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市場調查報告書
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1850237

微波裝置：市場佔有率分析、產業趨勢、統計數據和成長預測（2025-2030 年）

Microwave Devices - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 126 Pages | 商品交期: 2-3個工作天內

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簡介目錄

預計到 2025 年，微波設備市場規模將達到 69.3 億美元，到 2030 年將達到 88.3 億美元，複合年成長率為 4.92%。

微波裝置市場-IMG1

這一成長反映了日趨成熟且持續的需求，涵蓋國防、衛星通訊、5G回程傳輸以及新興醫療領域。氮化鎵（GaN）功率元件正日益取代傳統的砷化鎵解決方案，在提高功率密度和效率的同時，也能縮小系統尺寸並降低冷卻負荷。正在進行的國防現代化項目，例如目前與美國國防部簽訂合約的定向能量武器原型，為高功率訂單提供了堅實的基準。即使行動裝置的銷售量有所放緩，E頻段和V頻段5G固定無線存取的並行部署也將維持商業性發展動能。醫用微波消融平台完善了多元化的需求結構，與射頻消融相比，它能為醫院提供更快捷的手術和更深的病灶穿透深度。

全球微波裝置市場趨勢與洞察

對安全軍用衛星通訊的需求激增

現代軍事網路需要抗干擾鏈路和多頻段通用性。美國近期部署模組化VSAT終端，並與L3Harris公司簽訂了一份價值6000萬美元的契約，這表明軍事系統正朝著兼具高數據速率和快速部署能力的緊湊型系統發展。氮化鎵（GaN）放大器能夠實現目前規定的傳輸等級和頻寬，加速了真空管的淘汰。同時，中國對吉瓦級高功率微波（HPM）武器的大力投資，推動了一場技術競賽，並加速了國防採購進程。

E頻段和V頻段的5G和FWA回程傳輸部署

在光纖成本居高不下的地區，固定無線回程傳輸可提供Gigabit級吞吐量。美國聯邦通訊委員會 (FCC) 設立的 90 億美元「農村地區 5G 基金」旨在滿足近期對 E 波段和 V 波段鏈路的需求。 SpaceX 公司價值 1,970 萬美元的 E 波段固體功率放大器訂單，驗證了高頻微波有效載荷的商業性規模應用。

寬能能隙裝置的研發成本很高

GaN 和 SiC 外延反應器的成本高達數千萬美元，這造成了很高的准入門檻：領先的供應商將 15-20% 的收入用於製程最佳化，這為新參與企業設定了較低的門檻。

細分市場分析

至2024年，主動元件將佔微波元件市場62%的佔有率，並在2030年之前以7.57%的複合年成長率晶粒。尺寸、重量和可靠性方面的優勢正在加速從真空電子元件向氮化鎵（GaN）固體功率放大器的過渡。有源微波裝置市場預計在2030年達到53億美元。整合趨勢是將波束成形和增益控制邏輯整合到放大器晶片中，從而實現軟體定義無線電平台。真空管產品仍用於高功率雷達，但隨著國防項目逐步採用固態模組，其市佔率正在下降。

第二層影響也延伸至被動元件領域，隨著更多功能整合到晶片上，分離濾波器和耦合器面臨價格壓力。醫療消融平台傾向於採用毫秒功率調製的主動解決方案，這鞏固了該領域的長期成長勢頭。產品平臺對24V和28V氮化鎵元件的需求不斷成長，以支援新興的5G宏無線電架構。

微波裝置市場報告按裝置類型（主動[固體、真空電子]、被動[濾波器、耦合器等]）、頻段（L 和 S、C 和 X、其他）、應用（空間和通訊、國防[雷達、電子戰、定向能戰]、醫療[消融、成像]、其他）和地區進行細分。

區域分析

北美地區預計到2024年將維持38%的市場佔有率，這主要得益於聯邦政府90億美元的5G補貼以及強勁的美國國防預算。微波裝置市場將繼續受益於定向能量武器計畫和農村寬頻建設。出口授權合規性會帶來成本方面的摩擦，但現有主要供應商仍堅持在地採購策略以降低供應中斷的影響。

