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1811804

PCBA(印刷電路板集合)的到市場規模，佔有率，趨勢，成長機會，預測:各集合類型，各元件類型，各用途，各終端用戶產業 - 2035年前的世界預測

Printed Circuit Board Assembly Market Size, Share, Trends, Growth Opportunities & Forecast by Assembly Type (Surface Mount Technology, Through-Hole Technology, Mixed Technology), Component Type, Application, and End-User Industry-Global Forecast to 2035
出版日期: | 出版商: Meticulous Research | 英文 436 Pages | 訂單完成後即時交付

價格

預計2035年，PCBA（印刷電路板組裝）市場規模將達到1,475億美元，預測期間（2025-2035年）的複合年增長率為4.7%。本報告對全球五大主要地區的PCBA（印刷電路板組裝）市場進行了深入分析，重點關注當前的市場趨勢、市場規模、近期發展以及2035年的預測。

本報告進行了全面的二手資料和一手資料研究，對市場情景進行了詳細的分析，並對關鍵行業驅動因素、限制因素、市場機會和課題進行了影響分析。預計市場成長將受到消費性電子和智慧型裝置需求成長、汽車電子和電動汽車快速擴張、物聯網和連網設備日益普及、5G 網路加速部署、醫療電子和醫療保健設備需求成長以及持續小型化趨勢對先進組裝技術需求的推動。此外，電動汽車電子產品的擴張、可穿戴和柔性電子產品的發展、先進的封裝技術以及人工智慧硬體的採用預計將支持市場成長。

目錄

第1章 簡介

第2章 調查手法

第3章 摘要整理

  • 概要
  • 各市場區隔分析
    • 各集合類型市場分析
    • 各元件類型市場分析
    • 各用途市場分析
    • 各終端用戶市場分析
  • 各地區分析
  • 競爭分析

第4章 產業洞察

  • 概要
  • PCB集合技術標準
    • SMT對THT對混合技術的比較
    • 品質與可靠性標準（IPC、ISO）
  • 價值鏈分析
    • 概要
    • 原料和零件供應商
    • 與PCB製造集合
      • 主要的PCBA服務供應商(各規模)
        • 小規模集合住宅
        • 中規模地區供應商
        • 大規模受託製造商
        • 全球的EMS大廠
    • 與品管試驗
    • 物流和流通
    • 終端用戶的整合
    • 售後與服務支援
  • 波特的五力分析

第5章 市場洞察

  • 概要
  • 市場成長的影響因素
    • 促進因素
      • 消費性電子產品需求成長
      • 汽車電子的快速擴張電子產業
      • 5G 和物聯網的加速普及
      • 醫療電子應用日益增多
      • 小型化和複雜化趨勢持續
      • 工業自動化需求不斷成長
      • 電動車日益普及
      • 航空航太與國防電子應用不斷擴展
    • 限制因素
      • 原料與零件成本波動
      • 複雜的法規合規要求
      • 製造基地勞動成本上升
      • 先進組裝的技術課題
      • 供應鏈中斷與依賴性
    • 機遇
      • 電動車電子應用不斷擴展
      • 工業自動化與工業 4.0
      • 穿戴式和柔性電子產品的成長
      • 先進的封裝組裝技術
      • 對人工智慧和機器學習的需求硬體
    • 趨勢
      • 自動化與智慧製造的應用
      • 永續與綠色製造實踐
      • 近岸外包與供應鏈多元化
  • 標準和法規
    • 全球 PCB 組裝品質標準
    • 區域合規要求
      • 北美（IPC、UL、FCC）
      • 歐洲（CE、ROHM S、REACH）
      • 亞太地區（JIS、GB、區域標準）
      • 拉丁美洲（區域合規）
      • 中東和非洲（區域標準）
  • 對盒裝和佈線日益增長的趨勢的洞察
  • 技術進步
    • 模板與焊錫印刷
    • 氮氣烤箱
    • 拾放吞吐量
    • 其他新興 PCBA 技術

