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市場調查報告書
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1851734

相機模組：市場佔有率分析、行業趨勢、統計數據和成長預測（2025-2030 年）

Camera Module - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 194 Pages | 商品交期: 2-3個工作天內

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簡介目錄

預計到 2025 年，相機模組市場規模將達到 412.9 億美元，到 2030 年將達到 507.8 億美元，在此期間的複合年成長率為 4.22%。

攝影機模組市場-IMG1

行動電話的飽和正促使製造商轉向多攝影機陣列、折疊式光學變焦和裝置端人工智慧處理，從而將成長重心從單純的銷量擴張轉向功能豐富的創新。汽車安全法規、邊緣分析監控以及新興的XR設備正在拓展傳統手機出貨量以外的收入來源。 2024年台灣地震暴露了音圈馬達（VCM）採購的脆弱性，零件製造商正優先考慮供應鏈的韌性，而印度等國的政府則利用與生產掛鉤的獎勵來促進本地組裝並吸引新的投資。韓國、日本和中國的供應商正在競相爭奪屏下攝影機和潛望鏡模組等高價值細分領域的智慧財產權。

全球相機模組市場趨勢與洞察

中國旗艦智慧型手機的多鏡頭機型現在通常配備三個以上的鏡頭。

中國行動電話品牌正將多相機陣列推向主流，預計到2025年，平均鏡頭數量將達到五顆。更大的感光元件尺寸、專用的超廣角和微距鏡頭，以及潛望式長焦模組，正在強化智慧型手機作為主要影像工具的地位。結合運算攝影技術，這些陣列能夠實現夜景模式、人像模式和高倍變焦等功能，在競爭激烈的行動電話市場中脫穎而出。國內供應鏈正在快速擴張，這給現有廠商帶來了壓力，同時也提升了相機模組市場作為品牌形象和消費者升級意願關鍵平台的地位。華為的2億像素潛望式原型機標誌著光學領域的飛躍。人工智慧驅動的運算攝影技術能夠從小像素中提取更大的動態範圍和更強的降噪能力，使品牌無需使用大尺寸感測器即可銷售專業級影像。

後視視野和ADAS攝影機強制要求（FMVSS 111，歐盟GSR）

美國和歐盟的安全法規已將後視攝影機和環景顯示攝影機從可選配件轉變為必備組件。汽車製造商正在整合多個鏡頭以滿足盲點監測、車道維持輔助和行人偵測的要求，從而持續推動對堅固耐用、耐高溫模組的需求。美國新車安全評鑑協會（美國 NCAP）現在對盲點警告、車道維持輔助和行人自動緊急煞車進行評分，提高了每輛車攝影機數量的基準值。因此，汽車製造商訂購的環景顯示系統必須超越最低合規標準，增加感測器節點數量，從而推動相機模組市場的發展。

2024年台灣地震後VCM致動器供應受限

2024年台灣地震擾亂了緊密相連的VCM（可變晶片製造）生態系統，導致供不應求，並波及全球智慧型手機組裝。 OEM廠商加速了雙源採購，並尋求功耗更低、響應速度更快的壓電替代方案。零件製造商開始進行地理多元化佈局，在東南亞地區建造產能，以避免未來的災害風險。這次地震也促使韓國和中國的主要供應商採取垂直整合策略，因為在這些地區，關鍵致動器的供應對於高階相機的上市至關重要。 Alps Alpine公司公開揭露了由於採購溢價而導致的利潤壓力，並正在向雙源製造模式轉型。壓電替代方案可提供更安靜、更低功耗的驅動，並減少對專業線圈繞線商的依賴。

細分市場分析

VCM致動器支援高速自動對焦和光學防手震，成為提升照片和影片效能的關鍵策略手段。此細分市場的複合年成長率（CAGR）為7.2%，超過了整個相機模組市場的成長速度。儘管地震造成的供不應求推動了壓電和MEMS替代方案的發展，但VCM仍保持著成本和技術成熟度的優勢。同時，影像感測器預計到2024年將佔據48.8%的收入佔有率，這得益於整合式片上記憶體的堆疊式架構，從而實現了連拍和多幀HDR。背照式的進步降低了噪音基底，並擴展了移動和汽車應用的動態範圍。

