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半導體生產設備電子設備合同製造

市場調查報告書

商品編碼

1404500

OSAT：市場佔有率分析、產業趨勢/統計、成長預測，2024-2029

OSAT - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts 2024 - 2029

出版日期: 2024年01月04日 | 出版商:

Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

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簡介目錄

OSAT市場規模預計到2024年為468.7億美元，預計到2029年將達到691.9億美元，在預測期內（2024-2029年）複合年成長率為8.10%。

對半導體的需求不斷成長以及對新晶片製造、封裝、組裝和測試設施的投資正在推動所研究市場的成長。

主要亮點

外包也是半導體產業的重要組成部分。除了設計之外，半導體產品開發的製造方面還依賴第三方供應商提供的服務。 Fabs（純晶圓代工廠）和 OSAT 是半導體外包的兩個突出例子。 OSAT 半導體公司提供第三方積體電路 (IC) 封裝和測試服務，在代工製造的半導體裝置出貨之前對它們進行封裝和測試。這些公司提供創新、經濟高效的解決方案，可在電子設備內的較小空間內實現更快的處理速度、更高的效能和功能。
許多 OSAT 公司與英特爾、AMD 和 Nvidia 等半導體設計公司簽訂合約來執行他們的設計。例如，英特爾既是一家晶片設計公司，也是一家代工廠（晶圓供應公司）。英特爾委託晶片封裝外包給不同的OSAT，並在將晶片出貨給客戶之前提供組裝和測試服務。
半導體產業持續成長，小型化和效率是關鍵領域，半導體正在成為所有現代技術的基石。該領域的進步和創新對所有下游技術產生直接影響。人工智慧（AI）和雲端運算等電子技術的快速發展，伴隨著對高速、低功耗和高度整合積體電路（IC）的高需求，導致其銷售量龐大。
然而，家電需求的大幅下降以及雲端服務需求的下降對OSAT市場產生了負面影響，導致2023年上半年許多OSAT工廠的運轉率下降。另一方面，先進封裝技術的引入以及家用電子電器和汽車領域電子功能不斷增加帶來的庫存調整需求預計將導致未來幾個季度OSAT運轉率逐步恢復。。
此外，由於製造節點的進步和小型化趨勢，半導體封裝和測試製程的複雜性不斷增加，仍然是研究市場成長的主要挑戰。
此外，主要半導體製造商垂直整合封裝業務是全球OSAT市場面臨的重大威脅之一。近年來，代工廠和整合設備製造商 (IDM) 已開始將先進封裝產品作為其核心競爭力的一部分。這對 OSAT 供應商具有重大影響。因為他們很多都是大公司，投入巨資，控制前端設備。如果這種趨勢持續下去，可能會限制 OSAT 供應商的範圍，並對他們的成長產生負面影響。

OSAT市場趨勢

汽車應用領域預計將佔據主要市場佔有率

汽車應用是支援 OSAT 市場成長的成長最快的應用領域之一。自動駕駛汽車、電動車和 ADAS（高級駕駛輔助系統）的興起正在增加汽車晶片的需求和複雜性，導致對半導體晶片的強勁需求，並在所研究的市場中創造商機。
例如，資訊娛樂控制器和 ADAS 等汽車應用在寬動作溫度範圍內具有嚴格的關鍵任務測試要求，需要 OSAT 供應商的參與。先進封裝技術和新一代高性能、高可靠、高整合晶片是由封裝材料實現的，而封裝材料對於先進技術應用的成長至關重要。
隨著半導體晶片需求的增加，台積電（TSMC）和聯華電子（UMC）等供應商正在轉移生產以滿足大眾和豐田等汽車製造商的需求。我們宣布將重點關注這一點。例如，2023年2月，通用汽車與GlobalFoundries簽署了一項長期協議，建立美國生產的半導體晶片的生產能力。 WorldFoundries表示，為通用汽車獨家生產半導體晶片將擴大這家總部位於紐約的公司的業務。
此外，全球千禧世代對自動駕駛汽車的偏好預計將推動對半導體封裝和測試的需求。自動駕駛汽車配備了超過2500個晶片。幾年前，信譽良好的公司必須應對半導體短缺的問題，因為生產單一半導體需要很長時間。此外，汽車產業的電動趨勢預計也將對所研究市場的成長產生重大影響。
例如，根據IEA的預測，2022年電動車在全球小客車銷量中的佔有率將達到約14%，比與前一年同期比較增加約5.3個百分點。自2017年以來，電動車銷量一直快速成長，佔市場佔有率超過1%，尤其是2020年以來成長加速。由於環保意識增強，許多消費者在疫情期間開始尋求更永續的交通途徑。這有助於全球電動車市場的擴張。

