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市場調查報告書
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1849992

光電子：市場佔有率分析、行業趨勢、統計數據和成長預測（2025-2030 年）

Optoelectronics - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 220 Pages | 商品交期: 2-3個工作天內

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簡介目錄

預計2025年光電市場規模將達457.9億美元，2030年將達591.2億美元，複合年成長率為5.24%。

光電子市場-IMG1

需求廣泛，涵蓋消費性設備中的下一代3D感測、人工智慧密集型資料中心的高速光鏈路以及電動車中的先進照明和成像系統。裝置創新受惠於能夠在更高頻率和溫度下高效運作的寬能能隙材料，亞洲和北美的政策獎勵也鼓勵區域製造，以增強供應鏈的韌性。能夠整合超表面光學元件和多結VCSEL架構的公司將佔據先機，尤其是在功率效率和緊湊外形尺寸成為關鍵促進因素的情況下。在所有最終用途中，買家擴大評估供應商是否能夠證明關鍵投入的可追溯來源以及是否符合新興的出口管制法規。

全球光電市場趨勢與洞察

基於 VCSEL 的 3D 感測技術在亞洲智慧型手機的滲透率

隨著安全人臉部認證、空間視訊捕捉和室內導航需求的不斷成長，垂直共振腔面射型雷射(VCSEL) 在旗艦設備中的作用也日益增強。中國供應商提交的專利申請表明，他們正致力於全面實現 VCSEL 疊層國產化，並減少對進口外延晶圓的依賴。擁有高產量比率外延生長和先進測試能力的組件製造商已在屏下 3D 感測部署之前簽署了多年期供應協議。隨著光學 AI 協處理器的成熟，光電市場預計將在中階行動電話中廣泛採用支援 VCSEL 的手勢和環境映射技術。

歐洲對汽車LED照明的嚴格要求

歐盟 (EU) 安全標準建議使用自我調整LED 頭燈，以最大程度減少眩光並提升夜間駕駛舒適度，這促使汽車製造商採用先進的光域控制器。一級供應商正積極響應，推出 RGB 矩陣，以實現動態光束整形、品牌標誌性動畫和節能效果，從而延長電動車的續航里程。設計週期越來越需要照明和熱管理團隊之間的密切合作，以在不增加冷卻品質的情況下實現流明輸出和監管目標。這項法規間接促進了光電市場的發展，因為模組中嵌入的微光學元件、驅動器和感測器的價值超越了 LED晶粒本身。獲得歐洲車型認證的全球汽車製造商傾向於將相同的先進照明套件擴展到其他地區，從而推動了單位需求。

長期GaN基板供應限制

自主型GaN晶圓的生產仍然集中在少數幾家專業工廠，這為高功率元件的生產帶來了瓶頸。一些暫時的變通方案，例如在矽晶圓上生長GaN，有助於降低成本，但會引入位錯密度，從而限制額定電壓。政府現在將寬能能隙基板視為關鍵資產，為國內晶體生長工廠提供扣除額，以降低戰略風險。像Qromis基板技術這樣的先驅方法將異質外延堆疊技術應用於200毫米晶圓，有望實現更高的產量並與主流晶圓廠更好地相容。雖然這些措施將在中期內提高產能，但短期產能短缺仍將推動電動車和國防項目的優先發展。

細分分析

由於園藝照明、汽車外部模組和商用顯示器市場的復甦，LED 將在 2024 年繼續保持其在光電市場的領先地位，佔總營收的 34%。該細分市場受益於成熟的生產線和晶片級改進，這些改進無需大量資本支出即可提高每瓦流明。同時，受 3D 感測、短距離光互連和汽車雷射雷達 (LiDAR) 日益普及的推動，雷射二極體（尤其是垂直共振器和邊緣發射結構）的複合年成長率達到 6.8%。多結架構可以在相同的晶粒面積上提取更多光功率。隨著行動電話製造商青睞承包發送器封裝，將晶圓級測試與整合式驅動器 IC 結合的供應商將繼續獲得設計優勢。

人們對超表面整合日益成長的興趣，放大了晶片表面精確光束整形的價值，從而增加了目標商標產品製造商的轉換成本。隨著超表面庫的成熟，雷射二極體設計人員正在將定製圖形化融入最終的外延工藝中，實現傳統透鏡無法實現的圖案和相位控制。客製化發散分佈的能力將釋放企業對擴增實境(AR)顯示器和短焦投影機的需求，從而擴大整個可尋址光電子市場。雖然LED仍然是大面積照明的關鍵，但雷射二極體正在開闢一個需要連貫光和精確光束控制的高階市場。

