GPU散熱器和散熱模組：市場佔有率分析、行業趨勢和統計數據以及成長預測（2026-2031年）

根據 Mordor Intelligence 預測，GPU 散熱器和散熱模組市場預計將從 2025 年的 31 億美元成長到 2026 年的 34.4 億美元，到 2031 年達到 73.4 億美元，2026 年至 2031 年的複合年成長率為 16.37%。

本報告按產品類型（散熱器、均熱板、熱管模組、主動式散熱模組）、材料（鋁基、銅基、混合材料）、GPU類型（資料中心/AI GPU、工作站GPU、消費性/遊戲GPU）和地區（北美、歐洲、亞太、南美等）進行細分。市場預測以美元（USD）計價。

全球GPU散熱器及散熱模組市場趨勢及洞察

人工智慧工作負載的激增正在推動資料中心GPU的出貨量。

到2026年，超大規模資料中心營運商將在人工智慧基礎設施方面投資超過3,000億美元。這筆投資包括用於防止機架功率超過100千瓦時出現降頻的液冷分配單元。 NVIDIA的H200散熱功率為700瓦，AMD的MI300X為750瓦，這已接近風冷設計的經濟極限。英特爾的Gaudi 3只有在水冷環境下才能達到1200瓦的功率，功率密度提升33%，從而加快了模型訓練速度。根據Delta電子的報告，水冷技術的採用率預計將從2024年的14%上升到2026年的40%，這標誌著產業正在發生決定性的轉變。在這個兩極化的市場中，傳統的鰭片式散熱器僅限於300瓦以下的邊緣推理設備，而均熱板和冷板則在500瓦及以上的功率等級中佔據主導地位。

先進節點的熱設計功耗增加

隨著每一代新製程的推出，GPU的功耗都在不斷增加。 NVIDIA的RTX 5090在持續射線追蹤運行時功耗接近600瓦，即使配備了三槽散熱器，顯存結溫也高達92 度C 4090的450瓦規格已經迫使顯示卡廠商採用均熱板來將熱量分散到更大的散熱鰭片表面。資料中心加速器也呈現類似的趨勢，700瓦是其入門功耗。導熱材料的導熱係數現已超過15 W/mK，但仍需要金屬背板來維持接觸壓力。 IEC 62368-1標準的接觸溫度限制進一步限制了散熱鰭片的密度，這就需要巧妙的氣流管理。

原始設備製造商向整合式液冷迴路過渡

伺服器製造商現在出貨的伺服器都預先安裝了閉合迴路液冷系統，從而避免了售後市場對獨立模組的需求。聯想的「Neptune」系統實現了1.1的電源使用效率（PUE），並透過回收廢熱用於機房供暖，降低了40%的冷卻能耗。戴爾的「PowerCool eRDHx」系統能夠實現80千瓦機架的運行，同時避免了風冷系統難以接受的噪音。 AceTec公司價值3500萬美元的兩年期供貨契約，也印證了其向以OEM廠商為中心的收入模式轉型。雖然液冷系統正在擴大整體市場，但也導致獨立散熱器的銷售下降，尤其是在資料中心GPU領域，液冷正逐漸成為標配。

細分市場分析

隨著GPU功耗超過600瓦，均熱板散熱技術正經歷最快的成長，預計其複合年成長率將達到17.17%。散熱器主要涵蓋300瓦以下的消費級GPU，預計到2025年將佔總收入的37.48%，但隨著闆卡合作夥伴將高階設計轉向均熱板，其市佔率預計將會下降。熱管模組可支援功耗約320瓦的RTX 4080級顯示卡，但由於毛細作用的限制，其散熱能力受到一定限制。焊接式均熱板可將GPU結溫降低10-15%，使其成為專業渲染工作站的必備組件。主動式散熱模組整合了水泵和散熱器，可實現超過100千瓦的機架密度。 TaiSol的3D均熱板透過堆疊蒸發器來匹配晶片尺寸，而酷冷至尊的FreeForm 2.0則可在單一散熱器上實現雙GPU迴路。

均熱板在GPU散熱器和散熱模組的市佔率正在擴大。這是因為它們設計纖薄，同時熱阻低於0.1 度C·W，這對於多槽顯示卡至關重要。另一方面，風冷散熱的效率在400瓦以上趨於飽和，因此傳統散熱器在GPU散熱器和散熱模組中的市佔率預計將會下降。主動式散熱模組雖然銷售量較小，但在AI伺服器領域卻維持著較高的平均售價。這些產品類型的趨勢促使創新重點持續放在均熱板的形狀和冷板微通道上，而不是鰭片堆疊的高度。

