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市場調查報告書
商品編碼
2122631

結構電子學：市場佔有率分析、產業趨勢與統計、成長預測（2026-2031）

Structural Electronics - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026 - 2031)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

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簡介目錄

據 Mordor Intelligence 稱，2025 年結構電子市場價值為 246.3 億美元，預計從 2026 年的 283.1 億美元成長到 2031 年的 567.8 億美元。

預測期（2026-2031 年）的複合年成長率預計為 14.94%。

結構電子市場-IMG1

本報告按嵌入式系統（太陽能、電池/超級電容等）、製造技術（套模電子、積層製造/3D列印等）、材料（導電油墨、基板、封裝和黏合劑）、應用領域（汽車、航太和國防等）以及地區進行細分。市場預測以美元計價。

全球結構電子市場趨勢與洞察

輕量化汽車的趨勢以及車載電子設備（尤其是電動車）的快速成長，正在推動市場向前發展。

歐洲汽車製造商正面臨日益嚴格的車輛排放氣體法規，這些法規優先考慮配備整合電力電子設備的輕量化車輛。 Sinus AB 的碳纖維結構電池在減輕 50% 重量的同時，將續航里程提高了 70%，這表明單一複合材料部件既可以儲存能量，又能同時承受機械負荷。該設計還透過以半固體化學品取代易燃的液態電解質，降低了熱失控的風險。大眾汽車等汽車製造商正在將這些電池與安森美半導體的碳化矽逆變器結合使用，以減少零件數量並提高動力傳動系統的效率。圍繞鋼和鋁的超高速鑄造技術的爭論進一步凸顯了將電路嵌入任何結構材料的價值。因此，結構電子元件在底盤、車門、儀錶面板和其他領域的應用正在迅速擴展。

3D套模電子技術在亞太地區消費性電子設備的普及。

中國、韓國和越南的消費性電子產品契約製造（OEM）正在推廣3D套模電子技術，該技術將導電油墨、薄膜和樹脂整合於單一模塑製程。 TactoTek的射出成型成型結構電子（IMSE）製程已被證實，與傳統組裝方法相比，可減少60%的溫室氣體排放和70%的塑膠用量。科思創的「Makrofol」聚碳酸酯薄膜可在超薄外殼內實現觸控照明和觸覺回饋。香港大學等區域性研究機構的有機電化學電晶體研究正在推動下一代穿戴式裝置和感測器運算技術的發展。東南亞PCB產業產值已超過20億美元，其提供的多層背板可與這些結構外殼搭配使用。模具開發週期的縮短正在推動個人電子產品結構電子市場的整體，加速智慧型手機、穿戴式耳機和智慧家庭中心等產品的上市。

亞洲以外地區導電奈米材料供不應求

奈米碳管（CNT）油墨和漿料主要集中在少數幾家中國工廠，這些工廠的產量佔全球總產量的40%以上。颶風導致北卡羅來納州高純度石英供應中斷，暴露了半導體基板關鍵原料供應鏈中類似的脆弱性。美國和歐洲製造商近期擴大CNT產能的計畫仍無法滿足不斷成長的需求預期。因此，汽車和航太產業的買家面臨著更長的前置作業時間時間和飆升的價格，這將限制結構電子市場的擴張，直到採購管道多元化成為可能。

細分市場分析

到2025年，感測器和天線領域將佔銷售額的34.25%，這主要得益於高級駕駛輔助系統（ADAS）和飛機安全監控的法規的訂定。光纖陣列現已整合到飛機複合材料面板中，雷達和電容式觸控面板也整合到乘用車儀表板的單一模製嵌件中。預計到2031年，太陽能發電將以16.88%的複合年成長率實現最高成長，這主要得益於可彎曲以適應建築內部結構的軟性鈣鈦礦組件和穿戴式標籤的普及。將太陽能組件整合到結構中無需單獨的機殼即可發電，從而降低了組裝成本，並開闢了資產追蹤和室內農業等新的應用領域。

結構電池和微型超級電容已超越原型階段，例如，MXene墨水裝置的體積電容已達到611 F cm⁻³。顯示器正緊跟汽車造型潮流，OLED和微型LED薄膜實現了連續曲面顯示。佈線材料面臨銅價波動的挑戰，但銀奈米線和MXene等替代材料的出現正在克服這個難題，即使在可彎曲形狀下也能保持導電性。這些變化共同推動了結構電子市場的擴張，設計師將感測、能量和顯示功能整合到單一層壓板中。

套模電子技術將薄膜、油墨和樹脂熔合在一起，以生產可直接安裝的輕量化組件，預計2025年將佔銷售額的50.72%。汽車門飾板現在整合了無需單獨PCB的背光控制功能，從而減輕了線束的重量。消費性穿戴裝置也採用類似製程製造符合IP68防護等級的機殼。在DARPA的AMME計畫支援下，積層製造（AM）的複合年成長率（CAGR）高達17.46%，該技術可將複雜的微電路直接3D列印到3D基板上。 MXene油墨氣溶膠噴射列印技術正在實現高能量密度電容器的大規模生產，而多光子微影技術則引領可列印有機生物電子元件的發展。

對於消費性電子麵板中使用的大面積加熱器和天線而言，網版印刷和柔版印刷仍然具有成本效益。噴墨平台可在採用模具進行大規模生產前，製作出結構複雜的原型。這項技術的廣泛應用拓寬了市場准入管道，並加速了結構電子產品在大規模生產和客製化製造領域的市場推廣。

區域分析

亞太地區擁有蓬勃發展的半導體、印刷基板(PCB) 和模塑生態系統，預計到 2025 年將佔全球銷售額的 37.35%。中國正積極推動垂直整合，而泰國和馬來西亞則在擴大產能以支持全球供應。日本供應全球一半以上的積層陶瓷電容，並透過與村田製作所和 QuantumScape 等公司的合作，向固態電池陶瓷領域多元化發展。

歐洲結構電子市場正受惠於汽車電氣化進程中的一個重要里程碑，以及《晶片法案》提供的 800 億歐元（940.6 億美元）資金，該法案旨在到 2030 年佔據全球半導體市場佔有率的 20%。德國汽車製造商正在利用積體電路改進「千兆廣播」技術，而法國建設公司正在維修的建築立面上試行使用太陽能感測器皮膚。

中東和非洲地區正以15.12%的複合年成長率保持領先地位，這主要得益於國防能力的現代化和智慧城市的建設。位於阿拉伯聯合大公國的EDGE集團正在推動人工智慧衛星通訊鏈路的研究，該鏈路需要共形天線和輕型電源。地方政府正透過抵銷貿易計畫吸引供應商，以支持推出國內組裝，但該地區在奈米材料方面仍嚴重依賴進口，這種缺口可能會在2020年代後半期減緩成長。

在北美，航太計畫和新《晶片技術創新法案》（CHIPS Act）對先進封裝代工廠的補貼，正推動成長動能。波音公司收購Spirit公司旨在更緊密地整合配備感測器的機身部件。聯邦法規目前優先考慮國內採購，並鼓勵參與企業將其材料、印刷和成型功能集中在同一地點。

其他好處：

  • Excel格式的市場預測（ME）表
  • 3個月的分析師支持

目錄

第1章：引言

  • 研究假設和市場定義
  • 調查範圍

第2章：調查方法

第3章執行摘要

第4章 市場狀況

  • 市場概覽
  • 市場促進因素
    • 在歐洲，輕型車輛和車載電子產品，特別是電動車，正在迅速成長。
    • 3D套模電子技術在亞太地區消費性電子設備的普及。
    • 美國聯邦航空管理局（FAA）推動複合材料飛機採用整合感測器蒙皮（北美）
    • 智慧建築中用於無電池物聯網節點的印刷式太陽能發電
    • 邊緣人工智慧驅動的穿戴式設備正在推動可拉伸結構電路在醫療領域的應用。
    • 以色列和美國對共形天線和智慧表面的國防需求
  • 市場限制因素
    • 航太領域結構電子產品的複雜認證流程。
    • 積層製造生產線中由於週期時間限制而導致的吞吐量限制
    • 高溫聚合物基板分層風險 - 汽車產業
    • 亞洲以外地區導電奈米材料供不應求
  • 產業生態系分析
  • 技術展望
  • 波特五力分析

第5章 市場規模與成長預測

  • 按嵌入式類型
    • 太陽能
    • 電池/超級電容
    • 感測器和天線
    • 顯示器（OLED/MicroLED）
    • 導體和互連
  • 透過製造技術
    • 套模電子裝置（IME）
    • 積層製造/3D列印
    • 氣溶膠噴射和噴墨列印
    • 絲網/柔版印刷
  • 材料
    • 導電油墨（銀、銅、碳、奈米材料）
    • 基板（聚合物、玻璃、複合材料、熱固性樹脂）
    • 封裝和黏合劑
  • 透過使用
    • 汽車－內裝和外觀
    • 航太與國防 - 飛機、智慧蒙皮
    • 家用電子電器－白色家電和攜帶式設備
    • 醫療保健/醫療設備
    • 工業和建築自動化
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
      • 墨西哥
    • 歐洲
      • 德國
      • 英國
      • 法國
      • 義大利
      • 西班牙
      • 北歐國家（丹麥、瑞典、挪威、芬蘭）
      • 其他歐洲國家
    • 亞太地區
      • 中國
      • 日本
      • 韓國
      • 印度
      • 東南亞
      • 澳洲
      • 其他亞太國家
    • 南美洲
      • 巴西
      • 阿根廷
      • 其他南美國家
    • 中東
      • 波灣合作理事會（GCC）成員國
      • 土耳其
      • 其他中東國家
    • 非洲
      • 南非
      • 奈及利亞
      • 其他非洲國家

第6章 競爭情勢

  • 市場集中度
  • 策略趨勢
  • 市佔率分析
  • 公司簡介
    • TactoTek Oy
    • Molex LLC
    • Panasonic Holdings Corp.
    • Canatu Oy
    • Neotech AMT GmbH
    • Pulse Electronics（Yageo）
    • Optomec Inc.
    • Odyssian Technology LLC
    • Aconity3D GmbH
    • T-ink Inc.
    • Boeing Co.
    • Henkel AG and Co. KGaA
    • DuPont de Nemours Inc.
    • 3D Systems Corp.
    • Teijin Ltd.
    • PPG Industries Inc.
    • Flex Ltd.
    • General Electric Co.
    • Samsung Electro-Mechanics
    • Continental AG

第7章 市場機會與展望

  • 未開發市場和未滿足需求的評估
簡介目錄
Product Code: 63624

According to Mordor Intelligence, the structural electronics market size was valued at USD 24.63 billion in 2025 and estimated to grow from USD 28.31 billion in 2026 to reach USD 56.78 billion by 2031, at a CAGR of 14.94% during the forecast period (2026-2031).

Structural Electronics - Market - IMG1

This report is Segmented by Integrant (Photovoltaics, Batteries/Super-capacitors, and More), Manufacturing Technology (In-Mold Electronics, Additive Manufacturing/3-D Printing, and More), Material (Conductive Inks, Substrates, Encapsulation and Adhesives), Application (Automotive, Aerospace and Defense, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global Structural Electronics Market Trends and Insights

Automotive light weighting and EV-centric cabin electronics surge

European automakers face firm fleet-emission rules that prioritize lighter vehicles equipped with integrated power electronics. Sinonus AB's carbon-fiber structural battery shows a 70% range boost coupled with 50% weight reduction, illustrating how a single composite part can both store energy and carry mechanical loads. The design also mitigates thermal-runaway concerns by replacing flammable liquid electrolytes with semi-solid chemistries. Automakers such as Volkswagen link these batteries with silicon-carbide inverters from onsemi to shrink component count and raise drivetrain efficiency. The debate around steel versus aluminum gigacasting further underscores the value of embedding circuitry into any structural material. The result is a rapid uptick in structural electronics market adoption across chassis, doors, and instrument panels.

Mass adoption of 3-D in-mold electronics in Asia-Pacific consumer devices

Consumer-device contract manufacturers in China, South Korea, and Vietnam are standardizing 3-D in-mold electronics that combine conductive inks, films, and resins in a single molding step. TactoTek's injection-molded structural electronics (IMSE) process has verified a 60% drop in greenhouse-gas emissions and 70% less plastic usage versus traditional assembly. Covestro's Makrofol polycarbonate films enable touch lighting and haptic feedback inside ultrathin shells. Regional research, such as organic electrochemical transistors from the University of Hong Kong, drives the next wave of wearable, on-sensor computing. Southeast Asia's PCB sector, already above USD 2 billion in output, supplies multilayer backplanes that mate with these structural housings. Accelerated tooling cycles support product launches in smartphones, hearables, and smart-home hubs, lifting the structural electronics market across personal electronics.

Shortage of conductive nanomaterial supply outside Asia

Carbon-nanotube inks and pastes are concentrated in a handful of Chinese plants that together command over 40% of global output. Hurricanes that disrupted high-purity quartz in North Carolina exposed parallel weaknesses in raw-material chains essential for semiconductor substrates. Recent CNT scale-up announcements from U.S. and European producers remain short of demand growth projections. Automotive and aerospace buyers consequently face longer lead times and price spikes, constraining structural electronics market expansion until diversified sourcing becomes available.

Other drivers and restraints analyzed in the detailed report include:

  1. FAA push for integrated sensor skins in composite airframes
  2. Printed photovoltaics for battery-less IoT nodes in smart buildings
  3. Complex qualification cycles for structural electronics in aerospace

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

The sensor and antenna category contributed 34.25% revenue in 2025, buoyed by mandates for advanced driver-assistance systems and aircraft safety monitoring. Flight composite panels now embed fiber-optic arrays, whereas passenger-vehicle dashboards integrate radar and capacitive touch in one molded insert. Photovoltaics post the strongest 16.88% CAGR through 2031, driven by flexible perovskite modules that curve around building interiors and wearable tags. Structural integration allows power generation without separate housing, shrinking assembly cost, and opening new applications in asset tracking and indoor agriculture.

Structural batteries and micro-super-capacitors move beyond prototypes, illustrated by MXene ink devices delivering 611 F cm-3 volumetric capacitance. Displays follow automotive styling trends toward continuous curved surfaces enabled by OLED and micro-LED films. Interconnect materials confront copper volatility yet gain from silver-nanowire and MXene alternatives that sustain conductivity in bendable formats. Together, these shifts expand the structural electronics market as designers combine sensing, energy, and display functions within a single laminate.

In-mold electronics captured 50.72% revenue in 2025 by fusing films, inks, and resin into lightweight parts that ship ready-to-install. Automotive door trims now host back-lit controls without separate PCBs, cutting wire harness weight. Consumer wearables adopt the same process for IP68-rated casings. Additive manufacturing records the highest 17.46% CAGR, supported by DARPA's AMME program that 3-prints complex micro-circuits directly onto three-dimensional substrates. Aerosol-jet printing of MXene inks scales energy-dense capacitors, while multiphoton lithography pioneers printable organic bioelectronics.

Screen and flexographic presses remain cost-effective for large-area heaters and antennas on appliance panels. Inkjet platforms supply fine-feature prototypes before tooling commits to mass molding. This technology spreads, widening entry options, accelerating structural electronics market adoption in both high-volume and bespoke production runs.

Complete Report Scope:

  • By Integrant
    • Photovoltaics
    • Batteries/Super-capacitors
    • Sensors and Antennas
    • Displays (OLED/Micro-LED)
    • Conductors and Interconnects
  • By Manufacturing Technology
    • In-Mold Electronics (IME)
    • Additive Manufacturing/3-D Printing
    • Aerosol Jet and Inkjet Printing
    • Screen/Flexographic Printing
  • By Material
    • Conductive Inks (Silver, Copper, Carbon, Nanomaterial)
    • Substrates (Polymer, Glass, Composite, Thermoset)
    • Encapsulation and Adhesives
  • By Application
    • Automotive - Interior and Exterior
    • Aerospace and Defense - Airframe, Smart Skins
    • Consumer Electronics - Whitegoods and Handhelds
    • Healthcare/Medical Devices
    • Industrial and Building Automation
  • By Geography
    • North America
      • United States
      • Canada
      • Mexico
    • Europe
      • Germany
      • United Kingdom
      • France
      • Italy
      • Spain
      • Nordics (Denmark, Sweden, Norway, Finland)
      • Rest of Europe
    • Asia-Pacific
      • China
      • Japan
      • South Korea
      • India
      • Southeast Asia
      • Australia
      • Rest of Asia-Pacific
    • South America
      • Brazil
      • Argentina
      • Rest of South America
    • Middle East
      • Gulf Cooperation Council Countries
      • Turkey
      • Rest of Middle East
    • Africa
      • South Africa
      • Nigeria
      • Rest of Africa

Geography Analysis

Asia-Pacific delivered 37.35% of 2025 revenue by virtue of high-volume semiconductor, PCB, and molding ecosystems. China drives vertical integration, while Thailand and Malaysia add capacity that feeds global supply. Japan supplies over half the world's multilayer ceramic capacitors, and partnerships such as Murata with QuantumScape diversify into solid-state battery ceramics.

Europe's structural electronics market gains from automotive electrification milestones and EUR 80 billion (USD 94.06 billion) in Chips Act funds, targeting a 20% global semiconductor share by 2030. German OEMs refine giga casting with embedded circuits, whereas French construction firms pilot PV-powered sensor skins on retrofit facades.

The Middle East and Africa record the fastest 15.12% CAGR, propelled by defense modernization and smart-city rollouts. UAE's EDGE Group explores AI-enabled satellite links that demand conformal antennas and lightweight power sources. Local governments entice suppliers with offset programs that seed domestic assembly lines, yet the region still imports most nanomaterials, a gap that could temper late-decade growth.

North America keeps momentum through aerospace projects and fresh CHIPS Act subsidies for advanced packaging foundries. Boeing's acquisition of Spirit targets tighter integration of sensor-ready fuselage sections. Federal rules now favor home-grown supply, nudging structural electronics market participants to co-locate material, printing, and molding capabilities.

  1. TactoTek Oy
  2. Molex LLC
  3. Panasonic Holdings Corp.
  4. Canatu Oy
  5. Neotech AMT GmbH
  6. Pulse Electronics (Yageo)
  7. Optomec Inc.
  8. Odyssian Technology LLC
  9. Aconity3D GmbH
  10. T-ink Inc.
  11. Boeing Co.
  12. Henkel AG and Co. KGaA
  13. DuPont de Nemours Inc.
  14. 3D Systems Corp.
  15. Teijin Ltd.
  16. PPG Industries Inc.
  17. Flex Ltd.
  18. General Electric Co.
  19. Samsung Electro-Mechanics
  20. Continental AG

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Automotive Lightweighting and EV-Centric Cabin Electronics Surge in Europe
    • 4.2.2 Mass Adoption of 3-D In-Mold Electronics in Asia-Pacific Consumer Devices
    • 4.2.3 FAA Push for Integrated Sensor Skins in Composite Airframes (North America)
    • 4.2.4 Printed Photovoltaics for Battery-Less IoT Nodes in Smart Buildings
    • 4.2.5 Edge-AI Wearables Driving Stretchable Structural Circuits in Healthcare
    • 4.2.6 Defense Demand for Conformal Antennas and Smart Surfaces (Israel and US)
  • 4.3 Market Restraints
    • 4.3.1 Complex Qualification Cycles for Structural Electronics in Aerospace
    • 4.3.2 Limited Cycle-Time Throughput of Additive Manufacturing Lines
    • 4.3.3 Delamination Risks in High-Heat Polymer Substrates - Automotive
    • 4.3.4 Shortage of Conductive Nanomaterial Supply Outside Asia
  • 4.4 Industry Ecosystem Analysis
  • 4.5 Technological Outlook
  • 4.6 Porter's Five Forces Analysis
    • 4.6.1 Bargaining Power of Suppliers
    • 4.6.2 Bargaining Power of Buyers/Consumers
    • 4.6.3 Threat of New Entrants
    • 4.6.4 Threat of Substitute Products
    • 4.6.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUES)

  • 5.1 By Integrant
    • 5.1.1 Photovoltaics
    • 5.1.2 Batteries/Super-capacitors
    • 5.1.3 Sensors and Antennas
    • 5.1.4 Displays (OLED/Micro-LED)
    • 5.1.5 Conductors and Interconnects
  • 5.2 By Manufacturing Technology
    • 5.2.1 In-Mold Electronics (IME)
    • 5.2.2 Additive Manufacturing/3-D Printing
    • 5.2.3 Aerosol Jet and Inkjet Printing
    • 5.2.4 Screen/Flexographic Printing
  • 5.3 By Material
    • 5.3.1 Conductive Inks (Silver, Copper, Carbon, Nanomaterial)
    • 5.3.2 Substrates (Polymer, Glass, Composite, Thermoset)
    • 5.3.3 Encapsulation and Adhesives
  • 5.4 By Application
    • 5.4.1 Automotive - Interior and Exterior
    • 5.4.2 Aerospace and Defense - Airframe, Smart Skins
    • 5.4.3 Consumer Electronics - Whitegoods and Handhelds
    • 5.4.4 Healthcare/Medical Devices
    • 5.4.5 Industrial and Building Automation
  • 5.5 By Geography
    • 5.5.1 North America
      • 5.5.1.1 United States
      • 5.5.1.2 Canada
      • 5.5.1.3 Mexico
    • 5.5.2 Europe
      • 5.5.2.1 Germany
      • 5.5.2.2 United Kingdom
      • 5.5.2.3 France
      • 5.5.2.4 Italy
      • 5.5.2.5 Spain
      • 5.5.2.6 Nordics (Denmark, Sweden, Norway, Finland)
      • 5.5.2.7 Rest of Europe
    • 5.5.3 Asia-Pacific
      • 5.5.3.1 China
      • 5.5.3.2 Japan
      • 5.5.3.3 South Korea
      • 5.5.3.4 India
      • 5.5.3.5 Southeast Asia
      • 5.5.3.6 Australia
      • 5.5.3.7 Rest of Asia-Pacific
    • 5.5.4 South America
      • 5.5.4.1 Brazil
      • 5.5.4.2 Argentina
      • 5.5.4.3 Rest of South America
    • 5.5.5 Middle East
      • 5.5.5.1 Gulf Cooperation Council Countries
      • 5.5.5.2 Turkey
      • 5.5.5.3 Rest of Middle East
    • 5.5.6 Africa
      • 5.5.6.1 South Africa
      • 5.5.6.2 Nigeria
      • 5.5.6.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global-Level Overview, Market-Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
    • 6.4.1 TactoTek Oy
    • 6.4.2 Molex LLC
    • 6.4.3 Panasonic Holdings Corp.
    • 6.4.4 Canatu Oy
    • 6.4.5 Neotech AMT GmbH
    • 6.4.6 Pulse Electronics (Yageo)
    • 6.4.7 Optomec Inc.
    • 6.4.8 Odyssian Technology LLC
    • 6.4.9 Aconity3D GmbH
    • 6.4.10 T-ink Inc.
    • 6.4.11 Boeing Co.
    • 6.4.12 Henkel AG and Co. KGaA
    • 6.4.13 DuPont de Nemours Inc.
    • 6.4.14 3D Systems Corp.
    • 6.4.15 Teijin Ltd.
    • 6.4.16 PPG Industries Inc.
    • 6.4.17 Flex Ltd.
    • 6.4.18 General Electric Co.
    • 6.4.19 Samsung Electro-Mechanics
    • 6.4.20 Continental AG

7 MARKET OPPORTUNITIES AND OUTLOOK

  • 7.1 White-Space and Unmet-Need Assessment