氮化鎵憑藉其卓越的電子遷移率和熱導率，能夠在快速開關速度下高效運行，並將在2024年佔據41%的市場佔有率，繼續在光電子市場佔據主導地位。晶圓尺寸縮小至200毫米將有助於降低成本，而合金工程技術則能夠將光發射範圍從紫外線調整到可見光，以實現感測和殺菌。然而，碳化矽將呈現最快的成長軌跡，複合年成長率高達7.4%，因為其三倍的高熱導率將幫助快速充電電動車和太陽能逆變器的功率裝置。美國和歐洲政府支持的試驗線目前正在對8吋SiC基板進行認證，並且正在走向量產。

磷化銦憑藉其直接能隙特性，能夠在低驅動電壓下支援高調變速率，再次成為400G以上資料中心的光學元件。砷化鎵仍然是遠端操作和飛行時間感測器中紅外線發送器的主力。同時，矽光電正將自己定位為高密度收發器的經濟高效的解決方案，從而規避CMOS晶圓廠和混合雷射貼裝中III-V族晶圓短缺的問題。總而言之，這些趨勢凸顯了材料的多元化，特定應用需求決定了基板的選擇，從而豐富了更廣泛的光電子市場。

區域分析

到2024年，亞太地區將佔據光電市場的52%，並在收入方面保持領先地位。這項領先優勢建立在深度供應鏈整合、經驗豐富的勞動力和多年的政策支援之上。隨著地方政府補貼專門生產化合物半導體的200毫米和300毫米晶圓廠，中國的晶圓代工產能持續成長。日本正利用其醫學影像專業知識，率先推出基於CMOS感測器的診斷平台，在刺激國內需求的同時，向歐洲和北美出口子系統。韓國顯示器供應商正在推進可降低外延缺陷密度的microLED製程節點，並開發用於擴增實境（AR）的新型高亮度面板。儘管存在地緣政治風險，但台灣地區仍然是先進封裝技術不可或缺的一部分，這鼓勵跨國原始設備製造商在東南亞實現第二組裝來源多元化。

預計到2030年，中東和非洲地區的複合年成長率將達到7.9%，這主要得益於國防採購和整合LED照明、光纖骨幹網和安全成像的智慧城市計劃的推動。阿拉伯聯合大公國和沙烏地阿拉伯正在將過剩的石油出口輸送到主權技術叢集，並邀請全球光電公司建立區域設計中心。非洲沿海經濟體正在投資建造支援較短陸地鏈路的海底光纖登陸站，刺激對被動光學元件和下游維護服務的需求。雖然與亞洲相比，該地區的潛在需求量較小，但高成長率正在加速諸如用於周界系統的製冷型中波紅外線檢測器等利基設備的普及。

由於雄厚的創業投資資金、強大的大學研究實力以及美國晶片計畫（CHIPS），北美在光電市場保持顯著的影響力。該計劃為半導體製造和研發撥款500億美元。美國國家半導體技術中心提供共用原型製作線，降低了光電新興企業的進入門檻，更新的出口法規也加強了對軍民兩用積體電路的審查。加拿大正在培育探索基於糾纏通訊的量子光電企業，為該地區的商機增添了一個前沿領域。

儘管歐洲在全球半導體領域的佔有率正在逐漸下降，但它在計量光學、汽車照明和微影術設備領域仍保持領先地位。歐洲審核院預測，如果不採取進一步干預措施，到2030年其全球佔有率將僅為11.7%，但《晶片法案》已撥款430億歐元用於擴大本地生產。德國和法國正在建立寬能能隙功率元件的試驗生產線，北歐國家正在為航太和國防客戶擴大化合物半導體外延業務。該地區嚴格的環境法規將刺激對節能光電元件的需求，尤其是在建築自動化領域。

南美洲的光電子產業規模雖小，但發展迅速，這得益於巴西和阿根廷的寬頻擴張、LED路燈計畫以及農業影像技術。國際供應商正在利用合資企業來規避進口關稅，並滿足本地化要求，從而培育出未來十年可望進一步擴大的生態系統能力。

其他福利：

  • Excel 格式的市場預測 (ME) 表
  • 3個月的分析師支持

目錄

第1章 引言

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章 市場狀況

  • 市場概況
  • 市場促進因素
    • 基於 VCSEL 的 3D 感測技術在亞洲智慧型手機的滲透率
    • 歐洲對汽車LED照明的嚴格規定
    • 北美資料中心快速部署400G光纖收發器
    • 東南亞政府為智慧城市計劃提供GaN LED獎勵
    • 數位醫療影像技術蓬勃發展，推動日本CMOS感測器市場發展
    • 中東國防現代化刺激紅外線檢測器需求
  • 市場限制
    • 長期GaN基板供應限制
    • 商用 VCSEL 陣列的溫度控管成本高昂
    • 先進影像感測器供應鏈中的出口管制壁壘
    • LED價格下跌對中國二線廠商利潤率構成壓力
  • 產業生態系統分析
  • 技術展望
  • 波特五力分析
    • 供應商的議價能力
    • 買方的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭對手之間的競爭

第5章市場規模與成長預測（價值）

  • 依設備類型
    • LED
    • 雷射二極體
    • 影像感測器
    • 光耦合器
    • 太陽能電池
    • 其他
  • 按設備材質
    • 氮化鎵（GaN）
    • 砷化鎵（GaAs）
    • 碳化矽（SiC）
    • 磷化銦（InP）
    • 矽及其他
  • 按用途
    • 照明和顯示
    • 光纖通訊和 Li-Fi
    • 感測與成像
    • 電力轉換和太陽能
    • 國防和安全
  • 按最終用戶產業
    • 家電
    • 車
    • 資訊科技和通訊
    • 醫療保健和生命科學
    • 航太和國防
    • 工業自動化
    • 住宅及商業地產
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
      • 墨西哥
    • 歐洲
      • 德國
      • 英國
      • 法國
      • 義大利
      • 西班牙
      • 其他歐洲地區
    • 亞太地區
      • 中國
      • 日本
      • 韓國
      • 印度
      • 東南亞
      • 澳洲
      • 其他亞太地區
    • 南美洲
      • 巴西
      • 南美洲其他地區
    • 中東和非洲
      • 中東
      • 阿拉伯聯合大公國
      • 沙烏地阿拉伯
      • 其他中東地區
      • 非洲
      • 南非
      • 其他非洲國家

第6章 競爭態勢

  • 市場集中度
  • 策略趨勢
  • 市佔率分析
  • 公司簡介
    • Sony Corporation
    • Samsung Electronics Co., Ltd.
    • ams-OSRAM AG
    • SK Hynix Inc.
    • Broadcom Inc.
    • Panasonic Holdings Corp.
    • Signify NV
    • Nichia Corporation
    • Texas Instruments Inc.
    • STMicroelectronics NV
    • Infineon Technologies AG
    • ON Semiconductor Corp.
    • Vishay Intertechnology Inc.
    • Renesas Electronics Corp.
    • Rohm Co., Ltd.
    • Omnivision Technologies Inc.
    • Cree LED（Wolfspeed, Inc.）
    • LITE-ON Technology Corp.
    • Sharp Corporation
    • Mitsubishi Electric Corp.

第7章 市場機會與未來展望

簡介目錄
Product Code: 50812

The optoelectronics market size reached USD 45.79 billion in 2025 and is forecast to climb to USD 59.12 billion by 2030 as it advances at a 5.24% CAGR.

Optoelectronics - Market - IMG1

Demand is broad-based, spanning next-generation 3D sensing in consumer devices, higher-speed optical links for AI-heavy data centers, and advanced lighting and imaging systems in electric vehicles. Device innovation benefits from wide-bandgap materials that operate efficiently at elevated frequencies and temperatures, while policy incentives in Asia and North America encourage regional fabrication to bolster supply-chain resilience. Companies able to integrate metasurface optics or multi-junction VCSEL architectures are positioned to capture premium opportunities, especially where power efficiency and compact form factors are decisive. Across all end uses, buyers increasingly evaluate suppliers on the ability to certify both traceable sourcing of critical inputs and compliance with emerging export-control rules, factors that now influence design-win decisions as much as raw performance.

