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市場調查報告書
商品編碼
1872059
CMP墊片:全球市場佔有率和排名、總收入和需求預測(2025-2031年)CMP Pads - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031 |
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全球 CMP墊片市場預計在 2024 年達到 11.38 億美元,預計到 2031 年將達到 18.1 億美元,2025 年至 2031 年的複合年成長率為 6.8%。
本報告對近期關稅調整和國際戰略反制措施對 CMP墊片的跨境產業佈局、資本配置模式、區域經濟相互依存關係和供應鏈重組進行了全面評估。
化學機械拋光 (CMP) 是一種結合化學和機械(或研磨)作用的工藝,用於去除材料並獲得極其光滑平整的表面。化學機械拋光 (CMP) 通常與化學機械平坦化 (CMP) 相關聯,後者是一種利用化學反應去除表面材料的拋光工藝。 CMP 是半導體產業生產積體電路和儲存磁碟的標準製造流程。當目標是去除表面材料時,稱為化學機械拋光;而當目標是使表面平整時,則稱為化學機械平坦化。由於摩擦和腐蝕的協同效應,CMP 被認為是一種摩擦化學製程。 CMP墊片(化學機械拋光墊片)是一種透過物理和化學拋光製程平滑半導體晶圓表面的產品,可提高半導體整合度。
受電動車、可再生能源和5G基礎設施對碳化矽(SiC)功率裝置需求激增的推動,碳化矽化學機械拋光(CMP)墊片市場正快速發展。預計2024年全球SiC CMP墊片市場規模將達4,797萬美元,到2031年將達到2.0418億美元,2025年至2031年的複合年成長率(CAGR)為17.15%。碳化矽(SiC)化學機械拋光(CMP)墊片是支撐新一代功率電子技術的關鍵基礎技術,其市場競爭動態和技術挑戰也十分獨特。
考慮到成本以及晶圓尺寸對積體電路性能和效率的影響,晶圓尺寸增大已成為必然趨勢,目前8吋和12吋晶圓已成為主流。預計未來將發展到18吋晶圓。然而,晶圓尺寸越大,製造對應的CMP墊片的難度就越高。隨著下游尺寸的成長成為必然趨勢,開發大尺寸墊片對於佔據市場主導地位至關重要,否則企業將被淘汰。隨著積體電路性能的不斷提升,CMP墊片的拋光性能也必須隨之提高,未來的性能要求將更加嚴格。
目前,中國有多家市場導向型企業尚未獲得海外認證,因此無法出口。下游企業主要集中在日本、台灣、韓國以及歐美(美國除外)。除歐美以外,這些國家在CMP拋光墊片市場佔據了較大佔有率。電子產業主要集中在亞太地區,但當前的政治狀況並不樂觀。特別是2020年,可能是中國近30年來面臨的最嚴重的政治危機。鑑於當前的貿易摩擦和中國的國際政治因素,這為國內CMP拋光墊片製造商提供了主導市場的絕佳機會,預計未來幾年國家政策投資將會增加。因此,中國企業將抓住機遇,在未來幾年大力發展國內生產。為了獲得市場主導地位,湖北鼎龍預計將大幅降低產品價格,這可能會迅速擴大市場佔有率。
新進入者需要大量資金,這使得小規模公司難以進入該行業。 CMP墊片對技術和加工流程要求很高,目前市場由美國公司主導。市場不僅受價格影響,產品性能也扮演至關重要的角色。主要企業在卓越的性能、豐富的產品線、先進的技術和完善的售後服務方面具有優勢,因此佔據了高階市場的大部分佔有率。展望未來幾年,預計各品牌之間的價格差異將縮小,毛利率的波動也將隨之加劇。
現有製造商必須不斷提高技術門檻,以阻止新進入者。他們必須降低成本和價格,才能迅速佔領市場,擴大客戶群,並建立市場主導地位。打造品牌形象並為進入消費品市場奠定基礎至關重要。只有採取這些措施,他們才能在激烈的市場競爭中獲得更大的市場佔有率。
儘管市場對化學機械拋光(CMP)墊片表現出濃厚的興趣,但該市場仍面臨許多重大的准入壁壘。首先,該行業高度專業化,需要材料科學、表面化學和晶圓製程整合的深厚技術專長。其次,嚴格的性能要求,包括平整度、缺陷率以及與特定拋光液的兼容性,要求墊片供應商必須經過半導體晶圓廠的全面認證流程,這可能需要數年時間。此外,該市場由少數幾家擁有長期合作關係和專有技術的老牌企業主導,新進業者很難獲得市場認可。高昂的研發成本、精密製造方面的資本投入以及對全球支持體系的需求也構成了巨大的挑戰。
本報告旨在對全球 CMP墊片市場進行全面分析,重點關注總銷售量、收入、價格、企業市場占有率和主要企業的排名,並按地區/國家、類型和應用對 CMP墊片進行分析。
CMP墊片市場規模、估算和預測以銷售(千)和收入(百萬美元)為單位呈現,以 2024 年為基準年,並包含 2020 年至 2031 年的歷史數據和預測數據。定量和定性分析將幫助讀者制定 CMP墊片的業務和成長策略,評估市場競爭,分析自身在當前市場中的地位,並做出明智的商業決策。
市場區隔
公司
按類型分類的細分市場
應用領域
按地區
The global market for CMP Pads was estimated to be worth US$ 1138 million in 2024 and is forecast to a readjusted size of US$ 1810 million by 2031 with a CAGR of 6.8% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on CMP Pads cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Chemical mechanical polishing/planarization (CMP) is a process that removes materials by a combination of chemical and mechanical (or abrasive) actions to achieve highly smooth and planar material surfaces. Chemical-mechanical polishing (CMP) is often associated with chemical-mechanical planarization which is a polishing process assisted by chemical reactions to remove surface materials. CMP is a standard manufacturing process practiced at the semiconductor industry to fabricate integrated circuits and memory disks. When the purpose is to remove surface materials, it is referred to as chemical-mechanical polishing. However, when the purpose is to flatten a surface, it is referred to as chemical-mechanical planarization. CMP is considered to be a tribochemical process because of the synergy between friction and corrosion. CMP Pad (Chemical Mechanical Polishing Pad) is a product which increases semiconductor integration by smoothening the semiconductor wafer surface through physical and chemical polishing processes.
