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市場調查報告書
商品編碼
1825381

清涼膏市場:2025-2030 年預測

Cooling Paste Market - Forecasts from 2025 to 2030

出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 145 Pages | 商品交期: 最快1-2個工作天內

價格
簡介目錄

預計冷卻膏市場將從 2025 年的 1,035,467,000 美元成長到 2030 年的 1,290,333,000 美元,複合年成長率為 4.50%。

受電子、汽車和通訊業加速成長的推動,冷卻膏市場預計將大幅擴張,這些行業的各種應用都需要先進的溫度控管解決方案,對確保最佳性能和組件壽命的冷卻膏產品的需求巨大。

電子元件和設備在運作過程中會產生大量熱量,因此需要有效的溫度控管干預措施來維持產品的可靠性和性能標準。消費性電子產品日益複雜,迫使製造商採取措施保護敏感元件,防止熱相關損壞,同時確保足夠的使用者安全。這項技術需求是冷卻膏市場成長的根本驅動力。

市場促進因素

家電需求不斷成長

家電市場的成長是散熱膏需求加速成長的主要驅動力。為了應對日益激烈的競爭和快速的技術發展,家電製造商正擴大採用創新且具有戰略意義的經營模式。隨著企業不斷尋求更優的產品溫度控管解決方案,這些市場動態直接推動了散熱膏市場的成長。

在消費性電子產業,虛擬實境、物聯網 (IoT) 和機器人應用等新興技術正在推動溫度控管產品的需求成長。這些新技術帶來的先進硬體要求需要有效的冷卻解決方案來防止性能下降和組件故障,從而推動了散熱膏市場的擴張。

數位轉型在各行各業的廣泛應用,數位化滲透率高,對家電的供需動態產生了重大影響。這種數位轉型推動了對散熱膏的需求,因為製造商需要有效的溫度控管解決方案,以防止日益複雜的電子產品熱損傷。

發展新興市場

近年來,亞太市場,尤其是印度,電子產業發展迅速。該地區的擴張對經濟發展發揮關鍵作用,促進了GDP成長並創造了大量就業機會。隨著製造商擴大生產規模並採用更先進的溫度控管要求,這些市場電子產業的成長軌跡與散熱膏需求的成長直接相關。

印度政府舉措透過各種數位支付推廣計劃,將國家轉型為無現金經濟,這正在加速電子產品的普及。政府推出的政策,例如數付款管道的推薦獎勵計劃和線上交易激勵措施,正在刺激消費電子產品的需求,並相應地催生了對溫度控管解決方案的需求。

技術創新趨勢

隨著製造商不斷開發更有效率的熱界面材料,散熱膏市場正受益於持續的技術進步。創新工作專注於提高導熱係數、易用性以及在各種工作條件下的長期穩定性。這些技術改進不僅能實現更佳的散熱性能,還能滿足現代電子產品的嚴苛要求。

先進的冷卻膏配方增強了散熱性能,以應對電子製造業日益成長的功率密度和小型化趨勢。這些發展與業界對更緊湊、更有效率的散熱解決方案的需求相契合,以支援高效能電子系統。

政府措施和政策支持

政府正在實施各種舉措,以擴大電子產品的國內生產,為散熱膏市場的成長創造了有利條件。促進電子產品在地化生產和自主生產的政策正在刺激電子和IT產業的投資,從而增加對溫度控管解決方案的需求。

政府推出的支持性政策框架,鼓勵國內製造業發展,促進了電子和IT產業的大規模投資。這些政策舉措為散熱膏市場的擴張創造了有利環境,因為電子製造商需要可靠的溫度控管解決方案來支援其生產營運。

競爭格局

不斷成長的退燒膏需求吸引了眾多新進者,加劇了產業競爭動態。市場參與企業正在實施各種策略方針,包括夥伴關係和開發創新解決方案,以擴大客戶群並提升市場佔有率。 3M、博伊德公司和萊爾德等行業領導者繼續透過技術創新和策略定位引領市場發展,在快速發展的市場中保持競爭優勢。

本報告的主要優點

  • 深刻分析:獲得深入的市場洞察,重點關注客戶細分、政府政策和社會經濟因素、消費者偏好、垂直行業和其他細分市場,涵蓋主要地區和新興地區。
  • 競爭格局:了解世界主要企業所採用的策略策略,並了解採用正確的策略的市場滲透潛力。
  • 市場趨勢和促進因素:探索動態因素和關鍵市場趨勢以及它們將如何影響未來的市場發展。
  • 可行的建議:利用洞察力進行策略決策,並在動態環境中開闢新的業務流和收益。
  • 適合廣泛的使用者:對於新興企業、研究機構、顧問、中小企業和大型企業來說都是有益且具有成本效益的。

它有什麼用途?