整合化趨勢將VCM（可變光圈模組）與感測器內相位檢測演算法結合，使系統關注點從硬體共生轉向軟體共生。隨著折疊光學元件和可變光圈設計的日益普及，鏡頭組也變得越來越複雜，模組組裝正在採用主動校準機器人技術來實現微米級的公差。這些變化強化了相機模組市場向更高單價的轉變，即便智慧型手機的成長已趨於平緩。投資於致動器創新和感測器/鏡頭協同開發的供應商將在相機模組產業的利潤曲線中佔據高階位置。

CMOS技術佔出貨量的90.1%，其單晶片實現和低耗電量幾乎使CCD技術被淘汰。背照式（BSI）技術引領創新趨勢，以4.24%的複合年成長率快速成長，顯著提升了夜視和自動駕駛視覺的量子效率。高動態範圍（HDR）CMOS設計利用橫向溢出電容，在單次曝光中捕捉極高的亮度範圍，滿足嚴格的汽車安全要求。

3D堆疊技術將處理邏輯置於光電二極體平面下方，簡化了訊號路徑，並為神經型態和事件驅動型感測技術鋪平了道路，這些技術僅輸出像素級變化。此類架構降低了頻寬和能耗需求，這對邊緣AI部署至關重要。隨著CMOS技術的不斷最佳化，相機模組市場將繼續受到整合到整個成像子系統中的感測器技術進步的驅動。

800萬至1300萬像素的像素頻寬仍然是業界的主流，佔據了34.7%的市場佔有率，這得益於其在資料負載、電池消耗和影像清晰度方面的均衡表現。計算攝影技術能夠在不成比例增加檔案大小的情況下提升細節，使OEM廠商能夠優先考慮軟體流程而非像素數量。雙增益感測器和多幀融合技術能夠從中等解析度硬體中提取出色的動態範圍，進一步鞏固了該解析度在對成本敏感的智慧型手機和物聯網視覺節點領域的領先地位。

相反，1300萬像素以上的解析度正以6.8%的複合年成長率成長，這主要得益於旗艦級潛望式相機、醫療成像探頭以及需要精細細節的工業檢測系統。四拜耳像素合併技術使這些高解析度感測器能夠在全解析度日間成像和低雜訊夜間成像之間切換，從而控制功耗。隨著模組厚度持續受到限制，微透鏡設計和深溝槽隔離技術的創新有助於保持量子效率，從而推動高階相機模組市場的成長。

區域分析

亞太地區預計到2024年將佔全球銷售額的59.7%，這得益於其密集的供應鏈，該供應鏈涵蓋日本和台灣的感測器、中國當地的鏡頭組件以及越南和印度的成品生產線。新德里的生產連結獎勵計畫計畫為國內模組組裝的資本支出提供報銷，鼓勵跨國代工製造商實現在地化生產並加快交付速度。台灣的半導體產業深度為相機AI協處理器提供尖端邏輯電路，進一步鞏固了該地區的系統性重要地位。

北美和歐洲對高階手機的需求與嚴格的車輛安全標準相結合，支撐了對高可靠性模組的穩定需求。美國的XR頭顯專案正在增加深度感測器陣列的上拉電阻，而歐盟的EN 303645網路安全基準雖然延長了設計週期，但卻帶來了穩健且可升級的連網攝影機。自動駕駛電動車的補助進一步鞏固了攝影機作為關鍵感測輸入的地位。

中東和非洲是成長最快的地區，複合年成長率達6.5%。海灣國家的智慧城市正在部署邊緣人工智慧攝影機，用於交通流量和公共分析。當地整合商正與全球硬體供應商合作，部署符合FIPS標準的監控網路，從而帶動了對儲存、運算和網路升級的二次需求。隨著智慧型手機普及率的提高以及區域車輛安全標準與歐盟和美國標準的趨同，南美洲具有長期成長潛力。

其他福利：

  • Excel格式的市場預測（ME）表
  • 3個月的分析師支持

目錄

第1章 引言

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章 市場情勢

  • 市場概覽
  • 市場促進因素
    • 中國旗艦智慧型手機多鏡頭普及率超過三攝。
    • 後視視野和ADAS攝影機強制要求（FMVSS 111，歐盟GSR）
    • 在中東智慧城市計劃中部署人工智慧賦能的邊緣分析監控
    • 每個潛望鏡/折疊式光學臂模組的升降鏡頭數量
    • PLI計畫主導的印度本地模組組裝
    • 美國和韓國對XR頭顯的3D/深度感知需求
  • 市場限制
    • 2024年台灣地震後VCM致動器供應受限
    • 螢幕下相機模組晶圓級光學元件的產量比率損失
    • 圍繞堆疊式CIS架構的專利訴訟愈演愈烈
    • EN 303645：歐盟對網路模組網路安全回應的延遲
  • 產業生態系分析
  • 技術展望
  • 波特五力分析
    • 供應商的議價能力
    • 買方的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭對手之間的競爭
  • 定價分析
  • 超小型相機模組的動態特性
  • 投資分析（組裝和測試線資本投資）

第5章 市場規模與成長預測

  • 按組件
    • 影像感測器
    • 鏡頭組
    • 相機模組組件
    • 音圈馬達（AF 和 OIS）
  • 依感測器類型
    • CMOS
    • CCD
  • 按像素/解析度
    • 最高可達700萬像素
    • 8-13 MP
    • 1300萬像素或以上
  • 依焦點類型
    • 固定焦距
    • 自動對焦
  • 透過製造程序
    • 板載晶片（COB）
    • 覆晶/晶圓層次電子構裝
  • 按模組類型
    • 緊湊型/CCM
    • MIPI介面模組（CSI/DSI）
  • 透過使用
    • 手機/智慧型手機
    • 消費性電子產品（不包括行動裝置）
    • 車
    • 醫療保健和醫學影像
    • 安全與監控
    • 工業與機器人
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
      • 墨西哥
    • 歐洲
      • 德國
      • 英國
      • 法國
      • 義大利
      • 西班牙
      • 其他歐洲地區
    • 亞太地區
      • 中國
      • 日本
      • 韓國
      • 印度
      • 東南亞
      • 澳洲
      • 亞太其他地區
    • 南美洲
      • 巴西
      • 其他南美洲
    • 中東和非洲
      • 中東
      • 阿拉伯聯合大公國
      • 沙烏地阿拉伯
      • 其他中東地區
      • 非洲
      • 南非
      • 其他非洲地區

第6章 競爭情勢

  • 市場集中度
  • 策略性舉措（併購、合資、資本投資）
  • 市佔率分析
  • 公司簡介
    • LG Innotek Co. Ltd
    • Samsung Electro-Mechanics Co. Ltd
    • Sunny Optical Technology（Gp）Co. Ltd
    • O-Film Group Co. Ltd
    • Hon Hai Precision/Foxconn（incl. Sharp）
    • Chicony Electronics Co. Ltd
    • LuxVisions Innovation Ltd（Lite-On）
    • Cowell E Holdings Inc.
    • Sony Group Corporation
    • OmniVision Technologies Inc.
    • STMicroelectronics NV
    • AMS Osram AG
    • ON Semiconductor Corp.
    • Panasonic Corp.
    • Largan Precision Co. Ltd
    • MinebeaMitsumi（Mitsumi Electric）
    • Canon Inc.
    • Robert Bosch GmbH
    • Continental AG
    • Magna International Inc.
    • Valeo SA
    • e-con Systems Pvt Ltd

第7章 市場機會與未來展望

簡介目錄
Product Code: 64735

The camera module market is valued at USD 41.29 billion in 2025 and is forecast to reach USD 50.78 billion by 2030, reflecting a 4.22% CAGR over the period.

Camera Module - Market - IMG1

Growth is shifting from pure volume expansion to feature-rich innovation, as handset saturation nudges manufacturers toward multi-camera arrays, folded-optics zoom, and on-device AI processing. Automotive safety mandates, edge-analytics surveillance, and emerging XR devices are broadening revenue streams beyond traditional mobile shipments. Component makers are prioritizing supply-chain resilience after the 2024 Taiwan earthquake exposed vulnerability in voice-coil motor (VCM) sourcing, while governments such as India are using production-linked incentives to localize assembly and attract fresh investment. Competitive intensity is rising as Korean, Japanese, and Chinese suppliers race to secure intellectual-property positions in high-value niches like under-display cameras and periscope modules.

Global Camera Module Market Trends and Insights

Multi-camera smartphone adoption exceeding three lenses in Chinese flagships

Chinese handset brands have turned multi-camera arrays into mainstream specifications, pushing the average lens count toward five by 2025. Larger sensor footprints, dedicated ultra-wide and macro shooters, and periscope telephoto modules reinforce smartphones as primary imaging tools. Combined with computational photography, these arrays enable night-mode, portrait, and high-zoom features that differentiate devices in a saturated handset field. Domestic supply chains scale rapidly, pressuring incumbents while elevating the camera module market as a critical arena for brand identity and consumer upgrade intent. Huawei's 200 MP periscope prototype illustrates the leap in optical ambition. AI-driven computational photography squeezes more dynamic range and noise control from small pixels, letting brands market professional-grade imagery without larger sensors.