第6章 PCBA(印刷電路板集合)的全球市場評估:各集合類型

  • 概要
  • 表面裝置技術(SMT)
  • 通孔技術(THT)
  • 混合技術集合
  • 高密度互相連接(HDI)集合
  • 彈性及軟硬複合集合
  • 球柵陣列(BGA)與先進包裝

第7章 PCBA(印刷電路板集合)的全球市場評估:各元件類型

  • 概要
  • 主動元件
    • 積體電路和微處理器
    • 離散半導體
    • 光電零件
  • 被動元件
    • 電阻器和電容器(冷凝器)
    • 感應器和變壓器
    • 過濾器及振盪器
  • 電磁零件
    • 連接器和插座
    • 交換器及繼電器
    • 感測器和轉換器

第8章 PCBA(印刷電路板集合)的全球市場評估:各用途

  • 概要
  • 家用電子電器
    • 智慧型手機和平板電腦
    • 電腦和週邊設備
    • 家電及娛樂
    • 穿戴式設備
  • 汽車電子產品
    • 動力傳動系統與引擎控制
    • 資訊娛樂和導航
    • 先進安全系統
    • 電動車系統
  • 通訊設備
    • 網路基礎設施設備
    • 基地台和小型基地台
    • 資料中心和雲端·基礎設施
  • 醫療設備
    • 診斷設備
    • 治療設備
    • 監測和穿戴式·健康·Tec
  • 工業自動化
    • 控制系統和PLCS
    • 機器人技術和運動控制
    • 流程自動化設備
  • 航太·防衛
    • 航空電子學·系統
    • 軍事通訊設備
    • 雷達和導航系統

第9章 PCBA(印刷電路板集合)的全球市場評估:各終端用戶

  • 概要
  • 目標商標產品廠商(OEMS)
    • 科技企業
    • 汽車廠商
    • 產業設備廠商
  • 電子設備製造服務(EMS)
    • 受託製造商
    • 專門組裝供應商
    • 承包·解決方案·供應商
  • 原始·設計·廠商(ODMS)
    • 設計製造合作夥伴
    • 自有品牌廠商
    • 系統廠商

第10章 PCBA(印刷電路板集合)市場評估:各地區

  • 概要
  • 北美
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 法國
    • 英國
    • 義大利
    • 荷蘭
    • 西班牙
    • 瑞典
    • 丹麥
    • 其他歐洲
  • 亞太地區
    • 中國
    • 日本
    • 韓國
    • 台灣
    • 印度
    • 新加坡
    • 馬來西亞
    • 其他亞太地區
  • 南美
    • 巴西
    • 墨西哥
    • 阿根廷
    • 其他南美國家
  • 中東·非洲
    • UAE
    • 沙烏地阿拉伯
    • 南非
    • 其他中東和非洲

第11章 競爭情形

  • 概要
  • 主要成長策略
  • 競爭基準
  • 競爭儀表板
    • 產業領導者
    • 市場差異化要素
    • 領先企業
    • 新興企業
  • 市場佔有率/市場情況分析

第12章 企業簡介

  • Hon Hai Precision Industry Co., Ltd.(Foxconn)
  • Flex Ltd
  • Jabil, Inc
  • Sanmina Corporation
  • Celestica Inc.
  • Benchmark Electronics, Inc.
  • Plexus Corp.
  • Kimball Electronics, Inc.
  • Creation Technologies LP
  • Nortech Systems, Inc
  • Key Tronic Corporation
  • Universal Scientific Industrial Co., Ltd.
  • Shenzhen Kaifa Technology Co., Ltd.
  • Eurocircuits NV
  • Seeed Technology Co., Ltd
  • Vexos Corporation
  • Tempo Automation, Inc
  • PCBWay
  • WellPCB Technology Co., Ltd

第13章 附錄

Product Code: MRSE - 1041514

According to the research report titled, Printed Circuit Board Assembly Market Size, Share, Trends, Growth Opportunities & Forecast by Assembly Type (Surface Mount Technology, Through-Hole Technology, Mixed Technology), Component Type, Application, and End-User Industry-Global Forecast to 2035,' the printed circuit board assembly market is projected to reach $147.5 billion by 2035, at a CAGR of 4.7% during the forecast period 2025-2035. The report provides an in-depth analysis of the global printed circuit board assembly market across five major regions, emphasizing the current market trends, market sizes, recent developments, and forecasts till 2035.

Following comprehensive secondary and primary research and an in-depth analysis of the market scenario, the report conducts the impact analysis of the key industry drivers, restraints, opportunities, and challenges. The growth of this market is driven by the increasing demand for consumer electronics and smart devices, rapid expansion of automotive electronics and electric vehicles, growing adoption of IoT and connected devices, accelerating 5G network deployment, rising demand for medical electronics and healthcare devices, and continuous miniaturization trends requiring advanced assembly technologies. Moreover, electric vehicle electronics expansion, development of wearable and flexible electronics, advanced packaging technologies, and AI hardware adoption are expected to support the market's growth.

The key players operating in the printed circuit board assembly market are Hon Hai Precision Industry Co., Ltd. (Taiwan), Flex Ltd. (Singapore), Jabil Inc. (USA), Sanmina Corporation (USA), Celestica Inc. (Canada), Benchmark Electronics, Inc. (USA), Plexus Corp. (USA), Kimball Electronics, Inc. (USA), Creation Technologies LP (Canada), Nortech Systems, Inc. (USA), Key Tronic Corporation (USA), Universal Scientific Industrial Co., Ltd. (Taiwan), Shenzhen Kaifa Technology Co., Ltd. (China), and others.

The printed circuit board assembly market is segmented by assembly type (surface mount technology, through-hole technology, mixed technology assemblies), component type (active components, passive components, electromagnetic components), application (consumer electronics, automotive, telecommunications, medical devices, industrial automation, aerospace & defense), end-user industry (original equipment manufacturers, electronics manufacturing services providers, original design manufacturers), and geography. The study also evaluates industry competitors and analyzes the market at the country level.

Based on assembly type, the mixed technology segment is projected to grow at the highest CAGR during the forecast period of 2025-2035. The rapid growth of this segment is mainly due to the increasing complexity of electronic designs requiring both surface mount and through-hole components in a single assembly. This growth is driven by expanding automotive electronics applications, rising demand for ruggedized assemblies in industrial environments, and the need for hybrid solutions that combine high-density mounting with mechanical strength. As electronic systems become more sophisticated and demand both high performance and durability, the adoption of mixed technology assemblies is accelerating rapidly, particularly in sectors that prioritize long-term reliability and harsh environment operation.

Based on component type, the active components segment is expected to account for the largest share of the printed circuit board assembly market. Active components, including microprocessors, semiconductors, and integrated circuits, are fundamental to modern electronic devices and drive the functionality of virtually all electronic systems. As electronic devices become more intelligent and feature-rich, the demand for sophisticated active components continues to grow. Furthermore, the proliferation of AI-enabled devices, 5G infrastructure, and automotive electronics significantly increases the complexity and quantity of active components required per assembly.

Based on application, the automotive segment is projected to register the highest CAGR from 2025 to 2035. This growth is driven by the rapid transformation of the automotive industry toward electrification, autonomous driving, and connected vehicle technologies. The increasing electronic content per vehicle, driven by advanced driver assistance systems, infotainment systems, and electric powertrain controls, is significantly boosting demand for sophisticated PCB assemblies. Additionally, the global push toward electric vehicles is creating new requirements for high-power electronics, battery management systems, and thermal management solutions.

Based on end-user industry, the electronics manufacturing services (EMS) segment is expected to account for the largest share of the printed circuit board assembly market in 2025. This dominance is primarily driven by the widespread outsourcing trend among original equipment manufacturers seeking to reduce costs, access specialized expertise, and focus on core competencies. EMS providers offer comprehensive assembly services, advanced manufacturing capabilities, and economies of scale that individual OEMs find difficult to replicate in-house.

An in-depth geographic analysis of the industry provides detailed qualitative and quantitative insights into the five major regions (North America, Europe, Asia-Pacific, Latin America, and the Middle East & Africa) and the coverage of major countries in each region. Asia-Pacific is projected to register the highest growth rate during the forecast period across the overall printed circuit board assembly market. This growth is fueled by the region's established electronics manufacturing ecosystem, continued capacity expansion by leading EMS providers, and increasing domestic demand for electronic devices. The concentration of major contract manufacturers, well-developed supply chains, and favorable labor costs contribute to the region's manufacturing advantages.

Key Questions Answered in the Report-

  • What is the current revenue generated by the printed circuit board assembly market globally?
  • At what rate is the global printed circuit board assembly demand projected to grow for the next 7-10 years?
  • What are the historical market sizes and growth rates of the global printed circuit board assembly market?
  • What are the major factors impacting the growth of this market at the regional and country levels? What are the major opportunities for existing players and new entrants in the market?
  • Which segments in terms of assembly type, component type, application, and end-user industry are expected to create major traction for the manufacturers in this market?
  • What are the key geographical trends in this market? Which regions/countries are expected to offer significant growth opportunities for the manufacturers operating in the global printed circuit board assembly market?
  • Who are the major players in the global printed circuit board assembly market? What are their specific product offerings in this market?
  • What are the recent strategic developments in the global printed circuit board assembly market? What are the impacts of these strategic developments on the market?

Scope of the Report:

Printed Circuit Board Assembly Market Assessment -- by Assembly Type

  • Surface Mount Technology (SMT)
  • Through-Hole Technology (THT)
  • Mixed Technology Assemblies

Printed Circuit Board Assembly Market Assessment -- by Component Type

  • Active Components
  • Passive Components
  • Electromagnetic Components

Printed Circuit Board Assembly Market Assessment -- by Application

  • Consumer Electronics
  • Automotive
  • Telecommunications
  • Medical Devices
  • Industrial Automation
  • Aerospace & Defense
  • Others

Printed Circuit Board Assembly Market Assessment -- by End-User Industry

  • Original Equipment Manufacturers (OEMs)
  • Electronics Manufacturing Services (EMS) Providers
  • Original Design Manufacturers (ODMs)

Printed Circuit Board Assembly Market Assessment --- by Geography

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • U.K.
    • Germany
    • France
    • Spain
    • Italy
    • Netherlands
    • Rest of Europe
  • Asia-Pacific
    • China
    • India
    • Japan
    • South Korea
    • Taiwan
    • Singapore
    • Malaysia
    • Rest of Asia-Pacific
  • Latin America
    • Brazil
    • Argentina
    • Rest of Latin America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • South Africa
    • Rest of Middle East & Africa

TABLE OF CONTENTS

1 Introduction

  • 1.1. Market Definition & Scope
  • 1.2. Market Ecosystem
  • 1.3. Currency & Limitations
  • 1.4. Key Stakeholders

2 Research Methodology

  • 2.1. Research Approach
  • 2.2. Data Collection & Validation
    • 2.2.1. Secondary Research
    • 2.2.2. Primary Research
  • 2.3. Market Assessment
    • 2.3.1. Market Size Estimation
    • 2.3.2. Bottom-Up Approach
    • 2.3.3. Top-Down Approach
    • 2.3.4. Growth forecast
  • 2.4. Assumptions for The Study

3 Executive Summary

  • 3.1. Overview
  • 3.2. Segmental Analysis
    • 3.2.1. Market Analysis by Assembly Type
    • 3.2.2. Market Analysis by Component Type
    • 3.2.3. Market Analysis by Application
    • 3.2.4. Market Analysis by End User
  • 3.3. Regional Analysis
  • 3.4. Competitive Analysis

4 Industry Insights

  • 4.1. Overview
  • 4.2. PCB Assembly Technology Standards
    • 4.2.1. SMT Vs. THT Vs. Mixed Technology Comparison
    • 4.2.2. Quality and Reliability Standards (IPC, ISO)
  • 4.3. Value Chain Analysis
    • 4.3.1. Overview
    • 4.3.2. Raw Material and Component Suppliers
    • 4.3.3. PCB Manufacturing and Assembly
      • 4.3.3.1. Key PCBA Service Providers, by Size
        • 4.3.3.1.1. Small-Scale Assembly Houses
        • 4.3.3.1.2. Medium-Scale Regional Providers
        • 4.3.3.1.3. Large-Scale Contract Manufacturers
        • 4.3.3.1.4. Global EMS Giants
    • 4.3.4. Quality Control and Testing
    • 4.3.5. Logistics and Distribution
    • 4.3.6. End-User Integration
    • 4.3.7. After-Sales Service and Support
  • 4.4. Porter's Five forces Analysis
    • 4.4.1. Bargaining Power of Component Suppliers
    • 4.4.2. Bargaining Power of Electronics OEMS
    • 4.4.3. Threat of In-House Manufacturing
    • 4.4.4. Threat of New Assembly Service Entrants
    • 4.4.5. Degree of Competition Among EMS Providers

5 Market Insights

  • 5.1. Overview
  • 5.2. Factors Affecting Market Growth
    • 5.2.1. Drivers
      • 5.2.1.1. Growing Demand for Consumer Electronics
      • 5.2.1.2. Rapid Expansion of Automotive Electronics
      • 5.2.1.3. Accelerating 5G and IOT Deployment
      • 5.2.1.4. Increasing Medical Electronics Applications
      • 5.2.1.5. Continuous Miniaturization and Complexity Trends
      • 5.2.1.6. Rising Industrial Automation Demand
      • 5.2.1.7. Growing Electric Vehicle Adoption
      • 5.2.1.8. Expansion of Aerospace and Defense Electronics
    • 5.2.2. Restraints
      • 5.2.2.1. Volatile Raw Material and Component Costs
      • 5.2.2.2. Complex Regulatory Compliance Requirements
      • 5.2.2.3. Increasing Labor Costs in Manufacturing Hubs
      • 5.2.2.4. Technical Challenges in Advanced Assembly
      • 5.2.2.5. Supply Chain Disruptions and Dependencies
    • 5.2.3. Opportunities
      • 5.2.3.1. Electric Vehicle Electronics Expansion
      • 5.2.3.2. Industrial Automation and Industry 4.0
      • 5.2.3.3. Wearable and Flexible Electronics Growth
      • 5.2.3.4. Advanced Package Assembly Technologies
      • 5.2.3.5. Ai and Machine Learning Hardware Demand
    • 5.2.4. Trends
      • 5.2.4.1. Automation and Smart Manufacturing Adoption
      • 5.2.4.2. Sustainable and Green Manufacturing Practices
      • 5.2.4.3. Nearshoring and Supply Chain Diversification
  • 5.3. Standards and Regulations
    • 5.3.1. Global PCB Assembly Quality Standards
    • 5.3.2. Regional Compliance Requirements
      • 5.3.2.1. North America (IPC, Ul, FCC)
      • 5.3.2.2. Europe (CE, ROHS, REACH)
      • 5.3.2.3. Asia-Pacific (JIS, GB, Regional Standards)
      • 5.3.2.4. Latin America (Regional Compliance)
      • 5.3.2.5. Middle East & Africa (Local Standards)
  • 5.4. Insights on Growing Trend Towards Box Builds and Cabling
  • 5.5. Technological Advances
    • 5.5.1. Stencilling Vs. Solder Printing
    • 5.5.2. Nitrogen Ovens
    • 5.5.3. Pick-and-Place Throughput
    • 5.5.4. Other Emerging PCBA Technologies

6 Global PCBA Market Assessment - by Assembly Type

  • 6.1. Overview
  • 6.2. Surface Mount Technology (SMT)
  • 6.3. Through-Hole Technology (THT)
  • 6.4. Mixed Technology Assembly
  • 6.5. High-Density Interconnect (HDI) Assembly
  • 6.6. Flexible and Rigid-Flex Assembly
  • 6.7. Ball Grid Array (BGA) and Advanced Packaging

7 Global PCBA Market Assessment - by Component Type

  • 7.1. Overview
  • 7.2. Active Components
    • 7.2.1. Integrated Circuits and Microprocessors
    • 7.2.2. Discrete Semiconductors
    • 7.2.3. Optoelectronic Components
  • 7.3. Passive Components
    • 7.3.1. Resistors and Capacitors
    • 7.3.2. Inductors and Transformers
    • 7.3.3. Filters and Oscillators
  • 7.4. Electromagnetic Components
    • 7.4.1. Connectors and Sockets
    • 7.4.2. Switches and Relays
    • 7.4.3. Sensors and Transducers

8 Global PCBA Market Assessment - by Application

  • 8.1. Overview
  • 8.2. Consumer Electronics
    • 8.2.1. Smartphones and Tablets
    • 8.2.2. Computers and Peripherals
    • 8.2.3. Home Appliances and Entertainment
    • 8.2.4. Wearable Devices
  • 8.3. Automotive Electronics
    • 8.3.1. Powertrain and Engine Control
    • 8.3.2. Infotainment and Navigation
    • 8.3.3. Adas and Safety Systems
    • 8.3.4. Electric Vehicle Systems
  • 8.4. Telecommunications
    • 8.4.1. Network Infrastructure Equipment
    • 8.4.2. Base Stations and Small Cells
    • 8.4.3. Data Centers and Cloud Infrastructure
  • 8.5. Medical Devices
    • 8.5.1. Diagnostic Equipment
    • 8.5.2. Therapeutic Devices
    • 8.5.3. Monitoring and Wearable Health Tech
  • 8.6. Industrial Automation
    • 8.6.1. Control Systems and PLCS
    • 8.6.2. Robotics and Motion Control
    • 8.6.3. Process Automation Equipment
  • 8.7. Aerospace & Defense
    • 8.7.1. Avionics Systems
    • 8.7.2. Military Communication Equipment
    • 8.7.3. Radar and Navigation Systems

9 Global PCBA Market Assessment - by End User

  • 9.1. Overview
  • 9.2. Original Equipment Manufacturers (OEMS)
    • 9.2.1. Technology Companies
    • 9.2.2. Automotive Manufacturers
    • 9.2.3. Industrial Equipment Manufacturers
  • 9.3. Electronics Manufacturing Services (EMS)
    • 9.3.1. Contract Manufacturers
    • 9.3.2. Specialized Assembly Providers
    • 9.3.3. Turnkey Solution Providers
  • 9.4. Original Design Manufacturers (ODMS)
    • 9.4.1. Design and Manufacturing Partners
    • 9.4.2. Private Label Manufacturers
    • 9.4.3. System Integrators

10 PCBA Market Assessment, by Geography

  • 10.1. Overview
  • 10.2. North America
    • 10.2.1. U.S.
    • 10.2.2. Canada
  • 10.3. Europe
    • 10.3.1. Germany
    • 10.3.2. France
    • 10.3.3. U.K.
    • 10.3.4. Italy
    • 10.3.5. Netherlands
    • 10.3.6. Spain
    • 10.3.7. Sweden
    • 10.3.8. Denmark
    • 10.3.9. Rest of Europe
  • 10.4. Asia-Pacific
    • 10.4.1. China
    • 10.4.2. Japan
    • 10.4.3. South Korea
    • 10.4.4. Taiwan
    • 10.4.5. India
    • 10.4.6. Singapore
    • 10.4.7. Malaysia
    • 10.4.8. Rest of Asia Pacific
  • 10.5. Latin America
    • 10.5.1. Brazil
    • 10.5.2. Mexico
    • 10.5.3. Argentia
    • 10.5.4. Rest of Latin America
  • 10.6. Middle East & Africa
    • 10.6.1. UAE
    • 10.6.2. Saudi Arabia
    • 10.6.3. South Africa
    • 10.6.4. Rest of Middle East & Africa

11 Competitive Landscape

  • 11.1. Overview
  • 11.2. Key Growth Strategies
  • 11.3. Competitive Benchmarking
  • 11.4. Competitive Dashboard
    • 11.4.1. Industry Leaders
    • 11.4.2. Market Differentiators
    • 11.4.3. Vanguards
    • 11.4.4. Emerging Companies
  • 11.5. Market Share/Position Analysis

12 Company Profiles

  • 12.1. Hon Hai Precision Industry Co., Ltd. (Foxconn)
  • 12.2. Flex Ltd
  • 12.3. Jabil, Inc
  • 12.4. Sanmina Corporation
  • 12.5. Celestica Inc.
  • 12.6. Benchmark Electronics, Inc.
  • 12.7. Plexus Corp.
  • 12.8. Kimball Electronics, Inc.
  • 12.9. Creation Technologies LP
  • 12.10. Nortech Systems, Inc
  • 12.11. Key Tronic Corporation
  • 12.12. Universal Scientific Industrial Co., Ltd.
  • 12.13. Shenzhen Kaifa Technology Co., Ltd.
  • 12.14. Eurocircuits NV
  • 12.15. Seeed Technology Co., Ltd
  • 12.16. Vexos Corporation
  • 12.17. Tempo Automation, Inc
  • 12.18. PCBWay
  • 12.19. WellPCB Technology Co., Ltd

13 Appendix

  • 13.1. Available Customization
  • 13.2. Related Reports

LIST OF TABLES

  • Figure 1 Research Process
  • Figure 2 Key Secondary Sources
  • Figure 3 Primary Research Techniques
  • Figure 4 Key Executives Interviewed
  • Figure 5 Breakdown of Primary Interviews (Supply-Side & Demand-Side)
  • Figure 6 Market Sizing and Growth forecast Approach
  • Figure 7 in 2025, the Surface Mount Technology Segment is Expected to Dominate the PCBA Market
  • Figure 8 in 2025, the Active Components Segment is Expected to Dominate the PCBA Market
  • Figure 9 in 2025, the Consumer Electronics Segment is Expected to Dominate the PCBA Market
  • Figure 10 in 2025, the Electronics Manufacturing Services (EMS) Segment Is Expected to Dominate the PCBA Market
  • Figure 11 PCBA Market, by Region, 2025 Vs. 2032 (USD Million)
  • Figure 12 Factors Affecting Market Growth
  • Figure 13 Global PCBA Market, by Assembly Type, 2025 Vs. 2035 (USD Million)
  • Figure 14 Global PCBA Market, by Component Type, 2025 Vs. 2035 (USD Million)
  • Figure 15 Global PCBA Market, by Application, 2025 Vs. 2035 (USD Million)
  • Figure 16 Global PCBA Market, by End User, 2025 Vs. 2035 (USD Million)
  • Figure 17 Global PCBA Market, by Region, 2025 Vs. 2035 (USD Million)
  • Figure 18 North America: PCBA Market Snapshot
  • Figure 19 Europe: PCBA Market Snapshot
  • Figure 20 Asia-Pacific: PCBA Market Snapshot
  • Figure 21 Latin America: PCBA Market Snapshot
  • Figure 22 Middle East & Africa: PCBA Market Snapshot
  • Figure 23 Key Growth Strategies Adopted by Leading Players, 2022-2025
  • Figure 24 Printed Circuit Board Assembly (PCBA) Market: Competitive Benchmarking, by Region
  • Figure 25 Competitive Dashboard: Printed Circuit Board Assembly (PCBA) Market
  • Figure 26 Printed Circuit Board Assembly (PCBA) Market Position Analysis, 2024
  • Figure 27 SWOT Analysis - Hon Hai Precision Industry Co., Ltd. (Foxconn)
  • Figure 28 SWOT Analysis - Flex Ltd
  • Figure 29 SWOT Analysis - Jabil, Inc
  • Figure 30 SWOT Analysis - Sanmina Corporation
  • Figure 31 SWOT Analysis - Celestica Inc.
  • Figure 32 SWOT Analysis - Benchmark Electronics, Inc.
  • Figure 33 SWOT Analysis - Plexus Corp.
  • Figure 34 SWOT Analysis - Kimball Electronics, Inc.
  • Figure 35 SWOT Analysis - Creation Technologies LP
  • Figure 36 SWOT Analysis - Nortech Systems, Inc
  • Figure 37 SWOT Analysis - Key Tronic Corporation
  • Figure 38 SWOT Analysis - Universal Scientific Industrial Co., Ltd.
  • Figure 39 SWOT Analysis - Shenzhen Kaifa Technology Co., Ltd.
  • Figure 40 SWOT Analysis - Eurocircuits NV
  • Figure 41 SWOT Analysis - Seeed Technology Co., Ltd
  • Figure 42 SWOT Analysis - Vexos Corporation
  • Figure 43 SWOT Analysis - Tempo Automation, Inc
  • Figure 44 SWOT Analysis - PCBWay
  • Figure 45 SWOT Analysis - WellPCB Technology Co., Ltd

LIST OF FIGURES

  • Figure 1 Research Process
  • Figure 2 Key Secondary Sources
  • Figure 3 Primary Research Techniques
  • Figure 4 Key Executives Interviewed
  • Figure 5 Breakdown of Primary Interviews (Supply-Side & Demand-Side)
  • Figure 6 Market Sizing and Growth forecast Approach
  • Figure 7 in 2025, the Surface Mount Technology Segment is Expected to Dominate the PCBA Market
  • Figure 8 in 2025, the Active Components Segment is Expected to Dominate the PCBA Market
  • Figure 9 in 2025, the Consumer Electronics Segment is Expected to Dominate the PCBA Market
  • Figure 10 in 2025, the Electronics Manufacturing Services (EMS) Segment Is Expected to Dominate the PCBA Market
  • Figure 11 PCBA Market, by Region, 2025 Vs. 2032 (USD Million)
  • Figure 12 Factors Affecting Market Growth
  • Figure 13 Global PCBA Market, by Assembly Type, 2025 Vs. 2035 (USD Million)
  • Figure 14 Global PCBA Market, by Component Type, 2025 Vs. 2035 (USD Million)
  • Figure 15 Global PCBA Market, by Application, 2025 Vs. 2035 (USD Million)
  • Figure 16 Global PCBA Market, by End User, 2025 Vs. 2035 (USD Million)
  • Figure 17 Global PCBA Market, by Region, 2025 Vs. 2035 (USD Million)
  • Figure 18 North America: PCBA Market Snapshot
  • Figure 19 Europe: PCBA Market Snapshot
  • Figure 20 Asia-Pacific: PCBA Market Snapshot
  • Figure 21 Latin America: PCBA Market Snapshot
  • Figure 22 Middle East & Africa: PCBA Market Snapshot
  • Figure 23 Key Growth Strategies Adopted by Leading Players, 2022-2025
  • Figure 24 Printed Circuit Board Assembly (PCBA) Market: Competitive Benchmarking, by Region
  • Figure 25 Competitive Dashboard: Printed Circuit Board Assembly (PCBA) Market
  • Figure 26 Printed Circuit Board Assembly (PCBA) Market Position Analysis, 2024
  • Figure 27 SWOT Analysis - Hon Hai Precision Industry Co., Ltd. (Foxconn)
  • Figure 28 SWOT Analysis - Flex Ltd
  • Figure 29 SWOT Analysis - Jabil, Inc
  • Figure 30 SWOT Analysis - Sanmina Corporation
  • Figure 31 SWOT Analysis - Celestica Inc.
  • Figure 32 SWOT Analysis - Benchmark Electronics, Inc.
  • Figure 33 SWOT Analysis - Plexus Corp.
  • Figure 34 SWOT Analysis - Kimball Electronics, Inc.
  • Figure 35 SWOT Analysis - Creation Technologies LP
  • Figure 36 SWOT Analysis - Nortech Systems, Inc
  • Figure 37 SWOT Analysis - Key Tronic Corporation
  • Figure 38 SWOT Analysis - Universal Scientific Industrial Co., Ltd.
  • Figure 39 SWOT Analysis - Shenzhen Kaifa Technology Co., Ltd.
  • Figure 40 SWOT Analysis - Eurocircuits NV
  • Figure 41 SWOT Analysis - Seeed Technology Co., Ltd
  • Figure 42 SWOT Analysis - Vexos Corporation
  • Figure 43 SWOT Analysis - Tempo Automation, Inc
  • Figure 44 SWOT Analysis - PCBWay
  • Figure 45 SWOT Analysis - WellPCB Technology Co., Ltd