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光子積體電路-市場佔有率分析、產業趨勢與統計、2024年至2029年成長預測

Photonic Integrated Circuit - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts 2024 - 2029
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

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簡介目錄

光子積體電路市場規模預計到2024年為151.1億美元，預計到2029年將達到383.5億美元，在預測期內（2024-2029年）複合年成長率為20.47%。

光子積體電路-市場-IMG1

主要亮點

  • 一旦安裝了單一晶片，光子學的各種組件（例如波導管、雷射、調變和檢測器）就被稱為光子積體電路。光子積體電路比傳統 IC 速度更快、頻寬更高、能源效率更高。這些功能解決了傳統 IC 的一些基本缺點。
  • 光子 IC 可以將此類關鍵應用中的功耗降低至少 50%。光子可以覆蓋的頻率大約是微電子可以覆蓋的頻譜的 1,000 到 10,000 倍，透過使用光子 IC，最終用戶可以獲得比傳統 IC 節能得多的更高頻率。完成。
  • 由於資料驅動的生態系統，採用混合晶片方法製造的光子裝置的成本每年呈指數級成長，並且對終端用戶應用的需求巨大。
  • 此外，多個市場參與企業正在積極開發光子積體電路，作為高度整合光子技術的一部分，並解決因 COVID-19 大流行應對而增加的網路流量，特別是在資料中心內。我們正在努力利用它。
  • 儘管混合光子 IC 效率很高，並且與前幾代傳統 IC 相比具有許多優勢，但它們尚未達到傳統 IC 的市場滲透水平。
  • 由於 COVID-19 等威脅和場景，監控市場正在不斷成長。世界各地的許多公共場所都配備了光學和光子感測器，將矽基數位視訊技術與半導體光電陰極技術相結合，以實現高靈敏度的夜視感測器、攝影機和系統。

光子積體電路市場趨勢

通訊和資料中心應用的擴展推動市場發展

  • 混合光子積體電路在通訊和資料中心提供廣泛的應用。通訊和資料中心市場擴大採用混合光子積體電路的一個根本促進因素是現有 IC 無法滿足的高傳輸速率需求。
  • 高容量網路和 5G 的發展也有助於提高速度。透過收發器和被動元件的發展和普及，光子積體電路技術已成為通訊領域的眾所周知的技術。無線和無線電技術是5G發展的重點。
  • 然而，光子學和光纖對於新一代基地台的訊號傳輸至關重要。
  • 此外，許多製造商受益於先進的技術創新，開發符合其需求的低成本混合光子積體電路硬體。此外，由於雲端應用程式的增加，必須在資料中心（DC）處理的流量正在迅速擴大。
  • 根據Uptime Institute對資料中心產業的研究，大多數業者採用與資料中心營運相關的組合策略。由於 IT 工作負載分佈在不同的服務和資料中心，Uptime 估計大約三分之一的工作負載正在轉移到雲端、主機代管、託管和軟體即服務 (SaaS)共用商。
  • 事實上，根據思科的說法，到2022年，預計92%的資料中心工作負載將是雲端運算，對透過混合光子積體電路提供的更先進的交換和資料傳輸設備的巨大需求，這表明有這種需求。
  • 此外，中小型企業對更高頻寬的強烈需求以及對雲端服務的大力採用（在 COVID-19 期間普遍增加）推動了對資料中心的需求。交換器資料和收發器資料速率增加的趨勢正在推動光子積體電路的採用。
光子積體電路-市場-IMG2

