查看購物車
  • English
  • Japanese
封面
市場調查報告書
商品編碼
2124536

表面黏著技術：市場佔有率分析、產業趨勢與統計、成長預測（2026-2031）

Surface Mount Technology - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026 - 2031)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

價格

※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

簡介目錄

據 Mordor Intelligence 稱，2025 年表面黏著技術(SMT) 市場價值為 66.1 億美元，預計到 2031 年將達到 101.9 億美元，而 2026 年為 71.1 億美元，預測期（2026-2031 年）的複合年成長率為 7.49%。

表面貼裝技術市場-IMG1

本報告按元件（被動元件[電阻器、電容器等]）、設備類型（貼片設備[高速貼片機等]）、組裝類型（多品種小批量生產等）、終端用戶產業（家用電子電器等）及地區（北美、南美等）進行細分。市場預測以美元計價。

全球表面黏著技術（SMT）市場趨勢與洞察

物聯網和穿戴式裝置正在推動超高密度PCB的普及應用。

目前，設備製造商在單一智慧型手錶中整合了超過10,000個多層陶瓷電容器，是五年前的三倍。形成小於50µm的導電走線和小於75µm的微孔需要組裝設備可靠地處理精度為±25µm的01005封裝。符合FCC輻射限制和IEC安全要求正在推動電磁干擾（EMI）屏蔽技術的進一步發展，從而增加了對精密焊膏偵測和自動光學偵測（AOI）系統的需求。

汽車ADAS電子設備的採用重新定義了可靠性要求。

電動車的參考設計每輛車使用超過10,000個MLCC（多層陶瓷電容器）和200多個電控系統，儘管生命週期認證週期超過三年，但SMT（表面貼裝技術）的產量仍在成長。 ISO 26262功能安全要求以及-40 度C至150 度C的動作溫度範圍，要求基於汽車PPAP（生產件批准程序）和AEC-Q200應力測試進行製程認證。能夠檢驗焊點長期可靠性的設備製造商正在歐洲和日本獲得多年供貨合約。

大額初始資本投資是中小企業發展的障礙。

新一代貼片平台，若配備線上SPI、AOI和X光檢測設備，每條生產線的成本超過300萬美元。雖然預測性維護分析能夠降低整體擁有成本，但許多中小型電子製造服務（EMS）供應商難以在三年內收回投資。設備租賃和基於績效的服務合約正在興起，但在一級原始設備製造商（OEM）之外仍然不常見。

細分市場分析

到2025年，主動元件在表面黏著技術（SMT）市場佔有率中佔據65.74%的佔有率，這主要得益於人工智慧伺服器和電動汽車領域對微控制器（MCU）、專用積體電路（ASIC）和電源管理裝置的快速成長需求。預計到2031年，該細分市場將以8.62%的複合年成長率成長，這主要得益於異構片上系統（SoC）設計和高壓電晶體的日益普及。被動元件繼續受益於5G行動電話和汽車牽引逆變器等應用領域的成長，但陶瓷和鉭材料的供不應求持續考驗著供應鏈的韌性。

客戶期望正從控制元件成本轉向基板級整合密度和長期可靠性。原始設備製造商 (OEM) 要求故障率低於 10 ppm，運作長達 15 年，這促使基板供應商、元件製造商和組裝設備供應商之間進行更緊密的合作。提供主動和被動元件協作設計庫以及全面的設計組裝認證 (DFA) 審核的供應商，正在加速新產品的量推出，並確立自身作為先進穿戴式設備和工業IoT閘道器「首選供應商」的地位。

即使到了2025年，貼片設備仍將佔表面黏著技術（SMT）市場規模的42.62%，而檢測設備則以8.83%的複合年成長率（CAGR）成長最快。高速貼片機借助可自動調節頭部壓力的機器學習視覺系統，如今已能達到每小時10萬個貼片的加工速度和±10微米的精確度。對於焊接設備而言，由於無鉛合金需要更小的熱梯度，其製程窗口正在收窄；而絲網印刷平台則採用封閉回路型SPI回饋來提高一次合格率。

