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市場調查報告書
商品編碼
1857119
碳化矽拋光耗材:全球市佔率排名、總銷售額及需求預測(2025-2031年)SiC Polishing Consumables - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031 |
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2024年全球 SiC 磨料耗材市場規模為 1.34億美元,預計到2031年將達到 4.72億美元,在2025-2031年預測期內年複合成長率為 19.6%。
碳化矽(SiC)是寬能隙半導體,能夠在更高的溫度、功率和電壓下工作。這使得功率元件、LED 照明和通訊的能源效率得以提升。 SiC 的獨特性能使其成為眾多應用領域的首選材料,包括混合動力汽車、電力電子開關和 LED 照明技術。
本報告調查SiC拋光耗材,包括SiC CMP漿料和SiC CMP墊片。
全球碳化矽拋光耗材的主要企業包括杜邦、恩特格里斯、富士美株式會社、聖戈班、富士博、上海新安納等。到2024年,這四家全球主要企業的銷售收入將佔全球市場佔有率的約82%。
SiC CMP 漿料市場的主要參與者包括Entegris、Fujimi Corporation、Saint-Gobain、Shanghai Xinanna等。到2024年,這三大主要企業將佔據約 82.4%的市場佔有率(依銷售額計)。
SiC CMP 拋光墊墊片的主要參與者包括DuPont、Entegris、Fujibo 等。DuPont在全球 SiC CMP墊片市場佔據主導地位,市場佔有率超過 75%。
碳化矽(SiC)化學機械拋光(CMP)耗材市場,包括拋光液和墊片,正處於關鍵階段,反映了 SiC 晶圓產業本身的快速成長。目前,該市場高度集中,少數幾家主要企業主導供應鏈。 Entegris 和 Fujimi Corporation 是 SiC CMP 拋光液領域的領導者企業,憑藉其在材料科學方面的深厚專業知識,開發出滿足 SiC 拋光嚴苛要求的專有配方。同樣,杜邦和 Fujibo 在 SiC CMP墊片市場中佔據主導地位。雖然供應商數量有限確保了產品的高品質和高效能,但也可能成為未來產能擴張的瓶頸。目前,市場活動主要集中在 6 吋 SiC 晶圓上,這種晶圓已成為電力電子產業的標準,對汽車和能源產業非常重要。然而,對 8 吋晶圓的需求也興起並不斷成長,有望實現規模經濟,並成為晶圓製造商和意法半導體等主要 SiC 製造商的重點領域。這些耗材的性能直接影響最終裝置的產量比率和品質,因此它們的開發是整個碳化矽生態系統面臨的關鍵挑戰。
推動碳化矽(SiC)化學機械拋光(CMP)耗材市場發展的幾個強勁趨勢顯現。首先,SiC 在電動車(EV)中的應用加速。與傳統的矽基解決方案相比,SiC 功率元件具有更高的效率、功率密度和導熱性,因此對電動車逆變器、車載充電器和直流-直流轉換器非常重要。隨著全球電動車產量的擴大,對 SiC 晶圓的需求也隨之成長,進而帶動了拋光耗材的需求。其次,全球對再生能源的大力發展是關鍵促進因素。 SiC 組件是太陽能逆變器和風力發電機系統不可或缺的組件,有助於最大限度地提高能量轉換效率。第三個因素是晶圓尺寸從 6 英吋到 8 英吋的轉變。這項轉變是由半導體產業不斷追求降低晶片晶粒所驅動的。隨著主要 SiC 製造商對 8 吋生產線進行大量投資,對適用於這些更大尺寸晶圓的高性能 CMP 拋光液和墊片的需求也隨之激增。這項轉變要求耗材製造商進行大量的研發投資,以應對與較大基板上的拋光均勻性和缺陷相關的新技術挑戰。
儘管市場需求強勁,碳化矽化學機械拋光(CMP)耗材產業仍面臨許多挑戰。主要障礙在於碳化矽極高的硬度和化學惰性,使得拋光過程本身就十分困難且耗時。這就要求使用高效且經濟的拋光液和耐用的墊片。開發能夠在提高材料去除率(MRR)的同時最大限度地減少表面缺陷的新配方,仍然是一項重大的技術難題。第二個主要挑戰是原料成本高且供應有限,尤其是拋光液中使用的專用磨料和化學品。市場集中度高也是一個令人擔憂的問題,如果主要供應商出現生產問題,可能會導致供應鏈脆弱。此外,不同碳化矽元件製造商之間缺乏標準化的拋光製程也增加了複雜性。每個製造商都有自己的專有配方,迫使耗材供應商開發種類繁多的產品,或與各個客戶緊密合作,開發客製化解決方案。這種分散化可能會減緩整個產業的成熟度,並阻礙通用、高產量比率拋光製程的開發。
本報告目的是全面概述全球 SiC 拋光耗材市場,重點關注總銷售收入、主要企業佔有率和排名,並依地區/國家、類型和晶圓尺寸進行分析。
本報告對碳化矽拋光耗材市場規模進行了估算和預測,提供了2020年至2031年的歷史資料和預測資料,單位為銷售收入(百萬美元),以2024年為基準年。定量和定性分析有助於讀者制定業務/成長策略、評估市場競爭格局、分析公司在當前市場中的地位,並就碳化矽拋光耗材做出明智的商業決策。
The global market for SiC Polishing Consumables was estimated to be worth US$ 134 million in 2024 and is forecast to a readjusted size of US$ 472 million by 2031 with a CAGR of 19.6% during the forecast period 2025-2031.
