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市場調查報告書
商品編碼
1851136

薄膜封裝：市場佔有率分析、產業趨勢、統計數據和成長預測（2025-2030 年）

Thin Film Encapsulation - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

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簡介目錄

預計到 2025 年薄膜封裝市場規模將達到 3.5 億美元，到 2030 年將達到 10.5 億美元，複合年成長率將達到 20.78%。

薄膜密封市場-IMG1

受軟性OLED顯示器的快速普及、可折疊消費電子設備需求的激增以及亞太地區產能的積極擴張等因素的推動，OLED市場依然保持著強勁的成長勢頭。製造商正優先研發水蒸氣透過率低於10⁻⁶ g/m²/天的原子層沉澱（ALD）阻隔層，從而在維持裝置外形規格靈活性的同時，延長其使用壽命。儘管面臨前驅體短缺和資本密集型第六代ALD生產線帶來的挑戰，但汽車行業對曲面駕駛座的強制性要求以及醫療行業對卷對卷ALD薄膜的認證，仍在不斷擴大其應用範圍。隨著中國企業在「新顯示」補貼政策的推動下擴大生產規模，並逐漸削弱韓國的市場主導地位，競爭日益激烈。

全球薄膜封裝市場趨勢與洞察

韓國和中國AMOLED產能的擴大正在推動ALD-TFE設備的訂單。

三星顯示器已為其第8.6代IT OLED生產線撥款30億美元，計劃於2026年投產；京東方也為類似的晶圓廠撥款87億美元。這些計劃帶動了ALD封裝設備的訂單成長，因為這項技術能夠提供下一代IT和汽車面板所需的低溫、均勻、無針孔的封裝層。日益激烈的競爭使韓國重回出貨量主導，同時也擴大了亞太地區晶圓代工廠對ALD的需求。

歐盟和北美將強制要求使用曲面汽車顯示器

監管機構建議採用無縫儀錶群，這加速了曲面OLED儀錶板的設計應用。這些模組需要能夠承受振動、紫外線照射和-40 度C低溫循環的封裝結構。三星採用先進防潮層的串聯OLED技術，正是這一轉變的體現，也使該公司能夠把握市場機遇，因為預計到2026年，汽車顯示器總成本將超過顯示器面板的銷售額。

第六代ALD叢集生產線需要高資本投資

下一代ALD堆疊製程每條生產線需要超過1億美元的資本投資，這令中型製造商望而卻步，並減緩了該技術的普及應用。許多亞洲晶圓廠仍在對老舊的叢集設備進行折舊，即使產量比率提升顯而易見，升級的經濟效益也難以承受。這一成本壁壘阻礙了薄膜封裝市場全面採用一流封裝技術。

細分市場分析

儘管原子層沉積（ALD）的複合年成長率（CAGR）為26.4%，但等離子體增強化學氣相沉積（PECVD）的收入在2024年成長了39.3%，這標誌著薄膜封裝市場正處於轉型期。 ALD薄膜的水蒸氣含量達到10⁻⁶ g/m²/天，延長了OLED的使用壽命，並支援可折疊基板的製造。卷軸式ALD技術將產能提升至適用於穿戴式裝置生產的捲材速度，而太空ALD技術則正在克服基板尺寸的限制。 PECVD技術仍然是需要大批量生產的剛性面板的首選。在材料相容性比阻隔性能更重要的細分發光堆疊領域，真空熱電偶（VTE）和氧蒸氣沉積（OVPD）技術持續成長。低溫ALD化學技術於2023年獲得SID認證，該技術開發了用於大規模可折疊應用的聚醯亞胺基板，從而豐富了技術組合。因此，ALD設備供應商的訂單訂單創下歷史新高，並加強了韓國、中國和美國的供應商生態系統。

由於PECVD反應器能夠與傳統TFT生產線無縫整合，因此薄膜封裝市場在成本敏感型SKU方面仍然依賴PECVD。由Kateeva公司率先推出的噴墨封裝印刷技術減少了有機廢料，並為智慧型手錶實現了圖案化屏障。對於小面積微顯示器而言，裝置產量比率比產能更為重要，因此VTE（真空熱效率）至關重要。隨著太空ALD（原子層沉積）技術在15G基板上進行前導測試，PECVD和ALD之間的競爭預計將會加劇，從而推動採用兩種技術的混合生產車間的出現。