北美佔據主要市場佔有率

  • 在北美，對基於光子積體電路的產品的需求是由資料中心和光纖通訊廣域網路應用所驅動的。由於對高速資料傳輸的需求不斷成長，雲端運算流量不斷增加，而光子網際網路的快速引入可能會推動全部區域的IC產業發展。
  • 根據Cloudscene的數據，美國持有全球最多的資料中心，接近2,700個，佔全球總數的近33%。
  • 此外，隨著行動、視訊和雲端服務變得越來越關鍵，服務供應商必須滿足日益成長的網路容量需求。特別是，企業有望建構基於光子積體電路的光纖網路，這可能對市場成長產生正面影響。致力於基於光子積體電路解決方案來應對通訊挑戰的國際公司，包括 IBM 公司、英特爾公司和思科系統公司，已與該地區的學術、企業和政府合作夥伴合作。
  • 官民合作關係正在為中小型企業開發國家研究項目，包括美國的 AIM Photonics（美國製造整合光子學研究所，紐約州叢集）、美國的光子學產業聯盟佛羅裡達光子學集群和安大略省光子產業網路。我們已經組成了聯盟。
  • 隨著資料傳輸速度和頻寬要求的增加，公司開始轉向光子積體電路。光子積體電路利用光和光子而不是電和電子進行工作，有潛力提供更高的頻寬和效率，使其適合未來的應用。光子積體電路找到了改進量子計算等技術的新方法。
  • 2022年12月，OpenRight發表800G DR8光子積體電路，推動全球資料中心互連產業的發展。 OpenLite 使用 Tower Semiconductor 提供的雷射整合開放式矽光子代工平台製造並測試了這些晶圓。

光子積體電路產業概況

光子積體電路市場競爭激烈，Neophotonics公司、Poet Technologies、Cisco Systems Inc.和Infinera Corporation等主要公司進入該市場。從市場佔有率來看，目前該市場由少數大公司主導。然而，隨著技術創新和進步，許多公司正在透過贏得新契約和開拓新市場來增加其市場佔有率。以下是一些最近的市場開拓。

2023年3月，iPronics開發了一款可程式光子晶片，用於無線訊號處理、資料中心、機器學習和其他高階運算應用。該公司開發基於光學硬體的可程式光子系統，可滿足各種應用的需求。

2022年3月，EFFECT Photonics和Jabil Photonics宣布合作，設計新一代連貫光學模組。此模組專為尋求 QSFP 高 DD 效能、佔用空間小、低功耗和成本、現場可替換互通性以及雲端 DCI（資料中心互連）供應商之間的互通性等優勢的網路企業而設計，為企業家和超大規模資料中心業者企業提供了獨特的解決方案。新一代連貫光學模組可滿足對資料流、服務連續性、安全性問題、全球部署和永續性的需求。

2022年3月，ColorChip Group與異構異質整合矽光子垂直整合先驅Skorpios Technologies Inc.宣布了一項策略，利用Skorpios的顛覆性光學技術以前所未有的價格生產光學模組，建立了合作夥伴關係。 ColorChip 銷售自有品牌模組以及 Skorpios 銷售的各種速度和性能等級的自有品牌模組。未來，我們計劃共同開發Co-packaged Optics和Coherent Module等產品。

其他福利：

  • Excel 格式的市場預測 (ME) 表
  • 3 個月分析師支持

目錄

第1章簡介

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章市場洞察

  • 市場概況
  • 產業吸引力－波特五力分析
    • 供應商的議價能力
    • 消費者議價能力
    • 新進入者的威脅
    • 競爭公司之間的敵對關係
    • 替代品的威脅
  • 評估關鍵宏觀經濟因素對市場的影響

第5章市場動態

  • 市場促進因素
    • 通訊和資料中心應用的成長
    • 光子積體電路小型化投資與研究
  • 市場挑戰
    • 對傳統 IC 的持續需求
    • 光纖網路容量不足

第6章市場區隔

  • 依原料類型
    • III-V族材料
    • 鈮酸鋰
    • 矽基二氧化矽
    • 其他原料
  • 按整合過程
    • 混合
    • 整體式的
  • 按用途
    • 通訊
    • 生物醫學
    • 資料中心
    • 其他應用（光感測器（LiDAR）、測量設備）
  • 按地區
    • 北美洲
    • 歐洲
    • 亞太地區
    • 世界其他地區 中東/非洲

第7章競爭形勢

  • 公司簡介
    • NeoPhotonics Corporation
    • POET Technologies
    • II-VI Incorporated
    • Infinera Corporation
    • Intel Corporation
    • Cisco Systems Inc.
    • Source Photonics Inc.
    • Lumentum Holdings
    • Caliopa（Huawei Technologies Co. Ltd）
    • Effect Photonics
    • Colorchip Ltd

第8章投資分析

第9章市場的未來

簡介目錄
Product Code: 59006
Photonic Integrated Circuit - Market - IMG1

The Photonic Integrated Circuit Market size is estimated at USD 15.11 billion in 2024, and is expected to reach USD 38.35 billion by 2029, growing at a CAGR of 20.47% during the forecast period (2024-2029).