Silicon Carbide (SiC) is a wide band gap semiconductor that can operate at higher temperature, power level, and voltage. This enables improved energy efficiency in power devices, LED lighting, and telecommunications. Because of its unique properties, SiC is the material of choice for diverse applications such as Hybrid Electric vehicles, power electronic switches, and LED lighting technology.
This report studies the SiC Polishing Consumables, include the SiC CMP Slurry and SiC CMP Pad.
The global key players of SiC polishing consumables include DuPont, Entegris, Fujimi Corporation, Saint-Gobain, Fujibo and Shanghai Xinanna, etc. In 2024, the global top four players occupied for a share approximately 82% in terms of revenue.
The key players of SiC CMP slurry include Entegris, Fujimi Corporation, Saint-Gobain, and Shanghai Xinanna, etc. In 2024, the global top three players occupied for a share approximately 82.4% in terms of revenue.
The key players of SiC CMP pads include DuPont, Entegris, and Fujibo, etc. DuPont is domaing the global SiC CMP pads market, holds a share over 75%.
The market for silicon carbide (SiC) chemical mechanical polishing (CMP) consumables, including slurries and pads, is at a pivotal stage, reflecting the rapid growth of the SiC wafer industry itself. Currently, the market is highly concentrated, with a small number of key players dominating the supply chain. Entegris and Fujimi Corporation are the established leaders in SiC CMP slurries, leveraging their deep expertise in materials science to develop proprietary formulations that meet the stringent demands of SiC polishing. Similarly, DuPont and Fujibo hold a commanding position in the SiC CMP pads market. This limited number of suppliers, while ensuring high quality and performance, also presents a potential bottleneck for future capacity expansion. Most of the market activity today is focused on 6-inch SiC wafers, which have become the industry standard for power electronics and are critical for the automotive and energy sectors. However, there is a nascent but growing demand for 8-inch wafers, which promises economies of scale and is a key focus for leading SiC manufacturers like Wolfspeed and STMicroelectronics. The performance of these consumables directly impacts the final device yield and quality, making their development a critical path item for the entire SiC ecosystem.
Several powerful trends are acting as tailwinds for the SiC CMP consumables market. First and foremost is the accelerated adoption of SiC in electric vehicles (EVs). SiC power devices are crucial for EV inverters, on-board chargers, and DC-DC converters due to their superior efficiency, power density, and thermal conductivity compared to traditional silicon-based solutions. As EV production scales up globally, so does the demand for SiC wafers and, by extension, the consumables used to polish them. Second, the global push for renewable energy is a significant driver. SiC components are essential for solar inverters and wind turbine systems, where they help maximize energy conversion efficiency. The third factor is the transition from 6-inch to 8-inch wafers. This shift is driven by the semiconductor industry's constant quest for lower costs per die. As major SiC manufacturers invest heavily in 8-inch fabrication lines, the demand for high-performance CMP slurries and pads specifically optimized for these larger wafers will surge. This transition will require significant R&D investment from consumables suppliers to address new technical challenges related to polishing uniformity and defectivity on larger substrates.
Despite the robust growth drivers, the SiC CMP consumables industry faces significant challenges. The primary obstacle is the extreme hardness and chemical inertness of SiC, which makes polishing an inherently difficult and slow process. This necessitates the use of abrasive slurries and durable pads that are both effective and cost-effective. Developing new formulations that can achieve higher material removal rates (MRR) while minimizing surface defects remains a major technical hurdle. A second major challenge is the high cost and limited supply of raw materials, particularly the specialized abrasives and chemicals used in slurries. The concentrated nature of the market could also be a point of concern, as it could lead to potential supply chain vulnerabilities if a key supplier faces production issues. Furthermore, the lack of a standardized polishing process across different SiC device manufacturers adds complexity. Each manufacturer has its own proprietary recipes, requiring consumables suppliers to develop a wide range of products or work closely with individual customers on tailored solutions. This fragmentation can slow down the overall maturation of the industry and hinder the development of universal, high-yield polishing processes.
This report aims to provide a comprehensive presentation of the global market for SiC Polishing Consumables, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of SiC Polishing Consumables by region & country, by Type, and by Wafer Size.
The SiC Polishing Consumables market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Polishing Consumables.
Market Segmentation
By Company
Segment by Type
Segment by Wafer Size
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of SiC Polishing Consumables company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Wafer Size, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of SiC Polishing Consumables in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of SiC Polishing Consumables in country level. It provides sigmate data by Type, and by Wafer Size for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.