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1356868

半導體電鍍設備市場報告：至2030年的趨勢、預測與競爭分析

Semiconductor Plating System Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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簡介目錄

半導體電鍍系統趨勢與預測

全球半導體電鍍系統市場預計到2030年將達到 74 億美元，2024年至2030年年複合成長率為 4.5%。該市場的主要促進因素是電子零件在汽車領域的普及不斷提高、對半導體的需求迅速增加以及鍍銅利用率的提高。全球半導體電鍍系統市場的未來看起來充滿希望，在 TSV、銅柱、再分佈層（RDL）、凸塊下金屬層（UBM）和凸塊市場中存在機會。

半導體電鍍設備市場洞察

Lucintel預測，全自動電鍍設備將在預測期內達到最高成長。

再分配層（RDL）仍然是該市場最大的區隔。

預計亞太地區在預測期內將出現最高成長。

本報告回答了 11 個關鍵問題：

  • Q.1.細分市場中最有前途和高成長的機會為何？
  • Q.2.哪個細分市場將以更快的速度成長？理由為何？
  • Q.3.哪些地區未來會出現更快的成長？理由為何？
  • Q.4.影響市場動態的主要因素有哪些？市場的主要挑戰和商業風險是什麼？
  • Q.5.這個市場的商業風險和競爭威脅為何？
  • Q.6.這個市場有哪些新趨勢？理由為何？
  • Q.7.市場客戶需求有何改變？
  • Q.8.該市場有哪些新發展以及哪些公司處於領先地位？
  • Q.9.這個市場的主要企業有哪些？主要企業採取哪些策略配合措施來發展業務？
  • Q.10.該市場上的競爭產品有哪些，由於材料或產品替代導致市場佔有率下降的威脅有多大？
  • Q.11.過去年度發生了哪些併購事件，對產業產生了哪些影響？

目錄

第1章 執行摘要

第2章 全球半導體電鍍系統市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球半導體電鍍系統市場趨勢（2018-2023）與預測（2024-2030）
  • 全球半導體電鍍系統市場（依類型）
    • 全自動
    • 半自動
    • 手動的
  • 依技術分類的全球半導體電鍍系統市場
    • 電鍍
    • 電解
  • 以晶圓尺寸分類的全球半導體電鍍系統市場
    • 最大100毫米
    • 100mm～200mm
    • 200mm以上
  • 全球半導體電鍍系統市場（依應用）
    • TSV
    • 銅柱
    • 重新分佈層（RDL）
    • 凸塊下金屬層（UBM）
    • 碰撞
    • 其他

第4章 2018-2030年市場趨勢及預測分析（依地區）

  • 全球半導體電鍍系統市場（依地區）
  • 北美半導體電鍍設備市場
  • 歐洲半導體電鍍設備市場
  • 亞太半導體電鍍系統市場
  • 其他區域半導體電鍍設備市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 全球半導體電鍍系統市場成長機會（依類型）
    • 全球半導體電鍍系統市場成長機會（依技術）
    • 全球半導體電鍍系統市場成長機會（依晶圓尺寸）
    • 全球半導體電鍍系統市場成長機會（依應用）
    • 全球半導體電鍍系統市場成長機會（依地區）
  • 全球半導體電鍍系統市場新趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球半導體電鍍設備市場產能
    • 全球半導體電鍍系統市場的合併、收購和合資企業
    • 認證和許可

第7章 主要企業概況

  • ACM Research
  • Applied Materials
  • ASMPT
  • ClassOne Technology
  • Ebara Technologies
  • Hitachi Power Solutions
  • LAM Research Corporation
  • Mitmo Semicon Engineering
  • RENA Technologies
  • Tanaka Holdings
簡介目錄

Semiconductor Plating System Trends and Forecast

The future of the global semiconductor plating system market looks promising with opportunities in the TSV, copper pillar, redistribution layer (RDL), under bump metallization (UBM), and bumping markets. The global semiconductor plating system market is expected to reach an estimated $7.4 billion by 2030 with a CAGR of 4.5% from 2024 to 2030. The major drivers for this market are increasing penetration of electronic components in the automotive sector, surge in the demand for semiconductors, and utilization of copper plating has seen an upswing.

A more than 150-page report is developed to help in your business decisions.

Semiconductor Plating System by Segment

The study includes a forecast for the global semiconductor plating system by type, technology, wafer size, application, and region.

Semiconductor Plating System Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Fully Automatic
  • Semi-Automatic
  • Manual

Semiconductor Plating System Market by Technology [Shipment Analysis by Value from 2018 to 2030]:

  • Electroplating
  • Electroless

Semiconductor Plating System Market by Wafer Size [Shipment Analysis by Value from 2018 to 2030]:

  • Up to 100 mm
  • 100 mm - 200 mm
  • Above 200 mm

Semiconductor Plating System Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • TSV
  • Copper Pillar
  • Redistribution Layer (RDL)
  • Under Bump Metallization (UBM)
  • Bumping
  • Others

Semiconductor Plating System Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Semiconductor Plating System Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor plating system companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor plating system companies profiled in this report include-

  • ACM Research
  • Applied Materials
  • ASMPT
  • Classone Technology
  • Ebara Technologies
  • Hitachi Power Solutions
  • Lam Research Corporation
  • Mitmo Semicon Engineering
  • Rena Technologies
  • Tanaka Holdings

Semiconductor Plating System Market Insights

Lucintel forecasts that fully automatic is expected to witness highest growth over the forecast period.

Within this market, redistribution layer (RDL) will remain the largest segment.

APAC is expected to witness highest growth over the forecast period.

Features of the Global Semiconductor Plating System Market

Market Size Estimates: Semiconductor plating system market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Semiconductor plating system market size by type, technology, and region. in terms of value ($B).

Regional Analysis: Semiconductor plating system market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, technologies, and region.s for the semiconductor plating system market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the semiconductor plating system market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1. What is the semiconductor plating system market size?

Answer: The global semiconductor plating system market is expected to reach an estimated $7.4 billion by 2030.

Q.2. What is the growth forecast for semiconductor plating system market?

Answer: The global semiconductor plating system market is expected to grow with a CAGR of 4.5% from 2024 to 2030.

Q.3. What are the major drivers influencing the growth of the semiconductor plating system market?

Answer: The major drivers for this market are increasing penetration of electronic components in the automotive sector, surge in the demand for semiconductors, and utilization of copper plating has seen an upswing.

Q.4. What are the major segments for semiconductor plating system market?

Answer: The future of the semiconductor plating system market looks promising with opportunities in the TSV, copper pillar, redistribution layer (RDL), under bump metallization (UBM), and bumping markets.

Q.5. Who are the key semiconductor plating system market companies?

Answer: Some of the key semiconductor plating system companies are as follows:

  • ACM Research
  • Applied Materials
  • ASMPT
  • ClassOne Technology
  • Ebara Technologies
  • Hitachi Power Solutions
  • LAM Research Corporation
  • Mitmo Semicon Engineering
  • RENA Technologies
  • Tanaka Holdings

Q.6. Which semiconductor plating system market segment will be the largest in future?

Answer: Lucintel forecasts that fully automatic is expected to witness highest growth over the forecast period.

Q.7. In semiconductor plating system market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period.

Q.8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the semiconductor plating system market by type (fully automatic, semi-automatic, and manual), technology (electroplating and electroless), wafer size (up to 100 mm, 100 mm - 200 mm, and above 200 mm), application (TSV, copper pillar, redistribution layer (RDL), under bump metallization (UBM), bumping, and others), and region. (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Semiconductor Plating System Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Semiconductor Plating System Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Semiconductor Plating System Market by Type
    • 3.3.1: Fully Automatic
    • 3.3.2: Semi-Automatic
    • 3.3.3: Manual
  • 3.4: Global Semiconductor Plating System Market by Technology
    • 3.4.1: Electroplating
    • 3.4.2: Electroless
  • 3.5: Global Semiconductor Plating System Market by Wafer Size
    • 3.5.1: Up to 100 mm
    • 3.5.2: 100 mm - 200 mm
    • 3.5.3: Above 200 mm
  • 3.6: Global Semiconductor Plating System Market by Application
    • 3.6.1: TSV
    • 3.6.2: Copper Pillar
    • 3.6.3: Redistribution Layer (RDL)
    • 3.6.4: Under Bump Metallization (UBM)
    • 3.6.5: Bumping
    • 3.6.6: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Semiconductor Plating System Market by Region
  • 4.2: North American Semiconductor Plating System Market
    • 4.2.2: North American Semiconductor Plating System Market by Application: TSV, Copper Pillar, Redistribution Layer (RDL), Under Bump Metallization (UBM), Bumping, and Others
  • 4.3: European Semiconductor Plating System Market
    • 4.3.1: European Semiconductor Plating System Market by Type: Fully Automatic, Semi-Automatic, and Manual
    • 4.3.2: European Semiconductor Plating System Market by Application: TSV, Copper Pillar, Redistribution Layer (RDL), Under Bump Metallization (UBM), Bumping, and Others
  • 4.4: APAC Semiconductor Plating System Market
    • 4.4.1: APAC Semiconductor Plating System Market by Type: Fully Automatic, Semi-Automatic, and Manual
    • 4.4.2: APAC Semiconductor Plating System Market by Application: TSV, Copper Pillar, Redistribution Layer (RDL), Under Bump Metallization (UBM), Bumping, and Others
  • 4.5: ROW Semiconductor Plating System Market
    • 4.5.1: ROW Semiconductor Plating System Market by Type: Fully Automatic, Semi-Automatic, and Manual
    • 4.5.2: ROW Semiconductor Plating System Market by Application: TSV, Copper Pillar, Redistribution Layer (RDL), Under Bump Metallization (UBM), Bumping, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Semiconductor Plating System Market by Type
    • 6.1.2: Growth Opportunities for the Global Semiconductor Plating System Market by Technology
    • 6.1.3: Growth Opportunities for the Global Semiconductor Plating System Market by Wafer Size
    • 6.1.4: Growth Opportunities for the Global Semiconductor Plating System Market by Application
    • 6.1.5: Growth Opportunities for the Global Semiconductor Plating System Market by Region
  • 6.2: Emerging Trends in the Global Semiconductor Plating System Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Semiconductor Plating System Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Semiconductor Plating System Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: ACM Research
  • 7.2: Applied Materials
  • 7.3: ASMPT
  • 7.4: ClassOne Technology
  • 7.5: Ebara Technologies
  • 7.6: Hitachi Power Solutions
  • 7.7: LAM Research Corporation
  • 7.8: Mitmo Semicon Engineering
  • 7.9: RENA Technologies
  • 7.10: Tanaka Holdings