The silicon carbide (SiC) chemical mechanical planarization (CMP) pads market is evolving rapidly, driven by the booming demand for SiC power devices in electric vehicles (EVs), renewable energy, and 5G infrastructure. The global SiC CMP Pads market was valued at US$ 47.97 million in 2024 and is expected to reach US$ 204.18 million by 2031, growing at a CAGR of 17.15% during 2025-2031. The silicon carbide (SiC) chemical mechanical planarization (CMP) pad market is a critical enabler for next-generation power electronics, with distinct competitive dynamics and technological challenges.
At present, considering the cost and the influence of the size of silicon wafers on the performance and efficiency of integrated circuits, the increase in the size of wafers is an inevitable trend and a mainstream trend, in particular, 8-inch and 12-inch. Wafer may develop in the direction of 18 inches in the future. However, the larger the size, the more difficult it is to produce the corresponding CMP pad. When the downstream size becomes an inevitable trend, in order to occupy the market, it is necessary to be able to develop large-size pad, otherwise it will be eliminated by the market. With the expectation of the superior performance improvement of integrated circuits, the polishing performance of CMP pads has to be increased, so its performance in the future must be more stringent.
Several of the current market-oriented enterprises in China have not obtained foreign certifications, so there is no export for the time being. Because downstream companies are mainly concentrated in Japan, Taiwan, South Korea, Europe and the United States and other countries, in addition to Europe and South Korea, these countries have a relatively large market position of CMP polishing pads in several other regions. The electronics industry is mainly concentrated in the Asia-Pacific region, but the current political situation is not optimistic, especially in 2020, it may be the most serious year for China's political crisis in the past 30 years. Due to the current trade frictions and China's current international political factors, it may be the best time for domestic CMP pad manufacturers to occupy the market, and the country's policy investment will increase in the coming years. Therefore, Chinese companies will usher in opportunities for localization in the next few years. We predict that in order to occupy the market, Hubei Dinglong may actively lower the price of the product and madly occupy the market.
New investment requires large capital, and it is difficult for small-scale enterprises to enter the industry. CMP Pads has higher requirements on technology level and processing technology. At present, the market is occupied by American companies. The market is not only influenced by the price, but also influenced by the product performance. The leading companies own the advantages on better performance, more abundant product's types, better technical and impeccable after-sales service. Consequently, they take the majority of the market share of high-end market. Looking to the future years, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.
For manufacturers that have already entered, they need to constantly raise the technical threshold to prevent more companies from entering; by reducing costs and reducing prices, they will quickly occupy the market, develop incremental customer markets, and establish market share advantages; create a brand image and lay an advantage for entering the consumer goods market. Only in this way can we have a larger market share of capital in the fierce competition.
Despite this interest, the CMP pad market poses several significant barriers to entry. First, the industry is highly specialized and requires deep technical expertise in materials science, surface chemistry, and wafer process integration. Second, stringent performance requirements - such as planarity, defectivity, and compatibility with specific slurries - mean that pad suppliers must go through extensive qualification processes with semiconductor fabs, which can take years. Additionally, the market is dominated by a few entrenched players with long-term relationships and proprietary technologies, making it difficult for newcomers to gain design-ins. High R&D costs, capital investment in precision manufacturing, and the need for global support infrastructure also pose substantial challenges.
This report aims to provide a comprehensive presentation of the global market for CMP Pads, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of CMP Pads by region & country, by Type, and by Application.
The CMP Pads market size, estimations, and forecasts are provided in terms of sales volume (K Pcs) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding CMP Pads.
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of CMP Pads manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of CMP Pads in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of CMP Pads in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.