Key Highlights

  • As soon as a single chip is attached, different components of the photonics, like waveguides, lasers, modulators, and detectors, become known as photonic integrated circuits. Photonic integrated circuits are extremely fast, accommodate higher bandwidth, and have high energy efficiency compared to traditional ICs. These features have dealt with some of the fundamental drawbacks associated with traditional ICs.
  • In the case of photonic ICs, the power consumed in such critical applications could be reduced by at least 50%. The frequencies that could be covered with photons are about 1,000-10,000 times higher than the spectrum covered with microelectronics, implying that by using photonic ICs, end users can achieve much higher frequencies that are far more energy-efficient than traditional ICs.
  • These low costs of photonics devices manufactured through the hybrid monolithic approach are growing exponentially every year as a result of DataDriven Ecosystems, finding great demand from end users' applications.
  • In addition, several market participants are working to take advantage of PIC's active developments as part of a highly integrated photonic technology and in order to meet the growing volume of network traffic driven by COVID-19 pandemic responses, particularly within data centers.
  • While hybrid photonic ICs are highly efficient and have a number of advantages compared to previous generations of conventional ICs, they do not achieve the level of market penetration found in traditional ICs.
  • The surveillance market is growing with threats and scenarios like COVID-19. Many public places worldwide are deploying optical and photonic sensors that enable high-sensitivity night vision sensors, cameras, and systems combined with semiconductor photocathode technology with silicon-based digital video technology.

Photonic Integrated Circuit Market Trends

Growing Applications in Telecommunications and Data Centers to Drive the Market

  • In telecommunication businesses and data centers, hybrid PICs offer a wide range of applications. The basic factor that has led to the increased adoption of hybrid PICs in the telecommunications and data center markets is their need for a higher transfer rate, which existing ICs cannot accommodate.
  • The development of high-capacity networks and 5G have also contributed to an increase in speed. Through the development and widespread acceptance of transceivers and passive components, PIC technologies have emerged as a technology well-known within the telecommunications sector. Wireless and radio technology has become a focus of the development of 5G.
  • However, photonics and fiber optics have been critical in transporting signals to and from the new generation of base stations.
  • Moreover, many manufacturers are benefiting from the high degree of innovation that is allowing them to develop low-cost hybrid PIC hardware in line with their needs. In addition, an increasing number of cloud applications are rapidly upscaling the traffic that has to be handled by data centers (DC).
  • According to the survey conducted by Uptime Institute on the data center industry, most operators employ a mix of strategies related to DC operations. With IT workloads spread across various services and data centers, Uptime shared that about one-third of all workloads shifted to the cloud, colocation, hosting, and Software-as-a-Service (SaaS) suppliers.
  • As a matter of fact, according to Cisco, 92% of the workload in data centers will be cloud computing by 2022, which indicates that there is an important need for more advanced switching and data transfer devices available through hybrid PICs.
  • Additionally, booming demand for larger bandwidth and strong adoption of cloud services by SMEs typically heightened amid COVID-19 boosted the demand for data centers. A growing trend of increasing switch data and transceiver data rates is driving PIC adoption.
Photonic Integrated Circuit - Market - IMG2

