查看購物車
  • Simplified Chinese
  • English
  • Japanese
DRAM模組和組件市場：趨勢、商機和競爭分析[2023-2028]
市場調查報告書
商品編碼
1342013

DRAM模組和組件市場：趨勢、商機和競爭分析[2023-2028]

DRAM Module and Component Market: Trends, Opportunities and Competitive Analysis [2023-2028]
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

價格

※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

簡介目錄

DRAM模組和組件市場趨勢和預測

2028年，全球DRAM模組和組件市場預計將達到1,034億美元，2023年至2028年的年複合成長率為1.2%。該市場的主要促進因素是基於 5G 的技術趨勢的不斷發展、對物聯網設備的需求不斷增加，以及基於DRAM的現代計算設備(例如超薄筆記型電腦和混合設備)的日益普及。由於伺服器、汽車、消費性電子、電腦和行動裝置應用領域的商機，全球DRAM模組和組件市場未來性廣闊。

DRAM 模組和組件市場洞察

  • Lucintel 預測，DDR5 預計將在預測期內實現最高成長，因為其下一代效能、高容量和功效使其被認為是 PC 愛好者、重度核心玩家和內容製造商的理想選擇。
  • 由於數位設備、自動化技術、遠端存取應用程式在汽車中的日益普及，以及先進數位設備的引進，使駕駛體驗更加舒適和安全，汽車將繼續成為最大的細分市場。
  • 由於對智慧產品的巨大需求、主要半導體製造地的存在以及該地區主要參與者的存在，亞太地區仍將是最大的地區。

本報告回答了 11 個關鍵問題：

  • Q.1.細分市場中最有前途和高成長的機會為何？
  • Q.2.哪個細分市場將以更快的速度成長？理由為何？
  • Q.3.哪些地區未來會出現更快的成長？理由為何？
  • Q.4.影響市場動態的主要要素有哪些？市場的主要挑戰和業務風險是什麼？
  • Q.5.這個市場的商業風險和競爭威脅為何？
  • Q.6.這個市場有哪些新趨勢？理由為何？
  • Q.7.市場客戶需求有何改變？
  • Q.8.該市場有哪些新發展以及哪些公司處於領先地位？
  • Q.9.這個市場的主要企業有哪些？此外，主要企業採取什麼樣的策略配合措施？
  • Q10.該市場的競爭產品有哪些？因材料或產品替代而導致市場佔有率下降的威脅有多大？
  • Q11.過去年度發生了哪些併購事件，對產業產生了哪些影響？

目錄

第1章 執行摘要

第2章 全球DRAM模組與組件市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2017-2028年市場趨勢及預測分析

  • 宏觀經濟趨勢(2017-2022)與預測(2023-2028)
  • 全球DRAM模組和組件市場趨勢(2017-2022)和預測(2023-2028)
  • 依產品類型分類的全球DRAM模組和組件市場
    • LPDRAM
    • DDR2
    • DDR5
    • GDDR
    • HBM
    • DDR4
    • DDR3
    • 其他
  • 按記憶體類型分類的全球DRAM模組和組件市場
    • 8GB以上
    • 6～8GB
    • 3～4GB
    • 2GB
    • 其他
  • 依最終用途行業分類的全球DRAM模組和組件市場
    • 伺服器
    • 汽車
    • 家用電器
    • 電腦
    • 行動裝置
    • 其他

第4章 2017-2028年分地區市場趨勢及預測分析

  • 全球DRAM模組和組件市場(依地區)
  • 北美DRAM模組及零組件市場
  • 歐洲DRAM模組及零組件市場
  • 亞太DRAM模組及零組件市場
  • 其他地區DRAM模組及零組件市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 依產品類型分類的全球DRAM模組和組件市場成長機會
    • 按記憶體類型分類的全球DRAM模組和組件市場成長機會
    • 依最終用途產業分類的全球DRAM模組和組件市場成長機會
    • 全球DRAM模組和組件市場成長機會(依地區)
  • 全球DRAM模組和組件市場的新興趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球DRAM模組及零組件市場產能
    • 全球DRAM模組和組件市場的合併、收購和合資企業
    • 認證和許可

