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市場調查報告書
商品編碼
1851112
半導體設備：市場佔有率分析、產業趨勢、統計數據和成長預測（2025-2030 年）Semiconductor Equipment - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030) |
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預計到 2025 年半導體設備市場規模將達到 1,240 億美元，到 2030 年將達到 1,779.7 億美元，複合年成長率為 7.49%。
強勁的晶圓廠建設、創紀錄的設備訂單以及一系列政府獎勵正在支撐這一發展趨勢。晶圓代工廠正加速推進2奈米以下製程的產能，而半導體組裝測試外包（OSAT）公司則在擴建先進封裝生產線，以滿足人工智慧（AI）的需求。為實現技術主權而進行的地緣政治努力正在影響資本支出模式，迫使設備供應商在應對中國出口限制的同時，也要抓住北美、歐洲和中東的補貼機會。那些能夠兼顧製程廣度、軟體分析和售後服務覆蓋的設備製造商，正在從業內最大的投資者那裡獲得多年採購承諾。
全球半導體設備市場趨勢與洞察
對尖端家用電器和智慧型手機的需求激增
智慧型手機、穿戴式裝置和混合實境設備不斷增加邏輯、儲存和類比電路，這要求這些設備採用更小的製程節點進行製造，促使代工廠加速推進28nm至7nm生產線的產能提升。先進封裝技術能夠在不增加功耗的情況下縮小高頻寬功能，在2025年初佔據了相當大的營收佔有率，推動了凸塊、測試和微影術設備的升級換代。異質整合線（垂直堆疊晶片）以兩位數的成長率快速擴張，帶動了覆晶鍵合機和晶圓級檢測設備的出貨量。隨著消費品週期的縮短，能夠快速切換配方的模組化沉積腔設備製造商正在贏得訂單。在印度和東南亞，行動電話更新換代速度很快，成熟的製程節點設備幾乎滿載運作，證明即使在運作設備發布期間，也能實現穩定的營收成長。
對人工智慧、物聯網和邊緣設備節點的快速投資
資料中心營運商對高 TOPS/W 晶片的需求不斷成長，推動了對 3nm 及以下製程的極紫外線 (EUV) 掃描儀和原子層沉積模組的採購。美國和歐洲的 AI 加速器新興企業正在簽訂產能預訂協議，將多年 HBM 採購與尖端微影術的使用保障相結合，從而將需求風險從晶片設計商轉移到設備製造商。用於工廠自動化和智慧城市部署的邊緣 AI 設備正在加速對 16nm 到 12nm 製程的需求，並刺激了對配備嵌入式非揮發性記憶體的 300mm 蝕刻系統的新訂單。設備供應商正在將 AI 整合到原位製程監控演算法中，以縮短配方開發週期並提高腔室運作。 AI 工作負載的增加和更智慧工具的出現形成良性循環，這將使半導體設備市場在 2030 年及以後持續保持強勁成長。
極高的資本支出和漫長的投資回收期
如今，一座先進邏輯晶片工廠的成本已遠超200億美元，而尖端設備的基本客群也日益集中。漫長的折舊免稅額期延長了採購盡職調查的時間，迫使設備製造商在下單前證明其多節點擴充性。供應商正透過可升級平台、模組化真空結構以及基於訂閱的製程控制軟體來應對這項挑戰，將成本分攤到設備的整個生命週期內。一些整合裝置製造商（IDM）正在推遲產能擴張、推遲設備安裝，並將收入確認推遲到計劃後期。然而，對每瓦性能的持續追求正在推動藍圖的製定，並限制半導體設備市場整體的下滑趨勢。
細分市場分析
到2024年，晶圓前端設備將佔據半導體設備市場83.7%的佔有率，凸顯了微影術、蝕刻和沈積在產量比率方面的核心作用。在該領域，高數值孔徑（NA）極紫外線（EUV）掃描器到2030年將以21.1%的複合年成長率成長，因為它們對於2nm邏輯晶片和3D DRAM結構的圖形化至關重要，來自台灣和紐約晶圓廠的多系統訂單已達數十億美元。
後端製程的複雜性正在推動創新，例如具有亞2微米對準精度的熱壓鍵合機和利用前端微影術精度的扇出型晶圓級封裝。將微影術光學元件、貼片機器人和高頻測試模組整合到平台中的供應商正在佔據越來越大的先進封裝預算佔有率，並將微影術級投資進一步延伸至供應鏈下游。
到2024年，晶圓代工廠將佔半導體設備市場收入的52.2%，因為無晶圓廠晶片公司將訂單集中到台積電、三星晶圓代工和格羅方德等廠商。亞利桑那州、德勒斯登和高雄的大型企劃配備了叢集的極紫外光刻機、多腔室蝕刻堆疊裝置和原子層沉澱設備，這些設備均配置為可快速切換製程配方。嚴格的執行時間承諾促成了配套服務協議的簽訂，這些協議的價值如今已達到設備購置價值的25%至30%，從而為設備供應商創造了穩定的收入來源。
受人工智慧加速器和汽車網域控制器所需的 2.5D 和3D封裝架構的推動，OSAT 廠商以 12.2% 的複合年成長率成為成長最快的客戶類別。新增資本投資項目包括用於穿透矽通孔的雷射鑽孔機、高密度覆晶鍵合機和模具底部填充劑點膠系統。整合裝置製造商 (IDM) 的規模仍然可觀，但由於他們採取了「輕晶圓廠」策略，即選擇性地投資於電源、類比和感測器生產線，同時將尖端邏輯電路外包，因此其市場佔有率有所下降。
半導體設備市場按設備類型（前端設備、後端設備）、供應鏈參與企業（IDM、代工廠、OSAT）、晶圓尺寸（300mm、200mm、≤150mm）、晶圓製造技術節點（≥28Nm、16/14Nm、其他）、最終用戶行業（計算和資料中心、北美地區和其他國家（北美地區）進行細分、其他通訊/
區域分析
亞太地區在2024年仍維持72.2%的半導體設備市場佔有率，主要得益於台灣、韓國和中國當地密集的產業生態系統。光是台灣的晶圓代工產業叢集的運轉率就超過90%，並訂單了EUV光刻和計量訂單的成長。韓國加大了對1BETA DRAM和全環柵極邏輯裝置的投入，而中國大陸則在出口限制的壓力下，透過推進自主研發，提高了國內刻蝕和沈積設備的運作。
北美光刻技術的復興得益於《晶片技術組裝法案》（CHIPS Act）的津貼，奧爾巴尼奈米科技公司（Albany NanoTech）交付了全球首台高數值孔徑極紫外光刻機，並為美國本土微影術生態系統奠定了基礎。同時，台積電和英特爾在亞利桑那州的投資，打造了一條從奧勒岡州的設備組裝到德克薩斯州的材料供應的產業走廊，重新平衡了區域需求。
歐洲計畫利用《歐洲晶片法案》在2030年前將區域產能加倍，重點發展汽車功率元件、射頻前端和先進感測器等專業技術領域。薩克森州的雙300毫米生產線已經整合了邏輯、類比和功率處理功能。
中東和非洲地區成長最快，複合年成長率達9.9%，主要得益於沙烏地阿拉伯90億美元的晶圓廠建設計畫和阿拉伯聯合大公國的可行性研究。這些計劃需要涵蓋培訓、維修和物流承包工具支援合約。南美洲市場仍處於小眾階段，巴西則選擇性地投資於依賴成熟200毫米模具的汽車和工業晶片。
其他福利：
- Excel格式的市場預測（ME）表
- 3個月的分析師支持
目錄
第1章 引言
- 研究假設和市場定義
- 調查範圍
第2章調查方法
第3章執行摘要
第4章 市場情勢
- 市場概覽
- 市場促進因素
- 對尖端家用電器和智慧型手機的需求快速成長
- 對人工智慧、物聯網和邊緣設備節點的快速投資
- 一系列政府補貼（CHIPS、歐盟CHIPS法案等）將推升工具資本支出。
- 向 GAA 和高數值孔徑 EUV 的過渡需要新的工具集
- 永續性指示推廣「綠色製造」維修工具
- 對3D異質整合封裝的需求激增
- 市場限制
- 極高的資本支出和漫長的投資回收期
- 特殊材料供應瓶頸導致工具出貨延遲
- 對中國工具出口的限制
- 熟練的現場服務工程師嚴重短缺
- 價值鏈分析
- 監管環境
- 技術展望
- 波特五力分析
- 供應商的議價能力
- 買方的議價能力
- 新進入者的威脅
- 替代品的威脅
- 競爭對手之間的競爭
- 宏觀經濟因素的影響
第5章 市場規模與成長預測
- 透過裝置
- 前端裝置
- 微影術設備
- 蝕刻設備
- 沉澱設備
- 測量/檢測設備
- 清潔設備
- 光阻劑處理設備
- 其他前端類型
- 後端設備
- 測試設備
- 組裝和包裝設備
- 前端裝置
- 供應鏈參與企業
- IDM
- 晶圓代工廠
- OSAT
- 按晶圓尺寸
- 300 mm
- 200 mm
- ≤150 毫米
- 按晶圓製造技術節點
- >=28nm
- 16/14 nm
- 10/7 nm
- 5奈米或更小
- 按最終用戶行業分類
- 計算和資料中心
- 通訊（5G、射頻）
- 汽車與出行
- 消費性電子產品
- 工業及其他
- 按地區
- 北美洲
- 美國
- 加拿大
- 墨西哥
- 南美洲
- 巴西
- 阿根廷
- 其他南美洲
- 歐洲
- 德國
- 英國
- 法國
- 義大利
- 西班牙
- 其他歐洲地區
- 亞太地區
- 中國
- 日本
- 韓國
- 印度
- 亞太其他地區
- 中東和非洲
- 中東
- 沙烏地阿拉伯
- 阿拉伯聯合大公國
- 土耳其
- 其他中東地區
- 非洲
- 南非
- 奈及利亞
- 埃及
- 其他非洲地區
- 北美洲
第6章 競爭情勢
- 市場集中度
- 策略趨勢
- 市佔率分析
- 公司簡介
- Applied Materials Inc.
- ASML Holding NV
- Tokyo Electron Ltd.
- Lam Research Corp.
- KLA Corp.
- Screen Holdings Co. Ltd.
- Teradyne Inc.
- Hitachi High-Tech Corp.
- Veeco Instruments Inc.
- ASM International NV
- Canon Inc.
- Nikon Corp.
- Onto Innovation Inc.
- Nova Ltd.
- Advantest Corp.
- Hanmi Semiconductor Co. Ltd.
- Disco Corp.
- BESI（BE Semiconductor Industries）
- Kulicke & Soffa Industries Inc.
- FormFactor Inc.
- Plasma-Therm LLC
- SUSS MicroTec SE
- Kokusai Electric Corp.
- AMEC（Advanced Micro-Fabrication Equipment Inc.）
- Naura Technology Group Co. Ltd.
第7章 市場機會與未來展望
The semiconductor equipment market size was valued at USD 124.00 billion in 2025 and is forecast to reach USD 177.97 billion by 2030, at a 7.49% CAGR.
Robust fab construction, record equipment backlogs, and a wave of government incentives underpin this trajectory. Foundries are accelerating capacity at 2 nm and below, while Outsourced Semiconductor Assembly and Test (OSAT) players scale advanced-package lines to serve artificial-intelligence (AI) demand. Geopolitical efforts to achieve technological sovereignty are shaping capital-spending patterns, forcing tool vendors to juggle export controls in China with subsidy-fuelled opportunities in North America, Europe, and the Middle East. Equipment makers that bundle process breadth, software analytics, and service coverage are securing multi-year purchase commitments from the sector's largest investors.
Global Semiconductor Equipment Market Trends and Insights
Surging demand for advanced consumer electronics and smartphones
Smartphones, wearables, and mixed-reality devices keep adding logic, memory, and analog content that must be built at ever-smaller nodes, pushing foundries to accelerate capacity on 28 nm-7 nm lines. Advanced packaging that miniaturizes high-bandwidth functions without raising power budgets drove a sizable share of early-2025 revenue, triggering an upgrade wave in bumping, test, and lithography equipment. Heterogeneous-integration lines stacking chiplets vertically are expanding at double-digit rates, lifting shipments of flip-chip bonders and wafer-level inspection tools. Tool makers offering modular deposition chambers with rapid recipe switching are winning orders as consumer-product cycles tighten. Strong handset refresh rates across India and Southeast Asia keep mature-node tools running near full utilization, proving that resilient billings are achievable even during premium-device launches.
Rapid AI-, IoT- and edge-device node investments
Data-center operators seek chips that offer higher TOPS-per-watt, boosting procurement of extreme ultraviolet (EUV) scanners and atomic-layer deposition modules used at 3 nm and below. AI accelerator start-ups in the United States and Europe are signing capacity reservation agreements that tie multi-year HBM purchases to guaranteed access to leading-edge lithography, shifting demand risk from chip designers to equipment makers. Edge AI devices for factory automation and smart-city deployments accelerate 16 nm-12 nm demand, spurring fresh orders for 300 mm etch systems tailored to embedded non-volatile memory. Tool suppliers deploy AI in situ process-monitoring algorithms, shortening recipe-development cycles and improving chamber uptime. The self-reinforcing loop between AI workload growth and smarter tools bolsters the semiconductor equipment market well past 2030.
Extremely high CAPEX and long pay-back cycles
A single advanced-logic fab now costs well above USD 20 billion, making the customer base for leading-edge tools increasingly concentrated. Lengthy depreciation periods stretch procurement scrutiny, compelling toolmakers to demonstrate multi-node extendibility before purchase orders are released. Vendors respond with upgrade-ready platforms, modular vacuum geometries, and subscription-based process-control software that spreads cost over a tool's life span. Some IDMs delay capacity expansions, which defers installations and shifts revenue recognition to late project phases. Nevertheless, the relentless need for performance-per-watt keeps road maps intact, limiting the overall drag on the semiconductor equipment market.
Other drivers and restraints analyzed in the detailed report include:
- Government subsidy waves are boosting the tool CAPEX
- Transition to GAA and High-NA EUV necessitates new toolsets
- Specialty-material supply bottlenecks are delaying tool shipments
For complete list of drivers and restraints, kindly check the Table Of Contents.
Segment Analysis
Front-end wafer-processing instruments captured 83.7% of the semiconductor equipment market share in 2024, underscoring the central role of lithography, etch, and deposition in yield improvement. Within this segment, High-NA EUV scanners post a 21.1% CAGR to 2030 because they are indispensable for patterning 2 nm logic and 3-D DRAM structures; multi-system orders from fabs in Taiwan and New York already total several billion USD.
Backend complexity fuels innovations such as thermo-compression bonders with sub-2 µm alignment accuracy and fan-out wafer-level packaging that leverages front-end lithographic precision. Vendors that combine lithography optics, placement robotics, and high-frequency test modules into unified platforms are capturing a growing share of advanced-package budgets, extending lithography-grade investments further down the supply chain.
Foundries accounted for 52.2% of semiconductor equipment market revenue in 2024 as fabless chip firms concentrate orders on TSMC, Samsung Foundry, and GlobalFoundries. Mega-projects in Arizona, Dresden, and Kaohsiung each feature clusters of EUV scanners, multi-chamber etch stacks, and atomic-layer deposition tools configured for rapid recipe swaps, reflecting the foundry model's need to host diverse customer process flows. Strict uptime commitments drive bundled service contracts that now equal 25-30% of tool acquisition value, creating annuity streams for equipment suppliers.
OSAT houses emerge as the fastest-growing customer category at a 12.2% CAGR, propelled by 2.5-D and 3-D package architectures required for AI accelerators and automotive domain controllers. New capex lines include laser-drilling for through-silicon vias, high-density flip-chip bonders, and molded-underfill dispense systems. Integrated device manufacturers (IDMs) retain a sizeable but declining share as they pursue fab-lite strategies that outsource leading-edge logic while investing selectively in power, analog, and sensor lines.
Semiconductor Equipment Market is Segmented by Equipment Type (Front-End Equipment, and Back-End Equipment), Supply Chain Participant (IDM, Foundry, and OSAT), Wafer Size (300 Mm, 200 Mm, and <=150 Mm), Fab Technology Node (>=28 Nm, 16/14 Nm, and More), End-User Industry (Computing and Data-Center, Communications (5G, RF), and More), and Geography (North America, South America, Europe, Asia-Pacific, and Middle East and Africa).
Geography Analysis
Asia-Pacific retained 72.2% semiconductor equipment market share in 2024, powered by dense ecosystems in Taiwan, South Korea, and mainland China; Taiwan's foundry cluster alone ran above 90% utilization, sustaining EUV and metrology orders. South Korea intensified spending on 1-beta DRAM and gate-all-around logic, while China's drive for self-reliance lifted domestic etcher and deposition installations even under export-control pressure.
North America's renaissance stems from CHIPS Act grants; Albany NanoTech took delivery of the world's first High-NA EUV tool, creating a cornerstone for a domestic lithography ecosystem. Simultaneous investments by TSMC and Intel in Arizona form a corridor stretching from equipment assembly in Oregon to materials supply in Texas, re-balancing regional demand.
Europe sharpened its specialty-technology focus-automotive power devices, RF front-ends, and advanced sensors-using the European Chips Act to target a doubling of regional capacity by 2030; Saxony's dual 300 mm lines already combine logic, analog, and power processing.
The Middle East and Africa logged the fastest growth at 9.9% CAGR, fuelled by Saudi Arabia's USD 9 billion fab plan and UAE feasibility studies, which require turnkey tool-support contracts spanning training, refurbishment, and logistics. South America remains niche; Brazil is investing selectively in automotive and industrial chips that rely on mature-node 200 mm tools.
- Applied Materials Inc.
- ASML Holding NV
- Tokyo Electron Ltd.
- Lam Research Corp.
- KLA Corp.
- Screen Holdings Co. Ltd.
- Teradyne Inc.
- Hitachi High-Tech Corp.
- Veeco Instruments Inc.
- ASM International NV
- Canon Inc.
- Nikon Corp.
- Onto Innovation Inc.
- Nova Ltd.
- Advantest Corp.
- Hanmi Semiconductor Co. Ltd.
- Disco Corp.
- BESI (BE Semiconductor Industries)
- Kulicke & Soffa Industries Inc.
- FormFactor Inc.
- Plasma-Therm LLC
- SUSS MicroTec SE
- Kokusai Electric Corp.
- AMEC (Advanced Micro-Fabrication Equipment Inc.)
- Naura Technology Group Co. Ltd.
Additional Benefits:
- The market estimate (ME) sheet in Excel format
- 3 months of analyst support
TABLE OF CONTENTS
1 INTRODUCTION
- 1.1 Study Assumptions and Market Definition
- 1.2 Scope of the Study
2 RESEARCH METHODOLOGY
3 EXECUTIVE SUMMARY
4 MARKET LANDSCAPE
- 4.1 Market Overview
- 4.2 Market Drivers
- 4.2.1 Surging demand for advanced consumer electronics and smartphones
- 4.2.2 Rapid AI-, IoT- and edge-device node investments
- 4.2.3 Government subsidy waves (CHIPS, EU Chips Act, etc.) boosting tool CAPEX
- 4.2.4 Transition to GAA and High-NA EUV necessitating new toolsets
- 4.2.5 Sustainability mandates driving "green fab" retrofit tools
- 4.2.6 3D heterogeneous-integration packaging demand spike
- 4.3 Market Restraints
- 4.3.1 Extremely high CAPEX and long pay-back cycles
- 4.3.2 Specialty-material supply bottlenecks delaying tool shipments
- 4.3.3 Export-control restrictions on China-bound tools
- 4.3.4 Acute shortage of skilled field-service engineers
- 4.4 Value Chain Analysis
- 4.5 Regulatory Landscape
- 4.6 Technological Outlook
- 4.7 Porter's Five Forces Analysis
- 4.7.1 Bargaining Power of Suppliers
- 4.7.2 Bargaining Power of Buyers
- 4.7.3 Threat of New Entrants
- 4.7.4 Threat of Substitutes
- 4.7.5 Intensity of Competitive Rivalry
- 4.8 Impact of Macroeconomic Factors
5 MARKET SIZE AND GROWTH FORECASTS (VALUE)
- 5.1 By Equipment Type
- 5.1.1 Front-end Equipment
- 5.1.1.1 Lithography Equipment
- 5.1.1.2 Etch Equipment
- 5.1.1.3 Deposition Equipment
- 5.1.1.4 Metrology / Inspection Equipment
- 5.1.1.5 Cleaning Equipment
- 5.1.1.6 Photoresist Processing Equipment
- 5.1.1.7 Other Front-end Types
- 5.1.2 Back-end Equipment
- 5.1.2.1 Test Equipment
- 5.1.2.2 Assembly and Packaging Equipment
- 5.1.1 Front-end Equipment
- 5.2 By Supply-Chain Participant
- 5.2.1 IDM
- 5.2.2 Foundry
- 5.2.3 OSAT
- 5.3 By Wafer Size
- 5.3.1 300 mm
- 5.3.2 200 mm
- 5.3.3 <=150 mm
- 5.4 By Fab Technology Node
- 5.4.1 >=28 nm
- 5.4.2 16/14 nm
- 5.4.3 10/7 nm
- 5.4.4 5 nm and below
- 5.5 By End-user Industry
- 5.5.1 Computing and Data-Center
- 5.5.2 Communications (5G, RF)
- 5.5.3 Automotive and Mobility
- 5.5.4 Consumer Electronics
- 5.5.5 Industrial and Others
- 5.6 By Geography
- 5.6.1 North America
- 5.6.1.1 United States
- 5.6.1.2 Canada
- 5.6.1.3 Mexico
- 5.6.2 South America
- 5.6.2.1 Brazil
- 5.6.2.2 Argentina
- 5.6.2.3 Rest of South America
- 5.6.3 Europe
- 5.6.3.1 Germany
- 5.6.3.2 United Kingdom
- 5.6.3.3 France
- 5.6.3.4 Italy
- 5.6.3.5 Spain
- 5.6.3.6 Rest of Europe
- 5.6.4 Asia-Pacific
- 5.6.4.1 China
- 5.6.4.2 Japan
- 5.6.4.3 South Korea
- 5.6.4.4 India
- 5.6.4.5 Rest of Asia-Pacific
- 5.6.5 Middle East and Africa
- 5.6.5.1 Middle East
- 5.6.5.1.1 Saudi Arabia
- 5.6.5.1.2 United Arab Emirates
- 5.6.5.1.3 Turkey
- 5.6.5.1.4 Rest of Middle East
- 5.6.5.2 Africa
- 5.6.5.2.1 South Africa
- 5.6.5.2.2 Nigeria
- 5.6.5.2.3 Egypt
- 5.6.5.2.4 Rest of Africa
- 5.6.1 North America
6 COMPETITIVE LANDSCAPE
- 6.1 Market Concentration
- 6.2 Strategic Moves
- 6.3 Market Share Analysis
- 6.4 Company Profiles (includes Global-level Overview, Market-level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
- 6.4.1 Applied Materials Inc.
- 6.4.2 ASML Holding NV
- 6.4.3 Tokyo Electron Ltd.
- 6.4.4 Lam Research Corp.
- 6.4.5 KLA Corp.
- 6.4.6 Screen Holdings Co. Ltd.
- 6.4.7 Teradyne Inc.
- 6.4.8 Hitachi High-Tech Corp.
- 6.4.9 Veeco Instruments Inc.
- 6.4.10 ASM International NV
- 6.4.11 Canon Inc.
- 6.4.12 Nikon Corp.
- 6.4.13 Onto Innovation Inc.
- 6.4.14 Nova Ltd.
- 6.4.15 Advantest Corp.
- 6.4.16 Hanmi Semiconductor Co. Ltd.
- 6.4.17 Disco Corp.
- 6.4.18 BESI (BE Semiconductor Industries)
- 6.4.19 Kulicke & Soffa Industries Inc.
- 6.4.20 FormFactor Inc.
- 6.4.21 Plasma-Therm LLC
- 6.4.22 SUSS MicroTec SE
- 6.4.23 Kokusai Electric Corp.
- 6.4.24 AMEC (Advanced Micro-Fabrication Equipment Inc.)
- 6.4.25 Naura Technology Group Co. Ltd.
7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK
- 7.1 White-space and Unmet-Need Assessment
