![]() |
市場調查報告書
商品編碼
1873410
EUV光刻掩模檢測設備:全球市佔率及排名、總收入及需求預測(2025-2031年)EUV Mask Defect Inspection Equipment - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031 |
||||||
※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。
2024 年全球 EUV 光刻掩模缺陷檢測設備的市場規模估計為 18.64 億美元,預計到 2031 年將成長至 38.46 億美元,2025 年至 2031 年的複合年成長率為 12.5%。
本報告對近期有關 EUV 光刻掩模缺陷檢測設備的關稅調整和國際戰略反制措施的跨境產業佈局、資本配置模式、區域經濟相互依存關係和供應鏈重組進行了全面評估。
掩模(也稱為光掩模或光罩)是微影術工藝中使用的圖形母版,常用於微電子加工。作為圖形資訊的載體,掩模透過曝光製程將圖形轉移到基板上,從而實現圖形轉移。
掩模缺陷檢測是半導體微影術程的關鍵步驟,其目的是檢查掩模並識別和修復缺陷。作為微影術刻製程的關鍵組成部分,光罩負責將電路圖案精確地轉移到晶圓上,其品質直接影響晶圓圖案的精度和最終裝置的性能。缺陷類型多種多樣,包括顆粒污染、圖案破損、橋接問題、光罩材料本身的缺陷。
EUV光刻掩模缺陷檢測系統是先進半導體製程技術中至關重要的專用設備。鑑於EUV微影術技術對精度要求極高,即使在掩模上最小的缺陷也會對晶圓上的電路圖案品質產生顯著影響,進而可能對晶片性能和產量比率造成不利影響。因此,使用專用檢測系統對EUV光刻掩模進行嚴格檢測是確保半導體製造品質的關鍵步驟。
光學檢測是目前半導體檢測技術的主流。半導體光學檢測的類型包括圖案缺陷檢測、非圖案檢測和掩模檢測。其中,圖案缺陷偵測又分為明場偵測與暗場偵測。兩者都分析光訊號,差異在於明場偵測利用垂直反射光訊號,而暗場偵測利用散射光訊號。
半導體微影術程需要使用不同的光源來製作不同的光罩。掩模的用途十分廣泛,通常分為二元掩模、相移掩模和極紫外線(EUV)掩模。 EUV掩模是一種專為極紫外線(EUV)微影術技術設計的新型掩模。由於EUV光的波長極短,容易被多種材料吸收,因此無法使用透鏡等傳統屈光元件。 EUV掩模利用布拉格定律,透過多層(ML)結構反射光束(與EUV不同,深紫外線(DUV)光刻使用透射光)。這種掩模廣泛應用於7nm、5nm、3nm和2nm等先進製造製程(台積電計劃於2025年量產)。
目前,掩模檢測技術主要有光學檢測和掃描電子顯微鏡(SEM)檢測兩種。 Lasertec和KLA是光學檢測設備的主要製造商,而Advantest是SEM檢測設備的製造商。從下游應用的角度來看,如果在掩模上使用光阻,則需要使用EUV掩模檢測系統(換句話說,只要使用EUV曝光系統,就必須使用EUV檢測系統)。然而,目前並非所有下游廠商使用的EUV掩模都帶有光阻。
在深紫外線(DUV)微影和光學光罩技術中,保護膜(Pelicle)扮演關鍵角色。掩模檢測設備的工作波長為193奈米,並透過這層保護膜進行檢測。對於晶圓廠而言,這是一個簡單且有效率的過程。然而,對於極紫外線(EUV)光刻,掩模製造必須在專門的掩模車間進行。此時,掩模偵測變得更加複雜,需要高解析度的系統。在理想的晶圓廠環境中,保護膜可以保護掩模免受顆粒污染,同時允許檢測系統透過這層保護膜進行檢測。如果沒有發現缺陷,則可以繼續進行後續工序;如果偵測到缺陷,則必須移除保護膜並將遮罩送至遮罩研討會進行清洗。
EUV光刻掩模缺陷檢測系統主要應用於掩模加工廠和晶圓廠。晶圓廠包括光罩生產線和晶圓生產線。晶圓廠採用EUV光刻掩模缺陷檢測系統主要有兩個原因。首先,當在掩模上附著一層薄膜時,其他檢測工具(例如電子束或DUV檢測工具)難以進行高靈敏度檢測。薄膜的存在會阻礙這些工具的偵測能力,使其無法準確地識別微小缺陷。其次,EUV檢測系統具有極高的檢測精度,能夠檢測到傳統DUV光刻掩模檢測方法無法捕捉的缺陷和顆粒。掩模加工廠歷來佔較大的市場佔有率,預計到2023年將達到約61%。然而,隨著更小尺寸先進製程節點的商業化進程加快,預計到2030年,晶圓廠的市佔率將達到42%。
目前,EUV光刻掩模檢測市場由KLA和Lasertec兩家公司主導。 EUV光刻掩模檢測系統精度高、技術複雜,但交貨週期較長。例如,Lasertec的交貨週期為兩年。預計這兩家主要企業在未來幾年內將繼續保持其在EUV光刻掩模檢測市場的領先地位。
本報告旨在對全球 EUV 光刻掩模缺陷檢測設備市場依地區/國家、類型和應用進行全面分析,重點關注總銷售量、收入、價格、市場佔有率和主要企業的排名。
本報告以銷量和收入(百萬美元)為單位,對EUV光刻掩模檢測設備市場規模、估計值和預測進行了呈現,以2024年為基準年,並涵蓋了2020年至2031年的歷史數據和預測數據。定量和定性分析將幫助讀者制定EUV光刻掩模檢測設備業務和成長策略,評估市場競爭,分析自身在當前市場中的地位,並做出明智的商業決策。
市場區隔
公司
依類型分類的細分市場
應用領域
依地區
The global market for EUV Mask Defect Inspection Equipment was estimated to be worth US$ 1864 million in 2024 and is forecast to a readjusted size of US$ 3846 million by 2031 with a CAGR of 12.5% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on EUV Mask Defect Inspection Equipment cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Mask, also known as Photomask or Reticle, is a graphic master used in the lithography process commonly used in microelectronics processing technology. As a carrier of graphic information, Mask transfers the graphic to the base material through the exposure process, thereby realizing the transfer of the graphic.
Mask defect detection is a key link in the semiconductor lithography process, which aims to check the Mask and identify and repair the defects on it. As a critical component in the lithography process, Mask is responsible for accurately transferring the circuit pattern to the wafer, and its quality is directly related to the accuracy of the wafer pattern and the performance of the final device. There are various types of defects, including particle contamination, pattern breakage, bridging problems, and defects in the mask material itself.
EUV Mask defect detection equipment is a special equipment that plays an important role in the high-end semiconductor process technology. Given the high precision required by EUV lithography technology, even the smallest defect on the Mask may significantly affect the quality of the circuit pattern on the wafer, and thus adversely affect the performance and yield of the chip. Therefore, the use of special detection equipment to strictly inspect the EUV Mask is an indispensable key link to ensure the quality of semiconductor manufacturing.
At present, optical detection is the mainstream in semiconductor detection technology. The types of semiconductor optical detection include pattern, non-pattern and mask detection. Among them, pattern defect detection is divided into bright field and dark field detection. Both are analyzed through optical signals. The difference is that the bright field is a vertically reflected light signal, while the dark field is a scattered light signal.
In the semiconductor lithography process, corresponding light sources need to be used for different masks. Different mask applications vary greatly, and can be generally divided into binary masks, phase-shift masks and EUV masks. EUV Mask is a new type of mask designed specifically for EUV (extreme ultraviolet) lithography technology. Given the extremely short wavelength of EUV and its easy absorption by a variety of materials, traditional refractive elements such as lenses cannot be used. Instead, according to the Bragg law, the reflection of the light beam is achieved through a multi-layer (ML) structure (unlike EUV, DUV uses transmitted light). This type of mask is widely used in 7nm, 5nm, 3nm and 2nm (TSMC plans to mass produce in 2025) high-end manufacturing processes.
At present, mask detection technology is mainly optical detection and SEM detection. Among them, the optical inspection companies are mainly Lasertec and KLA, while SEM inspection is Advantest. From the perspective of downstream applications, as long as the mask uses Pellicle, EUV Mask inspection equipment is required (in other words, as long as there is an EUV lithography machine, EUV inspection equipment must be used), but at present, not all EUV Masks of downstream terminal manufacturers will be used with Pellicle.
In DUV lithography or optical Mask technology, Pellicle plays a key role. The Mask inspection tool operates at an exposure wavelength of 193nm, and inspection is performed through this layer of film. For the wafer fab, this is a direct and efficient process. However, in extreme ultraviolet (EUV) lithography technology, the manufacturing process of the Mask needs to be carried out in a dedicated Mask workshop. At this point, the inspection of the Mask becomes more complicated because it requires a high-resolution system. In the wafer fab environment, the ideal situation is to use a layer of Pellicle to protect the Mask from particle contamination, while allowing the inspection system to work through this layer of Pellicle. If there are no defects, you can proceed; if defects are detected, you need to remove the pellicle and send the Mask to the Mask workshop for cleaning.
EUV Mask defect detection equipment is mainly used in Mask Shop and Fab. The Fab includes the mask production line and the wafer manufacturing production line. For the Fab, there are two main reasons for using EUV Mask defect detection equipment. First, once the pellicle is attached to the Mask, other types of equipment (such as electron beam or DUV equipment) except EUV detection equipment are difficult to achieve high-sensitivity detection effects. This is because the presence of pellicles interferes with the detection capabilities of these devices, making it difficult for them to accurately identify tiny defects. Secondly, EUV detection equipment has higher detection accuracy and can detect defects and particles that traditional DUV Mask detection methods cannot capture. Mask Shop has always had a relatively large share, reaching about 61% in 2023. However, with the acceleration of commercialization of smaller advanced process nodes, it is expected that the share of Fab will reach 42% by 2030.
At present, the EUV Mask defect detection equipment market is mainly monopolized by KLA and Lasertec. EUV Mask defect detection equipment is a high-precision and advanced equipment with a long delivery time. For example, Lasertec's delivery time is two years. In the next few years, the two leading companies will still maintain a monopoly in the EUV Mask defect detection market.
This report aims to provide a comprehensive presentation of the global market for EUV Mask Defect Inspection Equipment, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of EUV Mask Defect Inspection Equipment by region & country, by Type, and by Application.
The EUV Mask Defect Inspection Equipment market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding EUV Mask Defect Inspection Equipment.
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of EUV Mask Defect Inspection Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of EUV Mask Defect Inspection Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of EUV Mask Defect Inspection Equipment in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.