Global Optoelectronics Market Trends and Insights

Proliferation of VCSEL-based 3D sensing in Asian smartphones

Rising demand for secure facial authentication, spatial video capture, and indoor navigation is reinforcing the role of vertical-cavity surface-emitting lasers in flagship handsets. Major brands integrate multi-junction VCSEL arrays that raise optical power while cutting battery drain, ultimately improving user experience.Patent filings by Chinese vendors illustrate a push to localize the full VCSEL stack and reduce dependence on imported epi-wafers, a move aligned with broader semiconductor self-reliance goals. Component suppliers positioned with high-yield epi-growth and advanced testing capacity are securing multi-year supply agreements ahead of under-display 3D sensing roll-outs. As optical-AI co-processors mature, the optoelectronics market anticipates wider adoption of VCSEL-enabled gesture and environment mapping across mid-tier phones as well.

Stringent automotive LED-lighting mandates in Europe

European Union safety standards now favor adaptive LED headlights that minimize glare and improve night driving comfort, pushing carmakers to adopt sophisticated light-domain controllers.Tier-1 suppliers respond with RGB matrices that enable dynamic beam shaping, brand-signature animations, and energy savings that extend electric-vehicle range. Design cycles increasingly require close collaboration between lighting and thermal teams to meet lumen output and regulation targets without adding cooling mass. The legislation indirectly boosts the optoelectronics market because micro-optics, drivers, and sensors embedded in the modules add value beyond the LED die itself. Global automakers homologating models for Europe tend to propagate the same advanced lighting packages into other regions, broadening unit demand.

Chronic GaN-substrate supply constraints

Production of free-standing GaN wafers remains concentrated in a handful of specialized facilities, creating bottlenecks for high-power devices. Makeshift workarounds such as growing GaN on silicon help lower costs but introduce dislocation densities that limit voltage ratings. Governments now treat wide-bandgap substrates as critical assets, offering tax credits for domestic crystal-growth plants to ease strategic risk. Pioneering approaches like Qromis Substrate Technology adapt hetero-epitaxial stacks to 200 mm formats, promising higher throughput and better compatibility with mainstream fabs. While these measures will add capacity over the medium term, short-term shortages continue to prompt allocation prioritization in favor of electric-vehicle and defense programs.

Other drivers and restraints analyzed in the detailed report include:

  1. Rapid roll-out of 400 G fiber modules in North-American data centers
  2. Government incentives for GaN LEDs in Southeast-Asian smart-city projects
  3. High thermal-management cost of consumer VCSEL arrays

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

LEDs retained the largest position in the 2024 optoelectronics market, accounting for 34% revenue as horticulture lighting, automotive exterior modules, and commercial displays rebounded. The segment benefited from mature manufacturing lines and incremental chip-level improvements that squeezed more lumens per watt without major capital upgrades. In parallel, laser diodes-especially vertical-cavity and edge-emitting structures-advanced at a 6.8% CAGR outlook due to expanding 3D sensing, short-reach optical interconnect, and automotive LiDAR adoption. Multi-junction architectures now squeeze additional optical power from the same die area, a feature critical for under-display projectors where footprint is limited. Suppliers that combine wafer-scale testing with integrated driver ICs continue to gain design wins as handset makers favor turnkey emitter packages.

Rising interest in metasurface integration amplifies the value of precise beam shaping at the chip face, which in turn raises switching costs for device original equipment manufacturers. As metasurface libraries mature, laser-diode designers embed custom patterning in the final epitaxy step, delivering pattern and phase control unattainable with conventional lenses. The ability to tailor divergence profiles opens enterprise demand for AR displays and short-throw projectors, widening the total addressable optoelectronics market. LEDs will remain indispensable for large-area illumination, yet laser diodes are carving out premium niches where coherent light or tight beam steering is essential.

Gallium nitride maintained dominance in 2024 with a 41% optoelectronics market share, sustained by its superior electron mobility and thermal conductivity that allow efficient operation at high switching speeds. Wafer scaling to 200 mm supports cost reductions, while alloy engineering delivers ultraviolet-to-visible emission tuning for sensing and sterilization. However, silicon carbide exhibits the fastest growth trajectory at a 7.4% CAGR as its threefold higher thermal conductivity enables power devices for fast-charging electric vehicles and solar inverters. Government-backed pilot lines in the United States and Europe now qualify 8-inch SiC substrates, signaling a ramp toward mass production.

Indium phosphide garners renewed attention for data-center optics beyond 400 G because its direct bandgap accommodates high-modulation speeds with low drive voltage. Gallium arsenide remains the workhorse for infrared emitters in remote-control and time-of-flight sensors. Meanwhile, silicon photonics positions itself as a cost-effective solution for dense transceivers, leveraging CMOS fabs and hybrid laser attach to sidestep III-V wafer shortages. Collectively, these trends underscore material pluralism wherein application-specific requirements dictate substrate selection, enriching the broader optoelectronics market.

