半導體前端設備：市場佔有率分析、產業趨勢與統計、成長預測（2025-2030 年）

Semiconductor Front End Equipment - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)

出版日期: 2025年03月18日 | 出版商:

Mordor Intelligence | 英文 148 Pages | 商品交期: 2-3個工作天內

價格

※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

簡介目錄

預計 2025 年半導體前端設備市場規模為 1,079.5 億美元，到 2030 年將達到 1,634.5 億美元，預測期內（2025-2030 年）的複合年成長率為 8.65%。

前端處理涉及許多複雜的步驟，以將晶圓轉化為成品設備。這些階段包括晶圓清洗、氧化、光刻以對裝置進行圖案化、蝕刻、沉澱、摻雜、金屬化和其他步驟。檢查和測量設備用於製程控制。這涉及檢查晶圓以識別可能導致最終產品出現問題的不規則之處。除此之外，還使用光學技術，通常需要電子束檢查才能發現即使是最小的缺陷。

主要亮點

在半導體產業低迷的背景下，主要前端設備製造商實現了創紀錄的收益，預計半導體前端設備設備的需求將大幅成長，而不是經歷短期調整。這是由產能擴張、新晶圓廠計劃以及前端設備市場對先進技術和解決方案的高需求所推動的。
這一萎縮較去年晶圓製造設備（包括晶圓加工設備、晶圓廠設施以及掩模版和光罩設備）的銷售額大幅成長相比有了顯著改善，目前預測這些設備到 2023 年的銷售額將略有下降。上調主要原因是中國有利的資本投資。在應對地緣政治挑戰（包括美國和荷蘭政府的出口管制限制）帶來的不確定性以及對通膨、利率上升和某些經濟體 GDP 成長放緩的全球宏觀擔憂的同時，市場也在成長。
家用電子電器是成長最快的領域，促進了市場擴張。智慧型手機的使用量預計會隨著人口的成長而增加，這是該市場的主要驅動力。由於對平板電腦、智慧型手機、筆記型電腦、個人電腦、穿戴式裝置等的需求不斷成長，消費性電子產品正在推動產業發展。隨著半導體的發展，機器學習等新的細分市場正在迅速整合。
未來最令人興奮的「必贏」技術，包括人工智慧、物聯網、量子運算和增強型無線網路，目前都是由半導體驅動的。隨著世界將突破性技術無縫融入生活的各個方面，半導體和微電子技術正在不斷發展以滿足不斷變化的數位環境的複雜需求。巨量資料和人工智慧正在推動這一成長，要求更小、更強大、更難製造的晶片，並推動創新的需求。
資料儲存、運算能力和演算法的快速進步使得開發和部署人工智慧系統成為可能。數位設備和網際網路的使用日益增加導致了大量數據的產生。人工智慧系統依靠大型資料集來學習和改進。
工業4.0的概念包含物聯網（IoT）、巨量資料、雲端製造、資訊物理系統（CPS）、服務網際網路（IoS）、機器人、擴增實境（AR）等新興技術。這些技術的採用對於創建更智慧的工業流程至關重要，這將涵蓋一些將物理世界和數位世界結合在一起的未來工業進步。
隨著全球在家工作趨勢的增強，對雲端服務的需求將激增，迫使資料中心供應商擴大其容量。這將導致全球對晶片和記憶體的需求增加。 SEMI報告稱，對300毫米晶圓廠的投資正在大幅增加。預測顯示，2020 年至 2024 年間，該產業將新增至少 38 座 300 毫米晶圓廠。
此次增產將使晶圓產能增加約180萬片，使總合達到700萬片以上。值得注意的是，台灣計劃建造 11 座新的量產工廠，其次是中國大陸，計劃建造 8 座。此外，台積電正在亞利桑那州建造一座新的 300 毫米晶圓廠。 2024年底，300mm量產工廠數量預計將達到161家。

半導體前端設備市場趨勢

半導體製造工廠成為最大的終端用戶產業

設計階段結束後，半導體晶片在稱為晶圓廠或鑄造廠的設施中製造。在前端製造中，晶片是在稱為晶圓的圓形矽晶圓上製造的，或者不太常見的是在其他半導體材料上製造的。
製造是將設計轉化為晶片的過程，依賴各種中小型公司和材料。首先，在熔爐中形成矽圓柱體，然後將其切割成圓盤狀晶片。半導體製造廠（「晶圓廠」）透過兩個步驟將晶片變成晶圓：在矽材料層中形成電晶體和其他電子裝置，然後在矽頂部的絕緣層中形成電子元件之間的金屬互連。電氣設備和互連元件組合起來形成電路。
總部位於美國、台灣、韓國、日本和中國的公司控制著全球大部分半導體代工市場佔有率和製造產能，而這些公司的實際所在地也位於這些國家。開發半導體產品需要許多企業（從材料到物流）的協同合作。半導體裝置的製造流程複雜，增加了開發成本。企業紛紛採用各種經營模式來降低開支，並依賴半導體生存。
2023年11月，中國引進了42台微影術系統，價值8.168億美元。荷蘭提供了16台微影術系統，總價值7.627億美元，比前一年成長了10倍。此外，中國10月從荷蘭進口了21套系統。日本Canon、尼康也向中國供應曝光設備。因此，預計半導體製造廠前端設備的需求將會上調。
隨著全球經濟有望復甦，由於明年智慧型手機、伺服器、筆記型電腦、電視和汽車市場的成長，以及包括 5G基地台和 Wi-Fi 6 技術在內的下一代網路的持續推出，預計對零件的需求將增加。
根據歐洲5G觀察站的數據，截至2023年，德國將成為歐盟成員國中5G基地台數量最多的國家，安裝的基地台數量約為9萬個。這些晶片的設計和製造以及背後的研究可以提供數十萬個高薪工作崗位，使在岸/迴岸成為一個熱門的政治話題。因此，鑄造廠和設備製造商正在自己的後院規劃和規劃巨額投資。例如，東京電子已宣布計劃在日本的設備製造工廠投資超過6億美元。
IDM 透過投資晶圓製造能力繼續發揮關鍵作用。例如，2023年6月，英特爾與德國政府宣布簽署修訂後的意向書，計畫在馬德堡建立一個投資超過300億歐元的尖端晶圓製造地，打造歐洲首批兩座半導體工廠。根據韓媒報道，該公司計劃於2023年12月從ASML收購六台高NA EUV曝光機台，並於2024年出貨，此次收購被視為該公司在2nm節點超越三星、台積電的秘密武器。
2023年7月，三星宣布將投資170億美元在德克薩斯州奧斯汀建造一座佔地1,200英畝的半導體製造廠。中國和台灣之間的地緣政治緊張局勢導致晶片製造商尋求在美國製造地。憑藉低稅收和新的補貼，德克薩斯已成為開展業務的好地方。全球半導體製造設備製造商正在擴建其在韓國的工廠。中國政府計劃在未來 20 年內投資 2,300 億美元建造新的國內製造基地，以吸引其他公司並培育晶片供應鏈。

中國可望佔主要市場佔有率

據CSET稱，除組裝和包裝工具外，中國在所有主要領域都佔有相當大的市場佔有率。但在微影術設備方面，特別是極紫外線（EUV）微影術和深紫外線（DUV）微影術，中國面臨的挑戰最大。
壓印微影術、電子束、雷射微影術、抗蝕劑處理設備、光掩模檢查和修復工具是主要障礙。過去幾年，中國持續投入進口先進的微影術設備，以支持其晶片產業的發展。
然而，憑藉著強大的技術力，中國不斷加大對前端設備的依賴，並進行大規模投資將其推向市場。
2023年12月，中國微影術設備專家上海微電子設備Group Limited（SMEE）推出了第一台能夠使用尖端28奈米級製程技術處理晶圓的機器。這項重大成就凸顯了SMEE致力於打造先進微影術工具的決心。這款名為 SSA/800-10W 的設備標誌著該公司的一個重要里程碑。
在日本和中國之間的技術僵局不斷升級的情況下，美國的製裁旨在阻礙中國在開發世界上最先進晶片方面的進展。中芯國際等晶片製造商致力於透過推進晶片生產來增強國家自主權。中芯國際正在利用先進的微影術設備，與本地設備製造商密切合作，並尋求華為的外部援助，以提高先進節點製程的產量比率。
由於美國持續對中國技術實施制裁，該地區正在努力自給自足。中國政府正大力投資先進晶片技術的研發。它還鼓勵本地製造商將重點轉向在經濟和電動車（EV）等新興產業中具有多種應用的更高節點晶片。政府的舉措不斷增多以及本地供應商為提高國內晶片產量而增加的投資預計將在前端市場創造顯著的需求。
根據中汽協統計，2023年8月中國新能源車銷量約84.6萬輛，其中搭乘用80.8萬輛，商用車3.9萬輛。其中，純電動車（BEV）搭乘用保有量為55.9萬輛，插電式混合動力電動車（PHEV）搭乘用保有量為24.8萬輛。

