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市場調查報告書
商品編碼
1386421

味之素積層薄膜基板市場報告：2030 年趨勢、預測與競爭分析

Ajinomoto Build-Up Film Substrate Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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簡介目錄

味之素積層薄膜基板趨勢與預測

預計到 2030 年，全球味之素組合薄膜基板市場將達到 37 億美元，2024 年至 2030 年年複合成長率為 18.9%。該市場的主要促進因素是消費者可支配所得的增加、技術進步以及對筆記型電腦、智慧型手機、平板電腦、個人電腦和筆記型電腦等家用電器的需求不斷成長。全球性味之素增層薄膜基板市場前景廣闊，PC、AI晶片、伺服器和交換器市場蘊藏商機。

味之素堆積薄膜基板市場洞察

根據Lucintel的預測，由於行動裝置、個人電腦、伺服器系統、智慧型手機、平板電腦、資料中心基礎設施等領域的全球普及，4-8層ABF基板預計在預測期內將出現更高的細分市場。

由於美國電子和半導體產業的成長，預計北美將成為預測期內最大的市場。

本報告回答了 11 個關鍵問題：

  • Q.1. 細分市場中最有前途和高成長的機會是什麼？
  • Q.2.哪個細分市場將以更快的速度成長？為什麼？
  • Q.3.您認為哪些地區未來會出現更快的成長？為什麼？
  • Q.4. 影響市場動態的主要因素有哪些？市場的主要挑戰和商業風險是什麼？
  • Q.5. 這個市場的商業風險和競爭威脅是什麼？
  • Q.6.這個市場有哪些新趨勢？為什麼？
  • Q.7.市場客戶需求有何改變？
  • Q.8. 該市場有哪些新發展以及哪些公司處於領先地位？
  • Q.9.這個市場的主要企業有哪些？主要企業採取哪些策略配合措施來發展業務？
  • Q.10. 該市場上的競爭產品有哪些？由於材料或產品替代而導致市場佔有率下降的威脅有多大？
  • Q.11.過去年度發生了哪些併購事件，對產業產生了哪些影響？

目錄

第1章 執行摘要

第2章 全球風味增層薄膜基板市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 味之素積層薄膜基板全球市場趨勢（2018-2023）與預測（2024-2030）
  • 味之素增層薄膜基板全球市場（按類型）
    • 4-8層ABF基板
    • 8-16層ABF基板
  • 味之素增層薄膜基板全球市場（依應用）
    • 電腦
    • 人工智慧晶片
    • 伺服器和交換機
    • 其他

第4章 2018-2030年分地區市場趨勢及預測分析

  • 全球風味增層薄膜基板市場（按地區）
  • 味之素北美增層薄膜基板市場
  • 歐洲味之素增層薄膜基板市場
  • 亞太味之素增層薄膜基板市場
  • 味之素其他地區增建薄膜基板市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 全球味之素堆積薄膜基板市場成長機會（按類型）
    • 全球味之素增層薄膜基板市場成長機會（按應用）
    • 全球性味之素增層薄膜基板市場成長機會（按地區）
  • 全球味之素增層薄膜基板市場新趨勢
  • 戰略分析
    • 新產品開發
    • 擴大味之素積層薄膜基板的全球市場容量
    • 全球味之素增層薄膜基板市場的合併、收購及合資企業
    • 認證和許可

第7章 主要企業概況

  • Ajinomoto
  • Unimicron Technology
  • Nan Ya Printed Circuit Board
  • AT & S
  • Samsung Electro-Mechanics
  • Kyocera
  • TOPPAN
  • ASE
  • LG Inno Tek
  • Shennan Circuit
簡介目錄

Ajinomoto Build-Up Film Substrate Trends and Forecast

The future of the global ajinomoto build-up film substrate market looks promising with opportunities in the PCs, AI chip, server and switch markets. The global ajinomoto build-up film substrate market is expected to reach an estimated $3.7 billion by 2030 with a CAGR of 18.9% from 2024 to 2030. The major drivers for this market are rising disposable income of consumers, technological advancements, and growing demand for consumer electronics such as laptops, smartphones, and tablets, PCs, and notebooks.

A more than 150-page report is developed to help in your business decisions.

Ajinomoto Build-Up Film Substrate by Segment

The study includes a forecast for the global ajinomoto build-up film substrate by type, application, and region.

Ajinomoto Build-Up Film Substrate Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • 4-8 Layers ABF Substrate
  • 8-16 ABF Substrate

Ajinomoto Build-Up Film Substrate Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • PCs
  • AI Chip
  • Server and Switch
  • Others

Ajinomoto Build-Up Film Substrate Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Ajinomoto Build-Up Film Substrate Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies ajinomoto build-up film substrate companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the ajinomoto build-up film substrate companies profiled in this report include-

  • Ajinomoto
  • Unimicron Technology
  • Nan Ya Printed Circuit Board
  • AT & S
  • Samsung Electro-Mechanics
  • Kyocera
  • Toppan
  • ASE
  • LG Inno Tek
  • Shennan Circuit

Ajinomoto Build-Up Film Substrate Market Insights

Lucintel forecasts that 4-8 layers ABF substrate is expected to witness higher segment over the forecast period due to expanding usage across mobile devices, personal computers, and server systems, as well as, global proliferation of smartphones, tablet computers, and data center infrastructure.

North America is expected to witness largest segment over the forecast period due to increasing electronic and semiconductor industry in US.

Features of the Global Ajinomoto Build-Up Film Substrate Market

Market Size Estimates: Ajinomoto build-up film substrate market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Ajinomoto build-up film substrate market size by type, application, and region in terms of value ($B).

Regional Analysis: Ajinomoto build-up film substrate market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the ajinomoto build-up film substrate market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the ajinomoto build-up film substrate market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the ajinomoto build-up film substrate market size?

Answer: The global ajinomoto build-up film substrate market is expected to reach an estimated $3.7 billion by 2030.

Q.2 What is the growth forecast for ajinomoto build-up film substrate market?

Answer: The global ajinomoto build-up film substrate market is expected to grow with a CAGR of 18.9% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the ajinomoto build-up film substrate market?

Answer: The major drivers for this market are rising disposable income of consumers, technological advancements, and growing demand for consumer electronics such as laptops, smartphones, and tablets, PCs, and notebooks.

Q4. What are the major segments for ajinomoto build-up film substrate market?

Answer: The future of the global ajinomoto build-up film substrate market looks promising with opportunities in the PCs, AI chip, server and switch markets.

Q5. Who are the key ajinomoto build-up film substrate market companies?

Answer: Some of the key ajinomoto build-up film substrate companies are as follows:

  • Ajinomoto
  • Unimicron Technology
  • Nan Ya Printed Circuit Board
  • AT & S
  • Samsung Electro-Mechanics
  • Kyocera
  • Toppan
  • ASE
  • LG Inno Tek
  • Shennan Circuit

Q6. Which ajinomoto build-up film substrate market segment will be the largest in future?

Answer: Lucintel forecasts that 4-8 layers ABF substrate is expected to witness higher segment over the forecast period due to expanding usage across mobile devices, personal computers, and server systems, as well as, global proliferation of smartphones, tablet computers, and data center infrastructure.

Q7. In ajinomoto build-up film substrate market, which region is expected to be the largest in next 5 years?

Answer: North America is expected to witness largest segment over the forecast period due to increasing electronic and semiconductor industry in US.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the ajinomoto build-up film substrate market by type (4-8 layers ABF substrate and 8-16 ABF substrate), application (PCs, AI chip, server and switch, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Ajinomoto Build-Up Film Substrate Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Ajinomoto Build-Up Film Substrate Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Ajinomoto Build-Up Film Substrate Market by Type
    • 3.3.1: 4-8 Layers ABF Substrate
    • 3.3.2: 8-16 ABF Substrate
  • 3.4: Global Ajinomoto Build-Up Film Substrate Market by Application
    • 3.4.1: PCs
    • 3.4.2: AI Chip
    • 3.4.3: Server And Switch
    • 3.4.4: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Ajinomoto Build-Up Film Substrate Market by Region
  • 4.2: North American Ajinomoto Build-Up Film Substrate Market
    • 4.2.2: North American Ajinomoto Build-Up Film Substrate Market by Application: PCs, AI Chip, Server And Switch, and Others
  • 4.3: European Ajinomoto Build-Up Film Substrate Market
    • 4.3.1: European Ajinomoto Build-Up Film Substrate Market by Type: 4-8 Layers ABF Substrate and 8-16 ABF Substrate
    • 4.3.2: European Ajinomoto Build-Up Film Substrate Market by Application: PCs, AI Chip, Server And Switch, and Others
  • 4.4: APAC Ajinomoto Build-Up Film Substrate Market
    • 4.4.1: APAC Ajinomoto Build-Up Film Substrate Market by Type: 4-8 Layers ABF Substrate and 8-16 ABF Substrate
    • 4.4.2: APAC Ajinomoto Build-Up Film Substrate Market by Application: PCs, AI Chip, Server And Switch, and Others
  • 4.5: ROW Ajinomoto Build-Up Film Substrate Market
    • 4.5.1: ROW Ajinomoto Build-Up Film Substrate Market by Type: 4-8 Layers ABF Substrate and 8-16 ABF Substrate
    • 4.5.2: ROW Ajinomoto Build-Up Film Substrate Market by Application: PCs, AI Chip, Server And Switch, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Ajinomoto Build-Up Film Substrate Market by Type
    • 6.1.2: Growth Opportunities for the Global Ajinomoto Build-Up Film Substrate Market by Application
    • 6.1.3: Growth Opportunities for the Global Ajinomoto Build-Up Film Substrate Market by Region
  • 6.2: Emerging Trends in the Global Ajinomoto Build-Up Film Substrate Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Ajinomoto Build-Up Film Substrate Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Ajinomoto Build-Up Film Substrate Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Ajinomoto
  • 7.2: Unimicron Technology
  • 7.3: Nan Ya Printed Circuit Board
  • 7.4: AT & S
  • 7.5: Samsung Electro-Mechanics
  • 7.6: Kyocera
  • 7.7: TOPPAN
  • 7.8: ASE
  • 7.9: LG Inno Tek
  • 7.10: Shennan Circuit