結合聚對二甲苯C和ALD氧化鋁的混合疊層結構，憑藉其在應力釋放和水分阻隔方面的優異平衡性能，預計2024年營收將成長47.3%。這些二元複合材料在承受超過10,000次彎曲循環的同時，實現了105克/平方米/天或更低的透濕率，滿足高階智慧型手機的規格要求。然而，目前單層阻隔材料的成長速度最快，複合年成長率達29.1%。這是因為Silvion混合薄膜在提供同等防護性能的同時，將沉澱流程縮短了一半，從而減少了旋轉性面板的生產週期。

無機多層膜具有無與倫比的抗氧性能，但在拉伸應力下容易開裂，限制了其在折疊面板中的應用。有機多層膜具有優異的柔韌性，但很少能達到預期的使用壽命。智慧型手機採用混合晶粒，而汽車儀錶板則需要三層無機蓋板。為了應對這些挑戰，組件供應商推出了模組化材料套件，這些套件能夠匹配相鄰層之間的屈光、模量和黏合力，從而確保生產線的可靠性，產量比率超過 90%。

薄膜封裝市場依技術（等離子體增強化學氣相沉積、原子層沉澱等）、層級構造（無機多層阻擋層、有機多層阻擋層等）、應用（軟性OLED顯示器等）、沉積設備類型（集群式PECVD系統等）、終端用戶產業（家用電器、可再生能源等）及地區進行細分。

區域分析

亞太地區預計到2024年將維持69.5%的市場佔有率，這主要得益於韓國和中國晶圓廠的擴建以及一體化的供應鏈生態系統。政府為覆蓋封裝技術資本成本而提供的誘因加速了原子層沉積（ALD）叢集的建立，韓國企業也因此將重心轉向高價值產品和疊層結構，以保障利潤率。區域模具製造商和化學品生產商已在ALD製造廠附近設立基地，縮短了認證週期，並鞏固了其在薄膜封裝市場的主導地位。

在汽車和建築整合太陽能（BIPV）需求的推動下，歐洲經濟實現了強勁成長。歐盟嚴格的汽車安全指令加速了曲面OLED駕駛座的普及，而碳中和建築法規則促進了ALD隔熱層在太陽能建築幕牆中的應用。研究聯盟致力於研發低溫ALD前驅體，使其性能符合循環經濟目標。

中東和非洲地區預計將以27.2%的複合年成長率實現最高成長，而該地區基數較小。阿拉伯聯合大公國和沙烏地阿拉伯等國投資建構電子產業叢集，以實現經濟多元化。嚴酷的沙漠氣候要求顯示器和太陽能產品採用堅固的封裝，從而催生了對基於原子層沉積（ALD）技術的無機薄膜的高階需求。與亞洲原始設備製造商（OEM）的技術轉移夥伴關係提升了當地的生產能力，並降低了全球品牌對單一地區的依賴。

儘管面板產量有限，北美憑藉著材料科學領域的領先地位和設備出口，仍保持著影響力。汽車產業的強制性要求和量子點微型LED的研發推動了對專業阻隔技術的需求，而卷對卷原子層沉積（ALD）新興企業利用創業投資資金實現了穿戴式裝置生產線的商業化。區域晶圓廠與大學合作，利用機器學習技術進行製程控制，以提高薄膜的均勻性和生產效率。

其他福利：

  • Excel格式的市場預測（ME）表
  • 3個月的分析師支持

目錄

第1章 引言

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章 市場情勢

  • 市場概覽
  • 市場促進因素
    • 韓國和中國AMOLED產能的提升正在推動ALD-TFE工具的訂單成長。
    • 歐盟和北美強制要求汽車使用曲面顯示螢幕
    • 利用卷軸式ALD技術解鎖醫療穿戴式裝置認證。
    • 歐盟推動碳中和建築整合太陽能（BIPV）項目，提高了無機物壁壘。
    • 榮獲SID大獎的低溫ALD材料使可折疊裝置成為可能
    • 中國的「新顯示」補貼涵蓋封裝設備的投資。
  • 市場限制
    • 第六代ALD叢集生產線需要高資本投資
    • 低於-40°C的汽車循環可靠性失效
    • 與超薄軟性玻璃的競爭
    • 前驅物供應瓶頸（例如，DEZ）
  • 價值鏈分析
  • 監理與技術展望
  • 關鍵績效指標基準
  • 波特五力模型
    • 新進入者的威脅
    • 買方的議價能力
    • 供應商的議價能力
    • 替代品的威脅
    • 競爭對手之間的競爭
  • 評估宏觀經濟因素對市場的影響

第5章 市場規模與成長預測

  • 透過技術
    • 等離子體增強化學氣相沉積（PECVD）
    • 原子層沉澱（ALD）
    • 噴墨列印
    • 真空沉澱（VTE）
    • 有機氣相沉積（OVPD）
    • 卷軸式原子層沉積
    • 其他新興技術（聚對二甲苯、溶膠-凝膠）
  • 按層級構造
    • 無機多層屏障
    • 有機多層屏障
    • 混合（有機+無機）屏障
    • 單層封裝
  • 透過使用
    • 軟性OLED顯示螢幕
    • 薄膜太陽能電池
    • 軟性OLED照明
    • 穿戴式和醫療用電子設備
    • 汽車顯示器和照明
    • 量子點和微型LED元件
    • 列印感測器和物聯網設備
  • 依薄膜沉積設備類型
    • 叢集PECVD系統
    • 噴墨封裝印表機
    • ALD反應器
    • 卷軸式真空系統
    • 雷射輔助沉澱工具
  • 按最終用途行業分類
    • 消費性電子產品
    • 可再生能源
    • 汽車與運輸
    • 醫療保健和穿戴式設備
    • 工業和航太
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
      • 墨西哥
    • 南美洲
      • 巴西
      • 阿根廷
      • 其他南美洲
    • 歐洲
      • 德國
      • 法國
      • 英國
      • 義大利
      • 其他歐洲地區
    • 亞太地區
      • 中國
      • 韓國
      • 日本
      • 印度
      • 亞太其他地區
    • 中東和非洲
      • 中東
      • 沙烏地阿拉伯
      • 阿拉伯聯合大公國
      • 土耳其
      • 其他中東地區
      • 非洲
      • 南非
      • 奈及利亞
      • 其他非洲地區

第6章 競爭情勢

  • 市場集中度
  • 策略趨勢
  • 市佔率分析
  • 公司簡介
    • Samsung SDI Co., Ltd.
    • LG Chem Ltd.
    • Universal Display Corporation
    • Applied Materials Inc.
    • Veeco Instruments Inc.
    • 3M Inc.
    • Toray Industries Inc.
    • Kateeva
    • BASF（Rolic）AG
    • Meyer Burger Technology AG
    • Encapsulix SAS
    • Forge Nano Inc.
    • Aixtron SE
    • Angstrom Engineering Inc.
    • Forge Nano Inc.
    • Beneq Oy
    • Picosun Oy
    • Canon Tokki Corporation
    • AP Systems
    • EMD Electronics（Merck KGaA）
    • Idemitsu Kosan Co.
    • Encapsulix SAS
    • Wonik IPS
    • Vitriflex Inc.

第7章 市場機會與未來展望

簡介目錄
Product Code: 67197

The thin film encapsulation market size was valued at USD 0.35 billion in 2025 and is forecast to reach USD 1.05 billion by 2030, reflecting a robust 20.78% CAGR.

Thin Film Encapsulation - Market - IMG1

Rapid adoption of flexible OLED displays, surging demand for bendable consumer devices, and aggressive capacity additions in Asia-Pacific have kept the growth trajectory steep. Manufacturers are prioritizing atomic layer deposition (ALD) barriers that achieve water-vapor transmission rates below 10-6 g/m2/day, enabling longer device lifetimes while preserving form-factor flexibility. Automotive mandates for curved cockpit displays and medical certification of roll-to-roll ALD films are widening application scope, even as precursor shortages and capital-intensive Gen-6 ALD lines present headwinds. Competitive intensity is rising as Chinese firms, buoyed by "New Display" subsidies, scale output and erode Korean dominance.

Global Thin Film Encapsulation Market Trends and Insights

AMOLED capacity expansions in South Korea and China are fueling ALD-TFE tool orders

Samsung Display allocated USD 3 billion for an 8.6-generation IT OLED line targeting 2026 production, while BOE committed USD 8.7 billion for a comparable plant. These projects multiplied purchase orders for ALD encapsulation tools because the technology offers uniform, pinhole-free barriers at low temperatures, a necessity for next-generation IT and automotive panels. Heightened competition has revived Korean shipment leadership but simultaneously broadened ALD demand across Asia-Pacific foundries.

Automotive curved-display mandates in the EU and North America

Regulatory guidance favoring seamless instrument clusters has sparked accelerated design-ins of curved OLED dashboards. These modules need encapsulation stacks that withstand vibration, UV exposure, and -40 °C cycling. Samsung's adoption of tandem OLED with advanced moisture barriers exemplified the shift, positioning the firm to capture revenue as total automotive display spend is forecast to overtake monitor panel sales by 2026.

High CapEx of Gen-6 ALD cluster lines

Next-generation ALD stacks demand more than USD 100 million per line, sidelining mid-tier producers and slowing technology diffusion. Many Asian fabs still amortize older cluster tools, complicating upgrade economics even where yield benefits are clear. This cost barrier delays uniform adoption of best-in-class encapsulation across the thin film encapsulation market.

Other drivers and restraints analyzed in the detailed report include:

  1. Roll-to-roll ALD unlocking certified medical wearables
  2. EU carbon-neutral BIPV push boosting inorganic barriers
  3. Reliability failures under -40 °C automotive cycling

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

ALD recorded a 26.4% CAGR outlook while PECVD held 39.3% revenue in 2024, illustrating a transition phase within the thin film encapsulation market. ALD films reached water-vapor rates at 10-6 g/m2/day that extend OLED life spans and support foldable substrates. Roll-to-roll ALD upgraded throughput to web speeds suitable for wearable production, while spatial ALD is overcoming substrate-size limits. PECVD remains preferred for rigid panels needing high volume. VTE and OVPD continue in niche emissive stacks where material compatibility overrides barrier extremity. Low-temperature ALD chemistries awarded by SID in 2023 unlocked polyimide substrates for mass foldables, deepening the technology mix. Consequently, ALD tool providers enjoy record order backlogs, lifting regional supplier ecosystems across South Korea, China, and the United States.

The thin film encapsulation market continues to rely on PECVD for cost-sensitive SKUs because the reactors integrate seamlessly with legacy TFT lines. Inkjet encapsulation printing, spearheaded by Kateeva, decreased organic material waste and enabled patterned barriers for smartwatch dials. VTE retains relevance for small-area microdisplays where device yield trumps throughput. With spatial ALD crossing 15 gen substrates in pilot tests, the competitive landscape between PECVD and ALD is expected to tighten, driving hybrid production floors that leverage both methods.

Hybrid stacks combining parylene C with ALD Al2O3 secured 47.3% sales in 2024, thanks to a proven balance of stress relief and moisture blocking. These dyads achieved sub-105 g/m2/day WVTR while sustaining flex cycles exceeding 10,000 bends, a specification demanded by premium smartphones. Single-layer barriers, however, now post the fastest 29.1% CAGR because silbione-blended hybrimer films offer comparable protection at half the deposition sequence length, cutting takt time for rollable panels.

Inorganic multi-layers deliver unmatched oxygen resistance but risk crack formation under tensile stress, limiting adoption in foldables. Organic multi-layers excel in bendability yet rarely reach lifetime targets alone. Commercial lines consequently calibrate layer architecture by product class: smartphones accept hybrid dyads, automotive clusters need triple inorganic caps, while e-textiles increasingly lean on advanced organic chemistries. Component suppliers respond with modular material kits that harmonize refractive index, modulus, and stickiness across adjoining layers, ensuring line reliability beyond 90% yield.

Thin Film Encapsulation Market is Segmented by Technology (Plasma-Enhanced Chemical Vapor Deposition, Atomic Layer Deposition, and More), by Layer Structure (Inorganic Multilayer Barriers, Organic Multilayer Barriers, and More), by Application (Flexible OLED Displays, and More), by Deposition Equipment Type (Cluster PECVD Systems, and More), by End-Use Industry (Consumer Electronics, Renewable Energy, and More), and by Geography.

Geography Analysis

Asia-Pacific retained 69.5% revenue share in 2024, driven by South Korea's and China's fab expansions and integrated supply ecosystems. Government incentives covering encapsulation capital costs accelerated ALD cluster installations, while Korean players pivoted toward high-value products and tandem stacks to defend margins. Regional tooling and chemical suppliers co-located near fabs, shortening qualification cycles and reinforcing dominance across the thin film encapsulation market.

Europe posted healthy gains built on automotive and BIPV demand. Strict EU vehicle safety directives accelerated curved OLED cockpit adoption, and carbon-neutral building rules spurred ALD barrier uptake in solar facades. Research consortia advanced low-temperature ALD precursors, aligning performance with circular-economy objectives.

The Middle East and Africa exhibited the highest 27.2% CAGR outlook from a small base, as nations like the UAE and Saudi Arabia funded electronics clusters to diversify their economies. Harsh desert climates necessitated robust encapsulation for display and solar products, creating premium demand for ALD-based inorganic layers. Technology transfer partnerships with Asian OEMs seeded local capacity, reducing single-region dependency for global brands.

North America maintained influence through materials science leadership and equipment exports despite limited panel production. Automotive mandates and quantum-dot microLED research and development anchored demand for specialized barrier know-how, while roll-to-roll ALD startups leveraged venture funding to commercialize wearable lines. Regional fabs collaborated with universities on machine-learning process control, enhancing film uniformity and throughput.

  1. Samsung SDI Co., Ltd.
  2. LG Chem Ltd.
  3. Universal Display Corporation
  4. Applied Materials Inc.
  5. Veeco Instruments Inc.
  6. 3M Inc.
  7. Toray Industries Inc.
  8. Kateeva
  9. BASF (Rolic) AG
  10. Meyer Burger Technology AG
  11. Encapsulix SAS
  12. Forge Nano Inc.
  13. Aixtron SE
  14. Angstrom Engineering Inc.
  15. Forge Nano Inc.
  16. Beneq Oy
  17. Picosun Oy
  18. Canon Tokki Corporation
  19. AP Systems
  20. EMD Electronics (Merck KGaA)
  21. Idemitsu Kosan Co.
  22. Encapsulix SAS
  23. Wonik IPS
  24. Vitriflex Inc.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 AMOLED Capacity Expansions in South Korea and China Fueling ALD-TFE Tool Orders
    • 4.2.2 Automotive Curved-Display Mandates in EU and NA
    • 4.2.3 Roll-to-Roll ALD Unlocking Certified Medical Wearables
    • 4.2.4 EU Carbon-Neutral BIPV Push Boosting Inorganic Barriers
    • 4.2.5 SID Award-Winning Low-Temp ALD Materials Enabling Foldables
    • 4.2.6 China "New Display" Subsidies Covering Encapsulation Capex
  • 4.3 Market Restraints
    • 4.3.1 High Capex of Gen-6 ALD Cluster Lines
    • 4.3.2 Reliability Failures under -40 °C Automotive Cycling
    • 4.3.3 Competition from Ultra-Thin Flexible Glass
    • 4.3.4 Precursor Supply Bottlenecks (e.g., DEZ)
  • 4.4 Value Chain Analysis
  • 4.5 Regulatory and Technological Outlook
  • 4.6 Key Performance Indicators Benchmarked
  • 4.7 Porter's Five Forces
    • 4.7.1 Threat of New Entrants
    • 4.7.2 Bargaining Power of Buyers
    • 4.7.3 Bargaining Power of Suppliers
    • 4.7.4 Threat of Substitutes
    • 4.7.5 Intensity of Competitive Rivalry
  • 4.8 Assessment of Impact of Macroeconomic factors on the Market

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

  • 5.1 By Technology
    • 5.1.1 Plasma-Enhanced Chemical Vapor Deposition (PECVD)
    • 5.1.2 Atomic Layer Deposition (ALD)
    • 5.1.3 Inkjet Printing
    • 5.1.4 Vacuum Thermal Evaporation (VTE)
    • 5.1.5 Organic Vapor Phase Deposition (OVPD)
    • 5.1.6 Roll-to-Roll ALD
    • 5.1.7 Other Emerging Techniques (Parylene, Sol-Gel)
  • 5.2 By Layer Structure
    • 5.2.1 Inorganic Multilayer Barriers
    • 5.2.2 Organic Multilayer Barriers
    • 5.2.3 Hybrid (Organic+Inorganic) Barriers
    • 5.2.4 Single-Layer Encapsulation
  • 5.3 By Application
    • 5.3.1 Flexible OLED Displays
    • 5.3.2 Thin-Film Photovoltaics
    • 5.3.3 Flexible OLED Lighting
    • 5.3.4 Wearable and Medical Electronics
    • 5.3.5 Automotive Displays and Lighting
    • 5.3.6 Quantum-Dot and MicroLED Devices
    • 5.3.7 Printed Sensors and IoT Devices
  • 5.4 By Deposition Equipment Type
    • 5.4.1 Cluster PECVD Systems
    • 5.4.2 Inkjet Encapsulation Printers
    • 5.4.3 ALD Reactors
    • 5.4.4 Roll-to-Roll Vacuum Systems
    • 5.4.5 Laser-Assisted Deposition Tools
  • 5.5 By End-Use Industry
    • 5.5.1 Consumer Electronics
    • 5.5.2 Renewable Energy
    • 5.5.3 Automotive and Transportation
    • 5.5.4 Healthcare and Wearables
    • 5.5.5 Industrial and Aerospace
  • 5.6 By Geography
    • 5.6.1 North America
      • 5.6.1.1 United States
      • 5.6.1.2 Canada
      • 5.6.1.3 Mexico
    • 5.6.2 South America
      • 5.6.2.1 Brazil
      • 5.6.2.2 Argentina
      • 5.6.2.3 Rest of South America
    • 5.6.3 Europe
      • 5.6.3.1 Germany
      • 5.6.3.2 France
      • 5.6.3.3 United Kingdom
      • 5.6.3.4 Italy
      • 5.6.3.5 Rest of Europe
    • 5.6.4 Asia-Pacific
      • 5.6.4.1 China
      • 5.6.4.2 South Korea
      • 5.6.4.3 Japan
      • 5.6.4.4 India
      • 5.6.4.5 Rest of Asia-Pacific
    • 5.6.5 Middle East and Africa
      • 5.6.5.1 Middle East
      • 5.6.5.1.1 Saudi Arabia
      • 5.6.5.1.2 United Arab Emirates
      • 5.6.5.1.3 Turkey
      • 5.6.5.1.4 Rest of Middle East
      • 5.6.5.2 Africa
      • 5.6.5.2.1 South Africa
      • 5.6.5.2.2 Nigeria
      • 5.6.5.2.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
    • 6.4.1 Samsung SDI Co., Ltd.
    • 6.4.2 LG Chem Ltd.
    • 6.4.3 Universal Display Corporation
    • 6.4.4 Applied Materials Inc.
    • 6.4.5 Veeco Instruments Inc.
    • 6.4.6 3M Inc.
    • 6.4.7 Toray Industries Inc.
    • 6.4.8 Kateeva
    • 6.4.9 BASF (Rolic) AG
    • 6.4.10 Meyer Burger Technology AG
    • 6.4.11 Encapsulix SAS
    • 6.4.12 Forge Nano Inc.
    • 6.4.13 Aixtron SE
    • 6.4.14 Angstrom Engineering Inc.
    • 6.4.15 Forge Nano Inc.
    • 6.4.16 Beneq Oy
    • 6.4.17 Picosun Oy
    • 6.4.18 Canon Tokki Corporation
    • 6.4.19 AP Systems
    • 6.4.20 EMD Electronics (Merck KGaA)
    • 6.4.21 Idemitsu Kosan Co.
    • 6.4.22 Encapsulix SAS
    • 6.4.23 Wonik IPS
    • 6.4.24 Vitriflex Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-Space and Unmet-Need Assessment