光連接模組半導體市場規模、佔有率和成長預測（2026-2032 年）

2026年光光連接模組半導體市場規模估計為84億美元，預計2032年將達227億美元。這意味著從2026年到2032年的複合年成長率為18.0%。

光連接模組半導體堆疊將高速電訊號轉換為光訊號，透過光纖傳輸這些訊號，並在接收端將其轉換回電訊號。在傳統的插入式收發器中，主機側的電介面連接到數位訊號處理器，該處理器執行均衡、時脈恢復、前向糾錯和調變功能。驅動器驅動雷射和調製器，光電二極體和電阻放大器重建接收到的光訊號。矽光電將調製器、波導管、連接複用器和檢測器整合在矽相容平台上。磷化銦在高效雷射振盪、電吸收調製和光放大中仍然發揮著至關重要的作用。隨著人工智慧 (AI) 基礎設施的發展，這些功能的實體位置也在改變。在傳統的插入式光學模組中，光學模組位於交換器或加速器系統的前面板上。近封裝光元件縮短了交換器矽晶片和光引擎之間的電距離。共封裝光學元件將光引擎直接置於交換或計算矽晶片旁邊，從而縮短高速電SerDes鏈路的長度並降低功耗。光輸入/輸出方案透過使用可整合到先進半導體封裝中的緊湊型光晶片，進一步提升了整合度。這些架構並未取代插件式光學元件，後者創造了多種半導體收入來源，這些收入來源在傳輸距離、頻寬密度、可維護性和功耗要求等方面存在差異。因此，各種技術的組合仍然是異質的。雖然矽光電非常適合高密度整合和分波多工，但在矽上實現高效的光生載子仍然具有挑戰性。這使得對外部或混合磷化銦雷射的需求得以維持。磷化銦電吸收調變雷射在200G和新興的400G/通道鏈路中持續提供可靠的高速性能。砷化鎵VCSEL陣列在短距離多模應用和高度並行化的光學結構中仍扮演重要角色。那些能夠將光電、高速模擬電子學、封裝和製造良率結合起來的供應商，比那些依賴單一材料平台的供應商更有可能在市場上取得成功。

市場促進因素

• 人工智慧架構的頻寬提升速度超過了電氣互連效率的提升速度。人工智慧叢集透過連接大量的加速器、記憶體資源和交換器來擴展效能。隨著架構總頻寬的增加，長距離高速銅纜鏈路面臨許多挑戰，例如插入損耗增加、均衡過程複雜以及功耗上升。當需要在不同基板、機架甚至高密度擴展系統中不同計算托架之間傳輸資料時，光鏈路的效用日益凸顯。博通、Marvell、 連貫和 Lumentum 等公司都在開發單通道 400G 的光鏈路技術，因為業界必須在不增加收發器數量或功耗的情況下擴展頻寬。
• 從1.6T到3.2T的過渡將增加每個光端口所需的半導體數量。從800G到1.6T的過渡初期將增加對每通道200G的DSP、驅動器、TIA、雷射和檢測器技術的需求。隨後過渡到3.2T將引入每通道400G的訊號傳輸，進一步提高對類比頻寬、調製效率、光電二極體性能和封裝寄生元件的要求。 2026年9月，Marvell宣布展示了採用2nm製程技術實現每通道400G的光纖通訊。 Coherent和Lumentum在2026年也示範了400G級EML和光電二極體技術。因此，每次速度升級都將導致整個光訊號鏈中半導體的更新換代。
• CPO 和光 I/O 解決了高基數交換器和加速器附近的功耗和傳輸距離限制問題。將光引擎放置在交換器和計算晶片附近，可以縮短耗電的電氣鏈路，並提高前面板頻寬密度。 GlobalFoundries 於 2026 年 5 月發布了 SCALE CPO 平台。 Broadcom 展示了使用共封裝光學模組的102.4T 乙太網路交換。 Intel 持續開發結合矽光電和 CMOS 電子技術的光運算互連晶片。這些方法正在拓展半導體業務的機遇，從分離式收發器組件擴展到封裝級光引擎和晶片。
• 對晶圓代工和封裝技術的投資正在降低光電整合的門檻。光連接模組需要在光電晶圓、電子積體電路、雷射附件、光纖耦合和先進封裝等各個環節實現可重複的製造。作為其2026年晶片研發計畫的一部分，GlobalFoundries正在投資矽光電、新型光學材料和3D混合鍵結技術。 Marvell、Broadcom和Intel等供應商也正在推動日益複雜的電子製程節點與光電的整合。改進的製程設計套件、晶圓級測試和自動化封裝正在降低將光技術從演示階段擴展到量產階段的風險。

市場限制因素

• 最大的阻礙因素是封裝成本、溫度控管、雷射可靠性和製造良率。光引擎需要精確的光纖對準和低損耗耦合。在共封裝架構中，光元件靠近高價值的開關或計算矽晶片，這可能會使現場更換變得複雜。外部雷射光源可以提高某些CPO設計的可維護性，但也會引入額外的光纖佈線和冗餘要求。科技碎片化仍然是一項重大挑戰。矽光電、磷化銦EML、VCSEL和新興的調製平台各自在不同的距離和功率範圍內提供了最佳選擇。光計算互連和封裝級光I/O的標準仍處於發展階段。在建立一個廣泛的、可互通的商業生態系統之前，超大規模資料中心業者資料中心和半導體供應商可能會採用專有架構。

目錄

第1章執行摘要

• 市場機會與主要發現
• 光連接模組半導體展望
• 關鍵技術和收入來源

第2章 市場概覽

• 光連接模組半導體架構
• 電光訊號鏈
• 插件式、近封裝式和共封裝式光元件
• 光輸入/輸出和計算互連
• 半導體封裝和光纖耦合的要求

第3章 市場規模及預測（2026-2032 年）

• 全球市場銷售
• 年增率分析
• 每個光鏈路的半導體用量

第4章 市場：依半導體功能分類

• 光數位訊號處理器
• 矽光電，光子積體電路
• 雷射和電吸收調製雷射
• VCSEL和平行光發射器
• 光電二極體、驅動器、電阻放大器
• 光I/O晶片和CPO光引擎

第5章 市場：依材料分類的平台

• 矽和絕緣體上矽
• 磷化銦
• 砷化鎵
• 矽鍺及互補型模擬平台
• 混合和異構光子整合

第6章 市場：依互連架構分類

• 可插拔光學裝置
• 線性可插拔光學元件
• 封裝最近的光學元件
• 共封裝光學元件
• 光運算 I/O 和晶片互連

第7章 市場：依網路速度分類

• 400G 或更少
• 800G
• 1.6T
• 3.2噸或以上

第8章 市場：依應用分類

• 人工智慧規模化網路
• AI橫向擴展與乙太網路架構
• 資料中心之間的互連
• 通訊和運營商網路
• 高效能運算和專用系統

第9章：地方市場

• 北美洲
  • 美國
  • 加拿大
• 亞太地區
  • 台灣
  • 中國
  • 日本
  • 韓國
  • 東南亞
• 歐洲
• 世界其他地區

第10章 市場動態

• 促進因素
  • AI織物的頻寬密度
  • 光學躍遷從 1.6T 到 3.2T
  • 高速電鏈路中的功率限制
  • 晶圓代工廠和光子封裝的規模化生產
• 抑制因子
  • 光纖封裝和光纖安裝成本
  • 雷射可靠性和溫度控管
  • CPO的可維護性和可修復性
  • 架構和標準的碎片化

第11章 競爭格局

• 市場結構與競爭強度
• 光DSP和連接半導體的市場定位
• 矽光電與代工策略
• InP、VCSEL 和雷射平台策略
• CPO 和光 I/O 生態系中的夥伴關係

第12章：公司簡介

• Broadcom
• Marvell Technology
• Intel
• GlobalFoundries
• Coherent
• Lumentum
• Cisco/Acacia
• MACOM Technology Solutions
• Semtech
• Taiwan Semiconductor Manufacturing Company
• Ayar Labs
• Lightmatter
• Ranovus
• POET Technologies
• NVIDIA

第13章 近期趨勢

第14章附錄

The Optical Interconnect Semiconductor Market is estimated at USD 8.40 billion in 2026 and is projected to reach USD 22.70 billion by 2032, representing a CAGR of 18.0% across 2026-2032.