North America to Hold Major Market Share

  • In North America, the demand for photonic integrated circuits (PIC)-based products is driven by data centers and fiber optic communication WAN applications. A growing need to transmit data at fast speeds has led to an increase in cloud computing traffic, and the rapid introduction of the Internet of photonics is likely to lead to a flourishing IC industry across the region.
  • According to Cloudscene, the United States holds the highest number of data centers globally, i.e., almost 2,700, which is almost 33% of the world's.
  • In addition, service providers must meet the growing demand for network capacity as mobile, video, and cloud services increasingly become an integral part of their business. In particular, it is expected that companies will base their optical networks on PICs, which may have a positive effect on the growth of the market. International companies working on PIC-based solutions for telecommunications challenges, including IBM Corporation, Intel Corporation, and Cisco Systems Inc., have worked together with academia, business, and government partners throughout the region.
  • Public-private partnerships have forged national research consortiums for smaller enterprises, such as the American Institute for Manufacturing Integrated Photonics (AIM Photonics, Rochester, NY) in the United States, the Canadian Photonic Industry Consortium Florida Photonics Cluster, and the Ontario Photonics Industry Network.
  • With increasing data rates and bandwidth requirements, companies have started to push for a shift toward PICs. PICs working with light and photons instead of electricity and electrons could offer higher bandwidth and efficiency, making them well-suited for future applications. PICs have been finding new ways to improve technology, like quantum computing.
  • In Dec 2022, OpenLight unveiled an 800 G DR8 photonic integrated circuit to advance the global data center interconnect industry. OpenLight has fabricated and tested these wafers using the open silicon photonics foundry platform with integrated lasers offered by open silicon photonics foundry platform with integrated lasers offered by Tower Semiconductor.

Photonic Integrated Circuit Industry Overview

The photonic integrated circuit market is moderately competitive and consists of several major players like Neophotonics Corporation, Poet Technologies, Cisco Systems Inc., and Infinera Corporation. In terms of market share, few major players currently dominate the market. However, with innovations and technological advancements, many companies are increasing their market presence by securing new contracts and tapping new markets. Some of the recent developments in the market are:

In March 2023, iPronics created a programmable photonic chip for wireless signal processing, data centers, machine learning, and other advanced computing applications. The company is developing programmable photonic systems based on optical hardware that can be adapted to meet the needs of different applications.

In March 2022, EFFECT Photonics and Jabil Photonics announced a cooperation with the aim of developing a new generation of coherent optical modules. The modules offer a unique solution for network operators and hyper-scalers seeking to benefit from QSFP-high DD's performance, small footprint, low power consumption and cost, field replaceability, and vendor interoperability for cloud DCIs (Data Center Interconnects). The next-generation coherent optical modules handle the increased demand for data flow, service continuity, security issues, global expansion, and sustainability.

In March 2022, ColorChip Group and Skorpios Technologies Inc., a vertically integrated pioneer in heterogeneously integrated silicon photonics, established a strategic partnership to use Skorpios' disruptive optical technology to produce optical modules at previously unheard-of prices. ColorChip will sell its brand of modules and private label modules for Skorpios to sell at various speeds and performance levels. Future products, such as Co-packaged Optics and Coherent Modules, will be developed in collaboration.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Consumers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Intensity of Competitive Rivalry
    • 4.2.5 Threat of Substitute Products
  • 4.3 Assessment of the Impact of Key Macroeconomic Factors on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Growing Applications in Telecommunications and Data Centers
    • 5.1.2 Investments and Research to Miniaturize the PICs
  • 5.2 Market Challenges
    • 5.2.1 Continued Demand for Traditional ICs
    • 5.2.2 Optical Networks Capacity Crunch

6 MARKET SEGMENTATION

  • 6.1 By Type of Raw Material
    • 6.1.1 III-V Material
    • 6.1.2 Lithium Niobate
    • 6.1.3 Silica-on-silicon
    • 6.1.4 Other Raw Materials
  • 6.2 By Integration Process
    • 6.2.1 Hybrid
    • 6.2.2 Monolithic
  • 6.3 By Application
    • 6.3.1 Telecommunications
    • 6.3.2 Biomedical
    • 6.3.3 Data Centers
    • 6.3.4 Other Applications (Optical Sensors (LiDAR), Metrology)
  • 6.4 By Geography
    • 6.4.1 North America
    • 6.4.2 Europe
    • 6.4.3 Asia Pacific
    • 6.4.4 Rest of the World

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 NeoPhotonics Corporation
    • 7.1.2 POET Technologies
    • 7.1.3 II-VI Incorporated
    • 7.1.4 Infinera Corporation
    • 7.1.5 Intel Corporation
    • 7.1.6 Cisco Systems Inc.
    • 7.1.7 Source Photonics Inc.
    • 7.1.8 Lumentum Holdings
    • 7.1.9 Caliopa (Huawei Technologies Co. Ltd)
    • 7.1.10 Effect Photonics
    • 7.1.11 Colorchip Ltd

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET