自動晶圓貼片機市場－2025-2030年預測

預計到 2025 年，自動晶圓貼片機市場規模將達到 14.73 億美元，到 2030 年將達到 23.89 億美元，複合年成長率為 10.15%。

自動晶圓貼片機市場分析

自動貼片機是一種專用貼片設備，旨在自動固定晶圓，同時確保在用於3D積體電路和晶圓層次電子構裝技術的薄晶片晶圓製造過程中安全運作。這些先進的系統滿足了先進半導體製造工作流程中對精度和安全性的關鍵要求。消費性電子產品產量的不斷成長以及先進電子控制設備和半導體裝置在工業和消費領域的快速普及，推動了自動貼片機市場的成長。

工業4.0的成長軌跡顯著提高了採用自動化晶圓製造技術生產的尖端半導體元件的普及率，同時也推動了自動化晶圓貼裝設備市場在預測期內的擴張。製造自動化、數位轉型和先進半導體需求的融合，為支援下一代元件的生產，持續催生了精密晶圓貼裝解決方案的需求。

主要市場特徵

隨著製造商努力提高產能和產量比率，半導體產業對速度更快、精度更高的晶圓貼片設備的需求日益成長。物聯網 (IoT) 的興起推動了電子製造領域對先進晶圓貼片技術的需求，因為物聯網設備需要使用精密設備來製造複雜的半導體元件。亞太地區憑藉其生產成本優勢和半導體製造設施的集中度，正崛起為關鍵市場。各公司正在創新自動化貼片設備，以支援小型化趨勢和 3D 積體電路技術，從而實現更複雜、更高效能的半導體裝置。

主要市場促進因素

半導體產業的成長

對速度更快、功能更強大、價格更實惠的電子設備的需求日益成長，迫使元件製造商不斷升級產品，從而增加了對自動化晶圓貼片設備的需求。晶圓貼片是半導體製造過程中晶粒準備階段的關鍵步驟。隨著半導體小型化趨勢的持續發展，對貼片和處理能力的要求也越來越高，相應的需求也不斷成長。

根據世界半導體貿易統計（WSTS）的數據，2021年5月全球半導體產業銷售額預計達到436億美元，高於2021年4月的419億美元。該統計機構預測，2022年至2023年全球半導體市場將以5.1%的年複合成長率成長，達到6,800億美元，顯示該產業正穩定擴張。隨著半導體銷售額和市場規模的擴大，對晶圓貼片機的需求也將相應成長，從而在整個預測期內推動自動化晶圓貼片機市場的成長。

半導體產業的持續成長反映了數位轉型、人工智慧應用、汽車電氣化以及5G網路建置等根本需求促進因素。所有這些應用都需要大量的半導體元件，從而持續推動對製造設備的需求，其中包括對先進封裝和3D整合技術至關重要的自動化晶圓貼片系統。

物聯網（IoT）的興起

半導體裝置製造商正優先發展自動化晶圓組裝設備，以滿足新興應用（包括物聯網 (IoT) 的部署）對晶片日益成長的需求。物聯網的發展需要感測器、微控制器和其他元件來獲取即時數據並執行邊緣運算功能，因此對矽晶圓和積體電路的需求不斷成長。

預計對智慧城市計劃的投資增加將提振物聯網需求，並顯著促進自動化晶圓貼片機市場的成長。印度政府承諾投資10億美元建設100座智慧城市，這有望成為全部區域物聯網普及的關鍵因素。 2021年7月，沙烏地阿拉伯啟動了四座大型智慧城市的開發案：NEOM、吉迪亞、紅海計劃和阿瑪拉。每個計劃都獲得了價值數十億美元的建設合約支援。其中，NEOM是規模最大的開發計劃，是一個耗資5000億美元的特大城市項目，旨在打造一個零碳排放、高度互聯的大都市。

政府對關鍵領域物聯網應用的支持，加上網路普及率的不斷提高，正在促進物聯網的普及，並推動自動化晶圓貼片機市場的成長。這些政府措施正在創造有利的政策環境，支持技術基礎設施投資和半導體製造能力的擴張。