產業和市場考量、商業機會評估、產品需求預測、打入市場策略、地理擴張、資本投資決策、法律規範與影響、新產品開發、競爭影響

調查範圍

  • 2022 年至 2024 年的歷史數據和 2025 年至 2030 年的預測數據
  • 成長機會、挑戰、供應鏈前景、法律規範與趨勢分析
  • 競爭定位、策略和市場佔有率分析
  • 收益成長和預測細分市場和區域分析(包括國家)
  • 公司概況(尤其是財務狀況和關鍵發展)。

目錄

第1章執行摘要

第2章市場概述

  • 市場概況
  • 市場定義
  • 調查範圍
  • 市場區隔

第3章 經營狀況

  • 市場促進因素
  • 市場限制
  • 市場機遇
  • 波特五力分析
  • 產業價值鏈分析
  • 政策法規
  • 策略建議

第4章 技術展望

5. 清涼膏市場(按類型)

  • 介紹
  • 膠帶和薄膜
  • 填縫劑
  • 相變材料
  • 油脂和黏合劑
  • 金屬基導熱材料
  • 其他

6. 清涼膏市場(依應用)

  • 介紹
  • 工業機械
  • 醫療設備
  • 汽車電子
  • 通訊設備
  • 個人電腦
  • 其他

7. 清涼膏市場(按地區)

  • 介紹
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他
  • 歐洲
    • 德國
    • 法國
    • 英國
    • 西班牙
    • 其他
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 其他
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 印尼
    • 泰國
    • 其他

第8章競爭格局及分析

  • 主要企業和策略分析
  • 市佔率分析
  • 合併、收購、協議和合作
  • 競爭對手儀表板

第9章:公司簡介

  • Parker Hannifin Corp
  • Henkel AG & Co. KGaA
  • Momentive
  • Laird
  • 3M
  • Boyd Corporation
  • Novagard Solutions
  • Dow Corning Corporation
  • To-Plan
  • Kobayashi Pharmaceutical Co.

第10章 附錄

  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要利益
  • 調查方法
  • 簡稱
簡介目錄
Product Code: KSI061610648

The Cooling Paste Market is expected to grow from USD 1,035.467 million in 2025 to USD 1,290.333 million in 2030, at a CAGR of 4.50%.

The cooling paste market is positioned for significant expansion driven by the accelerating growth across electronics, automotive, and telecommunication industries. These sectors increasingly require sophisticated thermal management solutions for various applications, creating substantial demand for cooling paste products that ensure optimal performance and component longevity.

Electronic components and devices inherently generate considerable heat during operation, necessitating effective thermal management interventions to maintain product reliability and performance standards. The increasing complexity of consumer electronics has compelled manufacturers to implement protective measures for sensitive components, preventing heat damage while ensuring adequate user safety. This technological imperative has become a fundamental driver for cooling paste market growth.

Primary Market Drivers

Consumer Electronics Demand Expansion

The growing consumer electronics market represents the primary catalyst for cooling paste demand acceleration. Manufacturers within this sector are increasingly adopting innovative and strategic business models in response to intensifying competition levels and rapid technological developments. These market dynamics have directly augmented cooling paste market growth as companies seek superior thermal management solutions for their products.

Advanced technologies including virtual reality, Internet of Things (IoT), and robotics applications within the consumer electronics industry have created elevated demand for thermal management products. The sophisticated hardware requirements associated with these emerging technologies necessitate effective cooling solutions to prevent performance degradation and component failure, thereby driving cooling paste market expansion.

The widespread adoption of digital transformation across industries, characterized by high digitalization penetration, has significantly influenced demand and supply dynamics for consumer electronics. This digital shift has correspondingly increased cooling paste demand as manufacturers require effective thermal management solutions to prevent heat damage in increasingly complex electronic products.

Regional Market Development

Asia-Pacific markets, particularly India, have demonstrated rapid growth in electronics industry development over recent years. This regional expansion plays a vital role in economic development by contributing to GDP growth and creating substantial employment opportunities. The electronics sector's growth trajectory in these markets directly translates to increased cooling paste demand as manufacturers scale production and adopt more sophisticated thermal management requirements.

The Indian government's initiative to transform the country into a cashless economy through various digital payment promotion schemes has accelerated electronics adoption. Government policies including referral bonus schemes for digital payment platforms and incentives for online transactions have stimulated consumer electronics demand, creating corresponding requirements for thermal management solutions.

Technology and Innovation Trends

The cooling paste market benefits from continuous technological advancement as manufacturers develop more efficient thermal interface materials. Innovation efforts focus on improving thermal conductivity, application ease, and long-term stability under varying operating conditions. These technological improvements enable better heat dissipation performance while meeting the demanding requirements of modern electronic devices.

Advanced cooling paste formulations incorporate enhanced thermal properties that accommodate the increasing power densities and miniaturization trends in electronics manufacturing. These developments align with industry requirements for more compact yet thermally efficient solutions that support high-performance electronic systems.

Government Initiatives and Policy Support

Various government initiatives have been implemented to scale domestic production of electronic products, creating favorable conditions for cooling paste market growth. Policies promoting local manufacturing and self-reliance in electronics production have stimulated investment in the electronics and information technology sectors, generating increased demand for thermal management solutions.

Significant investments in electronics and IT sectors have been facilitated through supportive government frameworks that encourage domestic manufacturing capabilities. These policy initiatives have created a conducive environment for cooling paste market expansion as electronics manufacturers require reliable thermal management solutions for their production operations.

Competitive Landscape

The increasing demand for cooling paste has attracted numerous new market entrants, intensifying competitive dynamics within the industry. Market participants are implementing various strategic approaches including partnerships and novel solution development to expand their clientele and increase market share. Major industry players including 3M, BOYD Corporation, and Laird continue to lead market development through innovation and strategic positioning, maintaining competitive advantages in this rapidly evolving marketplace.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Cooling Paste Market Segments:

By Type

  • Tapes & Films
  • Gap Fillers
  • Phase Change Materials
  • Greases & Adhesives
  • Metal-Based Thermal Interface Materials
  • Others

By Application

  • Industrial Machinery
  • Medical Devices
  • Automotive Electronics
  • Telecom Devices
  • Personal Computers
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Indonesia
  • Thailand
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study
  • 2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. COOLING PASTE MARKET BY TYPE

  • 5.1. Introduction
  • 5.2. Tapes & Films
  • 5.3. Gap Fillers
  • 5.4. Phase Change Materials
  • 5.5. Greases & Adhesives
  • 5.6. Metal-Based Thermal Interface Materials
  • 5.7. Others

6. COOLING PASTE MARKET BY APPLICATION

  • 6.1. Introduction
  • 6.2. Industrial Machinery
  • 6.3. Medical Devices
  • 6.4. Automotive Electronics
  • 6.5. Telecom Devices
  • 6.6. Personal Computers
  • 6.7. Others

7. COOLING PASTE MARKET BY GEOGRAPHY

  • 7.1. Introduction
  • 7.2. North America
    • 7.2.1. USA
    • 7.2.2. Canada
    • 7.2.3. Mexico
  • 7.3. South America
    • 7.3.1. Brazil
    • 7.3.2. Argentina
    • 7.3.3. Others
  • 7.4. Europe
    • 7.4.1. Germany
    • 7.4.2. France
    • 7.4.3. United Kingdom
    • 7.4.4. Spain
    • 7.4.5. Others
  • 7.5. Middle East and Africa
    • 7.5.1. Saudi Arabia
    • 7.5.2. UAE
    • 7.5.3. Others
  • 7.6. Asia Pacific
    • 7.6.1. China
    • 7.6.2. India
    • 7.6.3. Japan
    • 7.6.4. South Korea
    • 7.6.5. Indonesia
    • 7.6.6. Thailand
    • 7.6.7. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 8.1. Major Players and Strategy Analysis
  • 8.2. Market Share Analysis
  • 8.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 8.4. Competitive Dashboard

9. COMPANY PROFILES

  • 9.1. Parker Hannifin Corp
  • 9.2. Henkel AG & Co. KGaA
  • 9.3. Momentive
  • 9.4. Laird
  • 9.5. 3M
  • 9.6. Boyd Corporation
  • 9.7. Novagard Solutions
  • 9.8. Dow Corning Corporation
  • 9.9. To-Plan
  • 9.10. Kobayashi Pharmaceutical Co.

10. APPENDIX

  • 10.1. Currency
  • 10.2. Assumptions
  • 10.3. Base and Forecast Years Timeline
  • 10.4. Key benefits for the stakeholders
  • 10.5. Research Methodology
  • 10.6. Abbreviations