The optical interconnect semiconductor stack converts high-speed electrical data into optical signals, transports those signals across fiber, and converts them back into electrical form at the receiving end. In a conventional pluggable transceiver, a host electrical interface connects to a digital signal processor that performs equalization, clock recovery, forward error correction and modulation functions. Drivers then operate lasers or modulators, while photodiodes and transimpedance amplifiers recover the received optical signal. Silicon photonics integrates modulators, waveguides, multiplexers and photodetectors on a silicon-compatible platform. Indium phosphide remains important for efficient laser generation, electro-absorption modulation and optical amplification. Artificial intelligence infrastructure is changing where these functions are physically placed. Traditional pluggable optics position the optical module at the front panel of a switch or accelerator system. Near-packaged optics shorten the electrical distance between switch silicon and the optical engine. Co-packaged optics place optical engines adjacent to the switching or compute silicon itself, reducing the length and power of high-speed electrical SerDes links. Optical input and output approaches move integration closer again by using compact optical chiplets that can be incorporated within advanced semiconductor packages. These architectures do not eliminate pluggable optics. They create multiple semiconductor revenue pools differentiated by reach, bandwidth density, serviceability and power requirements. The technology mix therefore remains heterogeneous. Silicon photonics is well suited to dense integration and wavelength-division multiplexing, but efficient on-chip light generation remains difficult in silicon. This sustains demand for external or hybrid indium phosphide lasers. Indium phosphide electro-absorption modulated lasers continue to offer strong high-speed performance for 200G- and emerging 400G-per-lane links. Gallium arsenide VCSEL arrays remain relevant for short-reach multimode applications and highly parallel optical fabrics. The commercial winners are likely to be suppliers that combine photonics, high-speed analog electronics, packaging and manufacturing yield rather than relying on a single material platform.

Market Drivers

• AI fabrics are increasing bandwidth density faster than electrical interconnect efficiency improves. AI clusters scale performance by connecting very large numbers of accelerators, memory resources and switches. As aggregate fabric bandwidth rises, high-speed copper links face increasing insertion loss, equalization complexity and power consumption over longer reaches. Optical links become more attractive when data must move across boards, racks and increasingly between compute trays inside dense scale-up systems. Broadcom, Marvell, Coherent and Lumentum are all developing 400G-per-lane technologies because the industry must increase bandwidth without allowing transceiver count and electrical power to rise proportionally.
• The transition from 1.6T to 3.2T raises semiconductor content per optical port. The move from 800G to 1.6T initially increases demand for 200G-per-lane DSP, driver, TIA, laser and detector technologies. The next transition toward 3.2T introduces 400G-per-lane signaling and tighter requirements around analog bandwidth, modulation efficiency, photodiode performance and packaging parasitics. Marvell announced 2nm 400G-per-lane optical demonstrations in September 2026. Coherent and Lumentum demonstrated 400G-class EML and photodiode technologies during 2026. Each speed transition therefore creates a semiconductor replacement cycle across the optical signal chain.
• CPO and optical I/O address power and reach constraints near high-radix switches and accelerators. Moving optical engines closer to switch or compute silicon shortens power-hungry electrical links and can increase front-panel bandwidth density. GlobalFoundries introduced its SCALE CPO platform in May 2026. Broadcom demonstrated 102.4T Ethernet switching with co-packaged optics. Intel continues to develop optical compute interconnect chiplets that combine silicon photonics with complementary metal-oxide-semiconductor electronics. These approaches expand the semiconductor opportunity from discrete transceiver components toward package-level optical engines and chiplets.
• Foundry and packaging investment is reducing barriers to photonic integration. Optical interconnects require repeatable manufacturing across photonics wafers, electronic integrated circuits, laser attach, fiber coupling and advanced packaging. GlobalFoundries is investing in silicon photonics, novel optical materials and three-dimensional hybrid bonding under its 2026 CHIPS research and development program. Marvell, Broadcom, Intel and other suppliers are also integrating photonics with increasingly advanced electronic process nodes. Better process design kits, wafer-scale testing and packaging automation reduce the risk of scaling optical technologies from demonstration into volume production.

Market Restraints

• The largest constraints are packaging cost, thermal management, laser reliability and manufacturing yield. Optical engines require precise fiber alignment and low-loss coupling. Co-packaged architectures can complicate field replacement because optical components sit closer to high-value switch or compute silicon. External laser sources improve serviceability in some CPO designs but introduce additional fiber routing and redundancy requirements. Technology fragmentation also remains significant. Silicon photonics, indium phosphide EMLs, VCSELs and emerging modulation platforms can each be optimal for different distances and power envelopes. Standards for optical compute interconnects and package-level optical I/O are still maturing. Hyperscalers and semiconductor vendors may use proprietary architectures before a broad interoperable merchant ecosystem develops.

Technology and Segment Insights

• Optical DSP and associated high-speed analog interface integrated circuits represent the largest commercial semiconductor pool in 2026. Virtually every high-volume 800G and 1.6T pluggable architecture requires sophisticated signal processing, forward error correction and analog front-end functionality. Marvell and Broadcom have established large optical DSP portfolios. Other suppliers participate in drivers, TIAs and related connectivity silicon. Demand rises with both port count and lane speed. Linear pluggable and direct-drive architectures seek to reduce DSP power in selected short-reach deployments.
• Optical I/O chiplets and co-packaged optical engines are expected to grow fastest through 2032 from a much smaller base. Their value proposition improves as electrical SerDes power and reach become more problematic at 200G- and 400G-per-lane host interfaces. Adoption will initially concentrate in high-radix AI switching and large accelerator fabrics where power savings and bandwidth density justify more complex packaging. Silicon photonics is a central integration platform for these products. Indium phosphide and other compound-semiconductor light sources remain important to the complete optical engine.
• Optical DSPs and analog front ends perform signal conditioning, forward error correction, modulation and receive recovery. Their growth direction is strong. Primary use is 800G, 1.6T and emerging 3.2T pluggables. Silicon photonics photonic integrated circuits perform integrated modulation, multiplexing and photodetection. Their growth direction is very strong. Primary use is pluggables, co-packaged optics, near-packaged optics and optical I/O. Indium phosphide lasers and electro-absorption modulated lasers provide high-power light sources and high-speed modulation. Their growth direction is very strong. Primary use is 1.6T and 3.2T modules, external lasers and coherent links. Gallium arsenide VCSEL arrays provide parallel short-reach optical transmission. Their growth direction is strong. Primary use is scale-up and multimode high-density links. Photodiodes, drivers and transimpedance amplifiers perform transmit and receive analog conversion. Their growth direction is strong. Primary use is all major optical-link architectures. Optical I/O and co-packaged optics semiconductor engines provide package-level optical connectivity. Their growth direction is fastest. Primary use is AI scale-up, switch fabrics and future compute I/O.
• The market is segmented by semiconductor function, material platform, interconnect architecture, link speed, application and geography. Semiconductor functions include optical digital signal processors, silicon photonics photonic integrated circuits, lasers and electro-absorption modulated lasers, VCSELs and parallel optical emitters, photodiodes, drivers and transimpedance amplifiers, and optical I/O chiplets and co-packaged optics optical engines. Material platforms include silicon and silicon-on-insulator, indium phosphide, gallium arsenide, silicon germanium and complementary analog platforms, and hybrid and heterogeneous photonic integration. Interconnect architectures include pluggable optics, linear pluggable optics, near-packaged optics, co-packaged optics, and optical compute I/O and chiplet interconnect. Link speeds include 400G and below, 800G, 1.6T, and 3.2T and above. Applications include AI scale-up networks, AI scale-out and Ethernet fabrics, data center interconnect, telecom and carrier networks, and high-performance computing and specialized systems.
• Optical DSPs remain the largest near-term semiconductor revenue pool in high-speed pluggable interconnects. Silicon photonics gains strategic importance as bandwidth density and optical integration move closer to compute. Indium phosphide lasers and EMLs remain essential where high optical power and 200G-to-400G-per-lane performance are required. Optical input and output chiplets and co-packaged optics engines emerge fastest from a small commercial base. AI scale-up and scale-out networks are shifting optical design priorities toward lower power per bit and higher density.

Competitive and Strategic Outlook

• Competition spans digital connectivity silicon, silicon photonics, compound-semiconductor devices and integrated optical engines. Broadcom and Marvell compete across optical DSPs, high-speed SerDes, switch connectivity and increasingly co-packaged optics. Marvell also combines optical DSPs with silicon photonics and advanced coherent technologies. Its 2026 Polariton acquisition adds plasmonic modulation expertise. Intel differentiates through a vertically integrated silicon-photonics platform with on-chip lasers and optical compute interconnect development. GlobalFoundries participates as a foundry and platform provider rather than as a merchant transceiver supplier. Manufacturing scale and packaging capability are central to its position.
• Coherent and Lumentum compete across indium phosphide lasers, EMLs, photodiodes, VCSELs and optical subassemblies. This gives them strong positions where compound-semiconductor performance is difficult to replace with silicon-only implementations. Cisco and Acacia remain important in coherent optics and DSP architectures. Specialized companies such as Ayar Labs, Lightmatter and Ranovus focus on optical I/O and package-level photonic connectivity. MACOM and Semtech participate in high-speed analog optical components. Competitive advantage increasingly depends on power per bit, 200G and 400G lane performance, optical coupling loss, packaging yield, laser reliability and the ability to integrate photonics with leading-edge electronic silicon.
• North America is the largest design and premium-demand region for optical interconnect semiconductors. The United States combines hyperscale cloud infrastructure, AI accelerator development, high-radix Ethernet switching and a concentrated photonics semiconductor ecosystem. Broadcom and Marvell supply optical DSP, switching and connectivity silicon used across AI networks. Intel develops silicon-photonics and optical-compute-interconnect technologies. Coherent and Lumentum provide compound-semiconductor lasers, modulators, photodiodes and other optical components from large U.S.-based development platforms. Cisco contributes through Acacia coherent and pluggable optics. A group of specialized companies including Ayar Labs, Lightmatter and Ranovus are developing optical I/O and integrated photonic architectures.
• Public investment is reinforcing the region's position in silicon photonics manufacturing. In July 2026, GlobalFoundries signed a letter of intent with the U.S. Department of Commerce for an expected USD 300 million CHIPS research and development award focused on next-generation silicon photonics, advanced optical materials and packaging. The program targets technologies that support near-packaged and co-packaged optics deployment. This matters commercially because photonics scaling depends on more than transistor design. Foundry process control, optical-device uniformity, hybrid bonding, fiber attach and wafer-level test must all improve before highly integrated optical engines can reach large AI volumes.
• Demand is also unusually concentrated in North America because hyperscalers and AI infrastructure operators are among the earliest adopters of 1.6T optics, 102.4T switching and scale-up fabrics. Their requirements influence semiconductor roadmaps globally, particularly power per bit, fiber density, link reach and repairability. As a result, North American customers often participate directly in optical architecture definition even when wafer fabrication, package assembly or module manufacturing occurs in Asia.
• Asia Pacific remains essential to manufacturing through Taiwan, China, Japan, South Korea and Southeast Asia. The region provides advanced semiconductor fabrication, outsourced assembly and test, optical-module production and high-volume electronics manufacturing. Europe contributes through photonics research, indium phosphide and specialty semiconductor capabilities, networking technology and automotive and industrial optical applications. The highest near-term AI-driven semiconductor design value remains concentrated in the North American ecosystem.
• Recent developments confirm accelerating market activity. In September 2026, Marvell announced industry-first 2nm optical demonstrations including 400G-per-lane PAM4, 800G ZR and ZR+, and 1.6T coherent-lite technologies. In September 2026, Coherent demonstrated a 3.2T-class pluggable architecture, 6.4T near-packaged optical engine and VCSEL-based scale-up technologies at ECOC 2026. In July 2026, GlobalFoundries signed a letter of intent for an expected USD 300 million U.S. CHIPS research and development award for silicon photonics, optical materials and advanced packaging. In May 2026, GlobalFoundries introduced the SCALE co-packaged optical-module solution supporting Optical Compute Interconnect Multi-Source Agreement requirements. In April 2026, Marvell acquired Polariton Technologies to add high-speed, low-power plasmonics-based modulation to its optical roadmap. In March 2026, Broadcom showcased a 102.4T Ethernet switch with co-packaged optics and 400G-per-lane optical DSP technology at OFC 2026.

Conclusion

• The optical interconnect semiconductor market is growing rapidly as AI fabrics push bandwidth density beyond the limits of electrical links. Growth is driven by AI scale-up and scale-out networks, the 1.6T-to-3.2T transition, power constraints in high-speed electrical links, and foundry and photonic packaging scale-up. Optical DSPs remain the largest near-term revenue pool. Silicon photonics and indium phosphide lasers and EMLs are strategically important. Optical I/O chiplets and co-packaged optics engines are the fastest-growing segment from a small base. Packaging cost, laser reliability, serviceability and standards fragmentation remain the key restraints. North America leads design and premium demand. Asia Pacific remains essential to manufacturing. The market is projected to grow from USD 8.40 billion in 2026 to USD 22.70 billion by 2032 at a CAGR of 18.0%.

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TABLE OF CONTENTS

1. Executive Summary

• 1.1. Market Opportunity and Key Findings
• 1.2. Optical Interconnect Semiconductor Outlook
• 1.3. Principal Technology and Revenue Pools

2. Market Overview

• 2.1. Optical Interconnect Semiconductor Architecture
• 2.2. Electrical-to-Optical Signal Chain
• 2.3. Pluggable, Near-Packaged and Co-Packaged Optics
• 2.4. Optical Input/Output and Compute Interconnect
• 2.5. Semiconductor Packaging and Fiber-Coupling Requirements

3. Market Size and Forecast, 2026-2032

• 3.1. Global Market Revenue
• 3.2. Annual Growth Analysis
• 3.3. Semiconductor Content per Optical Link

4. Market by Semiconductor Function

• 4.1. Optical Digital Signal Processors
• 4.2. Silicon Photonics Photonic Integrated Circuits
• 4.3. Lasers and Electro-Absorption Modulated Lasers
• 4.4. VCSELs and Parallel Optical Emitters
• 4.5. Photodiodes, Drivers and Transimpedance Amplifiers
• 4.6. Optical I/O Chiplets and CPO Optical Engines

5. Market by Material Platform

• 5.1. Silicon and Silicon-on-Insulator
• 5.2. Indium Phosphide
• 5.3. Gallium Arsenide
• 5.4. Silicon Germanium and Complementary Analog Platforms
• 5.5. Hybrid and Heterogeneous Photonic Integration

6. Market by Interconnect Architecture

• 6.1. Pluggable Optics
• 6.2. Linear Pluggable Optics
• 6.3. Near-Packaged Optics
• 6.4. Co-Packaged Optics
• 6.5. Optical Compute I/O and Chiplet Interconnect

7. Market by Link Speed

• 7.1. 400G and Below
• 7.2. 800G
• 7.3. 1.6T
• 7.4. 3.2T and Above

8. Market by Application

• 8.1. AI Scale-Up Networks
• 8.2. AI Scale-Out and Ethernet Fabrics
• 8.3. Data Center Interconnect
• 8.4. Telecom and Carrier Networks
• 8.5. High-Performance Computing and Specialized Systems

9. Regional Market

• 9.1. North America
  • 9.1.1. United States
  • 9.1.2. Canada
• 9.2. Asia Pacific
  • 9.2.1. Taiwan
  • 9.2.2. China
  • 9.2.3. Japan
  • 9.2.4. South Korea
  • 9.2.5. Southeast Asia
• 9.3. Europe
• 9.4. Rest of World

10. Market Dynamics

• 10.1. Drivers
  • 10.1.1. AI Fabric Bandwidth Density
  • 10.1.2. 1.6T-to-3.2T Optical Transition
  • 10.1.3. Power Constraints in High-Speed Electrical Links
  • 10.1.4. Foundry and Photonic Packaging Scale-Up
• 10.2. Restraints
  • 10.2.1. Optical Packaging and Fiber-Attach Cost
  • 10.2.2. Laser Reliability and Thermal Management
  • 10.2.3. CPO Serviceability and Repairability
  • 10.2.4. Architecture and Standards Fragmentation

11. Competitive Landscape

• 11.1. Market Structure and Competitive Intensity
• 11.2. Optical DSP and Connectivity Silicon Positioning
• 11.3. Silicon Photonics and Foundry Strategies
• 11.4. InP, VCSEL and Laser Platform Strategies
• 11.5. CPO and Optical I/O Ecosystem Partnerships

12. Company Profiles

• 12.1. Broadcom
• 12.2. Marvell Technology
• 12.3. Intel
• 12.4. GlobalFoundries
• 12.5. Coherent
• 12.6. Lumentum
• 12.7. Cisco / Acacia
• 12.8. MACOM Technology Solutions
• 12.9. Semtech
• 12.10. Taiwan Semiconductor Manufacturing Company
• 12.11. Ayar Labs
• 12.12. Lightmatter
• 12.13. Ranovus
• 12.14. POET Technologies
• 12.15. NVIDIA

13. Recent Developments

14. Appendix