The Optoelectronics Market Report is Segmented by Device Type (LED, Laser Diode, Image Sensors, and More), Device Material (Gallium Nitride (GaN), Gallium Arsenide (GaAs), Silicon Carbide (SiC), and More), Application (Lighting and Display, Sensing and Imaging, and More), End-User Industry (Automotive, Aerospace and Defense, Consumer Electronics, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Geography Analysis

Asia Pacific dominates the optoelectronics market with 52% of 2024 revenue, a lead built on deep supply-chain integration, experienced labor, and long-standing policy support. China's foundry capacity continues to grow as provincial governments subsidize 200 mm and 300 mm fabs that focus on compound semiconductors, an expansion that mitigates some substrate shortages yet also raises concerns about overcapacity. Japan leverages its medical-imaging expertise to pioneer CMOS-sensor-based diagnostic platforms, boosting domestic demand while exporting subsystems to Europe and North America. South Korea's display vendors push micro-LED process nodes that shrink epi-defect density, creating new high-brightness panels for augmented reality. Taiwan remains indispensable in the advanced-packaging stack despite geopolitical risk, prompting multinational OEMs to diversify second-source assembly in Southeast Asia.

The Middle East and Africa region posts a 7.9% CAGR outlook through 2030, fueled by national defense procurements and smart-city megaprojects that integrate LED lighting, fiber backbones, and security imaging. United Arab Emirates and Saudi Arabia channel oil-export surpluses into sovereign technology clusters, inviting global optoelectronic players to establish regional design centers. African coastal economies invest in submarine fiber landing stations that anchor shorter terrestrial links, stimulating passive-optics demand and downstream maintenance services. Although base volumes remain modest compared with Asia, high growth accelerates adoption of niche devices such as cooled mid-wave IR detectors for perimeter systems.

North America sustains substantial optoelectronics market influence thanks to robust venture funding, strong university research, and the U.S. CHIPS incentive that earmarks USD 50 billion for semiconductor manufacturing and R&D. The National Semiconductor Technology Center provides shared prototyping lines that lower barrier-to-entry for photonics start-ups, while export-control updates tighten oversight of dual-use ICs. Canada nurtures quantum-photonics ventures that explore entanglement-based communication, adding a frontier segment to the regional opportunity set.

Europe contends with a gradual erosion of global semiconductor share yet retains leadership in metrology optics, automotive lighting, and lithography equipment. The Chips Act allocates EUR 43 billion to amplify local production, though the European Court of Auditors projects only 11.7% global share by 2030 absent further interventions. Germany and France coordinate pilot lines for wide-bandgap power devices, while Nordic nations expand compound-semiconductor epitaxy dedicated to space and defense customers. The region's stringent environmental rules stimulate demand for energy-efficient optoelectronic components, particularly in building automation.

South America remains a smaller but rising geography for the optoelectronics market, driven by broadband expansion, LED street-lighting programs, and agricultural imaging in Brazil and Argentina. International suppliers use joint-ventures to sidestep import duties and meet local-content requirements, seeding ecosystem capability that could scale in the next decade.

  1. Sony Corporation
  2. Samsung Electronics Co., Ltd.
  3. ams-OSRAM AG
  4. SK Hynix Inc.
  5. Broadcom Inc.
  6. Panasonic Holdings Corp.
  7. Signify N.V.
  8. Nichia Corporation
  9. Texas Instruments Inc.
  10. STMicroelectronics N.V.
  11. Infineon Technologies AG
  12. ON Semiconductor Corp.
  13. Vishay Intertechnology Inc.
  14. Renesas Electronics Corp.
  15. Rohm Co., Ltd.
  16. Omnivision Technologies Inc.
  17. Cree LED (Wolfspeed, Inc.)
  18. LITE-ON Technology Corp.
  19. Sharp Corporation
  20. Mitsubishi Electric Corp.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Proliferation of VCSEL-based 3-D Sensing in Asian Smartphones
    • 4.2.2 Stringent Automotive LED-Lighting Mandates in Europe
    • 4.2.3 Rapid Roll-out of 400 G Fiber Modules in North-American Data Centers
    • 4.2.4 Government Incentives for GaN LEDs in SE-Asian Smart-City Projects
    • 4.2.5 Digital Medical Imaging Boom Driving CMOS Sensors in Japan
    • 4.2.6 Middle-East Defense Modernization Fueling Infra-red Detector Demand
  • 4.3 Market Restraints
    • 4.3.1 Chronic GaN-substrate Supply Constraints
    • 4.3.2 High Thermal-management Cost of Consumer VCSEL Arrays
    • 4.3.3 Export-control Barriers on Advanced Image-Sensor Supply Chains
    • 4.3.4 LED Price-Erosion Compressing Tier-2 Chinese Margins
  • 4.4 Industry Ecosystem Analysis
  • 4.5 Technological Outlook
  • 4.6 Porter's Five Forces Analysis
    • 4.6.1 Bargaining Power of Suppliers
    • 4.6.2 Bargaining Power of Buyers
    • 4.6.3 Threat of New Entrants
    • 4.6.4 Threat of Substitutes
    • 4.6.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUES)

  • 5.1 By Device Type
    • 5.1.1 LED
    • 5.1.2 Laser Diode
    • 5.1.3 Image Sensors
    • 5.1.4 Optocouplers
    • 5.1.5 Photovoltaic Cells
    • 5.1.6 Others
  • 5.2 By Device Material
    • 5.2.1 Gallium Nitride (GaN)
    • 5.2.2 Gallium Arsenide (GaAs)
    • 5.2.3 Silicon Carbide (SiC)
    • 5.2.4 Indium Phosphide (InP)
    • 5.2.5 Silicon and Others
  • 5.3 By Application
    • 5.3.1 Lighting and Display
    • 5.3.2 Optical Communication and Li-Fi
    • 5.3.3 Sensing and Imaging
    • 5.3.4 Power Conversion and Photovoltaics
    • 5.3.5 Defense and Security
  • 5.4 By End-user Industry
    • 5.4.1 Consumer Electronics
    • 5.4.2 Automotive
    • 5.4.3 Information Technology and Telecom
    • 5.4.4 Healthcare and Life-Sciences
    • 5.4.5 Aerospace and Defense
    • 5.4.6 Industrial Automation
    • 5.4.7 Residential and Commercial
  • 5.5 By Geography
    • 5.5.1 North America
      • 5.5.1.1 United States
      • 5.5.1.2 Canada
      • 5.5.1.3 Mexico
    • 5.5.2 Europe
      • 5.5.2.1 Germany
      • 5.5.2.2 United Kingdom
      • 5.5.2.3 France
      • 5.5.2.4 Italy
      • 5.5.2.5 Spain
      • 5.5.2.6 Rest of Europe
    • 5.5.3 Asia-Pacific
      • 5.5.3.1 China
      • 5.5.3.2 Japan
      • 5.5.3.3 South Korea
      • 5.5.3.4 India
      • 5.5.3.5 South East Asia
      • 5.5.3.6 Australia
      • 5.5.3.7 Rest of Asia-Pacific
    • 5.5.4 South America
      • 5.5.4.1 Brazil
      • 5.5.4.2 Rest of South America
    • 5.5.5 Middle East and Africa
      • 5.5.5.1 Middle East
      • 5.5.5.1.1 United Arab Emirates
      • 5.5.5.1.2 Saudi Arabia
      • 5.5.5.1.3 Rest of Middle East
      • 5.5.5.2 Africa
      • 5.5.5.2.1 South Africa
      • 5.5.5.2.2 Rest of Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles {(includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)}
    • 6.4.1 Sony Corporation
    • 6.4.2 Samsung Electronics Co., Ltd.
    • 6.4.3 ams-OSRAM AG
    • 6.4.4 SK Hynix Inc.
    • 6.4.5 Broadcom Inc.
    • 6.4.6 Panasonic Holdings Corp.
    • 6.4.7 Signify N.V.
    • 6.4.8 Nichia Corporation
    • 6.4.9 Texas Instruments Inc.
    • 6.4.10 STMicroelectronics N.V.
    • 6.4.11 Infineon Technologies AG
    • 6.4.12 ON Semiconductor Corp.
    • 6.4.13 Vishay Intertechnology Inc.
    • 6.4.14 Renesas Electronics Corp.
    • 6.4.15 Rohm Co., Ltd.
    • 6.4.16 Omnivision Technologies Inc.
    • 6.4.17 Cree LED (Wolfspeed, Inc.)
    • 6.4.18 LITE-ON Technology Corp.
    • 6.4.19 Sharp Corporation
    • 6.4.20 Mitsubishi Electric Corp.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-space and Unmet-Need Assessment