 之間的產業關係（4）
• 中國與日本汽車 Tier1/OEM 之間的產業關係（5）
• 中日汽車 Tier1/OEM 之間的產業關係（6）
• 電裝中國佈局（1）
• 電裝在華佈局（2）
• 電裝中國研發中心
• 電裝在華生產佈局
• 住友電工在華佈局（1）
• 住友電工在華佈局（2）
• 住友電工在華佈局（3）
• 住友電工在華佈局（4）
• JTEKT 中國生產基地佈局
• NSK Steering & Control 公司中國生產基地佈局
• 日立阿斯特莫中國生產基地佈局
• KYB株式會社中國生產基地分佈
• KEL Corporation 在中國的生產工廠
• 矢崎商事在中國的合資企業
• 豐田汽車計劃在中國新建獨資工廠
• 日本工具機訂單：來自中國汽車市場的訂單
• 典型日本工具機製造商的案例研究

第 2 章：日本一級汽車製造商的 AI 開發、SDV 和晶片研究

• 摘要：日本的永續發展目標
• 摘要：日本正大力投資國內半導體產業。
• 摘要：日本八大企業擴大半導體產能
• 摘要：國內外汽車晶片製程比較（一）
• 摘要：國內外汽車晶片製程比較（二）
• 摘要：台積電、Nvidia、英特爾、微軟與日本的合作（1）
• 摘要：台積電、Nvidia、英特爾、微軟與日本的合作（2）
• 摘要：日本掌握的五項技術
• 摘要：日本的 Zetta 級超級計算機
• 摘要：汽車晶片聯盟（1）
• 摘要：汽車晶片聯盟（二）
• 摘要：日本企業AI發展對比
• AI開發案例1：TURING
• AI開發案例2：Digital Realty
• AI發展案例3：
• AI發展案例4：
• AI發展案例5：
• AI發展案例6：
• AI發展案例7：
• AI發展案例8：
• AI發展案例9：
• 摘要：日本企業的SDV案例對比
• SDV 案例 1：
• SDV 案例 2：
• SDV 案例 3：
• SDV 案例 4：本田 + 亞馬遜
• SDV 案例 5：松下汽車系統 + Arm（1）
• SDV 案例 6：
• 總結：日系車用晶片案例對比
• 汽車晶片案例1
• 汽車晶片案例2
• 汽車晶片案例3
• 汽車晶片案例4
• 汽車晶片案例5

第 3 章：日本一級自動駕駛/ADAS 技術與產品

• 日本的自動駕駛政策（1）
• 日本的自動駕駛政策（2）
• 日本自動駕駛汽車計劃
• 課題系統
• 自動駕駛/ADAS

第4章：日本汽車Tier1智慧座艙技術及產品

• 日本智慧座艙零件主要供應商（1）
• 日本智慧座艙零件主要供應商（2）
• 日本智慧座艙零件主要供應商（3）
• 日本智慧座艙零件主要供應商（4）
• 日本智慧座艙零件主要供應商（5家）
• 日本智慧座艙零件主要供應商（6家）
• 智慧座艙零件供應商供應關係（1） - 豐田
• 智慧座艙零件供應商供應關係（2） - 日產
• 智慧座艙零件供應商供應關係（3） - 本田
• 智慧座艙零件供應商供應關係（4）－馬自達
• 智慧座艙零件供應商供應關係（5）—Subaru
• 智慧座艙零件供應商供應關係（6） - 鈴木
• 智慧座艙零件供應商供應關係（7） - 三菱
• 智慧座艙零件供應商供應關係（8） - 大發
• 智慧座艙技術案例總結（一）
• 智慧座艙技術案例總結（二）
• 智慧座艙技術案例總結（三）

第5章：日本一級電氣化技術與產品

• IGBT/SiC/GaN功率半導體概述（1）
• IGBT/SiC/GaN功率半導體概述（二）
• IGBT/SiC/GaN功率半導體總結（3）
• 電子軸
• 馬達產品概要 (1)
• 馬達產品概覽 (2)
• 馬達產品概覽 (3)
• 電池/固態電池

第6章 日本一級供應商的供應關係

• 電裝
• 愛信
• 日本電產
• 住友電工
• 日本電動輔助轉向系統 (EPS) 供應商及其供應關係
• 日本市場主要 ADAS 雷達和 LiDAR 供應商及其與 OEM 的供應關係