區域市場動態

預計亞太地區將在預測期內引領自動化晶圓貼片機市場。推動亞太地區市場成長的主要因素是低成本生產和電子產業生產設施的增加。根據中華人民共和國國務院報告顯示，2022年1-2月，主要電子設備製造商的增加價值額年增12.7%，而同期整個工業部門的增幅僅為7.5%。

亞太地區繼續主導該市場，這主要得益於該地區半導體製造業的快速成長。根據印度新聞資訊局 (PIB) 2022 年 2 月發布的報告，2020 年印度半導體市場規模為 150 億美元，預計到 2026 年將達到約 630 億美元。這一顯著的成長勢頭表明該地區半導體製造能力正在擴張，並伴隨著對相關設備需求的成長。

預計半導體和電子產業的這些發展將推動全部區域自動化晶圓貼片機市場在預測期內成長，鞏固該地區作為全球半導體製造和設備消費中心的地位。

本報告的主要優勢：

• 深入分析：提供對主要和新興地區的深入市場洞察，重點關注客戶群、政府政策和社會經濟因素、消費者偏好、行業垂直領域和其他細分市場。
• 競爭格局：了解全球主要參與者的策略舉措，並了解透過正確的策略進入市場的機會。
• 市場促進因素與未來趨勢：探索推動市場的動態因素和關鍵趨勢，以及它們將如何塑造未來的市場發展。
• 可操作的建議：利用這些見解，在動態環境中製定策略決策，發展新的商業機會和收入來源。
• 受眾廣泛：適用於Start-Ups、研究機構、顧問公司、中小企業和大型企業，且經濟實惠。

公司如何使用我們的報告範例

產業與市場分析、機會評估、產品需求預測、打入市場策略、地理擴張、資本投資決策、法規結構及影響、新產品開發、競爭情報

報告範圍：

• 2022年至2024年的歷史數據和2025年至2030年的預測數據
• 成長機會、挑戰、供應鏈前景、法規結構與趨勢分析
• 競爭定位、策略和市場佔有率分析
• 按業務板塊和地區分類的收入成長和預測評估，包括國家/地區
• 公司概況（策略、產品、財務資訊、關鍵發展等）

目錄

第1章執行摘要

第2章 市場概覽

• 市場概覽
• 市場定義
• 調查範圍
• 市場區隔

第3章 商業情境

• 市場促進因素
• 市場限制
• 市場機遇
• 波特五力分析
• 產業價值鏈分析
• 政策與法規
• 策略建議

第4章 技術展望

第5章 依晶圓尺寸分類的自動晶圓貼片機設備市場

• 介紹
• 150mm
• 200mm
• 300mm
• 其他

第6章：按應用分類的自動晶圓貼片機設備市場

• 介紹
• 切丁
• 保護
• 晶片附著膜

第7章：依地區分類的自動晶圓貼片機設備市場

• 介紹
• 北美洲
  • 美國
  • 加拿大
  • 墨西哥
• 南美洲
  • 巴西
  • 阿根廷
  • 其他
• 歐洲
  • 德國
  • 法國
  • 英國
  • 西班牙
  • 其他
• 中東和非洲
  • 沙烏地阿拉伯
  • 阿拉伯聯合大公國
  • 其他
• 亞太地區
  • 中國
  • 印度
  • 日本
  • 韓國
  • 印尼
  • 泰國
  • 其他

第8章 競爭格局與分析

• 主要企業和策略分析
• 市佔率分析
• 合併、收購、協議和合作
• 競爭對手儀錶板

第9章：公司簡介

• DISCO Corp
• Syagrus Systems
• Longhill Industries
• Lintec Corporation
• Nitto Denko
• Hibex Singapore Pte Ltd
• Takatori
• Semiconductor Equipment Corp
• QES Group Berhad
• UVFAB Systems, Inc

第10章附錄

• 貨幣
• 先決條件
• 基準年和預測年時間表
• 相關人員的主要收益
• 調查方法
• 簡稱

The automatic mounter wafer equipment market, growing at a 10.15% CAGR, is expected to grow to USD 2.389 billion in 2030 from USD 1.473 billion in 2025.

Automatic Mounter Wafer Equipment Market Analysis

Automatic mounter wafer equipment represents specialized mounting devices designed to automatically secure wafers while guaranteeing safe operation during thin die wafer fabrication processes utilized in 3D integrated circuit and wafer-level packaging technologies. These sophisticated systems address critical requirements for precision and safety in advanced semiconductor manufacturing workflows. Market growth for automatic mounter wafer equipment is being driven by expanding consumer electronics production and the rapid proliferation of sophisticated electronic controls and semiconductor devices across industrial and consumer applications.

The adoption of cutting-edge semiconductor devices created through automatic mounter wafer fabrication has increased significantly due to Industry 4.0 growth trajectories, simultaneously boosting automatic mounter wafer equipment market expansion during the forecasted period. This convergence of manufacturing automation, digital transformation, and advanced semiconductor requirements creates sustained demand for precision wafer mounting solutions supporting next-generation device production.

Key Market Highlights

The semiconductor industry is driving demand for faster and more precise wafer mounting equipment as manufacturers pursue enhanced throughput and yield performance. Internet of Things adoption is increasing demand for advanced wafer mounting capabilities in electronics manufacturing, as IoT devices require sophisticated semiconductor components manufactured with precision equipment. The Asia-Pacific region is expanding as a key market due to production cost advantages and concentration of semiconductor manufacturing facilities. Companies are innovating automatic mounter equipment supporting miniaturization trends and 3D integrated circuit technologies, enabling more complex and capable semiconductor devices.

Primary Market Drivers

Rising Semiconductor Industry

Demand for faster, better, and more affordable electronic devices compels component manufacturers to upgrade their products constantly, increasing demand for automatic mounter wafer equipment. The wafer mounting procedure is executed as part of semiconductor fabrication during die preparation phases, representing a critical process step. An increasing tendency toward miniaturization in semiconductors creates corresponding demand growth, as smaller device geometries require more precise mounting and handling capabilities.

According to World Semiconductor Trade Statistics, global semiconductor sector sales were estimated to have reached $43.6 billion in May 2021, increasing from $41.9 billion in April 2021. The same source projected the global semiconductor market would grow by 5.1% from 2022 to reach $680 billion in 2023, demonstrating robust industry expansion. As semiconductor sales and market size grow, demand for fabrication utilizing mounter wafer equipment increases correspondingly, boosting automatic mounter wafer equipment market growth throughout the forecast period.

The semiconductor industry's sustained growth reflects fundamental demand drivers including digital transformation, artificial intelligence deployment, automotive electrification, and 5G network buildout. Each of these application areas requires substantial semiconductor content, creating sustained fabrication equipment demand including automatic mounter wafer systems essential for advanced packaging and 3D integration technologies.

Internet of Things Adoption

Semiconductor device manufacturers prefer automatic wafer mounting equipment to address increasing chip demand in emerging applications including Internet of Things deployments. IoT development has generated rising demand for silicon wafers and integrated circuits due to requirements for sensors, microcontrollers, and other components enabling IoT applications to retrieve real-time data and execute edge computing functions.

Rising investment in smart city projects is increasing IoT demand, which will boost automatic mounter wafer equipment market growth significantly. The Indian government committed $1 billion to construct 100 smart cities, anticipated to be crucial factors in IoT proliferation throughout the region. In July 2021, Saudi Arabia initiated development of four major smart cities: NEOM, Qiddiya, the Red Sea Project, and Amaala, each supported by multibillion-dollar construction contracts. The largest development, NEOM, represents a planned $500 billion megacity incorporating a zero-carbon hyper-connected metropolis.

Government support for IoT proliferation in key sectors, combined with mass internet adoption, is driving IoT deployment, thereby increasing automatic mounter wafer equipment market growth. This governmental commitment creates favorable policy environments supporting technology infrastructure investment and semiconductor manufacturing capacity expansion.

Regional Market Dynamics

During the forecast period, the Asia-Pacific region is expected to dominate the automatic mounter wafer equipment market. Two primary factors propelling market growth in Asia-Pacific are low production costs and rising numbers of production facilities in the electronics industry. The State Council of the People's Republic of China reported that in January-February 2022, the added value of the country's main electronics manufacturers increased by 12.7% year over year, contrasting with 7.5% growth experienced by the entire industrial sector.

The Asia-Pacific region will continue dominating this market primarily due to its flourishing semiconductor manufacturing sector. According to PIB reports from February 2022, the Indian semiconductors market was valued at $15 billion in 2020, with projections reaching approximately $63 billion by 2026. This substantial growth trajectory demonstrates the region's expanding semiconductor manufacturing capabilities and corresponding equipment requirements.

These developments in semiconductors and electronics industries will boost automatic mounter wafer equipment market growth throughout the Asia Pacific region during the forecasted period, solidifying its position as the global epicenter for semiconductor manufacturing and equipment consumption.

Key Benefits of this Report:

• Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
• Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
• Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
• Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
• Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

• Historical data from 2022 to 2024 & forecast data from 2025 to 2030
• Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
• Competitive Positioning, Strategies, and Market Share Analysis
• Revenue Growth and Forecast Assessment of segments and regions including countries
• Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Automatic Mounter Wafer Equipment Market Segmentation:

• AUTOMATIC MOUNTER WAFER EQUIPMENT MARKET BY WAFER SIZE
• 150mm
• 200mm
• 300mm
• Others
• AUTOMATIC MOUNTER WAFER EQUIPMENT MARKET BY APPLICATION
• Dicing
• Protection
• Die Attach Films
• AUTOMATIC MOUNTER WAFER EQUIPMENT MARKET BY GEOGRAPHY
• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• Germany
• France
• United Kingdom
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Others
• Asia Pacific
• China
• India
• Japan
• South Korea
• Indonesia
• Thailand
• Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

• 2.1. Market Overview
• 2.2. Market Definition
• 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

• 3.1. Market Drivers
• 3.2. Market Restraints
• 3.3. Market Opportunities
• 3.4. Porter's Five Forces Analysis
• 3.5. Industry Value Chain Analysis
• 3.6. Policies and Regulations
• 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. AUTOMATIC MOUNTER WAFER EQUIPMENT MARKET BY WAFER SIZE

• 5.1. Introduction
• 5.2. 150mm
• 5.3. 200mm
• 5.4. 300mm
• 5.5. Others

6. AUTOMATIC MOUNTER WAFER EQUIPMENT MARKET BY APPLICATION

• 6.1. Introduction
• 6.2. Dicing
• 6.3. Protection
• 6.4. Die Attach Films

7. AUTOMATIC MOUNTER WAFER EQUIPMENT MARKET BY GEOGRAPHY

• 7.1. Introduction
• 7.2. North America
  • 7.2.1. USA
  • 7.2.2. Canada
  • 7.2.3. Mexico
• 7.3. South America
  • 7.3.1. Brazil
  • 7.3.2. Argentina
  • 7.3.3. Others
• 7.4. Europe
  • 7.4.1. Germany
  • 7.4.2. France
  • 7.4.3. United Kingdom
  • 7.4.4. Spain
  • 7.4.5. Others
• 7.5. Middle East and Africa
  • 7.5.1. Saudi Arabia
  • 7.5.2. UAE
  • 7.5.3. Others
• 7.6. Asia Pacific
  • 7.6.1. China
  • 7.6.2. India
  • 7.6.3. Japan
  • 7.6.4. South Korea
  • 7.6.5. Indonesia
  • 7.6.6. Thailand
  • 7.6.7. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 8.1. Major Players and Strategy Analysis
• 8.2. Market Share Analysis
• 8.3. Mergers, Acquisitions, Agreements, and Collaborations
• 8.4. Competitive Dashboard

9. COMPANY PROFILES

• 9.1. DISCO Corp
• 9.2. Syagrus Systems
• 9.3. Longhill Industries
• 9.4. Lintec Corporation
• 9.5. Nitto Denko
• 9.6. Hibex Singapore Pte Ltd
• 9.7. Takatori
• 9.8. Semiconductor Equipment Corp
• 9.9. QES Group Berhad
• 9.10. UVFAB Systems, Inc

10. APPENDIX

• 10.1. Currency
• 10.2. Assumptions
• 10.3. Base and Forecast Years Timeline
• 10.4. Key Benefits for the Stakeholders
• 10.5. Research Methodology
• 10.6. Abbreviations