到2030年，亞太地區的複合年成長率將達到7.24%，位居全球之首。中國控制98%的鎵礦資源，賦予了國內晶圓廠成本優勢，同時也使海外整合商面臨價格波動的風險。區域各國政府正在資助興建300毫米功率半導體晶圓廠，而印度新成立的設計工作室將為射頻前端創新提供人才。韓國和日本將提供先進的測試和封裝能力，從而強化自足式的價值鏈。

歐洲在滿足國家國防需求的同時，也積極拓展商業通訊。歐盟的政策獎勵旨在實現氮化鎵（GaN）外延和封裝產能的在地化。跨大西洋夥伴關係將歐洲的射頻設計送往北美工廠進行試運作，然後將生產線遷回國內，降低地緣政治風險。永續性要求進一步引導網路營運商在新一代5G和未來的6G節點中採用節能的GaN平台。

其他福利：

  • Excel格式的市場預測（ME）表
  • 3個月的分析師支持

目錄

第1章 引言

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章 市場情勢

  • 市場概覽
  • 市場促進因素
    • 對安全軍用衛星通訊的需求激增
    • E頻段和V頻段的5G和FWA回程傳輸部署
    • 醫用微波消融術簡介
    • 基於氮化鎵的固體功率放大器的成本正在下降
    • 農村寬頻監管獎勵
    • 高功率定向能武器系統的需求
  • 市場限制
    • 寬能能隙裝置的研發成本很高
    • 關鍵射頻元件的出口管制
    • 超過 100 GHz 後，溫度控管將達到極限。
    • X 洞中與光子鏈的競爭
  • 價值鏈分析
  • 監管環境
  • 技術展望
  • 波特五力分析
    • 新進入者的威脅
    • 買方的議價能力
    • 供應商的議價能力
    • 替代品的威脅
    • 競爭對手之間的競爭

第5章 市場規模與成長預測

  • 依設備類型
    • 活性（固體，真空電子）
    • 被動元件（濾波器、耦合器等）
  • 按頻寬
    • L 和 S
    • C 和 X
    • Ku 和 Ka
    • V 和 E（毫米波）
  • 透過使用
    • 空間與通訊
    • 防禦（雷達、電子戰、定向能武器）
    • 醫療（消融術、影像學）
    • 商業和工業供暖
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
      • 墨西哥
    • 南美洲
      • 巴西
      • 阿根廷
      • 其他南美洲
    • 歐洲
      • 英國
      • 法國
      • 德國
      • 義大利
      • 其他歐洲地區
    • 亞太地區
      • 中國
      • 日本
      • 印度
      • 韓國
      • 亞太其他地區
    • 中東和非洲
      • 阿拉伯聯合大公國
      • 沙烏地阿拉伯
      • 南非
      • 其他中東和非洲地區

第6章 競爭情勢

  • 市場集中度
  • 策略趨勢
  • 市佔率分析
  • 公司簡介
    • Communications and Power Industries（CPI）
    • Teledyne Technologies
    • Thales Group
    • L3Harris Technologies
    • Toshiba Corporation
    • Qorvo Inc.
    • Analog Devices Inc.
    • Keysight Technologies
    • TMD Technologies Ltd.
    • Richardson Electronics Ltd.
    • Northrop Grumman
    • Raytheon Technologies
    • MACOM Technology
    • Microchip Technology
    • Cobham Advanced Electronic Solutions
    • NXP Semiconductors
    • API Technologies（AEA Investors LP）
    • Smiths Interconnect
    • Ampleon
    • MicroWave Technology Inc.

第7章 市場機會與未來展望

簡介目錄
Product Code: 57164

The microwave devices market reached a value of USD 6.93 billion in 2025 and is forecast to climb to USD 8.83 billion by 2030, reflecting a 4.92% CAGR.

Microwave Devices - Market - IMG1

Gains track a mature yet durable demand profile spanning defense, satellite communications, 5G back-haul, and emerging medical therapies. Gallium nitride (GaN) power devices continue to displace legacy gallium arsenide solutions, improving power density and efficiency while trimming system footprint and cooling loads. Ongoing defense modernization programs, highlighted by directed-energy weapon prototypes now on contract with the U.S. Department of Defense, underpin a robust baseline of high-power orders. Parallel roll-outs of 5G fixed-wireless access in the E- and V-bands sustain commercial momentum even as mass-tier handset volumes soften. Medical microwave ablation platforms round out a diversified demand stack, offering hospitals faster procedures and deeper lesion penetration than radiofrequency alternatives.