第7章 日本整車廠的國內合作與國際關係

• 日本新車銷售（2024 年 1 月至 11 月）
• 日本主機廠海外生產基地分佈
• 日本OEM海外生產數據
• 日本汽車製造商之間的技術合作（1）
• 日本汽車製造商之間的技術合作（2）
• 日本國內汽車及零件生產廠分佈
• 日中汽車產業關係
• 日美汽車產業關係
• 日本與歐洲汽車產業關係
• 日本汽車製造商的電氣化/智慧化

Japanese Tier1s' advanced technologies research: accelerate external cooperation, intensify internal collaboration, and further upgrade "fine manufacturing"

In vehicle electrification and intelligence, Chinese OEMs and solution suppliers are leading the trend, especially at a time when intelligent application speeds up. Japan's automotive industry and parts suppliers are however quickening their pace to catch up with their Chinese, European and American counterparts. While making continuous efforts to reinforce their technical superiority in some electrification segments, they are also still investing more in intelligence, involving AI development, software-defined vehicles (SDV) and chips. On the basis of stabilizing global sales growth, they also work to expedite connection with China's intelligent vehicle industry.

In May 2024, the Ministry of Economy, Trade and Industry (METI) and the Ministry of Land, Infrastructure, Transport and Tourism (MLIT) of Japan announced a strategic plan for digital transformation of the Japanese automotive industry in the next decade, highlighting software-defined vehicles (SDV), robotaxi, and vehicle data value. Wherein, the development of SDVs is considered a top priority. The Japanese government predicts that the scale of the global SDV market will reach 41 million vehicles in 2030, and hopes that Japanese OEM can take a 30% share, or 11 million to 12 million vehicles. It can be seen that the goal is ambitious.

1. Japanese automotive Tier1s rev up external cooperation, and consolidate their superiority in electrification segments, sparing no effort to embrace intelligence.

To develop artificial intelligence electric vehicles (AIEV), in addition to internal R&D and innovations, for example, support for AI development, automotive SoC, and operating system (OS), Tier1s need external cooperation as a matter of course.

In AI development, Japanese companies including TURING, TIER IV, Sakana AI, Digital Realty, NTT, Denso and Alps Alpine are working hard on development of AI technology, world models, LLM memory management technology, and more, in a bid to accelerate integration into automotive products and enable mass adoption of L4 autonomous driving in Japan. Examples include:

In November 2024, Denso and Quadric announced that they would work together to develop an NPU (neural processing unit), a semiconductor specialized for the arithmetic processing of AI. Through the agreement, DENSO will acquire the IP core license for Quadric's Chimera GPNPU, and the two companies will co-develop high-performance automotive semiconductors on this basis.

Alps Alpine + Qualcomm: In January 2025, the two parties announced their expanded technology collaboration to integrate Qualcomm Technologies' latest generation Snapdragon(R) Cockpit platform into Alps Alpine's automotive products.

TIER IV, a supplier of open source software for autonomous driving, and the Matsuo Institute embarked on a generative AI project for Autonomy 2.0, aiming to significantly expand the operational design domains (ODDs) of Level 4 autonomous driving.

In chip R&D, Japanese manufacturers are vigorously advancing cooperation with giants like TSMC, Nvidia, Intel, and Microsoft.

TSMC: its first Japanese wafer fab is scheduled to start mass production by the end of 2024, and the second fab will come into operation in 2027;

Microsoft: In November 2024, Microsoft opened its first research base in Japan in Tokyo;

Intel: In September 2024, Intel planned to partner with AIST to establish a new research and development center focused on advanced chip production;

NVIDIA: In April 2024, AIST and NVIDIA teamed up to build a quantum computing system.

In addition, the METI plans to provide a total of 2 trillion yen (about 13 billion US dollars) in subsidies to boost investment in the domestic chip industry. Japan's eight major chip vendors, including Sony Group, Mitsubishi Electric, Rohm, Toshiba, Kioxia Holdings, Renesas Electronics, Rapidus, and Fuji Electric, have planned to invest about 5 trillion yen (equivalent to 31 billion US dollars) by 2029 to increase the production capacity of power devices and image sensors, and increase investment in power semiconductors, sensors and logic chips. These technologies are considered the key to growth areas such as artificial intelligence, decarbonization and electric vehicles. Among them, Mitsubishi Electric, Rohm, Toshiba, Kioxia, and Renesas have taken a significant market share in SiC MOSFET, IGBT, automotive storage, high-end automotive MCU and other fields.

Not only that, the Japan Advanced SoC Research for Automotive, an alliance established at the end of 2023, is also committed to the research and development of "chiplet" technology to enable SoCs to be integrated into production vehicles. The members include Japanese OEMs like Toyota, Nissan, Honda, Mazda and Subaru, and automotive electronic system components suppliers such as Denso and Panasonic, as well as automotive chip vendor Renesas Electronics, design tool software provider Synopsys, chip developer MIRISE Technologies (a joint venture between Toyota and Denso), and chip designer Socionext.

In electrification, Japanese companies have technological advantages in some segments and keep improving competitive edges of products (see table below), such as motors and power semiconductors (IGBT/SiC/GaN).

As concerns motors, Japan has multiple superior suppliers like Fukuta Electric & Machinery (flat wire hairpin motor), JFE Precision (cold forged hollow shaft, e-Axle motor hollow shaft), Tokai Rika (5th generation hub motor), Toshiba (TB9084FTG, a MOSFET gate driver IC for motors), THK (variable flux in-wheel motor), ELEMEC (XPEAC internal direct cooling motor), Nitto (hairpin stator winding, EESM rotor winding), and Nidec (motor). Take automotive Tier1 Nidec as an example to see its external supply cases.

As for intelligence, in the case of intelligent cockpits, Honda now has ASIMO OS (debuted at CES 2025), its core vehicle operating system which will be gradually installed in Honda 0 series models including Honda 0 SUV and Honda 0 SALOON production cars. Moreover, Toyota's operating system "Arene OS" is scheduled to be launched in 2026. In terms of cockpit innovation, Japanese Tier 1 suppliers provide a variety of new in-cabin technologies and products, including in-cabin integration, integration of HMI and interiors, vehicle assistant HMI, cockpit design, new input/output devices, occupant monitoring, multi-screen interaction, new interior lighting and sound field presentation, and interior electronic rearview mirror technologies. Major players include Toyota Boshoku, AGC, TOPPAN, TORAY, Nippon Seiki, TOKAI RIKA, Yazaki Corporation, Toyoda Gosei, Ichikoh Industries, Kyocera, Murata Manufacturing, ROHM, KAGA FEI, Oshino Lamps, Asahi Kasei, and Stanley Electric.

2. Japanese Tier1s work together and collaborate to help Japanese OEMs with rapider global development.

In May 2024, the Ministry of Economy, Trade and Industry announced implementation of stricter regulatory measures in five key industrial sectors, namely, semiconductors, advanced electronic components, batteries, machine tools and industrial robots, and aircraft components, to curb the risk of technology leakage. Japan requires that these technologies should be "developed locally", and the most advanced factories also should "remain at home", and even sales and exports will be regulated.

The Japanese machine tool order data (final value) for November 2024, released by the Japan Machine Tool Builders' Association (JMA) on December 25, 2024, show that the total value of machine tool orders in November was 119.327 billion yen, an increase of 3.0% compared with the same period of the previous year, sustaining growth for two consecutive months. By region, the value of orders from the Chinese market jumped by 33.0% from the prior-year period to 29.319 billion yen, achieving eight consecutive months of growth. Especially in the automotive industry, the value of orders surged by 56.3% to 11.6 billion yen. This is mainly thanks to China's domestic competitiveness enhancement measures around electric vehicles and aggressive investments in overseas factories. The great investment willingness in the Chinese market has become an important source of income for Japanese machine tool manufacturers.

Examples of fine manufacturing process include:

DMG MORI: it has developed a solution based on a five-axis machining center. This solution enables a mode of "one machine, multiple functions" from gear roughing to precision grinding. This system covers the entire process from workpiece turning, milling, and gear roughing (e.g., gear shaping) to final precision grinding, even deburring. At the grinding stage, the grinding modules will be automatically loaded onto the spindle and ground precisely one by one by detecting the gear phase. The system is suitable for internal/external gear machining, with the machining accuracy up to ISO 4.

Nachi-Fujikoshi: it has launched "GSGT260", a gear grinder that enables high-precision and high-efficiency grinding. It is mainly suitable for production of external gears, with the machining accuracy up to Grade 1 of the new JIS. Through form grinding on multiple tooth surfaces at the same time, this equipment is particularly fit to meet the needs of mass-producing reducers for electric vehicle drive modules (e-Axle).

The close internal and external supply relationships of Japanese auto parts Tier1s, and the innovative upgrades in manufacturing process are helping Japanese companies to go steady and far in the global market.

Table of Contents

1 Relevance between Japanese Automotive Tier1s and China

• 1.1 China-Japan Automotive Tier1/OEM Industrial Connections (1)
• 1.1 China-Japan Automotive Tier1/OEM Industrial Connections (2)
• 1.1 China-Japan Automotive Tier1/OEM Industrial Connections (3)
• 1.1 China-Japan Automotive Tier1/OEM Industrial Connections (4)
• 1.1 China-Japan Automotive Tier1/OEM Industrial Connections (5)
• 1.1 China-Japan Automotive Tier1/OEM Industrial Connections (6)
• 1.2 Denso's Layout in China (1)
• 1.2 Denso's Layout in China (2)
• 1.2 Denso's R&D Centers in China
• 1.2 Denso's Production Layout in China
• 1.3 Sumitomo Electric's Layout in China (1)
• 1.3 Sumitomo Electric's Layout in China (2)
• 1.3 Sumitomo Electric's Layout in China (3)
• 1.3 Sumitomo Electric's Layout in China (4)
• 1.4 JTEKT's Production Base Layout in China
• 1.5 NSK Steering & Control's Production Base Layout in China
• 1.6 Hitachi Astemo's Production Base Layout in China
• 1.7 KYB Corporation's Production Base Layout in China
• 1.8 KEL Corporation's Production Plants in China
• 1.9 Yazaki Corporation's Joint Ventures in China
• 1.10 Toyota Motor's Plan for New Wholly-Owned Plants in China
• 1.11 Japan's Machine Tool Orders: Orders from the Chinese Automotive Market
• 1.12 Cases of Typical Japanese Machine Tool Manufacturers

2 Japanese Automotive Tier1s' AI Development, SDV and Chip Research

• Summary: Japan's SDV Goals
• Summary: Japan Lavishes on the Domestic Chip Industry
• Summary: Japan's Eight Giants Expand Chip Production Capacity
• Summary: Comparison between Domestic and Foreign Automotive Chip Processes (1)
• Summary: Comparison between Domestic and Foreign Automotive Chip Processes (2)
• Summary: Japan's Cooperation with TSMC, Nvidia, Intel, and Microsoft (1)
• Summary: Japan's Cooperation with TSMC, Nvidia, Intel, and Microsoft (2)
• Summary: Five Technologies Controlled by Japan
• Summary: Japan's Zetta-class Supercomputer
• Summary: Automotive Chip Alliances (1)
• Summary: Automotive Chip Alliances (2)
• Summary: Comparison of AI Development between Japanese Companies
• 2.1 AI Development Case 1: TURING
• 2.2 AI Development Case 2: Digital Realty
• 2.3 AI Development Case 3:
• 2.4 AI Development Case 4:
• 2.5 AI Development Case 5:
• 2.6 AI Development Case 6:
• 2.7 AI Development Case 7:
• 2.8 AI Development Case 8:
• 2.9 AI Development Case 9:
• Summary: Comparison of SDV Cases between Japanese Companies
• 2.10 SDV Case 1:
• 2.11 SDV Case 2:
• 2.12 SDV Case 3:
• 2.13 SDV Case 4: Honda + Amazon
• 2.14 SDV Case 5: Panasonic Automotive Systems + Arm (1)
• 2.15 SDV Case 6:
• Summary: Comparison of Automotive Chip Cases between Japanese Companies
• 2.16 Automotive Chip Case 1
• 2.17 Automotive Chip Case 2
• 2.18 Automotive Chip Case 3
• 2.19 Automotive Chip Case 4
• 2.20 Automotive Chip Case 5

3 Japanese Automotive Tier1s' Autonomous Driving/ADAS Technologies and Products

• 3.1 Japan's Policies Concerning Autonomous Driving (1)
• 3.1 Japan's Policies Concerning Autonomous Driving (2)
• 3.2 Japan's Autonomous Driving Schedule
• 3.3 Operating System
• Case 1:
• Case 2:
• 3.4 Autonomous Driving/ADAS
• Case 1: Hitachi Astemo
• Case 2: Ricoh
• Case 3: Panasonic Automotive
• Case 4: TDK
• Case 5: Murata
• Case 6: KOITO LiDAR
• Case 7: Sony Semiconductor + Lumotive
• Case 8: Sony Semiconductor (CIS)
• Case 9: Sony Semiconductor + Ansys
• Case 10: Kyocera Corporation
• Case 11: Toyota, Nissan and Momenta Cooperate on ADAS
• Case 12: Honda's Joint Ventures and ADAS for Global Use
• Case 13: Independent + Joint Venture Brands Cooperating with Huawei Intelligent Driving Solutions

4 Japanese Automotive Tier1s' Intelligent Cockpit Technologies and Products

• 4.1 Major Intelligent Cockpit Components Suppliers in Japan (1)
• 4.1 Major Intelligent Cockpit Components Suppliers in Japan (2)
• 4.1 Major Intelligent Cockpit Components Suppliers in Japan (3)
• 4.1 Major Intelligent Cockpit Components Suppliers in Japan (4)
• 4.1 Major Intelligent Cockpit Components Suppliers in Japan (5)
• 4.1 Major Intelligent Cockpit Components Suppliers in Japan (6)
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (1) - Toyota
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (1) - Toyota
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (2) - Nissan
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (3) - Honda
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (4) - Mazda
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (5) - Subaru
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (6) - Suzuki
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (7) - Mitsubishi
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (8) - Daihatsu
• 4.3 Summary of Intelligent Cockpit Technology Cases (1)
• 4.3 Summary of Intelligent Cockpit Technology Cases (2)
• 4.3 Summary of Intelligent Cockpit Technology Cases (3)
• Case 1: Toyota Boshoku (China) + Didi
• Case 2: Asahi Glass Co., Ltd. (AGC)
• Case 3: Toppan
• Case 4: Toray
• Case 5: Nippon Seiki
• Case 6: Tokai Rika
• Case 7: Yazaki
• Case 8: Tokai Rika
• Case 9: Toyota Gosei
• Case 10: Ichikoh Industries
• Case 11: Kyocera Corporation
• Case 12: Murata Manufacturing Co., Ltd.
• Case 13: Rohm
• Case 14: Kaga FEI Co., Ltd.
• Case 15: Oshino Electric Mfg. Co., Ltd.
• Case 16: Asahi Kasei
• Case 17: Stanley Electric Co., Ltd.
• Case 18: Nidec

5 Japanese Tier1s' Electrification Technologies and Products

• 5.1 Summary of IGBT/SiC/GaN Power Semiconductors (1)
• 5.1 Summary of IGBT/SiC/GaN Power Semiconductors (2)
• 5.1 Summary of IGBT/SiC/GaN Power Semiconductors (3)
• Case 1: Fuji Electric IGBT
• Case 2: Fuji Electric + Denso SiC
• Case 3: Mitsubishi Electric SiC
• Case 4: Rohm SiC
• Case 5: Rohm + Valeo SiC
• Case 6: Rohm IGBT
• Case 7: Rohm GaN
• Case 8: Japanese Material Manufacturers Work on Mass Production of GaN Substrates
• 5.2 e-Axle
• Case 1: Nidec
• Case 2: INAC
• Case 3: Aisin
• 5.3 Summary of Motor Products (1)
• 5.3 Summary of Motor Products (2)
• 5.3 Summary of Motor Products (3)
• Case 1: Tomita Electric
• Case 2: JFE Precision
• Case 3: Tokai Rika & Toshiba
• Case 4: THK
• Case 5: ELEMEC
• Case 6: Nidec
• Case 7: Odawara Mechanical Engineering
• Case 8: Nitto
• Case 9: Kuroda Seiko
• Case 10: Shin-Etsu Chemical
• Case 11: Sumitomo Electric Industries
• Case 12: Toshiba + MIKROE
• 5.4 Battery/Solid State Battery
• Supply Assurance Plan for Batteries Approved by the Ministry of Economy, Trade and Industry
• Battery Association for Supply Chain (BASC)
• Japan Vigorously Develops All-solid-state Batteries
• Honda's All-solid-state Battery Production Line
• Toyota's All-solid-state Battery Production
• Case 1: TDK
• Case 2: Panasonic
• Case 3: Shibaura Machine
• Case 4: PXP
• Case 5: Toshiba
• Case 6: Yazaki
• Case 7: AM Batteries