第7章 主要企業概況

  • Samsung Electronics
  • SK Hynix
  • Micron Technology
  • Nanya Technology
  • Winbond Electronics
  • Powerchip Technology
  • ADATA Technology
簡介目錄

DRAM Module and Component Market Trends and Forecast

The future of the global dram module and component market looks promising with opportunities in the server, automobile, consumer electronic, computer, and mobile device applications. The global dram module and component market is expected to reach an estimated $103.4 billion by 2028 with a CAGR of 1.2% from 2023 to 2028. The major drivers for this market are growing trend of 5G based technologies, rising demand for IoT enabled devices, and growing popularity of modern DRAM-based computing gadgets, such as ultra-thin laptops and hybrid devices.

A more than 150-page report is developed to help in your business decisions.

DRAM Module and Component Market by Segment

The study includes trends and forecast for the global dram module and component market by product type, memory type, end use industry, and region

DRAM Module and Component Market by Product Type [Shipment Analysis by Value from 2017 to 2028]:

  • LPDRAM
  • DDR2
  • DDR5
  • GDDR
  • HBM
  • DDR4
  • DDR3
  • Others

DRAM Module and Component Market by Memory Type [Shipment Analysis by Value from 2017 to 2028]:

  • Above 8 GB
  • 6-8GB
  • 3-4GB
  • 2GB
  • Others

DRAM Module and Component Market by End Use Industry [Shipment Analysis by Value from 2017 to 2028]:

  • Servers
  • Automobiles
  • Consumer Electronics
  • Computers
  • Mobile Devices
  • Others

DRAM Module and Component Market by Region [Shipment Analysis by Value from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of DRAM Module and Component Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, DRAM module and component companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the dram module and component companies profiled in this report include:

  • Samsung Electronics
  • SK Hynix
  • Micron Technology
  • Nanya Technology
  • Winbond Electronics
  • Powerchip Technology
  • ADATA Technology

DRAM Module and Components Market Insights

  • Lucintel forecasts that DDR5 is expected to witness the highest growth over the forecast period as it is considered an ideal option for PC enthusiasts, hardcore gamers, and content makers owing to its next-generation performance, extended capacity, and power efficiency.
  • Automotive will remain the largest segment due to increasing penetration of IoT gadgets, automation technology, and remote access applications in vehicles and introduction of advanced digital devices to make driving experience more comfortable and safe.
  • APAC will remain the largest region due to tremendous demand for smart gadgets, the existence of major semiconductor manufacturing hubs, and the presence of key players in the region.

Features of the Global DRAM Module and Component Market

  • Market Size Estimates: DRAM module and component market size estimation in terms of value ($B).
  • Trend and Forecast Analysis: Market trends (2017 to 2022) and forecast (2023 to 2028) by various segments and regions.
  • Segmentation Analysis: DRAM module and component market size by various segments, such as by product type, memory type, end use industry, and region in terms of value ($B).
  • Regional Analysis: DRAM module and component market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
  • Growth Opportunities: Analysis of growth opportunities in different product types, memory types, end use industries, and regions for the DRAM module and component market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape of the DRAM module and component market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

  • Q1. What is the DRAM module and component market size?
  • Answer: The global DRAM module and component market is expected to reach an estimated $103.4 billion by 2028.
  • Q2.What is the growth forecast for DRAM module and component market?
  • Answer: The global DRAM module and component market is expected to grow with a CAGR of 1.2% from 2023 to 2028
  • Q3.What are the major drivers influencing the growth of the DRAM module and component market?
  • Answer: The major drivers for this market are growing trend of 5G based technologies, rising demand for IoT enabled devices, and growing popularity of modern DRAM-based computing gadgets, such as ultra-thin laptops and hybrid devices.
  • Q4. What are the major segments for DRAM module and component market?
  • Answer: The future of the DRAM module and component market looks promising with opportunities in the server, automobile, consumer electronic, computer, and mobile device applications.
  • Q5. Who are the key DRAM module and component companies?
  • Answer: Some of the key DRAM module and component companies are as follows:
    • Samsung Electronics
    • SK Hynix
    • Micron Technology
    • Nanya Technology
    • Winbond Electronics
    • Powerchip Technology
    • ADATA Technology
  • Q6. Which DRAM module and component market segment will be the largest in future?
  • Answer: Lucintel forecasts that DDR5 is expected to witness the highest growth over the forecast period as it is considered an ideal option for PC enthusiasts, hardcore gamers, and content makers owing to its next-generation performance, extended capacity, and power efficiency.
  • Q7. In DRAM module and component market, which region is expected to be the largest in next 5 years?
  • Answer: APAC will remain the largest region due to tremendous demand for smart gadgets, the existence of major semiconductor manufacturing hubs, and the presence of key players in the region.
  • Q8.Do we receive customization in this report?
  • Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the global dram module and component market by product type (LPDRAM, DDR2, DDR5, GDDR, HBM, DDR4, DDR3, and others), memory type (above 8 GB, 6-8GB, 3-4GB, 2GB, and others), end use industry (servers, automobiles, consumer electronics, computers, mobile devices, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global DRAM Module and Component Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