Global Microwave Devices Market Trends and Insights

Surge in Secure Military SATCOM Demand

Modern armed-forces networks require jam-resilient links and multi-band versatility. Recent U.S. Army fielding of modular VSAT terminals, backed by a USD 60 million contract with L3Harris, illustrates the shift toward compact systems that merge high data rates with quick deployment. GaN amplifiers enable the power levels and bandwidth now specified, speeding the retirement of vacuum tubes. Parallel Chinese investment in gigawatt-class high-power microwave (HPM) weapons fuels a technology race that keeps defense procurement pipelines active.

5G and FWA Backhaul Deployment in E- and V-Bands

Fixed-wireless backhaul offers gigabit-class throughput where fiber costs remain prohibitive. The FCC's USD 9 billion 5G Fund for Rural America anchors near-term demand for E- and V-band links. Satellites add another pull: a USD 19.7 million order from SpaceX for E-band solid-state power amplifiers affirms commercial scale for high-frequency microwave payloads.

High R&D Cost of Wide-Bandgap Devices

Epitaxial reactors for GaN and SiC run into the tens of millions of dollars, creating high entry barriers. Leading suppliers devote 15-20% of turnover to process optimization, a hurdle few new entrants can clear.

Other drivers and restraints analyzed in the detailed report include:

  1. Medical Microwave Ablation Adoption
  2. GaN-Based Solid-State PA Cost Declines
  3. Export Controls on Critical RF Components

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Active devices accounted for 62% of the microwave devices market in 2024 and advanced at a 7.57% CAGR to 2030. Size, weight, and reliability advantages are accelerating the swap from vacuum electron devices to GaN solid-state power amplifiers. The Microwave devices market size for active devices is on track to reach USD 5.3 billion by 2030. Integration trends fold beam-forming and gain-control logic into the amplifier die, enabling software-defined radio platforms. Vacuum tube products still serve ultra-high-power radar, but cede volume share as defense programs standardize on solid-state modules.

Second-level effects cascade into the passive segment, where discrete filters and couplers face pricing pressure as functions move on-chip. Medical ablation platforms prefer active solutions for millisecond-scale power modulation, reinforcing the segment's long-term growth trajectory. Product pipelines show rising demand for 24 V and 28 V GaN devices that align with emerging 5G macro radio architectures.

The Microwave Devices Market Report is Segmented by Device Type (Active [Solid-State, Vacuum Electron] and Passive [Filters, Couplers, Etc. ]), Frequency Band (L and S, C and X, and More), Application (Space and Communication, Defense [Radar, EW, DEW], , Medical [Ablation, Imaging] and More), and Geography.

Geography Analysis

North America retained a 38% stake in 2024, anchored by USD 9 billion in federal 5G subsidies and strong U.S. defense budgets. The microwave devices market continues to benefit from directed-energy weapon programs and rural broadband build-outs. Export-license compliance introduces cost friction, but established primes sustain local sourcing strategies that cushion supply disruptions.

Asia Pacific delivers the highest 7.24% CAGR to 2030. China controls 98% of mined gallium, giving domestic fabs cost leverage while exposing foreign integrators to price volatility. Regional governments fund 300 mm power-semiconductor fabs, and India's newly opened design houses add talent depth for RF front-end innovation. South Korea and Japan supply advanced test and packaging capacity, reinforcing a self-contained value chain.

Europe balances sovereign defense needs with commercial telecom expansion. EU policy incentives aim to localize GaN epitaxy and packaging capacity. Cross-Atlantic partnerships send European RF designs to North American fabs for pilot runs, then bring volume back to domestic lines, mitigating geopolitical risk. Sustainability directives further nudge network operators toward energy-efficient GaN platforms in new 5G and future 6G nodes.