6 Supply Relationship of Japanese Tier1s

• 6.1 Denso
  • 6.1.1 Supply Relationship with OEMs (1)
  • 6.1.1 Supply Relationship with OEMs (2)
  • 6.1.1 Supply Relationship with OEMs (3)
  • 6.1.1 Supply Relationship with OEMs (4)
  • 6.1.1 Supply Relationship with OEMs (5)
  • 6.1.1 Supply Relationship with OEMs (6)
  • 6.1.1 Supply Relationship with OEMs (7)
  • 6.1.1 Supply Relationship with OEMs (8)
  • 6.1.2 Main Customers
• 6.2 Aisin
  • 6.2.1 Supply Relationship with OEMs (1)
  • 6.2.1 Supply Relationship with OEMs (2)
  • 6.2.1 Supply Relationship with OEMs (3)
  • 6.2.2 Main Customers
  • 6.2.3 Aisin Group's Revenue Structure (by Customer), FY2023-FY2025
• 6.3 Nidec
  • 6.3.1 Supply Relationship with OEMs
  • 6.3.2 Main Customers
  • 6.3.3 Main Subsidiaries and Businesses
  • 6.3.4 Sales by Product
  • 6.3.4 Sales by Region
• 6.4 Sumitomo Electric
  • 6.4.1 Supply Relationship with OEMs (1)
  • 6.4.1 Supply Relationship with OEMs (2)
  • 6.4.1 Supply Relationship with OEMs (3)
  • 6.4.1 Supply Relationship with OEMs (4)
  • 6.4.2 Sales by Division
  • 6.4.2 Sales by Region
  • 6.4.2 Sales by Product
• 6.5 Japanese Electric Power Steering (EPS) Suppliers and Their Supply Relationship
  • 6.5.1 Major Japanese EPS Parts Suppliers and Their Customers (Japan-made Models)
  • 6.5.2 OEM Customers of Japanese EPS Suppliers
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (1) - Toyota
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (1) - Toyota
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (1) - Toyota
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (2) - Nissan
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (3) - Honda
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (4) - Subaru
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (5) - Mazda
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (6) - Mitsubishi
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (7) - Suzuki
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (7) - Suzuki
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (8) - Daihatsu
• 6.6 Major ADAS Radar & LiDAR Suppliers and Their Supply Relationship with OEMs in the Japanese Market
  • 6.6.1 Major ADAS Radar & LiDAR Suppliers and Their Supply Relationship with OEMs in the Japanese Market (1) - Toyota
  • 6.6.2 Major ADAS Radar & LiDAR Suppliers and Their Supply Relationship with OEMs in the Japanese Market (2) - Nissan/Honda/Subaru/Mazda/Mitsubishi
  • 6.6.3 Major ADAS Radar & LiDAR Suppliers and Their Supply Relationship with OEMs in the Japanese Market (2) - Suzuki/Daihatsu

7 Internal Cooperation and International Connections of Japanese OEMs

• 7.1 Japan's New Vehicle Sales, Jan-Nov 2024
• 7.2 Layout of Overseas Production Bases of Japanese OEMs
• 7.3 Overseas Production Data of Japanese OEMs
• 7.4 Technical Cooperation between Japanese OEMs (1)
• 7.4 Technical Cooperation between Japanese OEMs (2)
• 7.5 Distribution of Vehicle/Parts Manufacturing Plants in Japan
• 7.6 Japan - Connection with China's Automotive Industry
• 7.7 Japan - Connection with US Automotive Industry
• 7.8 Japan - Connection with Europe's Automotive Industry
• 7.9 Electrification/Intelligence of Japanese OEMs
• Toyota's Electrification Plan
• Toyota's Battery R&D Plan (1)
• Toyota's Battery R&D Plan (2)
• Toyota's Intelligent Electric Vehicle R&D in China
• GAC Toyota's Intelligence
• FAW Toyota's Intelligence
• Honda's Electric Transformation Plan
• Honda's Battery and Production Capacity Layout
• Honda's All-solid-state Battery Production Line
• Nissan's Electric Vehicle Model Launch Plan
• Nissan Accelerates Its Electrification Transformation
• Nissan Accelerates Its Intelligence Layout
• Dongfeng Nissan's Intelligence