Rear-visibility and ADAS camera mandates (FMVSS 111, EU GSR)

Safety regulations in the United States and European Union have transformed rear-view and surround-view cameras from optional accessories into compulsory components. Automakers integrate multiple lenses to satisfy blind-spot monitoring, lane-keeping, and pedestrian detection requirements, generating recurring demand for ruggedized, temperature-tolerant modules. The US NCAP now scores blind-spot warning, lane-keeping assist, and pedestrian automatic emergency braking, raising baseline camera count per vehicle. Automakers therefore order surround-view systems that exceed compliance minimums, multiplying sensor nodes and propelling the camera module market.

VCM actuator supply constraints post-2024 earthquake in Taiwan

he 2024 seismic event disrupted a tightly clustered VCM ecosystem, triggering shortages that rippled through smartphone assembly lines worldwide. OEMs accelerated dual-sourcing and pursued piezoelectric alternatives that promise lower power draw and faster response times. Component makers embarked on geographic diversification, erecting capacity in Southeast Asia to de-risk future disasters. The episode also fueled vertical-integration strategies among leading Korean and Chinese suppliers, as access to critical actuators became decisive for premium-camera launch schedule. Alps Alpine disclosed profit pressure from procurement premiums and is diversifying into dual-site manufacturing.Piezoelectric alternatives offer silent, low-power actuation and lower reliance on niche coil winders.

Other drivers and restraints analyzed in the detailed report include:

  1. AI-enabled edge-analytics surveillance roll-outs in Middle-East smart-city projects
  2. Periscope/folded-optics boom elevating lens count per module
  3. Wafer-level optics yield loss in under-display camera modules

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

VCM actuators underpin rapid autofocus and optical image stabilization, making them strategic levers for differentiating photo and video performance. The segment's 7.2% CAGR surpasses the broader camera module market as handset brands spotlight low-light clarity and cinematic motion capture. Earthquake-induced shortages spurred exploration of piezoelectric and MEMS alternatives, yet VCMs retain cost and maturity advantages. Concurrently, image sensors held 48.8% revenue share in 2024, benefiting from stacked architectures that integrate on-sensor memory, enabling burst capture and multi-frame HDR. Advancements in back-side illumination have reduced noise floors, widening dynamic range for mobile and automotive applications.

Integration trends link VCMs with in-sensor phase-detection algorithms, allowing focus systems to swing from hardware to software symbiosis. Lens sets grow in complexity as folded-optics and variable-aperture designs proliferate, while module assemblers adopt active alignment robotics to hit micron-level tolerances. These changes reinforce the camera module market's shift toward higher value per unit even as smartphone growth plateaus. Suppliers investing in actuator innovation and sensor-lens co-development position themselves at the premium end of the camera module industry's margin curve.

CMOS technology owns 90.1% of shipments, its single-chip integration and low power making CCD largely obsolete. Back-side-illuminated (BSI) variants lead the innovation front, expanding at 4.24% CAGR as they boost quantum efficiency for night-mode photography and autonomous-vehicle vision. High-dynamic-range (HDR) CMOS designs now leverage lateral overflow capacitors to capture extreme luminance ranges in a single exposure, satisfying stringent automotive safety requirements.

Three-dimensional stacking pushes processing logic under the photodiode plane, trimming signal paths and opening doors to neuromorphic, event-based sensing that outputs only pixel-level changes. Such architectures reduce bandwidth and energy demand, critical for edge AI deployments. Continuous CMOS optimization ensures the camera module market remains driven by sensor advances that cascade into entire imaging subsystems.

The 8-13 MP band remains the industry's workhorse, controlling 34.7% revenue thanks to its balance of data load, battery drain, and perceived image clarity. Computational photography techniques upscale detail without proportionally larger files, letting OEMs prioritize software pipelines over larger pixel counts. Dual-gain sensors and multi-frame fusion extract superior dynamic range from mid-resolution hardware, reinforcing the segment's dominance across cost-sensitive smartphones and IoT vision nodes.

Conversely, resolutions above 13 MP are climbing at a 6.8% CAGR, driven by flagship periscope cameras, medical imaging probes, and industrial inspection systems that need granular detail. Quad-Bayer pixel-binning enables these high-res sensors to toggle between full-resolution daylight capture and low-noise night shots, guarding power budgets. As module thickness constraints persist, innovations in micro-lens design and deep-trench isolation help maintain quantum efficiency, anchoring the camera module market size gains in premium tiers.

The Camera Module Market Report is Segmented by Component (Image Sensor, Lens Set, and More), Sensor Type (CMOS, and CCD), Pixel/Resolution (Up To 7 MP, 8 - 13 MP, and More), Focus Type (Fixed-Focus, and Autofocus), Manufacturing Process (Chip-On-Board (COB), and More), Module Form-Factor (Compact/CCM, and More), Application (Mobile/Smartphones, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Geography Analysis

Asia Pacific controlled 59.7% of global revenue in 2024, propelled by dense supply chains spanning sensors in Japan and Taiwan, lens assemblies in mainland China, and finishing lines in Vietnam and India. New Delhi's Production Linked Incentive program reimburses capital expenditure for domestic module assembly, enticing multinational contract manufacturers to localize production and shorten delivery times. Taiwan's semiconductor depth supplies leading-edge logic for on-camera AI co-processors, reinforcing the region's systemic importance.

North America and Europe combine premium handset demand with stringent vehicle-safety standards, underpinning stable requirements for high-reliability modules. US-based XR headset programs add incremental pulls for depth-sensing arrays, while the European Union's EN 303645 cybersecurity baseline extends design cycles but yields hardened, upgradable connected cameras. Subsidy regimes for electric-vehicle autonomy further embed cameras as critical perception inputs.

Middle East & Africa, the fastest-growing region at 6.5% CAGR, banks on smart-city deployments in the Gulf that deploy edge AI cameras for traffic flow and public-safety analytics. Local integrators partner with global hardware vendors to roll out FIPS-compliant surveillance grids, catalyzing secondary demand for storage, compute, and network upgrades. South America offers longer-run upside as smartphone penetration rises and regional auto-safety standards converge with EU and US precedents.

  1. LG Innotek Co. Ltd
  2. Samsung Electro-Mechanics Co. Ltd
  3. Sunny Optical Technology (Gp) Co. Ltd
  4. O-Film Group Co. Ltd
  5. Hon Hai Precision/Foxconn (incl. Sharp)
  6. Chicony Electronics Co. Ltd
  7. LuxVisions Innovation Ltd (Lite-On)
  8. Cowell E Holdings Inc.
  9. Sony Group Corporation
  10. OmniVision Technologies Inc.
  11. STMicroelectronics N.V.
  12. AMS Osram AG
  13. ON Semiconductor Corp.
  14. Panasonic Corp.
  15. Largan Precision Co. Ltd
  16. MinebeaMitsumi (Mitsumi Electric)
  17. Canon Inc.
  18. Robert Bosch GmbH
  19. Continental AG
  20. Magna International Inc.
  21. Valeo SA
  22. e-con Systems Pvt Ltd

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Multi-camera Smartphone Adoption Exceeding 3 Lenses in Chinese Flagships
    • 4.2.2 Rear-Visibility and ADAS Camera Mandates (FMVSS 111, EU GSR)
    • 4.2.3 AI-Enabled Edge-Analytics Surveillance Roll-outs in Middle-East Smart-City Projects
    • 4.2.4 Periscope/Folded-Optics Boom Elevating Lens Count per Module
    • 4.2.5 PLI Scheme-Driven Local Assembly of Modules in India
    • 4.2.6 3D/Depth Sensing Demand for XR Headsets in United States and Korea
  • 4.3 Market Restraints
    • 4.3.1 VCM Actuator Supply Constraints Post 2024 Earthquake in Taiwan
    • 4.3.2 Wafer-Level Optics Yield Loss in Under-Display Camera Modules
    • 4.3.3 Escalating Patent Litigation on Stacked CIS Architectures
    • 4.3.4 EN 303645 Cyber-Security Compliance Delays for Networked Modules in EU
  • 4.4 Industry Ecosystem Analysis
  • 4.5 Technological Outlook
  • 4.6 Porter's Five Forces Analysis
    • 4.6.1 Bargaining Power of Suppliers
    • 4.6.2 Bargaining Power of Buyers
    • 4.6.3 Threat of New Entrants
    • 4.6.4 Threat of Substitutes
    • 4.6.5 Intensity of Competitive Rivalry
  • 4.7 Pricing Analysis
  • 4.8 Ultra-miniature Camera Module Dynamics
  • 4.9 Investment Analysis (CapEx in Assembly and Test Lines)

5 MARKET SIZE AND GROWTH FORECASTS (VALUES)

  • 5.1 By Component
    • 5.1.1 Image Sensor
    • 5.1.2 Lens Set
    • 5.1.3 Camera Module Assembly
    • 5.1.4 Voice-Coil Motor (AF and OIS)
  • 5.2 By Sensor Type
    • 5.2.1 CMOS
    • 5.2.2 CCD
  • 5.3 By Pixel/Resolution
    • 5.3.1 Up to 7 MP
    • 5.3.2 8 - 13 MP
    • 5.3.3 Above 13 MP
  • 5.4 By Focus Type
    • 5.4.1 Fixed-Focus
    • 5.4.2 Autofocus
  • 5.5 By Manufacturing Process
    • 5.5.1 Chip-on-Board (COB)
    • 5.5.2 Flip-Chip/Wafer-Level Packaging
  • 5.6 By Module Form-Factor
    • 5.6.1 Compact/CCM
    • 5.6.2 MIPI-Interface Modules (CSI/DSI)
  • 5.7 By Application
    • 5.7.1 Mobile/Smartphones
    • 5.7.2 Consumer Electronics (ex-Mobile)
    • 5.7.3 Automotive
    • 5.7.4 Healthcare and Medical Imaging
    • 5.7.5 Security and Surveillance
    • 5.7.6 Industrial and Robotics
  • 5.8 By Geography
    • 5.8.1 North America
      • 5.8.1.1 United States
      • 5.8.1.2 Canada
      • 5.8.1.3 Mexico
    • 5.8.2 Europe
      • 5.8.2.1 Germany
      • 5.8.2.2 United Kingdom
      • 5.8.2.3 France
      • 5.8.2.4 Italy
      • 5.8.2.5 Spain
      • 5.8.2.6 Rest of Europe
    • 5.8.3 Asia-Pacific
      • 5.8.3.1 China
      • 5.8.3.2 Japan
      • 5.8.3.3 South Korea
      • 5.8.3.4 India
      • 5.8.3.5 South East Asia
      • 5.8.3.6 Australia
      • 5.8.3.7 Rest of Asia-Pacific
    • 5.8.4 South America
      • 5.8.4.1 Brazil
      • 5.8.4.2 Rest of South America
    • 5.8.5 Middle East and Africa
      • 5.8.5.1 Middle East
      • 5.8.5.1.1 United Arab Emirates
      • 5.8.5.1.2 Saudi Arabia
      • 5.8.5.1.3 Rest of Middle East
      • 5.8.5.2 Africa
      • 5.8.5.2.1 South Africa
      • 5.8.5.2.2 Rest of Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves (M&A, JVs, CapEx)
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, and Recent Developments)
    • 6.4.1 LG Innotek Co. Ltd
    • 6.4.2 Samsung Electro-Mechanics Co. Ltd
    • 6.4.3 Sunny Optical Technology (Gp) Co. Ltd
    • 6.4.4 O-Film Group Co. Ltd
    • 6.4.5 Hon Hai Precision/Foxconn (incl. Sharp)
    • 6.4.6 Chicony Electronics Co. Ltd
    • 6.4.7 LuxVisions Innovation Ltd (Lite-On)
    • 6.4.8 Cowell E Holdings Inc.
    • 6.4.9 Sony Group Corporation
    • 6.4.10 OmniVision Technologies Inc.
    • 6.4.11 STMicroelectronics N.V.
    • 6.4.12 AMS Osram AG
    • 6.4.13 ON Semiconductor Corp.
    • 6.4.14 Panasonic Corp.
    • 6.4.15 Largan Precision Co. Ltd
    • 6.4.16 MinebeaMitsumi (Mitsumi Electric)
    • 6.4.17 Canon Inc.
    • 6.4.18 Robert Bosch GmbH
    • 6.4.19 Continental AG
    • 6.4.20 Magna International Inc.
    • 6.4.21 Valeo SA
    • 6.4.22 e-con Systems Pvt Ltd

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-Space and Unmet-Need Assessment