投資的重點在於利用深度學習技術將誤報率降低90%並將偵測速度提高四倍的AOI和X光檢測系統。 ViTrox和Koh Young已將IPC-CFX連接功能整合到系統中，從而實現即時分析，可在幾分鐘內檢測到降低良率的趨勢。設備融資方案與分析服務訂閱捆綁銷售，減輕了高昂的前期成本負擔，鼓勵東歐和東南亞的二級電子製造服務（EMS）企業升級其生產線。

區域分析

預計亞太地區將佔據主導地位，到2025年將佔據表面黏著技術（SMT）市場48.05%的佔有率，並維持到2031年8.12%的複合年成長率。中國大陸、台灣和韓國計畫在2027年共同投資超過840億美元新建300毫米晶圓廠，以確保上游基板和元件的生產能力。日本熊本產業叢集以台積電日本半導體製造有限公司（TSMC JASM）200億美元的擴建項目為核心，將擴大產能，使其每月能夠生產超過10萬片12英寸晶圓，並創造3400個高科技就業崗位。

北美地區先前發展落後，但在《晶片與整合產品法案》（CHIPS Act）的推動下正在加速，已公佈的項目預計將使該地區的生產能力投資加倍，從2024年的120億美元增至2027年的247億美元。亞利桑那州和紐約州的先進封裝先導計畫旨在實現人工智慧加速器中小於10微米佈局，以減少對跨太平洋航運路線的依賴。監管機構對網路安全意識強的生產流程的重視，正促使工廠努力獲得CMMC和IPC-1791可信任建構者認證。

在歐洲，重點領域是汽車功率半導體和寬能隙帶裝置，英飛凌和義法半導體引領資本投資，以支持800V電動車逆變器的發展。 RoHS指令在該地區覆蓋範圍的擴大以及即將訂定的生態設計法規，正在推動可修復PCB的發展，並刺激對選擇性焊接和返修平台的需求。根據歐洲技能契約（Pact for Skills）制定的勞動力技能發展計劃，結合IPC認證的互連設計師課程，旨在到2029年解決14.6萬的勞動力缺口問題。

在中東和非洲，沙烏地阿拉伯和阿拉伯聯合大公國（阿拉伯聯合大公國）正穩步推進科技產業發展，兩國政府投入資金建設科技園區，透過提供專業電子代工（EMS）激勵措施和降低公用事業收費剪切機，促進了科技產業的發展。在南非豪登省，電信設備翻新企業蓬勃發展，利用模組化表面貼裝技術（SMT）生產線處理小批量、多件次的維修訂單。然而，撒哈拉以南非洲大部分市場基礎設施​​不足和熟練人員短缺，阻礙了先進設備的應用。

其他好處：

  • Excel格式的市場預測（ME）表
  • 3個月的分析師支持

目錄

第1章：引言

  • 市場分析與定義的前提條件
  • 分析範圍

第2章 分析方法

第3章執行摘要

第4章 市場狀況

  • 市場概覽
  • 市場促進因素
    • 物聯網和穿戴式裝置的普及推動了對高密度印刷電路板的需求。
    • 汽車ADAS電子設備的普及
    • 5G基礎設施和高頻基板的擴展
    • 智慧型手機中的系統級封裝（SiP）整合
    • MicroLED顯示器的製造要求
    • 新興市場中的OEM外包給EMS公司
  • 市場限制因素
    • 高速裝配線需要大量的初始資本投入。
    • 由於無鉛焊料的熱限制，導致良率降低。
    • 半導體供應鏈的波動導致設備運轉率下降。
    • 人工智慧檢測系統領域技術純熟勞工短缺
  • 價值鏈分析
  • 監理情勢
  • 技術展望
  • 波特五力分析
  • 宏觀經濟趨勢影響分析

第5章：預測市場規模與成長率

  • 按組件
    • 被動元件
      • 電阻器
      • 電容器
    • 主動元件
      • 電晶體
      • 積體電路
  • 依設備類型
    • 安裝裝置
      • 高速取放機
    • 焊接設備
      • 回流焊接爐
      • 波峰焊接系統
    • 檢測設備
      • 自動光學檢測（AOI）
      • 焊膏測試（SPI）
      • X光檢查
    • 網版印刷設備
  • 按組裝類型
    • 高品種、小批量生產（HMLV）
    • 大批量、多品種生產（HVHM）
  • 按最終用戶行業分類
    • 家用電子電器
    • 車
    • 工業電子
    • 航太/國防
    • 醫療保健
    • 通訊和IT基礎設施
    • 其他最終用戶
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
      • 墨西哥
    • 歐洲
      • 德國
      • 英國
      • 法國
      • 義大利
      • 西班牙
      • 其他歐洲國家
    • 亞太地區
      • 中國
      • 日本
      • 韓國
      • 印度
      • 其他亞太國家
    • 中東
      • 沙烏地阿拉伯
      • 阿拉伯聯合大公國
      • 其他中東國家
    • 非洲
      • 南非
      • 其他非洲國家

第6章 競爭情勢

  • 市場集中度
  • 策略趨勢
  • 市佔率分析
  • 公司簡介
    • ASMPT Limited
    • Fuji Corporation
    • Yamaha Motor Co., Ltd.（SMT Division）
    • Panasonic Holdings Corporation（Panasonic Smart Factory Solutions）
    • Hanwha Precision Machinery Co., Ltd.
    • Mycronic AB
    • Juki Corporation
    • Nordson Corporation
    • Koh Young Technology Inc.
    • Saki Corporation
    • Test Research, Inc.（TRI）
    • Viscom SE
    • Europlacer Holdings Ltd.
    • Shenzhen JT Automation Equipment Co., Ltd.
    • Rehm Thermal Systems GmbH
    • Heller Industries, Inc.
    • MIRTEC Co., Ltd.
    • Shenzhen NEODEN Technology Co., Ltd.
    • Shenzhen JAGUAR Automation Equipment Co., Ltd.
    • Hanwa Precision Machinery Co., Ltd.

第7章 市場機會與未來展望

簡介目錄
Product Code: 71613

According to Mordor Intelligence, the surface mount technology market size was valued at USD 6.61 billion in 2025 and estimated to grow from USD 7.11 billion in 2026 to reach USD 10.19 billion by 2031, at a CAGR of 7.49% during the forecast period (2026-2031).

Surface Mount Technology - Market - IMG1

This report is Segmented by Component (Passive Components [Resistors, Capacitors], and More), Equipment Type (Placement Equipment [High-Speed Pick-And-Place Machines], and More), Assembly Line Type (High-Mix/Low-Volume, and More), End-User Industry (Consumer Electronics, and More), and Geography (North America, South America, and More). The Market Forecasts are Provided in Terms of Value (USD).

Global Surface Mount Technology Market Trends and Insights

IoT and Wearables Fuel Ultra-Dense PCB Adoption

Device makers now pack more than 10,000 multilayer ceramic capacitors into a single smartwatch, tripling the count seen five years ago. To print conductive traces below 50 µm and microvias under 75 µm, assemblies rely on placement tools that consistently handle 01005 packages at +-25 µm accuracy. Compliance with FCC emissions limits and IEC safety requirements is pushing additional electromagnetic-interference shielding steps, elevating demand for precision solder-paste inspection and automated optical inspection systems.

Automotive ADAS Electronics Adoption Reshapes Reliability Needs

Electric-vehicle reference designs use upward of 10,000 MLCCs and more than 200 electronic control units each, lifting SMT volumes even as lifecycle qualification stretches beyond three years. ISO 26262 functional-safety mandates and -40 °C to 150 °C operating windows compel suppliers to certify processes under automotive PPAP and AEC-Q200 stress tests. Equipment makers that can validate long-term solder-joint reliability are winning multiyear supply agreements across Europe and Japan.