區域分析

預計到2025年，亞太地區將佔全球銷售額的67.81%，並在2031年之前以17.29%的複合年成長率成長，這主要得益於台灣在均熱板製造方面的專業技術以及中國的大規模組裝能力。Delta電子正透過投資121億新台幣（約3.8億美元）擴大桃園工廠的產能，進一步鞏固其在該地區的市場主導地位。日本古河電機為1U底盤專用燒結管提供關鍵材料，而越南和泰國正作為替代組裝地點嶄露頭角，這些地點不僅具有成本優勢，還能降低對傳統製造地的依賴。

北美擁有全球第二大市場規模，這主要得益於位於維吉尼亞、奧勒岡州和愛荷華州的超大規模資料中心園區。這些設施擴大採用功率容量超過100千瓦的水冷機架。優惠的稅收政策和再生能源來源的取得途徑持續推動該地區新建資料中心的發展。在歐洲，需求主要集中在德國的汽車模擬叢集和英國的金融科技資料中心。這兩個地區都受到嚴格的碳定價法規約束，要求買家採用節能解決方案，例如先進的冷板，以達到永續發展目標。

南美洲、中東和非洲仍處於市場發展的早期階段。在南美，巴西的資料中心設施正在向30千瓦機架過渡，這需要先進的均熱板設計來有效管理散熱。同時，中東海灣國家正在部署水冷工作站，以支援人工智慧驅動的石油探勘活動，反映出該地區對高效能運算日益成長的興趣。地理分散化仍然是一個關鍵趨勢，供應商擴大在越南、泰國和墨西哥等國家建立生產線，以降低以台灣為中心的製造業帶來的風險，並滿足全球對溫度控管解決方案日益成長的需求。

其他好處：

• Excel格式的市場預測（ME）表
• 3個月的分析師支持

目錄

第1章：引言

• 研究假設和市場定義
• 調查範圍

第2章：調查方法

第3章執行摘要

第4章 市場狀況

• 市場概覽
• 市場促進因素
  • 人工智慧工作負載的激增正在推動資料中心GPU的出貨量成長。
  • 先進節點的熱設計功耗增加
  • 支援射線追蹤的遊戲數量成長
  • 全球雲端遊戲基礎設施的擴展
  • 基於晶片組的GPU架構的出現
  • 擴大焊接式均熱板在工作站的應用
• 市場限制因素
  • 銅商品價格波動
  • 原始設備製造商向整合式液冷迴路過渡
  • 東亞供應鏈集中
  • 關於熱界面金屬開採的環境法規
• 宏觀經濟因素對市場的影響
• 產業價值鏈分析
• 監理情勢
• 技術展望
• 波特五力分析

第5章 市場規模與成長預測

• 依產品類型
  • 散熱器
  • 蒸氣室
  • 熱管模組
  • 主動式熱模組
• 材料
  • 鋁基
  • 銅基
  • 混合（鋁+銅）
• 按GPU類型
  • 資料中心/AI GPU
  • 工作站用GPU
  • 消費/遊戲顯示卡
• 按地區
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 其他歐洲國家
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 韓國
    • 東南亞
    • 其他亞太國家
  • 南美洲
    • 巴西
    • 其他南美國家
  • 中東和非洲

第6章 競爭情勢

• 市場集中度
• 策略趨勢
• 市佔率分析
• 公司簡介
  • Boyd Corporation
  • Cooler Master Technology Inc.
  • Noctua GmbH
  • Arctic GmbH
  • Hon Hai Precision Industry Co., Ltd.
  • Delta Electronics, Inc.
  • Sunonwealth Electric Machine Industry Co., Ltd.
  • Furukawa Electric Co., Ltd.
  • Asia Vital Components Co., Ltd.
  • Taisol Electronics Co., Ltd.
  • Asetek A/S
  • EKWB doo
  • Thermalright Inc.
  • Listan GmbH
  • Corsair Gaming, Inc.
  • ASUSTeK Computer Inc.
  • Gigabyte Technology Co., Ltd.
  • Micro-Star International Co., Ltd.
  • Zotac Technology Limited
  • Palit Microsystems Ltd.

第7章 市場機會與未來展望

According to Mordor Intelligence, the gPU heatsink and thermal module market size is expected to increase from USD 3.1 billion in 2025 to USD 3.44 billion in 2026 and reach USD 7.34 billion by 2031, growing at a CAGR of 16.37% over 2026-2031.

This report is Segmented by Product Type (Heat Sinks, Vapor Chambers, Heat Pipe-Based Modules, and Active Thermal Modules), Material (Aluminum-Based, Copper-Based, and Hybrid), GPU Type (Data Center/AI GPUs, Workstation GPUs, and Consumer/Gaming GPUs), and Geography (North America, Europe, Asia Pacific, South America, and More). The Market Forecasts are Provided in Terms of Value (USD).

Global GPU Heatsink And Thermal Module Market Trends and Insights

Surging AI Workloads Driving Data-Center GPU Shipments

Hyperscale operators spent more than USD 300 billion on AI infrastructure in 2026, a figure that includes liquid-cooling distribution units needed to prevent throttling in racks exceeding 100 kilowatts. NVIDIA's H200 dissipates 700 watts, and AMD's MI300X reaches 750 watts, pushing air-cooled designs beyond their economic limits. Intel's Gaudi 3 delivers 1200 watts only under liquid cooling, a 33% power-density premium that translates into faster model-training cycles. Delta Electronics reports liquid-cooling penetration climbing from 14% in 2024 to 40% in 2026, illustrating a decisive industry pivot. The bifurcated market now sees traditional finned heat sinks limited to edge-inference boxes below 300 watts, whereas vapor chambers and cold plates dominate the 500-watt-plus tier.

Escalating Thermal Design Power of Advanced Nodes

GPU power envelopes rise with each process generation. NVIDIA's RTX 5090 approaches 600 watts under sustained ray tracing, and memory junctions climb to 92 °C despite triple-slot coolers. RTX 4090's 450-watt spec already forced board partners to adopt vapor chambers that spread heat across larger fin surfaces. Data-center accelerators follow the same arc, with 700 watts becoming the entry point. Thermal-interface materials now exceed 15 W m-K but demand metal backplates to maintain contact pressure. IEC 62368-1 touch-temperature limits further constrain fin density, forcing creative airflow management.

OEM Shift Toward Integrated Liquid Cooling Loops

Server builders now ship closed-loop liquid systems pre-installed, bypassing the aftermarket for discrete modules. Lenovo's Neptune achieves a 1.1 power-usage effectiveness and recycles waste heat for facility heating, cutting cooling energy by 40%. Dell's PowerCool eRDHx enables 80-kilowatt racks that air systems cannot meet without prohibitive noise. Asetek's USD 35 million, two-year supply contract underscores the pivot toward OEM-centric revenue streams. While liquid loops enlarge the total market, they erode unit sales of standalone heat sinks, especially in data-center GPUs where liquid is the default.

Other drivers and restraints analyzed in the detailed report include:

1. Emergence of Chiplet-Based GPU Architectures
2. Growth of Ray-Tracing Gaming Titles
3. Volatility in Copper Commodity Prices

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Vapor chambers accounted for the fastest expansion, posting a 17.17% CAGR outlook as GPU envelopes breach 600 watts. Heat sinks still secured 37.48% of 2025 revenue, covering sub-300-watt consumer GPUs, yet their share will contract as board partners migrate high-end designs to vapor chambers. Heat-pipe modules serve RTX 4080-class cards around 320 watts, but they face capillary-limit ceilings. Solder-attached vapor chambers lower GPU junction temperatures by 10-15%, making them indispensable in professional rendering stations. Active thermal modules integrate pumps and radiators, unlocking rack densities above 100 kilowatts. TaiSol's 3D vapor chamber layers evaporators to match chiplet footprints, while Cooler Master's FreeForm 2.0 allows dual-GPU loops on one radiator.

The GPU heatsink and thermal module market share of vapor chambers is rising because they deliver sub-0.1 °C-W thermal resistance in a thin profile, critical for multi-slot cards. Meanwhile, the GPU heatsink and thermal module market share of traditional heatsinks will shrink as air-cooling meets diminishing returns beyond 400 watts. Active modules remain niche in volume but command high average selling prices in AI servers. Together, these product-type dynamics keep innovation centered on vapor-chamber geometry and cold-plate microchannels rather than on fin-stack height.

Geography Analysis

Asia-Pacific generated 67.81% of 2025 revenue and is forecast to grow at a compound annual growth rate (CAGR) of 17.29% through 2031, driven by Taiwan's expertise in vapor-chamber manufacturing and China's large-scale assembly capabilities. Delta Electronics has committed NTD 12.1 billion (USD 380 million) to expand its Taoyuan production capacity, further solidifying the region's dominance in the market. Japan's Furukawa Electric plays a key role by supplying sintered pipes specifically designed for 1U chassis, while Vietnam and Thailand are emerging as alternative hubs for assembly, offering cost advantages and reducing reliance on traditional manufacturing centers.

North America ranks as the second-largest market, supported by hyperscale data center campuses located in states such as Virginia, Oregon, and Iowa. These facilities are increasingly adopting liquid-cooled racks with power capacities exceeding 100 kilowatts. Favorable tax incentives and access to renewable energy sources continue to drive the construction of new data centers in the region. In Europe, demand is concentrated in Germany's automotive simulation clusters and the United Kingdom's fintech data centers. Both regions operate under stringent carbon-pricing regulations, which are pushing buyers to adopt energy-efficient solutions such as advanced cold plates to meet sustainability goals.

South America, the Middle East, and Africa are still in the early stages of market development. In South America, Brazil's data center facilities are transitioning to 30-kilowatt racks that require advanced vapor-chamber designs to effectively manage heat dissipation. Meanwhile, Gulf nations in the Middle East are deploying liquid-cooled workstations to support AI-driven oil exploration activities, reflecting the region's growing interest in high-performance computing. Geographic diversification remains a key trend, as suppliers are increasingly establishing production lines in countries such as Vietnam, Thailand, and Mexico to mitigate risks associated with Taiwan-centric manufacturing and to meet the growing global demand for thermal management solutions.

1. Boyd Corporation
2. Cooler Master Technology Inc.
3. Noctua GmbH
4. Arctic GmbH
5. Hon Hai Precision Industry Co., Ltd.
6. Delta Electronics, Inc.
7. Sunonwealth Electric Machine Industry Co., Ltd.
8. Furukawa Electric Co., Ltd.
9. Asia Vital Components Co., Ltd.
10. Taisol Electronics Co., Ltd.
11. Asetek A/S
12. EKWB d.o.o.
13. Thermalright Inc.
14. Listan GmbH
15. Corsair Gaming, Inc.
16. ASUSTeK Computer Inc.
17. Gigabyte Technology Co., Ltd.
18. Micro-Star International Co., Ltd.
19. Zotac Technology Limited
20. Palit Microsystems Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Surging AI Workloads Driving Data-Center GPU Shipments
  • 4.2.2 Escalating Thermal Design Power of Advanced Nodes
  • 4.2.3 Growth of Ray-Tracing Gaming Titles
  • 4.2.4 Expansion of Cloud Gaming Infrastructure Globally
  • 4.2.5 Emergence of Chiplet-Based GPU Architectures
  • 4.2.6 Increasing Use of Solder-Attached Vapor Chambers in Workstations
• 4.3 Market Restraints
  • 4.3.1 Volatility in Copper Commodity Prices
  • 4.3.2 OEM Shift Toward Integrated Liquid Cooling Loops
  • 4.3.3 Supply Chain Concentration in East Asia
  • 4.3.4 Environmental Regulations on Mining of Thermal Interface Metals
• 4.4 Impact of Macroeconomic Factors on the Market
• 4.5 Industry Value Chain Analysis
• 4.6 Regulatory Landscape
• 4.7 Technological Outlook
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Product Type
  • 5.1.1 Heat Sinks
  • 5.1.2 Vapor Chambers
  • 5.1.3 Heat Pipe-Based Modules
  • 5.1.4 Active Thermal Modules
• 5.2 By Material
  • 5.2.1 Aluminum-Based
  • 5.2.2 Copper-Based
  • 5.2.3 Hybrid (Aluminum + Copper)
• 5.3 By GPU Type
  • 5.3.1 Data Center / AI GPUs
  • 5.3.2 Workstation GPUs
  • 5.3.3 Consumer / Gaming GPUs
• 5.4 By Geography
  • 5.4.1 North America
    • 5.4.1.1 United States
    • 5.4.1.2 Canada
    • 5.4.1.3 Mexico
  • 5.4.2 Europe
    • 5.4.2.1 United Kingdom
    • 5.4.2.2 Germany
    • 5.4.2.3 France
    • 5.4.2.4 Italy
    • 5.4.2.5 Rest of Europe
  • 5.4.3 Asia-Pacific
    • 5.4.3.1 China
    • 5.4.3.2 Japan
    • 5.4.3.3 India
    • 5.4.3.4 South Korea
    • 5.4.3.5 Southeast Asia
    • 5.4.3.6 Rest of Asia-Pacific
  • 5.4.4 South America
    • 5.4.4.1 Brazil
    • 5.4.4.2 Rest of South America
  • 5.4.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Boyd Corporation
  • 6.4.2 Cooler Master Technology Inc.
  • 6.4.3 Noctua GmbH
  • 6.4.4 Arctic GmbH
  • 6.4.5 Hon Hai Precision Industry Co., Ltd.
  • 6.4.6 Delta Electronics, Inc.
  • 6.4.7 Sunonwealth Electric Machine Industry Co., Ltd.
  • 6.4.8 Furukawa Electric Co., Ltd.
  • 6.4.9 Asia Vital Components Co., Ltd.
  • 6.4.10 Taisol Electronics Co., Ltd.
  • 6.4.11 Asetek A/S
  • 6.4.12 EKWB d.o.o.
  • 6.4.13 Thermalright Inc.
  • 6.4.14 Listan GmbH
  • 6.4.15 Corsair Gaming, Inc.
  • 6.4.16 ASUSTeK Computer Inc.
  • 6.4.17 Gigabyte Technology Co., Ltd.
  • 6.4.18 Micro-Star International Co., Ltd.
  • 6.4.19 Zotac Technology Limited
  • 6.4.20 Palit Microsystems Ltd.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment