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市場調查報告書
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1425063

半導體封裝市場 - 2024 年至 2029 年預測

Semiconductor Packaging Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 140 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

2022年半導體封裝市值為227.69億美元，複合年成長率為2.48%，到2029年市場規模將達270.28億美元。

推動半導體封裝市場成長的主要原因之一是全球半導體產業的擴張。眾多終端用戶產業不斷成長的需求以及使用封裝來提高電子系統的性能、可靠性和成本效益，有助於在整合度、能源效率和產品特性方面不斷改進，從而加速市場成長。對產業產生影響的另一個因素是家用電子電器和工業產品對採用應力分析、動態、動力學和傳熱等機械工程概念的創新包裝的需求不斷成長。此外，半導體行業的成長、可支配收入的增加以及降低相關成本和提高 IC 整體效率的迫切需求正在對半導體封裝市場產生有益的影響。此外，物聯網、人工智慧的出現以及先進電子產品的普及為市場參與企業帶來了利潤豐厚的可能性。

介紹

半導體封裝材料用於半導體裝置製造的最後階段，以保護半導體裝置免受劣化和其他外部影響。有機基板、焊球、接合線、引線框架等材料具有優異的性能，用於電子設備中防止腐蝕和磨損。近年來，平板電腦、行動電話和其他通訊設備等電子設備的普及激增，導致半導體封裝市場的需求不斷增加。由於家用電子電器需求不斷成長等因素，半導體和IC封裝市場正在經歷顯著擴張。此外，由於人們對電子封裝材料的使用意識不斷增強，半導體、 IC封裝材料市場的主要競爭對手擁有巨大的市場潛力。

促進因素

  • 消費者對先進電子產品的興趣日益濃厚正在推動市場擴張：推動半導體封裝市場的關鍵因素之一是對智慧型手機、平板電腦、穿戴式裝置和物聯網設備等高科技電子產品的需求不斷成長。客戶需要更緊湊、更強大且功能豐富的產品，需要創新的封裝概念來適應複雜的功能，同時保持最大的效能和可靠性。
  • 封裝解決方案的創新：半導體封裝技術的不斷改進正在擴大市場。新的包裝方法、組件和設計不斷湧現，以滿足不斷變化的行業需求。採用扇出封裝、晶圓層次電子構裝(WLP) 和覆晶等尖端封裝技術可提高效能、小型化和成本效率，是推動市場擴張的部分原因。
  • 日益關注小型化和整合度：主要成長要素之一是半導體元件的小型化和更高整合度的趨勢。隨著設備變得更小、整合度更高，需要封裝技術來將更多處理器、被動元件和互連裝置安裝到有限的空間中。系統級封裝 (SiP) 和 3D 封裝是先進封裝技術的範例，可提供更高層級的整合和卓越的功能。
  • 對高效能、低功耗解決方案的需求不斷增加：對高效能運算、人工智慧和邊緣運算應用的需求不斷成長，需要能夠提供高處理能力同時降低功耗的半導體封裝解決方案。為了實現這些應用，迫切需要具有改進的溫度控管、功率傳輸和訊號完整性的封裝解決方案，這有助於半導體封裝並推動成長。
  • 5G 技術使用的增加推動了市場擴張：由於 5G 網路，特別是射頻 (RF) 和毫米波設備的廣泛部署，半導體需求迅速增加。這些組件需要特殊的封裝解決方案才能在 5G 應用中完美可靠地運作。由於雲端處理服務需求的增加和資料中心的快速成長，對高效能運算（HPC）解決方案的需求不斷增加。資料中心的效能和能源效率需求必須透過2.5D和3D封裝等先進封裝技術來滿足。

主要企業提供的產品

  • 2.5D封裝：i-Cube(TM) & H-Cube(TM)，三星：i-Cube採用平行水平晶片排列，提升效能的同時減少熱量產生。三星的矽通孔(TSV) 和BEOL（後段生產線）技術為兩個或多個晶片結合其專業功能提供了基礎，為現代電子產品提供了有效的解決方案。正因為如此，它們比各自技術的總合更有效。成分。根據內插器層的類型，I-CubeTM 可提供 I-CubeSTM 和 I-CubeETM 變體。
  • 基於引線框架的封裝，ChipMOS：ChipMOS 提供多種封裝變體，為我們的客戶提供多種封裝選擇。基於引線框架的封裝包括小外形封裝 (SOP)、薄型小外形封裝 (TSOP) 和四方扁平封裝 (LQFP/TQFP)。也提供基於基板的封裝，例如 FBGA、VFBGA、堆疊式 CSP、TFBGA、LGA、COG 和 COF。為了促進封裝設計和製造參數的最佳化，ChipMOS 使用最先進的電腦輔助工程 (CAE) 模擬工具進行電氣和熱評估。

包裝材料領域陶瓷包裝領域成長顯著

陶瓷封裝領域以最高的收益佔據市場主導地位，預計將以顯著的成長率擴張。 Al2O3 佔陶瓷封裝的 90% 至 94%，其餘成分是形成玻璃的鹼土矽酸鹽。矽晶片安裝在封裝內部，玻璃或金屬頂部將封裝固定到位。由於安全功能、舒適性、穩定性和高性能等多種汽車零件中電子元件的快速採用，汽車行業對陶瓷封裝的需求大幅增加，預計該子區隔將大幅成長。整個時期發展。

亞太地區預計將佔據半導體封裝市場的主要佔有率：

亞太地區的收益佔有率在半導體封裝市場中處於領先地位，預計在整個預測期內將繼續保持這一領先地位。由於中國、台灣、韓國和新加坡等國家，亞太地區已成為世界半導體生產中心。這些國家進行了大規模的基礎設施投資、最尖端科技和技術純熟勞工，為半導體供應鏈創造了有利的環境。台積電（台灣積體電路製造公司）、三星和SK海力士只是亞洲最大、最前沿的半導體公司中的一些。這些公司正在為半導體封裝技術的創新和製定行業標準鋪平道路。為了生產半導體，亞太地區開發了專門的叢集。例如，台灣新竹科學園區是世界領先的半導體研發中心之一的所在地。亞太地區龐大的半導體製造量帶來了規模經濟，從而降低了當地公司的成本。亞太國家大力投資半導體技術研發，鼓勵創新，保持該產業處於封裝技術和材料的前沿。

目錄

第1章簡介

  • 市場概況
  • 市場定義
  • 調查範圍
  • 市場區隔
  • 貨幣
  • 先決條件
  • 基準年和預測年時間表

第2章調查方法

  • 調查資料
  • 調查過程

第3章執行摘要

  • 主要發現

第4章市場動態

  • 市場促進因素
  • 市場限制因素
  • 波特五力分析
  • 產業價值鏈分析

第5章半導體封裝市場：依封裝類型

  • 介紹
  • 先進封裝
    • 覆晶
    • 嵌入式晶粒
    • 扇出級封裝 (FO-WLP)
    • 扇入級封裝 (FI-WLP)

第6章半導體封裝市場：依封裝材料分類

  • 介紹
  • 有機基材
  • 引線框架
  • 陶瓷包裝
  • 接合線
  • 其他

第7章 半導體封裝市場：依最終使用者分類

  • 介紹
  • 家用電器
  • 航太和國防
  • 醫療設備
  • 通訊和電訊
  • 其他

第8章半導體封裝市場：依地區

  • 介紹
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 其他
  • 中東/非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 其他
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 韓國
    • 台灣
    • 泰國
    • 印尼
    • 其他

第9章競爭環境及分析

  • 主要企業及策略分析
  • 市場佔有率分析
  • 合併、收購、協議和合作
  • 供應商競爭力矩陣

第10章 公司簡介

  • ASE
  • Amkor Technology
  • Powertech Technology Inc.
  • Fujitsu Semiconductor Limited
  • ChipMOS TECHNOLOGIES INC.
  • Intel Corporation
  • Samsung Electronics Co. Ltd
  • Unisem（M）Berhad
  • ISI-Interconnect Systems
  • Jiangsu Changjiang Electronics Technology Co. Ltd.（JCET）
簡介目錄
Product Code: KSI061616099

The semiconductor packaging market is evaluated at US$22.769 billion for the year 2022 growing at a CAGR of 2.48% reaching the market size of US$27.028 billion by the year 2029.

One of the key reasons propelling the growth of the semiconductor packaging market is the expansion of the semiconductor industry globally. The growing demand across numerous end-user industries and the use of packaging to enhance the performance, reliability, and cost-effectiveness of electronic systems all contribute to ongoing improvements in terms of integration, energy efficiency, and product characteristics, which accelerate market growth. The industry is also being affected by the rise in demand for innovative packaging in consumer electronics and industrial items that use mechanical engineering concepts including stress analysis, fluid mechanics, dynamics, and heat transfer. Furthermore, the growth of the semiconductor industry, the rise in disposable income, and the pressing need to reduce the associated costs and improve the overall efficacy of ICs have a beneficial impact on the semiconductor packaging market. Additionally, the emergence of IoT, AI, and the widespread use of advanced electronics in the projection period open up lucrative potential for market participants.

Introduction:

Semiconductor packaging materials are used in the final stages of the production of semiconductor devices to protect them from degradation and other external influences. Organic substrates, solder balls, bonding wires, lead frames, and other materials provide superior performance and are used to guard against corrosion and wear and tear on electronic equipment. Due to the surge in popularity of electronic devices like tablets, mobile phones, and other communication devices during the past few years, there has been an increase in the need for semiconductor packaging market. Due to factors including the increase in demand for consumer electronics, the market for semiconductor, and IC packaging market has seen tremendous expansion. Additionally, the leading competitors in the semiconductor, and IC packaging materials market have tremendous market potential due to the growing awareness of the use of electronic packaging materials.

Drivers:

  • Growing consumer interest in advanced electronic devices is boosting market expansion: One of the main factors propelling the semiconductor packaging market is the rising demand for high-tech electronic gadgets like smartphones, tablets, wearables, and IoT devices. Customers are looking for products that are more compact, powerful, and feature-rich, thus there is a need for innovative package ideas that can contain complex features while maintaining maximum performance and dependability.
  • Innovations in Technology for Packaging Solutions: The market is expanding as a result of the ongoing improvements in semiconductor packaging technology. To suit the changing needs of the industry, new packaging methods, components, and designs are being invented. The adoption of cutting-edge packaging techniques like fan-out packaging, wafer-level packaging (WLP), and flip-chip, which offer enhanced performance, miniaturization, and cost-effectiveness, are a few reasons aiding in market expansion.
  • Greater attention paid to miniaturization and integration: One of the main growth drivers is the tendency for semiconductor components to get smaller and more integrated. There is a need for packaging methods that can fit many processors, passive components, and interconnects within constrained space as devices get smaller and more concise. System-in-package (SiP) and 3D packaging are examples of advanced packaging technologies that offer higher degrees of integration and better functionality.
  • Rise in demand for high-performance and low-power solutions: The need for semiconductor packaging solutions that can give high processing power while reducing power consumption is being fueled by the rising need for high-performance computing, artificial intelligence, and edge computing applications. To enable these applications, packaging solutions with improved heat management, power delivery, and signal integrity are highly sought after which is aided by semiconductor packaging thus fueling growth.
  • Rise in the usage of 5G technology to fuel market expansion: The need for semiconductors has surged as a result of the widespread deployment of 5G networks, notably for RF (Radio Frequency) and mm-wave devices. For these components to work flawlessly and with dependability in 5G applications, special packaging solutions are required. The requirement for high-performance computing (HPC) solutions has increased due to the growing demand for cloud computing services and the quick growth of data centers. The performance and power efficiency requirements for data centers must be met through the use of advanced packaging technologies, such as 2.5D and 3D packaging.

Products offered by key companies:

  • 2.5D Package: I-Cube™ & H-Cube™, Samsung: Parallel horizontal chip arrangement is used by I-Cube to improve performance while reducing heat buildup. Silicon Via (TSV) and Backend-of-the-Line (BEOL) technologies from Samsung serve as a basis for two or more chips to combine their specialized capabilities and become more effective than the sum of their components to provide effective solutions for contemporary electronics. Depending on the interposer type, I-CubeTM is offered in the variants I-CubeSTM and I-CubeETM.
  • Leadframe-based packages, ChipMOS: To provide its clients with a variety of packaging choices, ChipMOS delivers a wide selection of package variants. Leadframe-based packages like the small outline package (SOP), thin small outline package (TSOP), and quad flat package (LQFP/TQFP) are among the packages that are offered. Substrate-based packages like FBGA, VFBGA, stacked CSP, TFBGA, LGA, COG, and COF are also available. To ease package design and manufacturing parameter optimization, ChipMOS uses cutting-edge computer-aided engineering (CAE) simulation tools for both electrical and thermal evaluations.

The prominent growth in the ceramic package sector under the Packaging Material Segment

The ceramic package segment is projected to dominate the market with the highest revenue and is expected to expand at a significant growth rate. Al2O3 makes up 90% to 94% of ceramic packaging, with the remaining ingredients being glass-forming alkaline earth silicates. The package has a silicon chip installed inside, and a glass or metal top secures the package. This sub-segment is anticipated to develop throughout the forecast period due to the large rise in demand for ceramic packaging from the automotive sector as a result of the quick adoption of electronic components in several vehicle parts that include safety features, comfort, stability, and high performance.

The Asia Pacific region is expected to hold a significant share of the Semiconductor Packaging market:

Asia Pacific led the market for semiconductor packaging in terms of revenue share and is anticipated to continue to do so throughout the anticipated period. Asia Pacific has established itself as the hub of semiconductor production globally thanks to countries like China, Taiwan, South Korea, and Singapore. These countries have invested in large infrastructure investments, cutting-edge technology, and skilled labour, creating a favourable environment for the semiconductor supply chain. TSMC (Taiwan Semiconductor Manufacturing Company), Samsung, and SK Hynix are just some of Asia's largest and most cutting-edge semiconductor companies. These companies are paving the path for innovation in semiconductor packaging technologies and setting standards for the industry. To produce semiconductors, Asia Pacific has developed specialized clusters. Taiwan's Hsinchu Science Park, for example, is home to one of the world's most important semiconductor research and development centers. As a result of economies of scale made possible by the sheer volume of semiconductor manufacture in the Asia Pacific region, costs are reduced for local companies. Asia Pacific nations make considerable investments in semiconductor technology research and development, encouraging innovation and keeping the field at the cutting edge of packaging techniques and materials.

Key developments

  • A new kind of semiconductor packaging named Foveros Omni is being developed by Intel, and it will be released in September 2023. With the use of the 3D packaging method Foveros Omni, it is possible to stack many dies on top of one another, which can result in considerable performance and power efficiency gains.
  • VIPack, an advanced packaging platform created to support vertically integrated packaging solutions, was introduced by ASE Group in June 2022. The VIPack is ASE's next-generation 3D heterogeneous integration architecture, which offers extremely high performance and density while extending design principles.

SEGMENTS:

BY PACKAGING TYPE

  • Advanced Packaging
  • Flip Chip
  • Embedded Die
  • Fan-Out Level Packaging (FO-WLP)
  • Fan-In Level Packaging (FI-WLP)

BY PACKAGING MATERIAL

  • Organic Substrate
  • Leadframe
  • Ceramic Packaging
  • Bonding-Wire
  • Others

BY END-USER

  • Consumer Electronics
  • Aerospace and Defense
  • Medical Devices
  • Communication and Telecom
  • Others

BY GEOGRAPHY

  • North America
  • United States
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • United Kingdom
  • Germany
  • France
  • Italy
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • Japan
  • China
  • India
  • South Korea
  • Taiwan
  • Thailand
  • Indonesia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

  • 2.1. Research Data
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis

5. SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING TYPE

  • 5.1. Introduction
  • 5.2. Advanced Packaging
    • 5.2.1. Flip Chip
    • 5.2.2. Embedded Die
    • 5.2.3. Fan-Out Level Packaging (FO-WLP)
    • 5.2.4. Fan-In Level Packaging (FI-WLP)

6. SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL

  • 6.1. Introduction
  • 6.2. Organic Substrate
  • 6.3. Leadframe
  • 6.4. Ceramic Packaging
  • 6.5. Bonding-Wire
  • 6.6. Others

7. SEMICONDUCTOR PACKAGING MARKET, BY END-USER

  • 7.1. Introduction
  • 7.2. Consumer Electronics
  • 7.3. Aerospace and Defense
  • 7.4. Medical Devices
  • 7.5. Communication and Telecom
  • 7.6. Others

8. SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. United States
    • 8.2.2. Canada
    • 8.2.3. Mexico
  • 8.3. South America
    • 8.3.1. Brazil
    • 8.3.2. Argentina
    • 8.3.3. Others
  • 8.4. Europe
    • 8.4.1. United Kingdom
    • 8.4.2. Germany
    • 8.4.3. France
    • 8.4.4. Italy
    • 8.4.5. Spain
    • 8.4.6. Others
  • 8.5. The Middle East and Africa
    • 8.5.1. Saudi Arabia
    • 8.5.2. UAE
    • 8.5.3. Others
  • 8.6. Asia Pacific
    • 8.6.1. Japan
    • 8.6.2. China
    • 8.6.3. India
    • 8.6.4. South Korea
    • 8.6.5. Taiwan
    • 8.6.6. Thailand
    • 8.6.7. Indonesia
    • 8.6.8. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Vendor Competitiveness Matrix

10. COMPANY PROFILES

  • 10.1. ASE
  • 10.2. Amkor Technology
  • 10.3. Powertech Technology Inc.
  • 10.4. Fujitsu Semiconductor Limited
  • 10.5. ChipMOS TECHNOLOGIES INC.
  • 10.6. Intel Corporation
  • 10.7. Samsung Electronics Co. Ltd
  • 10.8. Unisem (M) Berhad
  • 10.9. ISI - Interconnect Systems
  • 10.10. Jiangsu Changjiang Electronics Technology Co. Ltd. (JCET)