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市場調查報告書
商品編碼
2122870
行動人工智慧:市場佔有率分析、產業趨勢與統計、成長預測(2026-2031)Mobile Artificial Intelligence - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026 - 2031) |
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根據 Mordor Intelligence 預測,行動人工智慧市場規模將從 2025 年的 248.5 億美元和 2026 年的 304.8 億美元成長到 2031 年的 831.5 億美元,2026 年至 2031 年的複合年成長率為 22.23%。

本報告按應用領域(智慧型手機、相機等)、組件(硬體、軟體、服務)、技術(CPU、GPU、NPU/AI加速器、DSP)、處理類型(設備端/邊緣、雲端、混合)、終端用戶產業(家用電子電器、汽車及旅遊等)和地區進行細分。市場預測以美元(USD)為單位。
到2025年,廠商將出貨超過3.2億部人工智慧智慧型手機,消費者如今評斷高階設備的標準不再是CPU時脈頻率,而是NPU TOPS(神經網路處理單元)的效能。驍龍8 Elite採用3nm工藝,功耗僅8瓦,NPU TOPS達45,比上一代產品能源效率提升60%。蘋果A18 Pro搭載16核神經網路引擎,NPU TOPS達到35,能夠在設備端處理30億參數的模型。聯發科天璣9400將射線追蹤和擴散建模硬體整合到單一SoC中,以支援混合實境(MR)任務。產品週期的縮短加劇了晶圓代工廠和封裝設備的供應緊張,也鞏固了那些在2023-2024年市場繁榮時期簽訂長期產能合約的公司的地位。
三星Galaxy S25整合了Gemini Nano晶片,無需雲端連接即可實現通話轉錄,從而消除了50-150毫秒的往返延遲。 GooglePixel 9引入了Magic Editor,可在本地執行基於擴散模型的影像修復,耗時不到3秒。小米15 Pro利用HyperOS 2.0整合了離線多應用工作流程。如今,設備之間的競爭不再取決於像素數量,而是取決於推理延遲和功耗,這使得軟體生態系統重新成為永續競爭優勢的關鍵。
驍龍8 Elite晶片的OEM售價約為160美元,比驍龍7 Gen 3貴了約50%,這使得中階設備的零售價增加了80到120美元。蘋果A18 Pro和A16之間也存在類似的價格差距,這在通貨膨脹嚴重的地區擠壓了利潤空間。由於需求超過供給能力,CoWoS和I-Cube封裝又使每顆晶片的成本增加了20到30美元。由於初始價格高昂,預計到2027年,尖端人工智慧技術仍將僅限於旗艦機型,這將減緩其普及速度。
預計到2025年,智慧型手機將佔行動人工智慧市場規模的41.23%,凸顯其作為半導體供應商銷售驅動力的重要地位。然而,隨著成熟市場趨於飽和,差異化重點轉向軟體生態系統(這將延長用戶的升級週期),智慧型手機的成長速度正在放緩。相較之下,受物流業人手不足推動,工業機器人領域預計將以23.81%的複合年成長率成長,這主要得益於對移動人工智慧視覺和路徑規劃模組的投資增加。
隨著智慧型手機銷售與機器人普及率之間的差距日益擴大,產品組合多元化趨勢也愈發明顯。晶片製造商可以利用智慧型手機的規模優勢來攤銷研發成本,同時瞄準利潤率更高、功耗更低的機器人市場。高通的機器人專用RB5晶片和英偉達的15瓦Jetson Orin Nano晶片便是供應商將移動核心IP重新應用於自主機器的典型案例。
到2025年,硬體將佔據62.13%的市場佔有率,但軟體授權的複合年成長率(CAGR)高達22.41%,這主要得益於SDK使用費和模型市場在半導體以外領域持續創造收入的驅動。高通的「AI Hub」透過以裝置收取使用費的方式,將100多個最佳化模型貨幣化;而蘋果的「Core ML」則將開發者整合到App Store分發生態系統中。
隨著製程節點和封裝成本的上漲擠壓硬體利潤空間,廠商正尋求從開發者生態系統中獲得永續的收入來源。這一趨勢正在改變競爭格局。同時掌控晶片和作業系統的公司可以獲得雙倍價值,而純粹的晶片設計公司則面臨著產品同質化的風險,除非它們與平台所有者建立合作關係。
預計到2025年,亞太地區將佔據行動人工智慧市場37.16%的佔有率,年複合成長率達24.12%,這主要得益於中國OEM廠商自主設計晶片組以規避出口限制。超過500億美元的政府資金正支持中芯國際和華宏半導體的7奈米和5奈米生產線,從而降低它們對台積電的依賴。
日本電信公司正投資5G邊緣人工智慧節點,用於自動駕駛試點計畫;韓國垂直整合型企業三星則將封裝技術的創新直接應用於其Galaxy設備。印度的生產關聯激勵計畫(PLI)吸引了富士康和和碩等公司,實現了人工智慧智慧型手機的在地化組裝,並將印度打造成為中階設備的低成本生產中心。
北美仍然是堅固耐用型企業手持終端機的盈利市場,但銷量落後於亞太地區。在歐洲,嚴格的隱私法推動了設備端處理的發展,但由於審計尚未完成,新功能的部署速度緩慢。中東和非洲地區在智慧城市預算的推動下呈現選擇性成長,而南美地區的宏觀經濟波動則抑制了設備升級。
According to Mordor Intelligence, the mobile artificial intelligence market size is projected to expand from USD 24.85 billion in 2025 and USD 30.48 billion in 2026 to USD 83.15 billion by 2031, registering a CAGR of 22.23% between 2026 to 2031.

