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市場調查報告書
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1801289

IC插座市場：全球產業分析、規模、佔有率、成長、趨勢及預測（2025-2032年）

IC Sockets Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2025 - 2032
出版日期: | 出版商: Persistence Market Research | 英文 250 Pages | 商品交期: 2-5個工作天內

價格
簡介目錄

Persistence Market Research 最近發布了一份關於全球 IC插座市場的綜合報告，本報告對重要市場動態進行了全面評估，包括市場促進因素、趨勢、機會和挑戰，並對市場結構提供了詳細的見解。

關鍵見解

  • IC插座市場規模（2025年預測）：11.459億美元
  • 市場預測（2032年）：16.017億美元
  • 全球市場成長率（2025-2032年年複合成長率）：4.9%

IC插座市場：研究範圍

IC插座是電子組件中用於封裝和連接積體電路（IC）的關鍵元件。這些插座為 IC 提供安全、可拆卸的連接，方便測試、更換和原型製作。 IC插座市場服務於家用電子電器、汽車、工業設備、通訊設備以及航太和國防等領域。市場成長的驅動力包括電子產品日益複雜的結構、小型化趨勢以及對可靠且可重複使用的互連解決方案的需求。

市場促進因素：

全球IC插座市場受多種關鍵因素驅動，其中包括消費和工業應用對高性能、緊湊型電子設備日益成長的需求。半導體生產和測試的發展，尤其是在亞太地區，進一步推動了老化、測試和開發過程中對IC插座的需求。汽車產業中電控系統（ECU）、感測器和資訊娛樂系統的使用日益增多，也推動了插座需求的成長。此外，5G的推出和物聯網的廣泛應用等趨勢加速複雜晶片的製造，而這些晶片需要高度可靠的插座介面來進行效能檢驗。

市場限制：

儘管IC插座市場成長動力良好，但仍面臨成本壓力和設計複雜性的挑戰。隨著半導體封裝向晶片級和系統級封裝發展，插座的兼容性和設計變得更加複雜，導致製造成本上升。此外，向焊接解決方案的轉變限制了傳統插座在某些小型電子設備中的使用。這些技術和經濟限制可能會影響市場滲透率，尤其是在小批量應用和成本敏感市場。

市場機會：

受插座設計創新、電子製造自動化程度不斷提高以及人工智慧和邊緣運算的興起等因素的推動，IC插座市場正迎來巨大的成長機會。 BGA、LGA和QFN等先進封裝的測試和老化插座的日益普及，為製造商提供了有利的發展方向。此外，半導體測試對可重複使用的高速插座的需求，也為高精度、熱穩定性和長壽命插座解決方案帶來了機會。與半導體代工廠的合作、研發投入和客製化能力是掌握新興趨勢、擴大市場佔有率的關鍵策略。

本報告探討的關鍵問題

  • 推動 IC插座市場成長的主要因素有哪些？
  • 哪些插座類型和應用在不同的終端用戶產業中佔據主導地位？
  • 技術進步如何影響 IC插座領域的產品開發？
  • IC插座市場的主要參與者有哪些？他們採取了哪些策略措施？
  • 全球IC插座產業未來前景及成長熱點有哪些？

目錄

第1章 執行摘要

第2章 市場概述

  • 市場範圍和定義
  • 價值鏈分析
  • 宏觀經濟因素
    • 世界GDP展望
    • 全球建設產業概況
    • 全球採礦業概況
  • 預測因子 - 相關性和影響力
  • COVID-19影響評估
  • PESTLE分析
  • 波特五力分析
  • 地緣政治緊張局勢：市場影響
  • 監管和技術格局

第3章 市場動態

  • 促進因素
  • 抑制因素
  • 機會
  • 趨勢

第4章 2019-2032年價格趨勢分析

  • 區域價格分析
  • 依細分市場定價
  • 價格影響因素

第5章 全球IC插座市場展望：過去（2019-2024年）與預測（2025-2032年）

  • 主要亮點
  • 全球 IC插座市場展望：類型
    • 簡介/主要調查結果
    • 歷史市場規模（百萬美元）分析，2019-2024年，依類型
    • 目前市場規模（百萬美元）預測，2025-2032年，依類型
      • 通孔插座
      • 表面黏著技術插座
      • 零插入力（ZIF）插座
      • 雙排插座
    • 市場吸引力分析：類型
  • 全球 IC插座市場展望：應用
    • 簡介/主要調查結果
    • 歷史市場規模（百萬美元）分析，2019-2024年，依應用
    • 當前市場規模（百萬美元）預測，2025-2032年，依應用
      • 記憶
      • CMOS影像感測器
      • 高壓
      • 射頻（RF）
      • 系統晶片（SoC）
      • 中央處理器（CPU）
      • 圖形處理單元（GPU）
      • 其他非記憶
    • 市場吸引力分析：應用