High Upfront Capex Constrains Smaller Firms

Next-generation placement platforms cost upward of USD 3 million per line when bundled with in-line SPI, AOI, and x-ray testers. Although predictive-maintenance analytics lower total cost of ownership, many small and medium EMS providers struggle to justify payback within three years. Equipment rental and outcome-based service contracts are emerging but remain uncommon outside Tier-1 OEMs.

Other drivers and restraints analyzed in the detailed report include:

  1. 5G Infrastructure and High-Frequency Boards
  2. System-in-Package Integration in Smartphones
  3. Lead-Free Solder Thermal Constraints Lower Yield

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Active Components accounted for 65.74% of the Surface Mount Technology market share in 2025 as MCU, ASIC, and power-management demand accelerated in AI servers and electric vehicles. The segment is forecast to grow at an 8.62% CAGR to 2031 on the back of increased adoption of heterogenous SoC designs and high-voltage transistors. Passive Components still benefit from rising unit counts in 5G handsets and automotive traction inverters, but ceramic and tantalum material shortages continue to test supply-chain resiliency.

Customer expectations are evolving from component cost control to board-level integration density and long-tail reliability. OEMs request sub-10 ppm failure rates and 15-year field lifetimes, driving closer collaboration between substrate vendors, component makers, and placement-equipment suppliers. Suppliers that deliver active-passive co-design libraries and full Design-for-Assembly review accelerate new-product ramps, securing supplier-of-choice status for advanced wearables and industrial IoT gateways.

Placement Equipment still commands 42.62% of the Surface Mount Technology market size in 2025, but Inspection Equipment is rising fastest with a 8.83% CAGR. High-speed pick-and-place machines now hit 100 k cph with +-10 µm accuracy, aided by machine-learning vision systems that auto-tune head pressure. Soldering Equipment faces process-window squeezes as lead-free alloys demand tighter thermal gradients, while Screen-Printing platforms adopt closed-loop SPI feedback to boost first-pass yield.

Investment momentum favors AOI and x-ray systems that harness deep learning to cut false-call rates by 90 % and raise inspection speed four-fold. ViTrox and Koh Young incorporate IPC-CFX connectivity for real-time analytics that flag yield-eroding trends within minutes. Equipment finance packages bundling analytics subscriptions help offset sticker shock, enticing Tier-2 EMS firms in Eastern Europe and Southeast Asia to upgrade lines.

Complete Report Scope:

  • By Component
    • Passive Components
      • Resistors
      • Capacitors
    • Active Components
      • Transistors
      • Integrated Circuits
  • By Equipment Type
    • Placement Equipment
      • High-speed Pick-and-Place Machines
    • Soldering Equipment
      • Reflow Ovens
      • Wave Solder Systems
    • Inspection Equipment
      • Automated Optical Inspection (AOI)
      • Solder Paste Inspection (SPI)
      • X-ray Inspection
    • Screen Printing Equipment
  • By Assembly Line Type
    • High-Mix / Low-Volume (HMLV)
    • High-Volume / High-Mix (HVHM)
  • By End-user Industry
    • Consumer Electronics
    • Automotive
    • Industrial Electronics
    • Aerospace and Defense
    • Healthcare
    • Telecom and IT Infrastructure
    • Other End-users
  • By Geography
    • North America
      • United States
      • Canada
      • Mexico
    • Europe
      • Germany
      • United Kingdom
      • France
      • Italy
      • Spain
      • Rest of Europe
    • Asia-Pacific
      • China
      • Japan
      • South Korea
      • India
      • Rest of Asia-Pacific
    • Middle East
      • Saudi Arabia
      • United Arab Emirates
      • Rest of Middle East
    • Africa
      • South Africa
      • Rest of Africa

Geography Analysis

Asia-Pacific dominated with 48.05% Surface Mount Technology market share in 2025 and is forecast to post an 8.12% CAGR through 2031. China, Taiwan, and South Korea together are slated to invest more than USD 84 billion in new 300 mm fabs by 2027, securing upstream substrate and component capacity. Japan's Kumamoto cluster, anchored by TSMC JASM's USD 20 billion expansion, adds over 100,000 12-inch wafers per month while creating 3,400 high-tech roles.

North America trails but is accelerating under the CHIPS Act, with announced projects doubling regional capacity investment from USD 12 billion in 2024 to USD 24.7 billion by 2027. Advanced packaging pilots in Arizona and New York target sub-10 µm placement for AI accelerators, reducing dependence on trans-Pacific shipping lanes. Regulatory emphasis on cyber-secure production flows nudges factories toward CMMC and IPC-1791 trusted builder accreditation.

Europe focuses on automotive power semiconductors and wide-band-gap devices, with Infineon and STMicroelectronics driving capital expenditure to support 800 V EV inverters. The region's RoHS expansion and incoming Ecodesign rules favor repairable PCBs, stimulating demand for selective soldering and rework platforms. Workforce upskilling programs under Europe's Pact for Skills align with IPC's certified interconnect designer curriculum, aiming to close a 146,000-worker gap by 2029.

Middle East and Africa makes incremental gains as Saudi Arabia and the UAE funnel sovereign-fund capital into tech parks that bundle EMS incentives with reduced utility tariffs. South Africa's Gauteng hub attracts telecom-equipment refurbishers that rely on modular SMT lines to process short-run, high-mix repair orders. Still, infrastructure gaps and limited specialist labor temper adoption of cutting-edge equipment in most sub-Saharan markets.

  1. ASMPT Limited
  2. Fuji Corporation
  3. Yamaha Motor Co., Ltd. (SMT Division)
  4. Panasonic Holdings Corporation (Panasonic Smart Factory Solutions)
  5. Hanwha Precision Machinery Co., Ltd.
  6. Mycronic AB
  7. Juki Corporation
  8. Nordson Corporation
  9. Koh Young Technology Inc.
  10. Saki Corporation
  11. Test Research, Inc. (TRI)
  12. Viscom SE
  13. Europlacer Holdings Ltd.
  14. Shenzhen JT Automation Equipment Co., Ltd.
  15. Rehm Thermal Systems GmbH
  16. Heller Industries, Inc.
  17. MIRTEC Co., Ltd.
  18. Shenzhen NEODEN Technology Co., Ltd.
  19. Shenzhen JAGUAR Automation Equipment Co., Ltd.
  20. Hanwa Precision Machinery Co., Ltd.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 Introduction

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 Research Methodology

3 Executive Summary

4 Market Landscape

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Proliferation of IoT and wearables driving high-density PCB demand
    • 4.2.2 Automotive ADAS electronics adoption
    • 4.2.3 Expansion of 5G infrastructure and high-frequency boards
    • 4.2.4 System-in-Package (SiP) integration in smartphones
    • 4.2.5 MicroLED display manufacturing requirements
    • 4.2.6 OEM outsourcing to EMS firms in emerging economies
  • 4.3 Market Restraints
    • 4.3.1 High upfront capex for high-speed placement lines
    • 4.3.2 Lead-free solder thermal constraints lowering yield
    • 4.3.3 Semiconductor supply-chain volatility causing under-utilisation
    • 4.3.4 Skilled labour shortage for AI-driven inspection systems
  • 4.4 Value Chain Analysis
  • 4.5 Regulatory Landscape
  • 4.6 Technological Outlook
  • 4.7 Porter's Five Forces Analysis
    • 4.7.1 Bargaining Power of Suppliers
    • 4.7.2 Bargaining Power of Buyers
    • 4.7.3 Threat of New Entrants
    • 4.7.4 Threat of Substitutes
    • 4.7.5 Intensity of Competitive Rivalry
  • 4.8 Macroeconomic Trends Impact Analysis

5 Market Size and Growth Forecasts (Value)

  • 5.1 By Component
    • 5.1.1 Passive Components
      • 5.1.1.1 Resistors
      • 5.1.1.2 Capacitors
    • 5.1.2 Active Components
      • 5.1.2.1 Transistors
      • 5.1.2.2 Integrated Circuits
  • 5.2 By Equipment Type
    • 5.2.1 Placement Equipment
      • 5.2.1.1 High-speed Pick-and-Place Machines
    • 5.2.2 Soldering Equipment
      • 5.2.2.1 Reflow Ovens
      • 5.2.2.2 Wave Solder Systems
    • 5.2.3 Inspection Equipment
      • 5.2.3.1 Automated Optical Inspection (AOI)
      • 5.2.3.2 Solder Paste Inspection (SPI)
      • 5.2.3.3 X-ray Inspection
    • 5.2.4 Screen Printing Equipment
  • 5.3 By Assembly Line Type
    • 5.3.1 High-Mix / Low-Volume (HMLV)
    • 5.3.2 High-Volume / High-Mix (HVHM)
  • 5.4 By End-user Industry
    • 5.4.1 Consumer Electronics
    • 5.4.2 Automotive
    • 5.4.3 Industrial Electronics
    • 5.4.4 Aerospace and Defense
    • 5.4.5 Healthcare
    • 5.4.6 Telecom and IT Infrastructure
    • 5.4.7 Other End-users
  • 5.5 By Geography
    • 5.5.1 North America
      • 5.5.1.1 United States
      • 5.5.1.2 Canada
      • 5.5.1.3 Mexico
    • 5.5.2 Europe
      • 5.5.2.1 Germany
      • 5.5.2.2 United Kingdom
      • 5.5.2.3 France
      • 5.5.2.4 Italy
      • 5.5.2.5 Spain
      • 5.5.2.6 Rest of Europe
    • 5.5.3 Asia-Pacific
      • 5.5.3.1 China
      • 5.5.3.2 Japan
      • 5.5.3.3 South Korea
      • 5.5.3.4 India
      • 5.5.3.5 Rest of Asia-Pacific
    • 5.5.4 Middle East
      • 5.5.4.1 Saudi Arabia
      • 5.5.4.2 United Arab Emirates
      • 5.5.4.3 Rest of Middle East
    • 5.5.5 Africa
      • 5.5.5.1 South Africa
      • 5.5.5.2 Rest of Africa

6 Competitive Landscape

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
    • 6.4.1 ASMPT Limited
    • 6.4.2 Fuji Corporation
    • 6.4.3 Yamaha Motor Co., Ltd. (SMT Division)
    • 6.4.4 Panasonic Holdings Corporation (Panasonic Smart Factory Solutions)
    • 6.4.5 Hanwha Precision Machinery Co., Ltd.
    • 6.4.6 Mycronic AB
    • 6.4.7 Juki Corporation
    • 6.4.8 Nordson Corporation
    • 6.4.9 Koh Young Technology Inc.
    • 6.4.10 Saki Corporation
    • 6.4.11 Test Research, Inc. (TRI)
    • 6.4.12 Viscom SE
    • 6.4.13 Europlacer Holdings Ltd.
    • 6.4.14 Shenzhen JT Automation Equipment Co., Ltd.
    • 6.4.15 Rehm Thermal Systems GmbH
    • 6.4.16 Heller Industries, Inc.
    • 6.4.17 MIRTEC Co., Ltd.
    • 6.4.18 Shenzhen NEODEN Technology Co., Ltd.
    • 6.4.19 Shenzhen JAGUAR Automation Equipment Co., Ltd.
    • 6.4.20 Hanwa Precision Machinery Co., Ltd.

7 Market Opportunities and Future Outlook

  • 7.1 White-space and Unmet-Need Assessment