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1687269

類比和混合訊號 IP：市場佔有率分析、行業趨勢和統計、成長預測（2025-2030 年）

Analog and Mixed Signal IP - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

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簡介目錄

模擬和混合訊號 IP 市場規模估計並預測在 2025 年將達到 2.2322 億美元，預計到 2030 年將達到 4.5231 億美元，在預測期內（2025-2030 年）的複合年成長率為 15.17%。

類比和混合訊號 IP-市場-IMG1

2020年初半導體市場的低迷，很大程度是由於新冠疫情對整個產業的影響。由於COVID-19在全球蔓延而實施的封鎖不僅影響了設備的製造，也抑制了消費者需求。

美國消費科技協會數據顯示，2020年美國消費性電子產業成長率下降2.2%，這是美國電子產業數年來首次出現成長率下滑。

主要亮點

  • 在過去的十年中，積體電路變得越來越複雜和昂貴。該產業已經開始採用新的設計和重用方法，統稱為晶片系統(SoC)、封裝系統 (SiP) 和板載系統 (SoB) 設計。隨著向小型化的轉變，採用此類解決方案的公司開始面臨這種模式轉移帶來的重複使用和整合問題的挑戰。為了解決這些問題，IP 阻止已成為工業終端用戶最有希望的解決方案。
  • 在過去的十年中，積體電路變得越來越複雜和昂貴。該產業已經開始採用新的設計和重用方法，統稱為晶片系統(SoC)、封裝系統 (SiP) 和板載系統 (SoB) 設計。
  • 隨著向小型化的轉變，採用此類解決方案的公司開始面臨這種模式轉移帶來的重複使用和整合挑戰。為了解決這些問題，IP 阻止已成為工業終端用戶最有希望的解決方案。
  • 可重複使用元件（也稱為智慧財產權 (IP) 區塊或 IP 核心）通常是可綜合的暫存器傳輸級 (RTL) 設計（稱為軟性核心）或佈局級設計（稱為硬核心）。重用的概念可以在模組、平台和晶片層級實現，並要求IP具有足夠的通用性、可配置性或可編程性，以便用於廣泛的應用。

類比和混合訊號 IP 市場趨勢

通訊預計將佔很大佔有率

  • 通訊基礎設施是推動市場發展的關鍵因素之一，這主要歸因於4G和部分5G網路的出現。無線基礎設施製造商，尤其是 4G 和 5G 網路製造商，正在不斷減少新無線基礎設施安裝的規模和成本，同時保持高標準的效能、功能和服務品質。
  • 5G基礎設施有望徹底改變寬頻服務頻譜並增強多個終端用戶的垂直連接。據GSMA稱，新的5G網路部署路線圖將使城市覆蓋率達到45%左右。中國、印度等國家也計劃在2020年推出5G網路，而5G網路的發展需要對5G基礎設施進行大量的資本投入。
  • 英特爾等主要參與者於 2019 年 1 月宣布推出專為下一代行動基地台設計的新型晶片系統(SoC)。同樣，覆銅板 (CCL) 專家 Iteq 也期待來自中國的 5G 基礎設施訂單。中國政府正大力投資5G服務的開發與部署，華為等本土公司也積極參與。
  • 有線和無線廣播和寬頻通訊設備領先製造商 Jinwell 已將 MaxLinear 的 AirPHY 多Gigabit調變解調器技術和 jjPlus 最新的整合式類比混合訊號 IP 的 65W 磁諧振無線電源模組整合到其第三代 ZRA-003 設備中，能夠透過傳輸達 20 公分的電力結構和資料。該解決方案預計將推動對類比和混合訊號 IP 整合的需求，以實現Gigabit速度的 4G/LTE 或 5G mmWave 無線寬頻服務。

預計北美將佔據最大市場佔有率

  • 對類比/數位混合訊號 IP 的需求源於其作為這些產品的建構模組的日益廣泛的應用。美國通訊業正在積極投資5G基礎設施。該國的終端用戶產業佔全球5G技術消費的很大一部分。在北美，美國在投資、部署和應用方面佔據區域5G市場的主導地位。
  • 5G無線網路的超高速特性預計將為電訊業放緩的成長提供急需的初步提振。美國電訊協會估計，到2025年，美國通訊業者將花費約1,040億美元。預計通訊服務供應商將其現有的4G網路升級到即將到來的5G標準將成為當務之急，從而全面推出5G無線服務。
  • 2019 年 10 月，Analog 宣布推出 Analog Game Boy Pocket，這是復古遊戲裝置的現代版本。該公司推出的關鍵組件是第二個 FPGA（與用於影像處理的 FPGA 分開，用於在顯示器上提供更高解析度的影像，其解析度是原始 Game Boy 的 10 倍）。第二塊 FPGA 將使復古遊戲社群能夠建立和移植核心以在 Pocket 上運行其他遊戲，類似於 MiSTER FPGA 設備的工作方式。
  • 預計加拿大將全額支出並資助其軍事計劃（包括服飾）。加拿大政府正專注於綜合士兵系統計劃，該項目將士兵的服裝與電子設備、武器以及士兵在戰場上移動時的通訊整合在一起。預計這將對該地區的市場成長產生積極影響。

類比和混合訊號 IP 產業概覽

由於全球參與者致力於將訊號整合到消費性電子、汽車等各種應用中，類比和混合訊號 IP 市場高度分散，導致競爭對手之間的競爭非常激烈。主要參與者有Cadence設計系統公司、台灣半導體製造股份有限公司、格芯晶圓代工廠、三星電子等。

  • 2020 年 5 月－新思科技 (Synopsys, Inc.) 宣布推出採用台積電 5nm 製程技術的高效能運算系統晶片(SoC) 高品質 IP 組合。台積電製程上的DesignWare IP產品組合，包括最廣泛使用的高速通訊協定的介面和基礎IP，可加速高階雲端處理、AI加速器、網路和儲存應用的SoC開發。

其他福利：

  • Excel 格式的市場預測 (ME) 表
  • 3 個月的分析師支持

目錄

第 1 章 簡介

  • 研究假設和市場定義
  • 研究範圍

第2章調查方法

第3章執行摘要

第4章 市場動態

  • 市場概況
  • 產業價值鏈分析
  • 產業吸引力－波特五力分析
    • 新進入者的威脅
    • 購買者/消費者的議價能力
    • 供應商的議價能力
    • 替代品的威脅
    • 競爭對手之間的競爭強度
  • 市場促進因素
    • 提高 AMS 區塊的再生性
    • 無線通訊的興起
  • 市場限制
    • 類比/混合訊號 (AMS) 設計的複雜性和敏感性
  • 評估新冠肺炎對產業的影響

第5章 市場區隔

  • 設計
    • 公司/軟知識產權
    • 硬核IP
  • 產品
    • A2D 和 D2A 轉換器
    • 電源管理模組
    • RF
    • 其他產品
  • 最終用戶產業
    • 消費性電子產品
    • 通訊業
    • 車
    • 工業
    • 其他最終用戶產業
  • 地區
    • 北美洲
    • 歐洲
    • 亞太地區
    • 拉丁美洲
    • 中東和非洲

第6章 競爭格局

  • 公司簡介
    • Cadence Design Systems Inc.
    • Silicon Creations LLC
    • VeriSilicon Holdings Co. Ltd
    • Renesas Electronics Corporation
    • Synopsys Inc.
    • ARM Holdings PLC
    • Xilinx Inc.
    • Intel Corporation
    • Analog Devices Inc.
    • Maxim Integrated Products Inc.
    • Texas Instruments Limited

第7章投資分析

第 8 章：市場的未來

簡介目錄
Product Code: 58979

The Analog and Mixed Signal IP Market size is estimated at USD 223.22 million in 2025, and is expected to reach USD 452.31 million by 2030, at a CAGR of 15.17% during the forecast period (2025-2030).