第6章 全球IC插座市場展望：依地區

  • 主要亮點
  • 歷史市場規模（百萬美元）分析，2019-2024年，依地區
  • 目前市場規模（百萬美元）預測，2025-2032年，依地區
    • 北美洲
    • 歐洲
    • 東亞
    • 南亞和大洋洲
    • 拉丁美洲
    • 中東和非洲
  • 市場吸引力分析：地區

第7章 北美 IC插座市場展望：歷史（2019-2024年）與預測（2025-2032年）

第8章 歐洲 IC插座市場展望：歷史（2019-2024年）與預測（2025-2032年）

第9章 東亞 IC插座市場展望：歷史（2019-2024年）與預測（2025-2032年）

第10章 南亞和大洋洲 IC插座市場展望：歷史（2019-2024年）和預測（2025-2032年）

第11章 拉丁美洲 IC插座市場展望：歷史（2019-2024年）與預測（2025-2032年）

第12章 中東和非洲 IC插座市場展望：歷史（2019-2024年）和預測（2025-2032年）

第13章 競爭格局

  • 2025年市場佔有率分析
  • 市場結構
    • 競爭強度圖
    • 競爭儀表板
  • 公司簡介
    • Aries Electronics, Inc.
    • Enplas Corporation
    • Loranger International Corporation
    • Mill-Max Mfg. Corporation
    • Molex LLC

第14章 附錄

  • 調查方法
  • 調查前提
  • 首字母縮寫和簡稱
簡介目錄
Product Code: PMRREP33495

Persistence Market Research has recently released a comprehensive report on the worldwide market for IC sockets. The report offers a thorough assessment of crucial market dynamics, including drivers, trends, opportunities, and challenges, providing detailed insights into the market structure.

Key Insights:

  • IC Sockets Market Size (2025E): USD 1,145.9 Million
  • Projected Market Value (2032F): USD 1,601.7 Million
  • Global Market Growth Rate (CAGR 2025 to 2032): 4.9%

IC Sockets Market - Report Scope:

IC sockets are integral components used in electronic assemblies for housing and interfacing integrated circuits (ICs). These sockets provide secure, removable connections for ICs, enabling ease of testing, replacement, and prototyping. The IC sockets market caters to applications across consumer electronics, automotive, industrial equipment, communication devices, and aerospace & defense sectors. The market growth is supported by the increasing complexity of electronic devices, miniaturization trends, and the need for reliable and reusable interconnection solutions.

Market Growth Drivers:

The global IC sockets market is propelled by several key factors, including the rising demand for high-performance and compact electronic devices in consumer and industrial applications. Growth in semiconductor production and testing, particularly in the Asia Pacific region, further fuels the need for IC sockets in burn-in, test, and development processes. The automotive industry's increasing use of electronic control units (ECUs), sensors, and infotainment systems also contributes to socket demand. Additionally, trends such as 5G deployment and IoT proliferation accelerate the production of complex chips requiring high-reliability socket interfaces for performance validation.

Market Restraints:

Despite its promising growth trajectory, the IC sockets market faces challenges related to cost pressures and design complexities. As semiconductor packaging evolves toward chip-scale and system-in-package designs, the compatibility and design of sockets become more intricate, leading to higher manufacturing costs. Furthermore, the shift toward soldered solutions in some compact electronics limits the use of traditional sockets. These technical and economic constraints may affect market penetration, particularly for low-volume applications or cost-sensitive markets.

Market Opportunities:

The IC sockets market presents significant growth opportunities driven by innovations in socket design, increasing automation in electronics manufacturing, and the emergence of AI and edge computing. Growing adoption of test and burn-in sockets for advanced packaging types such as BGA, LGA, and QFN presents a lucrative avenue for manufacturers. Moreover, the demand for reusable and high-speed sockets in semiconductor testing opens up opportunities for high-precision, thermally stable, and long-lifecycle socket solutions. Collaborations with semiconductor foundries, R\&D investments, and customization capabilities are essential strategies to tap into emerging trends and expand market presence.

Key Questions Answered in the Report:

  • What are the primary factors driving the growth of the IC sockets market globally?
  • Which socket types and applications are dominating demand across different end-user industries?
  • How are technological advancements impacting product development in the IC sockets segment?
  • Who are the major players in the IC sockets market, and what strategic initiatives are they pursuing?
  • What are the future prospects and growth hotspots in the global IC sockets industry?

Competitive Intelligence and Business Strategy:

These firms leverage their R\&D capabilities to develop sockets for high-frequency, high-density applications and extreme environmental conditions. Strategic initiatives such as partnerships with semiconductor testing companies, geographical expansion, and participation in trade fairs help in market penetration. Emphasis is also placed on sustainability, miniaturization, and design flexibility to meet evolving industry demands.

Key Companies Profiled:

  • Aries Electronics, Inc.
  • Enplas Corporation
  • Loranger International Corporation
  • Mill-Max Mfg. Corporation; Molex LLC
  • Plastronics Socket Company Inc.
  • Sensata Technologies, Inc.
  • Smiths Interconnect
  • TE Connectivity Ltd.
  • Yamaichi Electronics Co., Ltd.
  • Molex

IC Sockets Market Research Segmentation:

By Type:

  • Through-hole Sockets
  • Surface-mount Sockets
  • Zero Insertion Force (ZIF) Sockets
  • Dual-row Sockets
  • Other

By Applications:

  • Memory
  • CMOS Image Sensors
  • High Voltage
  • Radio Frequency (RF)
  • System on Chip (SoC)
  • Central Processing Unit (CPU)
  • Graphics Processing Unit (GPU)
  • Other Non-memory

By Region:

  • North America
  • Latin America
  • Europe
  • Asia Pacific
  • Middle East and Africa

Table of Contents

1. Executive Summary

  • 1.1. Global IC Sockets Market Snapshot 2025 and 2032
  • 1.2. Market Opportunity Assessment, 2025-2032, US$ Mn
  • 1.3. Key Market Trends
  • 1.4. Industry Developments and Key Market Events
  • 1.5. Demand Side and Supply Side Analysis
  • 1.6. PMR Analysis and Recommendations

2. Market Overview

  • 2.1. Market Scope and Definitions
  • 2.2. Value Chain Analysis
  • 2.3. Macro-Economic Factors
    • 2.3.1. Global GDP Outlook
    • 2.3.2. Global Construction Industry Overview
    • 2.3.3. Global Mining Industry Overview
  • 2.4. Forecast Factors - Relevance and Impact
  • 2.5. COVID-19 Impact Assessment
  • 2.6. PESTLE Analysis
  • 2.7. Porter's Five Forces Analysis
  • 2.8. Geopolitical Tensions: Market Impact
  • 2.9. Regulatory and Technology Landscape

3. Market Dynamics

  • 3.1. Drivers
  • 3.2. Restraints
  • 3.3. Opportunities
  • 3.4. Trends

4. Price Trend Analysis, 2019-2032

  • 4.1. Region-wise Price Analysis
  • 4.2. Price by Segments
  • 4.3. Price Impact Factors

5. Global IC Sockets Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

  • 5.1. Key Highlights
  • 5.2. Global IC Sockets Market Outlook: Type
    • 5.2.1. Introduction/Key Findings
    • 5.2.2. Historical Market Size (US$ Mn) Analysis by Type, 2019-2024
    • 5.2.3. Current Market Size (US$ Mn) Forecast, by Type, 2025-2032
      • 5.2.3.1. Through-hole Sockets
      • 5.2.3.2. Surface-mount Sockets
      • 5.2.3.3. Zero Insertion Force (ZIF) Sockets
      • 5.2.3.4. Dual-row Sockets
    • 5.2.4. Market Attractiveness Analysis: Type
  • 5.3. Global IC Sockets Market Outlook: Applications
    • 5.3.1. Introduction/Key Findings
    • 5.3.2. Historical Market Size (US$ Mn) Analysis by Applications, 2019-2024
    • 5.3.3. Current Market Size (US$ Mn) Forecast, by Applications, 2025-2032
      • 5.3.3.1. Memory
      • 5.3.3.2. CMOS Image Sensors
      • 5.3.3.3. High Voltage
      • 5.3.3.4. Radio Frequency (RF)
      • 5.3.3.5. System on Chip (SoC)
      • 5.3.3.6. Central Processing Unit (CPU)
      • 5.3.3.7. Graphics Processing Unit (GPU)
      • 5.3.3.8. Other Non-memory
    • 5.3.4. Market Attractiveness Analysis: Applications