半導體前端設備市場概況

半導體前端設備市場由應用材料公司主導。市場參與者正在採用夥伴關係、創新和收購等策略來加強其產品供應並獲得永續的競爭優勢。

2024 年 2 月－ASML Holding NV 推出最新的晶片製造機 High-NA，其重量相當於兩架空中巴士 A320 飛機，耗資 3.5 億歐元。英特爾已確保其奧勒岡工廠的首批貨物，預計明年年底開始生產晶片。該機器將實現厚度為8奈米的半導體線路，比傳統型號小1.7倍，並提高晶片的電晶體密度，從而提高處理速度和記憶體。
2024 年 1 月－應用材料公司與Google合作推進擴增實境(AR) 技術。此次合作將利用應用材料公司的材料工程專業知識和Google的平台，為下一代 AR 體驗開發輕量級視覺顯示系統。目標是加速多代 AR 產品、應用和服務的開發。

其他福利

Excel 格式的市場預測 (ME) 表
3個月的分析師支持

The front-end procedure necessitates a multitude of intricate phases to convert a wafer into a completed device. These steps incorporate wafer cleaning, oxidation, and photolithography to pattern devices, along with etching, deposition, doping, and metallization steps. Inspection and metrology equipment is utilized for process control. This is when the wafers are inspected to identify irregularities that potentially induce issues with the end product. In addition to this, optical techniques are also used, and e-beam inspection is often needed to find the smallest defects.

Key Highlights

The demand for semiconductor front-end equipment is expected to observe a noteworthy surge as some of the major front-end equipment-producing companies observed record-breaking revenue against a backdrop of a downturn in the semiconductor industry instead of the mild and short-term correction. It was driven by capacity expansion, new fab projects, and high demand for advanced technologies and solutions across the front-end equipment market.
After registering a record of significant sales last year, the wafer fab equipment, which includes wafer processing, fab facilities, and mask/reticle equipment, is projected to be a bit low in 2023, and this contraction marks a significant improvement. The upward revision is primarily due to China's strong equipment spending. The market grew managing uncertainties created by geopolitical challenges, including the US and Dutch governments' export control regulations and global macro concerns around inflation, rising interest rates, and lower GDP growth in certain economies.
Consumer electronics is the fastest-growing segment, contributing to market expansion. The use of smartphones, anticipated to rise with population growth, is the key driver of this market. Consumer electronics drive the industry due to increased demand for tablets, smartphones, laptops, computers, and wearable gadgets. As semiconductors advance, new market areas, such as machine learning, are rapidly being integrated.
The most fascinating "must-win" technologies of the future, such as artificial intelligence, the Internet of Things, quantum computing, and enhanced wireless networks, are currently supported by semiconductors. Semiconductors and microelectronics are advancing to satisfy the complicated demands of a constantly changing digital environment as the world seamlessly integrates breakthrough technology into every aspect of life. Big Data and AI drive this increase and call for smaller, more powerful chips, making their production more difficult and increasing the need for technological innovation.
Rapid advancements in data storage, computing power, and algorithms have enabled the development and deployment of AI systems. The increased use of digital devices and the Internet has generated extensive volumes of data. AI systems rely on large datasets to train and improve their performance.
The Internet of Things (IoT), big data, cloud manufacturing, cyber-physical systems (CPS), the Internet of Services (IoS), robotics, augmented reality, and other emerging technologies are included in the Industry 4.0 idea. Creating additional smart industrial processes depends on adopting these technologies, which will unite the physical and digital worlds by encompassing several future industrial advancements.
As global work-from-home trends gain momentum, the demand for cloud services surges, prompting data center providers to expand their capacities. This, in turn, fuels the global appetite for chips and memory. SEMI reports a notable uptick in investments in 300 mm fabs. Projections suggest that the industry will witness the addition of a minimum of 38 new 300 mm fabs between 2020 and 2024.
This surge is set to boost the capacity by approximately 1.8 million wafers, pushing the total beyond 7 million. Notably, Taiwan is slated to host 11 of these new volume fabs, with China following closely with eight. Additionally, TSMC is in the process of constructing a new 300 mm fab in Arizona. By the close of 2024, the tally of 300 mm volume fabs is anticipated to hit a significant 161 units.