  1. Communications and Power Industries (CPI)
  2. Teledyne Technologies
  3. Thales Group
  4. L3Harris Technologies
  5. Toshiba Corporation
  6. Qorvo Inc.
  7. Analog Devices Inc.
  8. Keysight Technologies
  9. TMD Technologies Ltd.
  10. Richardson Electronics Ltd.
  11. Northrop Grumman
  12. Raytheon Technologies
  13. MACOM Technology
  14. Microchip Technology
  15. Cobham Advanced Electronic Solutions
  16. NXP Semiconductors
  17. API Technologies (AEA Investors LP)
  18. Smiths Interconnect
  19. Ampleon
  20. MicroWave Technology Inc.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Surge in secure military SATCOM demand
    • 4.2.2 5G and FWA backhaul deployment in E- and V-bands
    • 4.2.3 Medical microwave ablation adoption
    • 4.2.4 GaN-based solid-state PA cost declines
    • 4.2.5 Regulatory incentives for rural broadband
    • 4.2.6 Demand for high-power DEW systems
  • 4.3 Market Restraints
    • 4.3.1 High RandD cost of wide-bandgap devices
    • 4.3.2 Export controls on critical RF components
    • 4.3.3 Thermal management limits at >100 GHz
    • 4.3.4 Competition from photonic links in X-haul
  • 4.4 Value Chain Analysis
  • 4.5 Regulatory Landscape
  • 4.6 Technological Outlook
  • 4.7 Porter's Five Forces Analysis
    • 4.7.1 Threat of New Entrants
    • 4.7.2 Bargaining Power of Buyers
    • 4.7.3 Bargaining Power of Suppliers
    • 4.7.4 Threat of Substitutes
    • 4.7.5 Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

  • 5.1 By Device Type
    • 5.1.1 Active (Solid-state, Vacuum Electron)
    • 5.1.2 Passive (Filters, Couplers, etc.)
  • 5.2 By Frequency Band
    • 5.2.1 L and S
    • 5.2.2 C and X
    • 5.2.3 Ku and Ka
    • 5.2.4 V and E (mmWave)
  • 5.3 By Application
    • 5.3.1 Space and Communication
    • 5.3.2 Defense (Radar, EW, DEW)
    • 5.3.3 Medical (Ablation, Imaging)
    • 5.3.4 Commercial and Industrial Heating
  • 5.4 By Geography
    • 5.4.1 North America
      • 5.4.1.1 United States
      • 5.4.1.2 Canada
      • 5.4.1.3 Mexico
    • 5.4.2 South America
      • 5.4.2.1 Brazil
      • 5.4.2.2 Argentina
      • 5.4.2.3 Rest of South America
    • 5.4.3 Europe
      • 5.4.3.1 United Kingdom
      • 5.4.3.2 France
      • 5.4.3.3 Germany
      • 5.4.3.4 Italy
      • 5.4.3.5 Rest of Europe
    • 5.4.4 Asia Pacific
      • 5.4.4.1 China
      • 5.4.4.2 Japan
      • 5.4.4.3 India
      • 5.4.4.4 South Korea
      • 5.4.4.5 Rest of Asia Pacific
    • 5.4.5 Middle East and Africa
      • 5.4.5.1 United Arab Emirates
      • 5.4.5.2 Saudi Arabia
      • 5.4.5.3 South Africa
      • 5.4.5.4 Rest of Middle East and Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
    • 6.4.1 Communications and Power Industries (CPI)
    • 6.4.2 Teledyne Technologies
    • 6.4.3 Thales Group
    • 6.4.4 L3Harris Technologies
    • 6.4.5 Toshiba Corporation
    • 6.4.6 Qorvo Inc.
    • 6.4.7 Analog Devices Inc.
    • 6.4.8 Keysight Technologies
    • 6.4.9 TMD Technologies Ltd.
    • 6.4.10 Richardson Electronics Ltd.
    • 6.4.11 Northrop Grumman
    • 6.4.12 Raytheon Technologies
    • 6.4.13 MACOM Technology
    • 6.4.14 Microchip Technology
    • 6.4.15 Cobham Advanced Electronic Solutions
    • 6.4.16 NXP Semiconductors
    • 6.4.17 API Technologies (AEA Investors LP)
    • 6.4.18 Smiths Interconnect
    • 6.4.19 Ampleon
    • 6.4.20 MicroWave Technology Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-space and Unmet-need Assessment