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市場調查報告書
商品編碼
1630269

密封包裝：市場佔有率分析、產業趨勢與統計、成長預測（2025-2030）

Hermetic Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 106 Pages | 商品交期: 2-3個工作天內

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簡介目錄

預計氣密包裝市場在預測期內複合年成長率為 8.1%

密封包裝-市場-IMG1

主要亮點

  • 在所有需要保護電子元件免受腐蝕環境並確保使用壽命的應用中，都需要密封包裝。空間電子元件要求極高的可靠性，常採用氣密封裝。在中低功率等級下，採用玻璃金屬密封的金屬封裝是常見的解決方案。由於標準氣密封裝中使用的金屬導熱性差且導電性有限，因此開發了直接鍵合銅解決方案。
  • 電子塑膠包裝在低溫清潔環境下使用壽命可達20年。然而，在高溫高壓的腐蝕性氣氛中，它們會在幾天內失效。封裝電子裝置的保護取決於封裝中所使用的材料的氣體介電常數。氣體介電常數的差異在塑膠側和玻璃/陶瓷/金屬側之間存在數量級差異。
  • 此外，防止內部組件與空氣中的氧氣和水分反應的密封封裝技術對於感測器、電池、超級電容器、能源採集和其他能源系統等眾多微型技術至關重要。隨著這些設備市場的不斷擴大，開發適合這些微型技術的封裝策略將變得越來越重要。
  • 例如，由於電動車、新型物聯網 (IoT)、醫療設備等的推動，微電池市場預計在 2019 年至 2025 年間將成長約五倍。儘管如此，目前的密封封裝技術仍將微型電池的能量密度限制為大型電池的一小部分。微型和宏觀尺寸電池具有不同能量密度的原因之一是封裝在內部組件的體積和質量中占主導地位，因此廣泛使用的宏觀尺寸密封封裝技術不能直接應用於微型電池。

氣密包裝市場趨勢

鉛玻璃預計將佔有較大佔有率

  • 磁簧玻璃可在數百萬次開關週期內可靠地封裝磁簧開關。
  • 許多電子應用將玻璃管用於需要保護、絕緣和密封的分立電子元件。然而，這種玻璃通常用作被動元件的電隔離或氣密密封。
  • 鉛玻璃用於汽車中控鎖系統、熱水鍋爐開關、皮帶感測器等。簧片開關開啟和關閉電路，無需外部機械影響。
  • 當弱磁場將薄玻璃管內的兩個金屬接觸片推在一起時，就會建立接觸。簧片開關作為功耗非常低的設備非常重要，因為它們在靜態時不需要任何電源。
  • 由於沒有機械控制，磁簧開關可以經歷數百萬次的通斷循環而不會磨損。
  • 金屬刀片無塵，必須用高公差的惰性氣體密封在玻璃管中，以確保功能。

預計北美將佔據最大佔有率

  • 該地區各國政府增加在航太和國防領域的支出預計將在預測期內推動密封包裝市場的發展。此外，航空業對新飛機的依賴將推動對氣密包裝的需求，從而加強氣密包裝產業。 2020年，美國軍事開支估計達7,780億美元，比2019年成長4.4%。 （來源：SIPRI）。
  • 消費者在家用電器上的支出不斷成長，加上智慧型手機等智慧型通訊設備的普及率不斷提高，預計將在預測期內推動對密封包裝的需求。根據2021年零售額預測，美國消費性電子零售額達4,420億美元。智慧型手機是家用電子電器領域零售額最大的產品，2020年零售額達790億美元。 （資料來源：消費者科技協會）。
  • 另外，美國是世界上一些最大的汽車製造商的所在地，並且正在投資電動車和自動駕駛的潛力。 2016年，光是美國就生產了約1,750萬套ADAS（高級駕駛輔助系統）。到 2021 年，這一數字預計將增加約 150 萬台。 （資料來源：阿美特克）。在汽車產業，密封件用於確保傾翻裝置和安全氣囊裝置的感測器功能。因此，隨著安全氣囊設備的增加，市場將潛在地需求氣密包裝。
  • 這是拉動半導體矽晶圓市場需求的主要因素之一。例如，2020年12月，全球鋰離子應用矽碳複合材料供應商Group14 Technologies獲得由SK Materials主導的1,700萬美元B輪資金籌措。

氣密包裝產業概況

由於以下主要企業的存在，密封包裝市場中競爭公司之間的對抗非常激烈： Schott AG、SGA Technologies、Kyocera 等公司不斷創新產品和服務的能力使他們能夠透過策略合作夥伴關係、併購以及研發活動來獲得競爭優勢。

  • 2020 年 4 月 - NanoRetina 宣布其採用 Schott Primocerar 玻璃雷射黏合技術的 NR600 視網膜假體裝置取得了初步成功結果。 NanoRetina 在建立視網膜植入方面邁出了里程碑式的一步，該植入物可能成為退化性視力喪失的解決方案。 SCHOTT Primoceler 的氣密密封玻璃晶圓微接合用於超小型全玻璃封裝元件。

其他好處：

  • Excel 格式的市場預測 (ME) 表
  • 3 個月分析師支持

目錄

第1章簡介

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章市場動態

  • 市場概況
  • 市場促進因素
    • 保護敏感電子元件的需求日益增加
  • 市場限制因素
    • 對包裝材料的嚴格規定
  • 產業吸引力－波特五力分析
    • 新進入者的威脅
    • 買家/消費者的議價能力
    • 供應商的議價能力
    • 替代品的威脅
    • 競爭公司之間的敵對關係
  • 技術簡介
    • 玻璃金屬密封（GTMS）
    • 陶瓷金屬密封 (CERTMS)
    • 玻璃微接合
  • COVID-19 市場影響評估

第5章市場區隔

  • 按類型
    • 鈍化玻璃
    • 鉛玻璃
    • 應答器玻璃
  • 按最終用戶產業
    • 石化
    • 航太/國防
    • 汽車工業
    • 衛生保健
    • 消費性電子產品
    • 其他最終用戶產業
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
    • 歐洲
      • 英國
      • 德國
      • 法國
      • 西班牙
      • 義大利
      • 其他歐洲國家
    • 亞太地區
      • 中國
      • 日本
      • 韓國
      • 印度
      • 其他亞太地區
    • 拉丁美洲
    • 中東/非洲

第6章 競爭狀況

  • 公司簡介
    • Schott AG
    • Ametek Inc.
    • Kyocera Corporation
    • Micross Components Inc.
    • Willow Technologies Ltd.
    • SGA Technologies limited
    • CompleteHermetics
    • Special Hermetics products Inc.
    • Materion Corporation
    • Teledyne Technologies Incorporated
    • Egide SA

第7章 投資分析

第8章市場的未來

簡介目錄
Product Code: 66646

The Hermetic Packaging Market is expected to register a CAGR of 8.1% during the forecast period.

Hermetic Packaging - Market - IMG1

Key Highlights

  • Hermetic packaging is a requirement for all applications where electronic components must be protected from corrosive environments to ensure acceptable service life. Extremely high reliability is required for space electronics, often utilizing hermetic packages. Metal packages with glass to metal seals are the common solution for low to medium power levels. Due to poor thermal conductivity and limited electric conductivity of metals used in standard hermetic packages, direct bond copper solutions have been developed.
  • Electronic plastic packages can survive 20 years in clean environments at lower temperatures. The same can fail in a few days in a corroding atmosphere at higher temperatures or higher pressure. The protection of encapsulated electronics is important for the permittivity of gases of the materials used for packaging. The difference of gas permittivity span over orders of magnitude for plastics on the side and glass/ceramic and metals on the other side.
  • Further, hermetic packaging technologies that prevent internal components from reacting with oxygen or moisture in the air are critical for numerous microscale technologies, including sensors, batteries, super-capacitors, energy harvesters, and other energy systems. Creating suitable packaging strategies for these microscale technologies is of growing importance as the markets for these devices continue to increase.
  • The micro battery market, for example, is expected to grow nearly five times between 2019 and 2025 as a result of electric vehicles, a new Internet of Things (IoT), and medical devices. Still, current hermetic packaging technologies limit micro battery energy densities to a fraction of macroscale batteries. One reason for the divergent energy densities of micro-and macroscale batteries is that widely used macroscale hermetic packaging technologies cannot be directly applied to micro-batteries as the packaging dominates the volume and mass of the internal components.

Hermetic Packaging Market Trends

Reed Glass is Expected to Hold Significant Share

  • Reed Glasses provide Highly reliable encapsulation of reed switches over millions of switching cycles.
  • The numerous electronic applications involve using Glass tubes where some discrete electronic components demand protection, isolation, or being sealed. However, the function of this glass many a time is to insulate passive components electrically, or it functions as a hermetic seal.
  • Reed glass has found its applications in the centralized locking systems of automobiles, as switches in hot water boilers or as belt sensors. The reed switches, without any mechanical influence from the outside, opens and closes the electrical circuits.
  • Contact is established when a weak magnetic field presses two metal contact blades together inside a thin glass tube. A reed switch, when in resting-state, does not require power which makes this important for the devices consuming very little power.
  • As they possess no mechanical control, reed switches can handle millions of make-and-break cycles without any wear.
  • The metal blades should be free of dust and hermetically sealed inside the glass tubes with inert gas with high tolerances to ensure functionality.

North America is Expected to Hold the Largest Share

  • The increased government spending on the aerospace and defense sector by the government in the region is expected to boost the hermetic packaging market over the forecast period. Also, the aviation industry fuels the demand for hermetic packaging owing to its reliance on new aircraft, thereby strengthening the hermetic packaging industry. In 2020, the US military expenditure reached an estimated USD 778 billion, representing an increase of 4.4 % over 2019. (source: SIPRI).
  • The increased consumer spending in consumer electronics, coupled with the increased penetration of smart communication devices like smartphones, is expected to fuel the demand for hermetic packaging over the forecast period. Based on the projected retail sales for 2021, consumer electronics retail sales in the United States reached USD 442 billion. Smartphones were the products accounting for the largest retail revenue within the consumer electronics sector, comprising USD 79 billion in 2020. (source: Consumer Technology Association).
  • Apart from this, the United States is home to some of the world's major automotive players, investing in electric vehicles and in the self-driving potential of cars, which demand high-performance ICs. Approximately 17.5 million advanced driver assistance systems (ADAS) were manufactured in the United States alone during 2016. By 2021, that number is expected to increase by about 1.5 million units. (source: AMETEK). The automotive industry uses hermetic to ensure sensor functionality in rollover devices and airbag equipment. Hence, with the increasing airbag equipment, the market would potentially demand hermetic packaging.
  • This is one of the major factors to drive the demand for the semiconductor silicon wafers market. For instance, in December 2020, Group14 Technologies, a global provider of silicon-carbon composite materials for lithium-ion applications, secured USD 17 million in Series B funding led by SK materials.

Hermetic Packaging Industry Overview

The competitive rivalry in the hermetic packaging market is quite high owing to the presence of some key players such as Schott AG, SGA technologies, Kyocera and many more. Their ability to continually innovate their products and services has allowed them to gain a competitive advantage over other players. Through strategic partnerships, mergers & acquisitions and research and development activities the players are able to attain a strong foothold in the market.

  • April 2020 - The NanoRetina announced successful preliminary results for its NR600 Artificial Retina Device using SCHOTT Primoceler's glass laser bonding technology. NanoRetina has taken a monumental step forward in establishing its retinal implant that could represent an answer to degenerative vision loss. SCHOTT Primoceler's hermetic glass wafer micro bonding was used for the ultra-miniature, all-glass encapsulation of the device.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Increasing Need to Protect Highly Sensitive Electronic Components
  • 4.3 Market Restraints
    • 4.3.1 Strict Rules and Regulations Regarding Packaging Materials
  • 4.4 Industry Attractiveness - Porter's Five Force Analysis
    • 4.4.1 Threat of New Entrants
    • 4.4.2 Bargaining Power of Buyers/Consumers
    • 4.4.3 Bargaining Power of Suppliers
    • 4.4.4 Threat of Substitute Products
    • 4.4.5 Intensity of Competitive Rivalry
  • 4.5 Technology Snapshot
    • 4.5.1 Glass to Metal Sealing (GTMS)
    • 4.5.2 Ceramics to Metal Sealing (CERTMS)
    • 4.5.3 Glass Micro Bonding
  • 4.6 Assessment of the COVID-19 Impact on the Market

5 MARKET SEGMENTATION

  • 5.1 Type
    • 5.1.1 Passivation Glass
    • 5.1.2 Reed Glass
    • 5.1.3 Transponder Glass
  • 5.2 End-user Industry
    • 5.2.1 Petrochemical
    • 5.2.2 Aerospace and Defense
    • 5.2.3 Automotive Industry
    • 5.2.4 Healthcare
    • 5.2.5 Consumer Electronics
    • 5.2.6 Other End-user Industry
  • 5.3 Geography
    • 5.3.1 North America
      • 5.3.1.1 United States
      • 5.3.1.2 Canada
    • 5.3.2 Europe
      • 5.3.2.1 United Kingdom
      • 5.3.2.2 Germany
      • 5.3.2.3 France
      • 5.3.2.4 Spain
      • 5.3.2.5 Italy
      • 5.3.2.6 Rest of Europe
    • 5.3.3 Asia Pacific
      • 5.3.3.1 China
      • 5.3.3.2 Japan
      • 5.3.3.3 South Korea
      • 5.3.3.4 India
      • 5.3.3.5 Rest of Asia Pacific
    • 5.3.4 Latin America
    • 5.3.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Schott AG
    • 6.1.2 Ametek Inc.
    • 6.1.3 Kyocera Corporation
    • 6.1.4 Micross Components Inc.
    • 6.1.5 Willow Technologies Ltd.
    • 6.1.6 SGA Technologies limited
    • 6.1.7 CompleteHermetics
    • 6.1.8 Special Hermetics products Inc.
    • 6.1.9 Materion Corporation
    • 6.1.10 Teledyne Technologies Incorporated
    • 6.1.11 Egide SA

7 INVESTMENT ANALYSIS

8 FUTURE OF THE MARKET