Semiconductor Front End Equipment Market Trends

Semiconductor Fabrication Plant to be the Largest End-user Industry

After the design stage, semiconductor chips are manufactured or fabricated in facilities called fabs or foundries. In front-end fabrication, chips are manufactured on circular sheets of silicon or, less commonly, other semiconducting materials called wafers, typically about 8 or 12 inches in diameter.
Fabrication is a process that turns designs into chips, relying on various SMEs and materials. First, a furnace forms a cylinder of silicon, which is cut into disc-shaped wafers. Semiconductor fabrication facilities ("fabs") make chips into wafers in two steps: forming transistors and other electrical devices in material layers within the silicon and forming metal interconnects between the electrical devices in insulating layers above the silicon. Together, the electrical devices and interconnects form circuits.
Firms headquartered in the United States, Taiwan, South Korea, Japan, and China control most of the world's fab market share and fab capacity, which are also physically located in these countries. Semiconductor product development requires working harmoniously for many businesses (from materials to logistics). The complex process of fabricating semiconductor devices has also increased the development cost. Companies have leveraged different business models to lower expenditures and survive in semiconductors.
In November 2023, China brought 42 lithography systems worth USD 816.8 million. The Netherlands supplied 16 lithography systems, totaling USD 762.7 million, a tenfold increase from the previous year. Additionally, China imported 21 systems from the Netherlands in October. Japanese companies Canon and Nikon also supplied China with lithography tools. Thus, an upward revision is expected in the demand for front-end equipment in semiconductor fabrication plants.
The global economy is expected to recover, and the demand for components is expected to rise owing to not only growth in the smartphone, server, notebook computer, TV, and automobile markets next year but also the continued rollout of next-generation networks, including 5G base stations and Wi-Fi 6 technologies.
According to the European 5G Observatory, as of 2023, Germany had the maximum 5G base stations among European Union (EU) member states, with approximately 90,000 base stations installed. The design and manufacturing of these chips and their research can provide hundreds of thousands of high-paying jobs, making onshoring/re-shoring a popular topic politically. It is why foundries and equipment companies are planning and mapping enormous investments in their backyards. For instance, TEL announced plans to invest more than USD 600 million in equipment manufacturing facilities in Japan.
IDMs still play a significant role by investing in wafer fabrication capacities. For instance, in June 2023, Intel and the German government announced signing a revised letter of intent for planning a leading-edge wafer fabrication site in Magdeburg with more than EUR 30 billion for two first-of-a-kind European semiconductor facilities. In December 2023, the company reportedly acquired six high-NA EUV lithography machines from ASML, which is scheduled for shipment in 2024, according to South Korean media outlets. This acquisition is expected to be its secret weapon to overtake Samsung and TSMC at the 2nm node.
In July 2023, Samsung announced it would spend USD 17 billion to build a semiconductor fabrication plant on a 1,200-acre plot of land in Austin, Texas. Owing to the geopolitical tension between China and Taiwan, chipmakers turned to the United States for manufacturing. Due to low taxes and new subsidies, Texas has emerged as a suitable place to do business. Global semiconductor manufacturing equipment companies are expanding facilities in South Korea. The company plans to invest USD 230 billion over the next 20 years in a new domestic production hub, attracting other players and fostering a chip supply system.

China is Expected to Hold a Significant Market Share

According to CSET, China holds a noteworthy market share in all major segments besides assembly and packaging tools. However, China faces the greatest challenge in lithography tools, particularly extreme ultraviolet (EUV) photolithography and deep ultraviolet (DUV) photolithography.
Imprint lithography, e-beam, laser lithography, resist processing equipment, photomask inspection, and repair tools pose significant obstacles. Over the past few years, China has consistently invested in importing advanced lithography equipment to support its chip industry.
However, with its technological capabilities, the country constantly strives to enhance its self-dependency on front-end equipment and invest significantly to introduce it into the market.
In December 2023, Shanghai Micro Electronics Equipment Group (SMEE), a Chinese company specializing in lithography tools, unveiled its inaugural machine capable of processing wafers using a cutting-edge 28nm-class process technology. This significant achievement highlights SMEE's dedication to constructing advanced lithography machines. The scanner, known as SSA/800-10W, marks a significant milestone for the company.
US sanctions have been formulated to impede China's progress in developing the most cutting-edge chips globally as the technological rivalry between the two countries intensifies. SMIC and other chip manufacturers are dedicated to enhancing the nation's autonomy by advancing chip production. SMIC collaborates closely with local tool manufacturers, utilizing its advanced lithography equipment, and seeks external assistance from Huawei to enhance yields in advanced node processes.
Due to the continuous US sanctions on Chinese technology, the area strives for self-sufficiency. The Chinese government is investing substantially in the research and development of advanced chip technology. It also encourages local manufacturers to shift their focus to higher-node chips with various uses in the economy and emerging industries like electric vehicles (EVs). The growing government initiatives and the increasing investments by local vendors to boost domestic chip production are expected to create a notable demand for the front-end market.
According to CAAM, in August 2023, China's new energy vehicle sales were approximately 846,000 units, of which 808,000 were passenger electric vehicles and 39,000 were commercial electric vehicles. The sales of passenger battery electric vehicles (BEVs) and passenger plug-in hybrid electric vehicles (PHEVs) were 559,000 and 248,000 units, respectively.

Semiconductor Front End Equipment Market Overview

The semiconductor front-end equipment market is semi-consolidated, with major players like Applied Materials Inc., ASML Holding NV, Tokyo Electron Limited, LAM Research Corporation, and KLA Corporation. Market players are adopting strategies such as partnerships, innovations, and acquisitions to enhance their product offerings and gain sustainable competitive advantage.

February 2024 - ASML Holding NV unveiled its latest chipmaking machine, the High-NA extreme ultraviolet, priced at EUR 350 million, weighing as much as two Airbus A320s. Intel Corp. secured the first shipment for its Oregon factory, with chip production set to begin late next year. The machine achieves 8-nanometer thick semiconductor lines, 1.7 times smaller than its predecessor, enhancing chip transistor density for increased processing speeds and memory.
January 2024 - Applied Materials Inc. collaborated with Google to advance augmented reality (AR) technologies. This partnership leverages Applied Materials' expertise in materials engineering with Google's platforms to develop lightweight visual display systems for the next era of AR experiences. The goal is to expedite the creation of multiple generations of AR products, applications, and services.

Additional Benefits:

The market estimate (ME) sheet in Excel format
3 months of analyst support

1 INTRODUCTION

1.1 Study Assumptions and Market Definition
1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

4.1 Market Overview
4.2 Industry Attractiveness - Porter's Five Forces Analysis
- 4.2.1 Bargaining Power of Suppliers
- 4.2.2 Bargaining Power of Buyers
- 4.2.3 Threat of New Entrants
- 4.2.4 Threat of Substitute Products
- 4.2.5 Degree of Competition
4.3 Industry Value Chain Analysis
4.4 Impact of COVID-19 Pandemic on the Market

5 MARKET DYNAMICS

5.1 Market Drivers
- 5.1.1 Increasing Needs of Consumer Electronic Devices Boosting the Manufacturing Prospects
- 5.1.2 Proliferation of Artificial Intelligence, IoT, and Connected Devices Across Industry Verticals
5.2 Market Restraints
- 5.2.1 Dynamic Nature of Technologies Requires Several Changes in Manufacturing Equipment

6 MARKET SEGMENTATION

6.1 By Type
- 6.1.1 Lithography Equipment
- 6.1.2 Etching Equipment
- 6.1.3 Deposition Equipment
- 6.1.4 Other Equipment Types
6.2 By End-user Industry
- 6.2.1 Semiconductor Fabrication Plant
- 6.2.2 Semiconductor Electronics Manufacturing
6.3 By Geography
- 6.3.1 United States
- 6.3.2 Europe
- 6.3.3 China
- 6.3.4 South Korea
- 6.3.5 Taiwan
- 6.3.6 Japan
- 6.3.7 Latin America
- 6.3.8 Middle East and Africa

7 COMPETITIVE LANDSCAPE

7.1 Company Profiles
- 7.1.1 Applied Materials Inc.
- 7.1.2 ASML Holding NV
- 7.1.3 Tokyo Electron Limited
- 7.1.4 LAM Research Corporation
- 7.1.5 KLA Corporation
- 7.1.6 Nikon Corporation
- 7.1.7 VEECO Instruments Inc.
- 7.1.8 Plasma Therm
- 7.1.9 Hitachi High -Technologies Corporation
- 7.1.10 Carl Zeiss AG
- 7.1.11 Screen Holdings Co. Ltd