This report is Segmented by Application (Smartphone, Camera, and More), Component (Hardware, Software, and Services), Technology (CPU, GPU, NPU/AI Accelerator, and DSP), Processing Type (On-Device/Edge, Cloud-Based, and Hybrid), End-User Industry (Consumer Electronics, Automotive and Mobility, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).
Vendors shipped more than 320 million AI-ready phones in 2025, and buyers now judge premium devices by NPU TOPS rather than CPU clock speeds. Snapdragon 8 Elite delivers 45 TOPS at 8 watts on a 3 nm node, a 60% efficiency jump over its predecessor. Apple's A18 Pro hits 35 TOPS with a 16-core neural engine, letting a 3-billion-parameter model stay local. MediaTek's Dimensity 9400 folds ray-tracing and diffusion-model hardware into a single SoC for mixed-reality tasks. Faster product cycles are tightening foundry and packaging supply, solidifying the position of firms that signed long-term capacity contracts during the 2023-2024 boom.
Samsung's Galaxy S25 integrates Gemini Nano for call transcription without the cloud, eliminating 50-150 ms round-trip latency. Google's Pixel 9 introduced Magic Editor, performing diffusion-model inpainting locally in under three seconds. Xiaomi's 15 Pro leverages HyperOS 2.0 to orchestrate multi-app workflows offline. Devices now compete on inference latency and energy draw instead of megapixel count, repositioning software ecosystems as enduring competitive moats.
Snapdragon 8 Elite sells to OEMs for about USD 160, roughly 50% above a Snapdragon 7 Gen 3, adding USD 80-120 to retail prices in mid-tier handsets. Apple faces a similar gap between A18 Pro and A16, compressing margins in inflation-sensitive regions. CoWoS and I-Cube packaging tack on another USD 20-30 per die as demand outruns capacity. High entry prices confine cutting-edge AI to flagships until 2027, slowing mass adoption.
Other drivers and restraints analyzed in the detailed report include:
For complete list of drivers and restraints, kindly check the Table Of Contents.
Smartphones contributed 41.23% of the mobile artificial intelligence market size in 2025, confirming their role as the volume engine for silicon vendors. Growth is tapering, however, because mature markets are saturated and differentiation is shifting to software ecosystems that lock users in for longer upgrade cycles. Industrial robotics, by contrast, is forecast to climb at a 23.81% CAGR as labor shortages in logistics spur investment in mobile AI vision and path-planning modules.
The widening gap between smartphone volume and robotics velocity drives portfolio diversification. Chipmakers can leverage smartphone scale to amortize R&D while targeting high-margin robots that accept higher power envelopes. Qualcomm's robotics-ready RB5 and NVIDIA's 15-watt Jetson Orin Nano illustrate how suppliers repurpose mobile core IP for autonomous machines.
Hardware dominated with a 62.13% share in 2025, but software licensing is growing at a 22.41% CAGR, driven by SDK fees and model marketplaces that generate recurring revenue beyond silicon. Qualcomm's AI Hub monetizes over one hundred tuned models through per-device fees, and Apple's Core ML locks creators into the App Store's distribution economics.
As hardware margins compress under node and packaging costs, vendors seek annuity streams from developer ecosystems. This dynamic reshapes competition: firms that control both silicon and the OS can capture value twice, while pure-play chip designers must ally with platform owners or risk commoditization.
Asia-Pacific captured 37.16% of the mobile artificial intelligence market share in 2025 and will rise at a 24.12% CAGR as Chinese OEMs design in-house chipsets to sidestep export controls. State-backed funds exceeding USD 50 billion support 7 nm and 5 nm production lines at SMIC and Hua Hong, dialing down reliance on TSMC.
Japan's carriers are investing in 5G edge AI nodes for autonomous mobility pilots, while South Korea's vertically integrated Samsung funnels packaging breakthroughs directly into Galaxy devices. India's PLI subsidies attract Foxconn and Pegatron to localize AI-phone assembly, positioning the country as the world's low-cost production hub for mid-tier devices.
North America remains lucrative for ruggedized enterprise handhelds, but unit volumes trail Asia-Pacific. Europe's strict privacy laws drive on-device processing, yet slow new feature rollouts pending audits. The Middle East and Africa grow selectively via smart city budgets, while macroeconomic volatility suppresses South American upgrades.