韓國預計將佔據較大市場佔有率

韓國是全球OSAT廠商最有前景的市場之一。該國也是消費性電子領域著名晶片製造商的所在地，例如三星和SK海力士，使其成為半導體設備創新的有利中心。
韓國政府專注於發展智慧製造，計畫在2025年將全自動化製造企業數量增加到3萬家。政府的目標是透過整合最新的自動化、資料交換和物聯網技術來實現這一目標。預計這將成為該國 OSAT 服務的主要動力。
此外，由於三星電子系統半導體業務的成長，該國半導體測試產業的規模正在顯著擴大。 NEPES Ark、LB Semicon、Tesna 和 Hana Micron 等國內半導體測試公司正在透過大力投資必要的設施和設備來應對系統半導體供應的增加。
5G領域的發展也帶動了晶片先進封裝的成長。根據科學與資訊通訊部的數據，截至 2023 年 2 月，5G用戶數為 2,913 萬，比 2021 年 2 月的 1,366 萬增加了 113%。這種趨勢預計將進一步增加對半導體晶片的需求，並在所研究的市場中創造機會。
另外，韓國著名汽車公司之一的汽車製造商現代汽車宣布，計劃未來五年在 ADAS 系統、電動車、自動駕駛汽車及相關技術領域投資 215.6 億美元。預計這也將推動汽車半導體的區域需求，並為 OSAT 市場創造機會。

OSAT產業概況

半導體組裝與測試服務(OSAT) 市場較為分散，主要參與者包括日月光科技控股(ASE Technology Holding)、安靠科技(Amkor Technology Inc.)、力成科技(Powertech Technology Inc.)、景源電子(King Yuan Electronics) 和茂茂科技(ChipMOS Technologies Inc.)。

2023 年 8 月，凱因斯科技與卡納塔克邦（印度）IT&BT 部簽署了一份合作備忘錄，將在邁索爾建立半導體組裝和測試設施。藉此，Kaynes Circuits India Pvt. Ltd. 將主導建立一家製造工廠，生產複雜的多層印刷電路基板(PCB)。

2023 年 6 月，Amkor Technology Inc. 宣布，它一直致力於先進的封裝創新，以實現未來的汽車。這是由於過去幾年汽車體驗的巨大發展，以及在當地法律規章和消費者偏好的推動下，朝向 ADAS（高級駕駛輔助系統）和全自動駕駛發展的趨勢。

其他福利：

Excel 格式的市場預測 (ME) 表
3 個月的分析師支持

按服務類型
- 包裝
- 測試
按包裝類型
- 球柵陣列 (BGA) 封裝
- 晶片級封裝 (CSP)
- 堆疊晶片封裝封裝
- 多晶片封裝
- 四扁平雙列直插式封裝
按申請
- 通訊設備
- 消費性電子產品
- 車
- 運算網路
- 產業
- 其他
按地區
- 美國
- 中國
- 台灣
- 韓國
- 馬來西亞
- 新加坡
- 日本
- 其他地區

第7章競爭形勢

公司簡介
- ASE Technology Holding Co. Ltd
- Amkor Technology Inc.
- Powertech Technology Inc.
- ChipMOS Technologies Inc.
- King Yuan Electronics Co. Ltd
- Formosa Advanced Technologies Co. Ltd
- Jiangsu Changjiang Electronics Technology Co. Ltd
- UTAC Holdings Ltd
- Lingsen Precision Industries Ltd
- Tongfu Microelectronics Co.
- Chipbond Technology Corporation
- Hana Micron Inc.
- Integrated Micro-electronics Inc.
- Tianshui Huatian Technology Co. Ltd
Vendor Share Analysis

第8章投資分析

第9章市場機會及未來趨勢

簡介目錄

Product Code: 66300

The OSAT Market size is estimated at USD 46.87 billion in 2024, and is expected to reach USD 69.19 billion by 2029, growing at a CAGR of 8.10% during the forecast period (2024-2029).

The growing semiconductor demand and investments in new chip manufacturing, packaging, assembly, and testing facilities favor the studied market's growth.

Key Highlights

Outsourcing is also a major factor in the semiconductor industry. More than just design, the manufacturing aspect of semiconductor product development is dependent on the services provided by third-party vendors. Fabs (Pure-Play Foundries) and OSATs are two prominent examples of semiconductor outsourcing. OSAT semiconductor firms provide third-party integrated circuit (IC) packaging and testing services package and test semiconductor devices made by foundries before shipping them to the market. Such companies in the market provide innovative and cost-effective solutions that deliver faster processing speeds, higher performance, and functionality while taking up less space in an electronic device.
OSAT companies are mostly contracted by semiconductor design companies, such as Intel, AMD, and Nvidia, and execute those companies' designs. For instance, Intel is both a chip designer and a foundry (wafer provider) owing to the fact that they own and operate their fabs or foundries. Intel outsources its chip packaging to different OSATs for assembly and test services before shipping the chips to customers.
The semiconductor industry has been growing, with miniaturization and efficiency being the focus area and semiconductors emerging as building blocks of all modern technology. The advancements and innovations in this field have been directly impacting all downstream technologies. The rapid development of electronics technology, including artificial intelligence (AI) and cloud computing, is complemented by a high demand for integrated circuits (ICs) with high speed, low power consumption, and high integration, leading to its significant sales.
However, the significant downfall in demand for consumer electronics and declining demand for cloud services has negatively impacted the OSAT market, leading to a decrease in the capacity utilization of many OSAT plants in the first half of 2023. On the contrary, the introduction of advanced packaging technologies owing to the development of sophisticated electronics in both the consumer electronics and automotive sectors, as well as demand for stock adjustment, is expected to provide a moderate recovery of capacity utilization of OSAT in the upcoming quarters.
Furthermore, the growing complexity in the semiconductor packaging and testing process owing to the advancement in manufacturing nodes and the miniaturization trend continues to remain among the major challenging factors for the growth of the studied market.
Additionally, vertical integration of key semiconductor manufacturers into packaging operations is one of the significant threats faced by the global OSAT market. In recent years, foundries and integrated device manufacturers (IDMs) have begun to include advanced packaging products as part of their core competencies. This has a significant impact on OSAT vendors, as many of them are large players with high expenditures and control the front-end devices. If this trend continues, it may limit the scope of OSAT vendors and harm their growth.

OSAT Market Trends

Automotive Application Segment is Expected to Hold Significant Market Share

Automotive applications are one of the fastest-growing application areas supporting the growth of the OSAT market. As the demand and complexity of automotive chips are growing with the advent of autonomous vehicles, electric cars, and advanced driver-assistance system (ADAS) systems, the demand for semiconductor chips has been growing significantly, creating opportunities in the studied market.
For instance, in-cabin applications such as infotainment controllers and ADAS have stringent mission-critical test requirements over wide operating temperature ranges, necessitating the need for OSAT vendors to step in. Advanced packaging technologies and a new generation of chips with high performance, reliability, and integration are made possible by packaging materials, which are essential to the growth of advanced technology applications.
Owing to the growing demand for semiconductor chips, the vendors, such as Taiwan Semiconductor Manufacturing Co. (TSMC) and United Microelectronics Corp. (UMC), announced that they have been focusing on relocating their production to meet the demand from automakers, such as Volkswagen and Toyota, among others. For instance, in February 2023, GM signed a long-term agreement with Global Foundries to establish the production capacity of U.S.-produced semiconductor chips. According to GlobalFoundaries, this exclusive production of semiconductor chips for General Motors will be an expansion of the New York-based company's operations.
Furthermore, the global millennial preference for autonomous vehicles is anticipated to fuel the semiconductor packaging and testing demand. In an automatic car, there are more than 2,500 chips installed. Since it used to take longer to produce a single semiconductor a few years ago, reputable companies had to deal with a shortage of semiconductors. Furthermore, the electrification trend in the automobile industry is also anticipated to have a notable influence on the studied market's growth.
For instance, according to IEA, Electric vehicles amounted to about 14 percent of global passenger car sales in 2022, a rise of around 5.3 percentage points year-over-year. Electric vehicle sales have rapidly increased since 2017, when they rose above one percent of the market, and have particularly accelerated since 2020. Due to increased environmental consciousness, many consumers started looking for more sustainable transportation methods amid the pandemic. This contributed to the EV market expansion worldwide.

South Korea is Expected to Hold a Significant Market Share

South Korea is one of the promising markets for global OSAT vendors. The country is also home to some prominent chip makers for the consumer electronics segment, such as Samsung and SK Hynix, making it a lucrative hub for innovation in semiconductor devices.
The Korean government focuses on smart manufacturing and plans to have 30,000 fully automated manufacturing companies by 2025. The government aims to achieve this by incorporating the latest automation, data exchange, and IoT technologies. This is expected to be a major driver for OSAT services in the country.
Moreover, the size of the country's semiconductor testing sector has grown significantly with the growth of Samsung Electronics' system semiconductor business. The semiconductor testing companies in the country, such as NEPES Ark, LB Semicon, Tesna, and Hana Micron, have been dealing with increased supplies of system semiconductors by making significant investments in necessary facilities and equipment.
The developments in the 5G space also led to the growth of advanced packaging of chips. According to the Ministry of Science and ICT, as of February 2023, the country had 29.13 million 5G Subscribers, an increase of 113% compared to 13.66 million 5G subscribers in February 2021. Such trends are anticipated to drive the demand for semiconductor chips further, creating opportunities in the studied market.
Apart from this, the automotive maker Hyundai, one of the prominent automobile companies in South Korea, announced that it is planning to invest USD 21.56 billion over the next five years in ADAS systems, electric cars, autonomous vehicles, and related technology, as its aim to push itself to catch up in this critical emerging technology. This is also expected to fuel the regional demand for automotive semiconductors, creating opportunities in the OSAT market as well.

OSAT Industry Overview

The outsourced semiconductor assembly and test services (OSAT) Market is fragmented, with the presence of major players like ASE Technology Holding Co. Ltd, Amkor Technology Inc., Powertech Technology Inc., King Yuan Electronics Co. Ltd., ChipMOS Technologies Inc., and Players in the market are adopting strategies such as innovations, partnerships, and acquisitions to enhance their product offerings and gain sustainable competitive advantage.

In August 2023, Kaynes Technology and the Karnataka (India) IT&BT Department signed an MoU for setting up a semiconductor assembly and testing facility in Mysuru. Through this, Kaynes Circuits India Pvt. Ltd. is planning to spearhead the establishment of a manufacturing plant for producing complex multi-layered Printed Circuit boards (PCB).

In June 2023, Amkor Technology Inc. announced that it has been working toward innovating advanced packaging to enable the car of the future. This is done owing to the dramatic evolution of the enhanced automotive experience over the past few years and the move toward advanced driver assistance systems (ADAS) and full autonomy, motivated by regional legislation and consumer preference.

Additional Benefits:

The market estimate (ME) sheet in Excel format
3 months of analyst support

1 INTRODUCTION

1.1 Study Assumptions and Market Definition
1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

4.1 Market Overview
4.2 Semiconductor Industry Outlook
4.3 Industry Attractiveness - Porter's Five Forces Analysis
- 4.3.1 Bargaining Power of Suppliers
- 4.3.2 Bargaining Power of Buyers
- 4.3.3 Threat of New Entrants
- 4.3.4 Threat of Substitutes
- 4.3.5 Intensity of Competitive Rivalry
4.4 Industry Value Chain Analysis
4.5 Assessment of the Impact of Macro Trends on the Market

5 MARKET DYNAMICS

5.1 Market Drivers
- 5.1.1 Increased Applications of Semiconductors in Automotive
- 5.1.2 Advancement in Semiconductor Packaging Due to Trends like 5G
5.2 Market Restraints
- 5.2.1 Vertical Integration is one of the Significant Concerns of OSAT Players

6 MARKET SEGMENTATION

6.1 By Service Type
- 6.1.1 Packaging
- 6.1.2 Testing
6.2 By Type of Packaging
- 6.2.1 Ball Grid Array (BGA) Packaging
- 6.2.2 Chip Scale Packaging (CSP)
- 6.2.3 Stacked Die Packaging
- 6.2.4 Multi Chip Packaging
- 6.2.5 Quad Flat and Dual-inline Packaging
6.3 By Application
- 6.3.1 Communication
- 6.3.2 Consumer Electronics
- 6.3.3 Automotive
- 6.3.4 Computing and Networking
- 6.3.5 Industrial
- 6.3.6 Other Applications
6.4 By Geography
- 6.4.1 United States
- 6.4.2 China
- 6.4.3 Taiwan
- 6.4.4 South Korea
- 6.4.5 Malaysia
- 6.4.6 Singapore
- 6.4.7 Japan
- 6.4.8 Rest of the World

7 COMPETITIVE LANDSCAPE

7.1 Company Profiles
- 7.1.1 ASE Technology Holding Co. Ltd
- 7.1.2 Amkor Technology Inc.
- 7.1.3 Powertech Technology Inc.
- 7.1.4 ChipMOS Technologies Inc.
- 7.1.5 King Yuan Electronics Co. Ltd
- 7.1.6 Formosa Advanced Technologies Co. Ltd
- 7.1.7 Jiangsu Changjiang Electronics Technology Co. Ltd
- 7.1.8 UTAC Holdings Ltd
- 7.1.9 Lingsen Precision Industries Ltd
- 7.1.10 Tongfu Microelectronics Co.
- 7.1.11 Chipbond Technology Corporation
- 7.1.12 Hana Micron Inc.
- 7.1.13 Integrated Micro-electronics Inc.
- 7.1.14 Tianshui Huatian Technology Co. Ltd
7.2 Vendor Share Analysis