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半導體雷射設備市場——增長、趨勢、COVID-19 的影響、預測 (2023-2028)

Semiconductor Laser Equipment Market - Growth, Trends, and Forecasts (2023 - 2028)

出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

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簡介目錄

半導體雷射設備市場預計在預測期內以約 5.6% 的複合年增長率增長。

機床、微電子、汽車和工業等最終用途行業對半導體的需求不斷增長,預計將推動半導體雷射設備市場的發展。

主要亮點

  • 半導體製造過程中有多種雷射應用。 一些雷射技術開始被納入主要的半導體操作,如雷射切割、焊接、鍵合、鑽孔、剝離、標記、圖案化、計量和沈積。 它們用於製造半導體器件、模塊化高容量互連印刷電路板,特別是用於集成電路 (IC) 的封裝。
  • 應用因半導體類型而異。 雷射在製造過程中被廣泛用於標記晶圓,以表明它們適用於哪種應用。 此外,雷射不僅會刮擦晶圓表面,還會重新排列表面的顆粒,以創建淺而易讀的標記。
  • 半導體雷射器應用於工業、通信、軍事等各個領域,在現代社會中的重要性與日俱增。 此外,新用例的出現正在推動對所研究市場的進一步投資。 例如,2022 年 2 月,美國國防高級研究計劃局 (DARPA) 提交了一份關於可擴展的高能雷射 (HEL) 技術的提案,以開發雷射戰系統的新時代。 計劃為期五年、耗資 6000 萬美元的模塊化高效雷射技術 (MELT) 項目將消除所有當前的技術發展。 它還計劃利用最先進的半導體製造工藝、相干光束組合、光子集成、三維 (3D) 連接和封裝。 預計此類投資將增加半導體需求,並促進軍事和國防應用的市場發展。
  • 對半導體芯片不斷增長的需求也在推動全球對製造設備的投資,為預測期內研究的市場增長創造了有利的市場環境。 例如,根據SEMI(國際半導體設備與材料),預計2021年韓國在半導體設備上的支出將達到249.8億美元,中國台灣將達到249.4億美元,中國將達到296.2億美元。
  • 然而,高初始投資、複雜的程序、技術知識、技能等是預計在預測期內限制半導體雷射設備市場增長的主要因素。
  • COVID-19 大流行在多個國家實施了廣泛的封鎖,嚴重擾亂了半導體行業的供應鏈,導致對相關設備的需求放緩,並嚴重影響了研究市場的增長。我是。 然而,伴隨疫情而來的數字技術的普及預計在後 COVID 時期也將增長,推動對半導體芯片的需求,促使芯片製造商投資雷射等設備以加快生產,釋放研究市場機會。我認為它會創造。

半導體雷射設備市場趨勢

對半導體芯片的需求增加以支持市場增長

  • 各個最終用戶領域對半導體芯片的需求不斷增加,這為半導體雷射設備市場的增長創造了有利的市場環境。 例如,根據 IEEE,汽車領域對半導體的需求不斷增加。 這是由於先進技術的重大進步,如車對車通信、高級駕駛員輔助系統 (ADAS) 和電動汽車的電源管理,如導航、儀表板攝像頭、智能鑰匙和備受期待的圖像處理器。
  • 根據中國汽車工業協會 (CAAM) 的數據,2021 年中國生產的汽車總數約為 2610 萬輛。 此外,預計汽車行業將在 2022 年穩步增長。 例如,2022年9月,全國汽車銷量約為260萬輛。 汽車行業的增長預計將增加對汽車半導體芯片的需求,推動對半導體雷射器等半導體設備的投資。
  • 此外,隨著對智能和多功能設備的需求不斷增加,消費電子行業的增長預計也將在預測期內推動對半導體芯片的需求。 這種需求增長正在推動供應商擴大業務並投資新的製造設施。 例如,2022 年 7 月,三星透露計劃投資 5 億美元擴大墨西哥兩家工廠的消費電子產品製造。 預計此類投資將推動對半導體芯片的需求並促進市場增長。
  • 隨著對半導體芯片的需求增加,製造商正在增加對新芯片製造設施和設備的投資,為所研究的市場創造了有利的市場前景。 例如,根據 SEMI 的數據,半導體製造設備的支出從 2018 年的 644.2 億美元增加到 2021 年的 1026.4 億美元。

預計亞太地區在預測期內將顯著增長

  • 預計亞太地區在預測期內將實現顯著增長,政府支出和舉措的增加以及該地區的高生產力和工業化將增加對半導體的需求。 此外,印度、中國、日本、韓國和台灣等國家的電信行業正在經歷強勁增長,主要智能手機製造商在該地區的存在意味著未來幾年該地區存在增長機會。預計出生。
  • 大型公司增加投資以及政府增加對最終用途應用的承諾預計將在未來幾年推動產品需求。 例如,京瓷計劃在截至 2022 年 12 月的三年內將其在半導體製造和其他行業的投資翻一番。 在截至 2026 年 3 月的三年中,資本投資、研究和技術的總支出預計將達到 1.3 萬億日元(97.8 億美元)。
  • 同樣,2021 年 11 月,日本政府宣布計劃將其 2021 財年追加預算中的 6000 億日元(45 億美元)用於先進半導體製造。 2021 年,日本政府批准了一項 3.38 億美元的芯片研究項目,該項目將允許台積電開發新的芯片技術。 由於各國目前面臨芯片短缺和對未來國內供應的擔憂,該公司與英特爾和三星等競爭對手正在利用慷慨的國家補貼。 未來幾年,由於半導體製造方法的變化,半導體雷射設備的市場有望擴大。
  • 此外,亞太地區還有台積電、中芯國際、SK海力士等主要半導體芯片廠商。 這些供應商在半導體製造設備上投入大量資金,以擴充現有晶圓廠並開拓新市場。 這為亞太地區研究市場的增長創造了有利的市場條件。

半導體雷射設備市場競爭者分析

半導體雷射設備市場與眾多公司競爭適中,例如 Hamamatsu Photonics K.K.、Applied Materials K.K.、Disco Inc.、Delphi Laser K.K. 和 Sumitomo Heavy Industries, Ltd.。 這些參與者不斷採取產品發布、產品開發、合作夥伴關係和協作等策略,以增加其全球份額並擴大其市場佔有率。

2022 年 11 月,法國 LP3 研究所的研究人員開發了一種基於光的技術,該技術支持半導體芯片三維空間中任何位置的局部材料處理。 該技術促成的雷射直寫開闢了利用地下空間實現更高集成度和附加功能的可能性。

2022 年 9 月,Ushio 宣布推出新的 405nm、600mW (CW) 雷射二極管“HL40173MG”和“HL40175MG”,其使用壽命約為傳統產品的兩倍。 隨著智能手機的小型化和高性能化,將高清電路設計曝光到基板上的無掩模(直寫)曝光設備對光源的需求急劇增加。 對 405nm 雷射二極管的需求也越來越大,它經常被用作生物醫學、計量學和 3D 打印等行業的光源,並且需要進一步提高穩定性和使用壽命。

其他好處

  • Excel 格式的市場預測 (ME) 表
  • 三個月的分析師支持

內容

第1章介紹

  • 研究假設和市場定義
  • 調查範圍

第2章研究方法論

第 3 章執行摘要

第 4 章市場洞察

  • 市場概覽
  • 產業競爭力 - 波特的五力分析
    • 新進入者的威脅
    • 買家的議價能力
    • 供應商的議價能力
    • 替代品的威脅
    • 競爭公司之間的敵對關係
  • 工業價值鏈分析
  • 評估 COVID-19 對行業的影響

第 5 章市場動態

  • 市場驅動力
    • 終端行業對半導體芯片的需求不斷增長
  • 市場製約因素
    • 安裝和維護成本高

第 6 章市場細分

  • 按流程
    • 雷射晶圓切割
    • 雷射鍵合/剝離
      • 臨時粘貼/臨時剝離
      • 雷射剝離
      • 雷射誘導正向轉移
    • 雷射退火
    • 雷射晶圓打標
  • 區域信息
    • 北美
    • 歐洲
    • 亞太地區
    • 世界其他地區

第7章競爭格局

  • 公司簡介
    • Hamamatsu Photonics K.K
    • Applied Materials
    • DISCO Corporation
    • Delphi Laser
    • Sumitomo Heavy Industries, Ltd.
    • Coherent
    • FitTech
    • Corning
    • IPG Photonics
    • Hanmi Semiconductor

第8章 投資分析

第9章 市場將來展望

簡介目錄
Product Code: 93319

The semiconductor laser equipment market is expected to register an approximate CAGR of 5.6% throughout the forecast period. Increasing demand for semiconductors from end-use sectors such as machine tools, microelectronics, automotive, and industrial is expected to drive the semiconductor laser equipment market.

Key Highlights

  • The semiconductor manufacturing process has a wide range of laser applications. Several laser technologies have begun integrating into main semiconductor operations, such as laser cutting, welding, bonding, drilling, debonding, marking, patterning, measuring, and deposition. These are utilized in fabricating semiconductor devices, modular and high-capacity interconnect printed circuit boards, and especially in packaging integrated circuits (ICs).
  • as different semiconductors have different applications. Lasers are widely used during the manufacturing process for marking the wafers, indicating which item is suitable for which application. Furthermore, lasers not only cut into a wafer's surface but also re-arrange the surface particles, creating marks that are easily readable despite being minutely shallow.
  • Semiconductor lasers have become more important in modern life, with several uses in industry, communication, and the military. Furthermore, the emergence of new use cases is driving further investments in the studied market. For instance, in February 2022, the Defense Advanced Research Projects Agency (DARPA) submitted proposals for scalable, high-energy laser (HEL) technologies to develop a novel era of laser combat systems. The planned five-year, USD 60 million Modular Efficient Laser Technology (MELT) effort removes all current technology development. It also plans to leverage cutting-edge semiconductor manufacturing processes, coherent beam combining, photonic integration, and three-dimensional (3D) connectivity and packaging. Such investments are expected to increase semiconductor demand across military and defense applications, contributing to market development.
  • Increasing demand for semiconductor chips is also driving investments in manufacturing equipment worldwide, which in turn is creating a favorable market scenario for the growth of the studied market during the forecast period. For instance, according to Semiconductor Equipment and Materials International (SEMI), the spending on semiconductor equipment in South Korea amounted to USD 24.98 billion, in Taiwan, to USD 24.94 billion, and in China, to USD 29.62 billion in 2021.
  • However, high initial investment, complex procedures, technical knowledge, and skills are among the major factors expected to restrain the semiconductor laser equipment market's growth over the forecast period.
  • The COVID-19 pandemic had a notable impact on the growth of the studied market as the widespread lockdown imposed across various countries significantly disrupted the semiconductor industry's supply chain, resulting in a slowdown in demand for related equipment. However, the pandemic-led growth in the adoption of digital technologies was expected to grow in the post-COVID period as well, driving the demand for semiconductor chips, which in turn will encourage the chip manufacturers to invest in equipment such as lasers to drive production, creating opportunities in the studied market.

Semiconductor Laser Equipment Market Trends

Increasing Demand for Semiconductor Chips To Support The Market Growth

  • The rising demand for semiconductor chips throughout various end-user sectors creates a favorable market setting for the semiconductor laser equipment market's growth. For example, according to IEEE, semiconductor demand in the automotive sector has been continuous, owing to a significant improvement in cutting-edge technologies such as vehicle-to-everything communication, advanced driver-assistance systems (ADAS), and power management in electric cars, including navigation, dashboard cameras, smart keys, as well as a highly anticipated image processor.
  • According to the China Association of Automobile Manufacturers (CAAM), the total number of automobiles manufactured in China in 2021 was around 26.1 million. Furthermore, the automobile sector is expected to increase steadily in 2022. For example, in September 2022, the country sold around 2.6 million automobiles. The growth in the automobile sector is expected to increase demand for automotive-grade semiconductor chips, driving investments in semiconductor equipment such as semiconductor lasers.
  • Growth in the consumer electronics industry is also expected to contribute to the demand for semiconductor chips over the forecast period as a result of the increasing demand for smart and multifunctional devices. This demand growth is encouraging vendors to expand their operations and invest in new manufacturing facilities. For instance, in July 2022, Samsung revealed plans to invest USD 500 million to increase the manufacture of household appliances at its two plants in Mexico. Such investments are expected to propel semiconductor chip demand, contributing to the market's growth.
  • Driven by an increasing demand for semiconductor chips, manufacturers are increasing their investments in new chip manufacturing facilities and equipment, creating a favorable market scenario for the studied market. For instance, according to SEMI, semiconductor manufacturing equipment spending increased from USD 64.42 billion in 2018 to USD 102.64 billion in 2021.

Asia Pacific is Expected to Grow Significantly Over the Forecast Period

  • Asia-Pacific is expected to grow considerably throughout the forecast period due to increased government expenditures and efforts coupled with the region's high production and industrialization, increasing the demand for semiconductors. Also, strong growth in the communications sector in countries like India, China, Japan, Korea, and Taiwan, among others, and the presence of major smartphone manufacturers across the region are expected to create growth opportunities in the region over the next few years.
  • Increasing investments by major players and rising government initiatives in end-uses are expected to boost product demand over the coming years. For example, Kyocera plans to spend twice as much on semiconductor manufacturing and other industries as it did in the three years before December 2022. This will bring total spending on capital expenditures, research and technology to JPY 1.3 trillion (USD 9.78 billion) during the three fiscal years until March 2026.
  • Similarly, in November 2021, the Japanese government unveiled its plans to allocate JPY 600 billion (USD 4.5 billion) of its fiscal 2021 supplementary budget to help fund advanced semiconductor manufacturing. In 2021, the Japanese government approved a USD 338 million chip research project where TSMC could develop new chip technology. The company, along with rivals like Intel and Samsung, is taking advantage of generous state subsidies as nations face the current chip shortage and concerns about domestic supplies in the future. Over the next few years, the semiconductor laser equipment market is expected to grow because of changes in how semiconductors are made.
  • Furthermore, the Asia-Pacific region is also home to some of the biggest semiconductor chip manufacturers, such as TSMC, SMIC, SK Hynix, etc. These vendors are spending a lot of money on semiconductor equipment to increase production at their existing plants and move into new markets. This is creating a good market situation for the growth of the studied market in the Asia-Pacific region.

Semiconductor Laser Equipment Market Competitor Analysis

The semiconductor laser equipment market is moderately competitive, with the presence of numerous players such as Hamamatsu Photonics K.K., Applied Materials, DISCO Corporation, Delphi Laser, and Sumitomo Heavy Industries, Ltd., among others. These players are continuously adopting strategies such as product launches, product development, partnerships, and collaboration, among others, to increase their global share and expand their market presence.

In November 2022, researchers from LP3 Laboratory, France, developed a light-based technique that supports local material processing anywhere in the three-dimensional space of semiconductor chips. The direct laser writing facilitated by this technology opens the possibility of exploiting the sub-surface space for higher integration densities and additional functionalities.

In September 2022, Ushio introduced its novel 405 nm, 600 mW (CW) laser diodes, the HL40173MG and HL40175MG, with a lifetime almost double that of traditional products. The light source need for mask-less (direct imaging) exposure devices that expose high-definition circuit designs on the substrate has increased dramatically in parallel with customer demand for compact and more powerful smartphones. There is also a growing need for 405 nm laser diodes, which are frequently utilized as light supplies in the biomedical, measuring, and 3D printing industries and require additional advancements in stability and operational life.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Acctractiveness - Porter's Five Forces Analysis
    • 4.2.1 Threat of New Entrants
    • 4.2.2 Bargaining Power of Buyer
    • 4.2.3 Bargaining Power of Suppliers
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis
  • 4.4 Assesment of the impact of COVID-19 on the Industry

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increasing Semiconductor Chip Demand from End-Use Industries
  • 5.2 Market Restraints
    • 5.2.1 High Cost of Installation and Maintainance

6 MARKET SEGMENTATION

  • 6.1 By Process
    • 6.1.1 Laser Wafer Dicing
    • 6.1.2 Laser Bonding and Debonding
      • 6.1.2.1 Temporary bonding/debonding
      • 6.1.2.2 Laser Lift-Off
      • 6.1.2.3 Laser Induced Forward Transfer
    • 6.1.3 Laser Annealing
    • 6.1.4 Laser Wafer Marking
  • 6.2 By Geography
    • 6.2.1 North America
    • 6.2.2 Europe
    • 6.2.3 Asia-Pacific
    • 6.2.4 Rest of the World

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Hamamatsu Photonics K.K
    • 7.1.2 Applied Materials
    • 7.1.3 DISCO Corporation
    • 7.1.4 Delphi Laser
    • 7.1.5 Sumitomo Heavy Industries, Ltd.
    • 7.1.6 Coherent
    • 7.1.7 FitTech
    • 7.1.8 Corning
    • 7.1.9 IPG Photonics
    • 7.1.10 Hanmi Semiconductor

8 INVESTMENT ANALYSIS

9 FUTURE OUTLOOK OF THE MARKET