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1918042

半導體乾式剝離設備市場 - 2026-2031 年預測

Semiconductor Dry Strip Equipment Market - Forecast from 2026 to 2031
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 140 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計半導體乾帶設備市場將從 2025 年的 2.8337 億美元成長到 2031 年的 3.64336 億美元，複合年成長率為 4.28%。

半導體乾式剝離系統利用等離子體製程去除關鍵的光阻劑和蝕刻後殘留物，從而保護那些不再適用濕式化學製程的精密前端（FEOL）和後段製程（BEOL）結構。隨著裝置尺寸的不斷縮小、新型通道材料的湧現以及3D結構的日益普及，這些工具變得至關重要。其需求主要來自邏輯晶片代工廠、記憶體製造商及功率元件製造商，他們需要處理7nm及以下節點的晶圓，以及寬能能隙化合物半導體的快速規模化生產。

主要成長要素

1. 全球半導體晶圓廠產能快速成長：邏輯晶片、DRAM、3D NAND快閃記憶體和代工服務的持續大規模生產擴張直接轉化為晶圓產量的增加，以及每片晶圓乾法剝離製程步驟的增加。同時，5G基礎設施、邊緣人工智慧、汽車電子和高效能運算的並行發展，也持續推動前端製程向剝離室集中化。

2. 裝置的複雜性和尺寸不斷縮小。環柵奈米片（GAA）、CFET架構、背面供電和先進封裝技術顯著增加了剝離循環次數，同時也對原子級選擇性提出了更高的要求。乾式剝離設備必須能夠無損去除聚合物，並保持表面無殘留，同時不得劣化高介電常數材料、低介電常數材料和新型通道半導體材料造成性能劣化。

目錄

第1章執行摘要

第2章市場概述

  • 市場概覽
  • 市場定義
  • 分析範圍
  • 市場區隔

第3章 商業情境

  • 市場促進因素
  • 市場限制
  • 市場機遇
  • 波特五力分析
  • 產業價值鏈分析
  • 政策和法規
  • 策略建議

第4章 技術展望

5. 以半導體類型分類的半導體乾式剝線設備市場

  • 介紹
  • 元素半導體
  • 化合物半導體

6. 按技術分類的半導體乾剝離設備市場

  • 介紹
  • 等離子條
  • 氣相反應

7. 半導體乾式剝線設備市場（依應用領域分類）

  • 介紹
  • 功率半導體
  • MEMS
  • CMOS影像感測器
  • 其他

8. 半導體乾式剝線設備市場（依地區分類）

  • 介紹
  • 美洲
    • 美國
  • 歐洲、中東和非洲
    • 德國
    • 法國
    • 英國
    • 其他
  • 亞太地區
    • 中國
    • 日本
    • 韓國
    • 台灣
    • 其他

第9章 競爭格局與分析

  • 主要企業和策略分析
  • 市佔率分析
  • 企業合併、協議、商業合作
  • 競爭對手儀錶板

第10章：公司簡介

  • Applied Materials Inc.
  • Axcelis Technologies Inc.
  • PSK Holdings Inc.
  • Lam Research Corporation
  • Mattson Technology Inc.
  • Tokyo Electron Limited
  • Grand Process Technology Co., Ltd.
  • Samco Inc.
  • ULVAC Inc.

第11章附錄

  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要收益
  • 分析方法
  • 簡稱
簡介目錄
Product Code: KSI061617045

Semiconductor Dry Strip Equipment Market is expected to grow at a 4.28% CAGR, achieving USD 364.336 million in 2031 from USD 283.370 million in 2025.

emiconductor dry strip systems perform critical photoresist and post-etch residue removal through plasma-based processes, preserving delicate front-end-of-line (FEOL) and back-end-of-line (BEOL) structures where wet chemistry is no longer viable. These tools have become indispensable as device geometries shrink, new channel materials emerge, and 3D architectures proliferate. Primary demand originates from logic foundries, memory manufacturers, and power-device fabricators processing wafers at <=7 nm nodes and below, alongside the rapid scale-up of wide-bandgap compound semiconductors.

Core Growth Drivers

1. Surging global semiconductor fab capacity Sustained volume expansion across logic, DRAM, 3D NAND, and foundry services directly correlates with higher wafer starts and increased dry-strip processing steps per wafer. The parallel ramp of 5G infrastructure, edge AI, automotive electronics, and high-performance computing continues to drive front-end loading of strip chambers.

2. Relentless device complexity and miniaturization Gate-all-around (GAA) nanosheets, CFET architectures, backside power delivery, and advanced packaging schemes dramatically increase the number of strip cycles while imposing atomic-level selectivity requirements. Dry strip tools must deliver damage-free polymer removal and residue-free surfaces without degrading high-k dielectrics, low-k materials, or novel channel semiconductors.

Fastest-Growing Segments

The compound semiconductor segment is the most dynamic portion of the dry strip equipment market:

  • Gallium Nitride (GaN): Accelerated adoption in RF front-end modules, fast chargers, and electric-vehicle traction inverters requires dedicated strip recipes that prevent surface pitting and gallium re-deposition. Specialized downstream plasma systems optimized for GaN-on-Si, GaN-on-SiC, and GaN-on-sapphire are seeing the strongest unit growth.
  • Silicon Carbide (SiC): The shift to 150 mm and 200 mm SiC platforms for 800 V+ EV powertrains and renewable-energy inverters demands robust high-temperature implant strip and post-etch cleaning processes that maintain basal plane integrity and minimize micro-pipe propagation.

Regional Dynamics

Asia-Pacific maintains overwhelming dominance, accounting for the majority of installed base and new tool shipments. Taiwan, South Korea, and Japan benefit from massive logic, memory, and power-device investments, reinforced by aggressive national semiconductor initiatives:

  • South Korea's Semiconductor Industry Promotion Plan
  • Japan's Rebirth of Japan's Electronics Industry strategy
  • Taiwan's continuing foundry and memory megafab expansions

These programs channel subsidies, tax incentives, and R&D funding directly into advanced-node and compound-semiconductor capacity, ensuring sustained pull-through demand for next-generation dry strip platforms.

North America retains a strategic position through design leadership and early adoption of advanced packaging and GAA technologies at Intel, AMD, and Qualcomm, but lags in raw manufacturing footprint.

Key Equipment Platforms

  • Lam Research GAMMA(R) family: Remains the volume leader for logic and memory with differentiated downstream microwave plasma technology offering high throughput, residue-free performance, and minimal device impact at advanced nodes.
  • Kao CLEANTHROUGH A-06 & A-19: Specialty chemical dry-film strippers targeting back-end photoresist removal with emphasis on speed (A-06) and amine-free environmental compliance (A-19).

Market Constraints

High system cost, extreme selectivity challenges with new materials (e.g., ruthenium, molybdenum, EUV resists), and the intrinsic cyclicality of semiconductor capex continue to moderate growth velocity despite strong underlying wafer-fab-equipment (WFE) intensity trends.

The confluence of logic/memory node scaling and the structural rise of GaN and SiC devices nevertheless positions semiconductor dry strip equipment for sustained mid-to-high single-digit annual growth, with compound-semiconductor-specific systems exhibiting the highest incremental demand through the remainder of the decade.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2021 to 2025 & forecast data from 2026 to 2031
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information), and Key Developments among others.

Semiconductor Dry Strip Equipment Market Segmentation:

  • By Semiconductor Type
  • Element Semiconductor
  • Compound Semiconductor
  • By Technology
  • Plasma Strip
  • Gas-Phased Reaction
  • By Application
  • Power Semiconductors
  • MEMS
  • CMOS Image Sensors
  • Others
  • By Geography
  • Americas
  • USA
  • Europe Middle East and Africa
  • Germany
  • France
  • United Kingdom
  • Others
  • Asia Pacific
  • China
  • Japan
  • South Korea
  • Taiwan
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study
  • 2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. SEMICONDUCTOR DRY STRIP EQUIPMENT MARKET BY SEMICONDUCTOR TYPE

  • 5.1. Introduction
  • 5.2. Element Semiconductor
  • 5.3. Compound Semiconductor

6. SEMICONDUCTOR DRY STRIP EQUIPMENT MARKET BY TECHNOLOGY

  • 6.1. Introduction
  • 6.2. Plasma Strip
  • 6.3. Gas-Phased Reaction

7. SEMICONDUCTOR DRY STRIP EQUIPMENT MARKET BY APPLICATION

  • 7.1. Introduction
  • 7.2. Power Semiconductors
  • 7.3. MEMS
  • 7.4. CMOS Image Sensors
  • 7.5. Others

8. SEMICONDUCTOR DRY STRIP EQUIPMENT MARKET BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. Americas
    • 8.2.1. USA
  • 8.3. Europe Middle East and Africa
    • 8.3.1. Germany
    • 8.3.2. France
    • 8.3.3. United Kingdom
    • 8.3.4. Others
  • 8.4. Asia Pacific
    • 8.4.1. China
    • 8.4.2. Japan
    • 8.4.3. South Korea
    • 8.4.4. Taiwan
    • 8.4.5. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. Applied Materials Inc.
  • 10.2. Axcelis Technologies Inc.
  • 10.3. PSK Holdings Inc.
  • 10.4. Lam Research Corporation
  • 10.5. Mattson Technology Inc.
  • 10.6. Tokyo Electron Limited
  • 10.7. Grand Process Technology Co., Ltd.
  • 10.8. Samco Inc.
  • 10.9. ULVAC Inc.

11. APPENDIX

  • 11.1. Currency
  • 11.2. Assumptions
  • 11.3. Base and Forecast Years Timeline
  • 11.4. Key Benefits for the Stakeholders
  • 11.5. Research Methodology
  • 11.6. Abbreviations

LIST OF TABLE