6. Global IC Sockets Market Outlook: Region

  • 6.1. Key Highlights
  • 6.2. Historical Market Size (US$ Mn) Analysis by Region, 2019-2024
  • 6.3. Current Market Size (US$ Mn) Forecast, by Region, 2025-2032
    • 6.3.1. North America
    • 6.3.2. Europe
    • 6.3.3. East Asia
    • 6.3.4. South Asia & Oceania
    • 6.3.5. Latin America
    • 6.3.6. Middle East & Africa
  • 6.4. Market Attractiveness Analysis: Region

7. North America IC Sockets Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

  • 7.1. Key Highlights
  • 7.2. Pricing Analysis
  • 7.3. North America Market Size (US$ Mn) Forecast, by Country, 2025-2032
    • 7.3.1. U.S.
    • 7.3.2. Canada
  • 7.4. North America Market Size (US$ Mn) Forecast, by Type, 2025-2032
    • 7.4.1. Through-hole Sockets
    • 7.4.2. Surface-mount Sockets
    • 7.4.3. Zero Insertion Force (ZIF) Sockets
    • 7.4.4. Dual-row Sockets
  • 7.5. North America Market Size (US$ Mn) Forecast, by Applications, 2025-2032
    • 7.5.1. Memory
    • 7.5.2. CMOS Image Sensors
    • 7.5.3. High Voltage
    • 7.5.4. Radio Frequency (RF)
    • 7.5.5. System on Chip (SoC)
    • 7.5.6. Central Processing Unit (CPU)
    • 7.5.7. Graphics Processing Unit (GPU)
    • 7.5.8. Other Non-memory

8. Europe IC Sockets Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

  • 8.1. Key Highlights
  • 8.2. Pricing Analysis
  • 8.3. Europe Market Size (US$ Mn) Forecast, by Country, 2025-2032
    • 8.3.1. Germany
    • 8.3.2. Italy
    • 8.3.3. France
    • 8.3.4. U.K.
    • 8.3.5. Spain
    • 8.3.6. Russia
    • 8.3.7. Rest of Europe
  • 8.4. Europe Market Size (US$ Mn) Forecast, by Type, 2025-2032
    • 8.4.1. Through-hole Sockets
    • 8.4.2. Surface-mount Sockets
    • 8.4.3. Zero Insertion Force (ZIF) Sockets
    • 8.4.4. Dual-row Sockets
  • 8.5. Europe Market Size (US$ Mn) Forecast, by Applications, 2025-2032
    • 8.5.1. Memory
    • 8.5.2. CMOS Image Sensors
    • 8.5.3. High Voltage
    • 8.5.4. Radio Frequency (RF)
    • 8.5.5. System on Chip (SoC)
    • 8.5.6. Central Processing Unit (CPU)
    • 8.5.7. Graphics Processing Unit (GPU)
    • 8.5.8. Other Non-memory

9. East Asia IC Sockets Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

  • 9.1. Key Highlights
  • 9.2. Pricing Analysis
  • 9.3. East Asia Market Size (US$ Mn) Forecast, by Country, 2025-2032
    • 9.3.1. China
    • 9.3.2. Japan
    • 9.3.3. South Korea
  • 9.4. East Asia Market Size (US$ Mn) Forecast, by Type, 2025-2032
    • 9.4.1. Through-hole Sockets
    • 9.4.2. Surface-mount Sockets
    • 9.4.3. Zero Insertion Force (ZIF) Sockets
    • 9.4.4. Dual-row Sockets
  • 9.5. East Asia Market Size (US$ Mn) Forecast, by Applications, 2025-2032
    • 9.5.1. Memory
    • 9.5.2. CMOS Image Sensors
    • 9.5.3. High Voltage
    • 9.5.4. Radio Frequency (RF)
    • 9.5.5. System on Chip (SoC)
    • 9.5.6. Central Processing Unit (CPU)
    • 9.5.7. Graphics Processing Unit (GPU)
    • 9.5.8. Other Non-memory