Analog and Mixed Signal IP - Market - IMG1

The semiconductor market's downturn at the start of 2020 is significantly owing to the COVID-19 pandemic's impact on the entire industry. The lockdowns that have been enforced by the spread of COVID-19 across the world have not only affected the manufacturing of devices but also reduced consumer's demand.

According to the Consumer Technology Association, the growth rate of the consumer electronics industry in the United States fell by 2.2% in 2020, which was the first decrease in the growth rate in the consumer electronics landscape of the United States after several years.

Key Highlights

  • Over the past decade, the integrated circuits have become increasingly complex and expensive. The industry started to embrace new design and reuse methodologies that are collectively referred to as system-on-chip (SoC), System-in-Package (SiP), and System-on-Board (SoB) design. With this shift toward miniaturization, the companies incorporating such solutions started facing the challenges for the re-usage and integration issues encountered in this paradigm shift. To solve such problems, IP blocks emerged as the most prominent solution for the industry end-users.
  • Over the past decade, integrated circuits have become increasingly complex and expensive. The industry started to embrace new design and reuse methodologies that are collectively referred to as system-on-chip (SoC), System-in-Package (SiP), and System-on-Board (SoB) design.
  • With this shift toward miniaturization, the companies incorporating such solutions started facing the challenges for the reusage and integration issues encountered in this paradigm shift. To solve such issues, IP blocks emerged as the most prominent solution for the industry end-users.
  • The reusable components, also called intellectual property (IP) blocks or IP cores are typically synthesizable register-transfer level (RTL) designs referred to as soft cores or layout level designs, referred to as hard cores. The concept of reusage can be carried out at the block, platform, or chip levels and involves making the IP sufficiently general, configurable, or programmable for use in a wide range of applications.

Analog & Mixed Signal IP Market Trends

Telecommunication is Expected Hold a Significant Share

  • Telecommunication infrastructure is one of the key factors driving the market, primarily owing to the advent of the 4G network and some parts of the 5G network. Manufacturers of wireless infrastructure, especially 4G and 5G networks, are continuously reducing the size and cost of their newly installed wireless infrastructure while holding towards the high standards of performance, functionality, and quality of service.
  • 5G Infrastructure is expected to revolutionize the domain of various broadband services and is expected to empower connectivity across multiple end-user verticals. According to GSMA, around 45% urban coverage level has been achieved for 5G networks in the new deployment trails. Countries like China and India are also planning to implement the 5G network by 2020, and the development of 5G networks requires large amounts of capital investment in 5G capable infrastructure.
  • Significant players like Intel have announced a new system on chip (SoC) designed specifically for next-generation mobile base stations in Jan 2019. Similarly, Copper-clad laminate (CCL) specialist Iteq expects orders for 5G infrastructure to pull in from China. The country is investing significantly in the development and deployment of 5G services with the government and local players like Huawei actively taking part
  • Zinwell, a leading manufacturer of wired and wireless broadcast and broadband communication equipment has integrated MaxLinear's AirPHY multi-gigabit modem technology with jjPlus's latest 65W magnetic resonant wireless power module integrated with analog mixed-signal IP into its 3rd generation ZRA-003 device, which can transfer power and gigabit data through glass windows or structural walls up to 20cm thick. The solution will enhance the demand of the analog mixed-signal IP integration as the solution will enable 4G/LTE or 5G millimeter wave wireless broadband service with gigabit speeds.

North America is Expected to Hold the Largest Market Share

  • The demand for the analog and digital mixed-signal IP is driven by the growing utilization of these products as building blocks. The telecommunication sector in the US has been actively investing in 5G infrastructure. The end-user industry in the country accounts for the significant portion of the global consumption of 5G technology. In the North American region, the US dominates the regional 5G market, regarding investment, adoption, and applications.
  • The nature of the 5G superfast wireless networks is expected to provide the needed primary impetus to the telecom industry, which has been experiencing slow growth. The US Telecom Association has estimated that the US telecom operators are expected to spend around USD 104 billion by 2025. It is expected to be essential for the telecom service providers to upgrade existing 4G networks to the upcoming 5G standards and, consequently, execute the full installation of 5G wireless services.
  • In October 2019, Analogue announced the launch of its Analogue Game Boy Pocket, which is a modern version of the retro-gaming device. The critical component the company has introduced is the second FPGA (apart from one for image processing to deliver high-resolution image on its 10X high-resolution display compared to the original Game Boy). This second FPGA enables the retro-gaming community to build and port their cores to run other games on the Pocket, similar to how the MiSTER FPGA device works.
  • Canada is expected to provide sufficient expenditure and funding for its military programs (including clothing). The Canadian government has been focusing on the Integrated Soldier System Project, which is assimilating the soldier suit with electronic devices, weapons, and feed communication among soldiers as they move through the battlefield. This is expected to impact the market's growth positively in the region.

Analog & Mixed Signal IP Industry Overview

The analog and mixed signal IP is quite fragmented as the global players are engaged in integrating the signal in various applications like consumer electronics, automotive, etc., which gives an intense rivalry among the competitors. Key players are Cadence Design Systems Inc., Taiwan Semiconductor Manufacturing Company Limited, Global foundries Inc., and Samsung Electronics Co. Ltd.

  • May 2020 - Synopsys, Inc. announced the broadest portfolio of high-quality IP on TSMC's 5nm process technology for high-performance computing system-on-chips (SoCs). The DesignWare IP portfolio on the TSMC process, encompassing interface IP for the most widely used high-speed protocols and foundation IP, accelerates the development of SoCs for high-end cloud computing, AI accelerators, networking, and storage applications.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Industry Value Chain Analysis
  • 4.3 Industry Attractiveness - Porter's Five Force Analysis
    • 4.3.1 Threat of New Entrants
    • 4.3.2 Bargaining Power of Buyers/Consumers
    • 4.3.3 Bargaining Power of Suppliers
    • 4.3.4 Threat of Substitute Products
    • 4.3.5 Intensity of Competitive Rivalry
  • 4.4 Market Drivers
    • 4.4.1 Increasing Reusability of AMS Block
    • 4.4.2 Growing Prevalence of Wireless Communications
  • 4.5 Market Restraints
    • 4.5.1 Complexity and Sensitivity of Analog/Mixed-Signal (AMS) design
  • 4.6 An Assessment of the Impact of COVID-19 on the Industry

5 MARKET SEGMENTATION

  • 5.1 Design
    • 5.1.1 Firm/Soft IP
    • 5.1.2 Hard IP
  • 5.2 Product
    • 5.2.1 A2D and D2A Converter
    • 5.2.2 Power Management Modules
    • 5.2.3 RF
    • 5.2.4 Other Products
  • 5.3 End-user Industry
    • 5.3.1 Consumer Electronics
    • 5.3.2 Telecommunication
    • 5.3.3 Automotive
    • 5.3.4 Industrial
    • 5.3.5 Other End-user Industries
  • 5.4 Geography
    • 5.4.1 North America
    • 5.4.2 Europe
    • 5.4.3 Asia Pacific
    • 5.4.4 Latin America
    • 5.4.5 Middle East & Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Cadence Design Systems Inc.
    • 6.1.2 Silicon Creations LLC
    • 6.1.3 VeriSilicon Holdings Co. Ltd
    • 6.1.4 Renesas Electronics Corporation
    • 6.1.5 Synopsys Inc.
    • 6.1.6 ARM Holdings PLC
    • 6.1.7 Xilinx Inc.
    • 6.1.8 Intel Corporation
    • 6.1.9 Analog Devices Inc.
    • 6.1.10 Maxim Integrated Products Inc.
    • 6.1.11 Texas Instruments Limited

7 INVESTMENT ANALYSIS

8 FUTURE OF THE MARKET