  • 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
  • 3.2: Global DRAM Module and Component Market Trends (2017-2022) and Forecast (2023-2028)
  • 3.3: Global DRAM Module and Component Market by Product Type
    • 3.3.1: LPDRAM
    • 3.3.2: DDR2
    • 3.3.3: DDR5
    • 3.3.4: GDDR
    • 3.3.5: HBM
    • 3.3.6: DDR4
    • 3.3.7: DDR3
    • 3.3.8: Others
  • 3.4: Global DRAM Module and Component Market by Memory Type
    • 3.4.1: Above 8 GB
    • 3.4.2: 6-8GB
    • 3.4.3: 3-4GB
    • 3.4.4: 2GB
    • 3.4.5: Others
  • 3.5: Global DRAM Module and Component Market by End Use Industry
    • 3.5.1: Servers
    • 3.5.2: Automobiles
    • 3.5.3: Consumer Electronics
    • 3.5.4: Computers
    • 3.5.5: Mobile Devices
    • 3.5.6: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

  • 4.1: Global DRAM Module and Component Market by Region
  • 4.2: North American DRAM Module and Component Market
    • 4.2.1: North American DRAM Module and Component Market by Product Type: LPDRAM, DDR2, DDR5, GDDR, HBM, DDR4, DDR3, and Others
    • 4.2.2: North American DRAM Module and Component Market by End Use Industry: Servers, Automobiles, Consumer Electronics, Computers, Mobile Devices, and Others
  • 4.3: European DRAM Module and Component Market
    • 4.3.1: European DRAM Module and Component Market by Product Type: LPDRAM, DDR2, DDR5, GDDR, HBM, DDR4, DDR3, and Others
    • 4.3.2: European DRAM Module and Component Market by End Use Industry: Servers, Automobiles, Consumer Electronics, Computers, Mobile Devices, and Others
  • 4.4: APAC DRAM Module and Component Market
    • 4.4.1: APAC DRAM Module and Component Market by Product Type: LPDRAM, DDR2, DDR5, GDDR, HBM, DDR4, DDR3, and Others
    • 4.4.2: APAC DRAM Module and Component Market by End Use Industry: Servers, Automobiles, Consumer Electronics, Computers, Mobile Devices, and Others
  • 4.5: ROW DRAM Module and Component Market
    • 4.5.1: ROW DRAM Module and Component Market by Product Type: LPDRAM, DDR2, DDR5, GDDR, HBM, DDR4, DDR3, and Others
    • 4.5.2: ROW DRAM Module and Component Market by End Use Industry: Servers, Automobiles, Consumer Electronics, Computers, Mobile Devices, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global DRAM Module and Component Market by Product Type
    • 6.1.2: Growth Opportunities for the Global DRAM Module and Component Market by Memory Type
    • 6.1.3: Growth Opportunities for the Global DRAM Module and Component Market by End Use Industry
    • 6.1.4: Growth Opportunities for the Global DRAM Module and Component Market by Region
  • 6.2: Emerging Trends in the Global DRAM Module and Component Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global DRAM Module and Component Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global DRAM Module and Component Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Samsung Electronics
  • 7.2: SK Hynix
  • 7.3: Micron Technology
  • 7.4: Nanya Technology
  • 7.5: Winbond Electronics
  • 7.6: Powerchip Technology
  • 7.7: ADATA Technology