10. South Asia & Oceania IC Sockets Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

  • 10.1. Key Highlights
  • 10.2. Pricing Analysis
  • 10.3. South Asia & Oceania Market Size (US$ Mn) Forecast, by Country, 2025-2032
    • 10.3.1. India
    • 10.3.2. Southeast Asia
    • 10.3.3. ANZ
    • 10.3.4. Rest of SAO
  • 10.4. South Asia & Oceania Market Size (US$ Mn) Forecast, by Type, 2025-2032
    • 10.4.1. Through-hole Sockets
    • 10.4.2. Surface-mount Sockets
    • 10.4.3. Zero Insertion Force (ZIF) Sockets
    • 10.4.4. Dual-row Sockets
  • 10.5. South Asia & Oceania Market Size (US$ Mn) Forecast, by Applications, 2025-2032
    • 10.5.1. Memory
    • 10.5.2. CMOS Image Sensors
    • 10.5.3. High Voltage
    • 10.5.4. Radio Frequency (RF)
    • 10.5.5. System on Chip (SoC)
    • 10.5.6. Central Processing Unit (CPU)
    • 10.5.7. Graphics Processing Unit (GPU)
    • 10.5.8. Other Non-memory

11. Latin America IC Sockets Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

  • 11.1. Key Highlights
  • 11.2. Pricing Analysis
  • 11.3. Latin America Market Size (US$ Mn) Forecast, by Country, 2025-2032
    • 11.3.1. Brazil
    • 11.3.2. Mexico
    • 11.3.3. Rest of LATAM
  • 11.4. Latin America Market Size (US$ Mn) Forecast, by Type, 2025-2032
    • 11.4.1. Through-hole Sockets
    • 11.4.2. Surface-mount Sockets
    • 11.4.3. Zero Insertion Force (ZIF) Sockets
    • 11.4.4. Dual-row Sockets
  • 11.5. Latin America Market Size (US$ Mn) Forecast, by Applications, 2025-2032
    • 11.5.1. Memory
    • 11.5.2. CMOS Image Sensors
    • 11.5.3. High Voltage
    • 11.5.4. Radio Frequency (RF)
    • 11.5.5. System on Chip (SoC)
    • 11.5.6. Central Processing Unit (CPU)
    • 11.5.7. Graphics Processing Unit (GPU)
    • 11.5.8. Other Non-memory

12. Middle East & Africa IC Sockets Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

  • 12.1. Key Highlights
  • 12.2. Pricing Analysis
  • 12.3. Middle East & Africa Market Size (US$ Mn) Forecast, by Country, 2025-2032
    • 12.3.1. GCC Countries
    • 12.3.2. South Africa
    • 12.3.3. Northern Africa
    • 12.3.4. Rest of MEA
  • 12.4. Middle East & Africa Market Size (US$ Mn) Forecast, by Type, 2025-2032
    • 12.4.1. Through-hole Sockets
    • 12.4.2. Surface-mount Sockets
    • 12.4.3. Zero Insertion Force (ZIF) Sockets
    • 12.4.4. Dual-row Sockets
  • 12.5. Middle East & Africa Market Size (US$ Mn) Forecast, by Applications, 2025-2032
    • 12.5.1. Memory
    • 12.5.2. CMOS Image Sensors
    • 12.5.3. High Voltage
    • 12.5.4. Radio Frequency (RF)
    • 12.5.5. System on Chip (SoC)
    • 12.5.6. Central Processing Unit (CPU)
    • 12.5.7. Graphics Processing Unit (GPU)
    • 12.5.8. Other Non-memory

13. Competition Landscape

  • 13.1. Market Share Analysis, 2025
  • 13.2. Market Structure
    • 13.2.1. Competition Intensity Mapping
    • 13.2.2. Competition Dashboard
  • 13.3. Company Profiles
    • 13.3.1. Aries Electronics, Inc.
      • 13.3.1.1. Company Overview
      • 13.3.1.2. Product Portfolio/Offerings
      • 13.3.1.3. Key Financials
      • 13.3.1.4. SWOT Analysis
      • 13.3.1.5. Company Strategy and Key Developments
    • 13.3.2. Enplas Corporation
    • 13.3.3. Loranger International Corporation
    • 13.3.4. Mill-Max Mfg. Corporation
    • 13.3.5. Molex LLC

14. Appendix

  • 14.1. Research Methodology
  • 14.2. Research Assumptions
  • 14.3. Acronyms and Abbreviations