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市場調查報告書
商品編碼
1353434
全球功率半導體市場規模、佔有率和行業趨勢分析報告:2023-2030年按按產品、用途、材料和地區分類的展望和預測Global Power Semiconductor Market Size, Share & Industry Trends Analysis Report By Product (Power MOSFET, IGBT, Thyristor, Power Diode, and Others), By Application, By Material (SiC, GaN, and Others), By Regional Outlook and Forecast, 2023 - 2030 |
功率半導體市場規模預計到 2030 年將達到 670 億美元,預測期內年複合成長率為 4.6%。 2022年市場規模為12.336億台,成長率為2.7%(2019-2022年)。
根據 KBV Cardinal Matrix 發表的分析,德州儀器 (TI) 是市場領導者。 2022 年 12 月,德州儀器 (TI) 與群光電源 (Chicony Power) 建立合作夥伴關係,借助 TI 帶有整合柵極促進因素的半橋GaN FET,將群光電源(Chicony Power) 的適配器尺寸縮小了50%,效率提高了高達94%。我做到了。安森美半導體公司、瑞薩電子公司和英飛凌科技公司等公司是該市場的主要創新者。
市場成長要素
電路在汽車中很重要
汽車零件、馬達、空調系統和電動車中的矽基功率金屬氧化物半導體場效電晶體(MOSFET)都需要電力電子電路和半導體。功率半導體通常用於包含電氣零件和整合晶片的汽車設備中,例如轉向、煞車、燃油分配和安全系統。碳化矽和其他高寬頻半導體用於接近電路的溫度區域。這些半導體減少了電路面積,具有高耐壓性,並且能夠實現高頻開關。此外,多項技術開拓正在推動市場成長,例如線控和線控驅動技術的採用,有助於減輕汽車重量、提高燃油效率並減少排放。
消費性電子設備和無線通訊的需求正在成長
由於全球消費性電子產品的消費不斷增加,該市場正在蓬勃發展。如今,許多消費產品都使用半導體,包括通訊設備(例如智慧型手機、平板電腦、智慧手錶和其他小玩意)、電腦(個人和商用電腦都有 PCB)、娛樂系統和家用電器。我需要它。智慧型手機是該領域半導體的主要消費者。近年來,由於行動電話使用量的增加,智慧型手機產業經歷了激烈的競爭。互聯家庭技術預計將顯著推動智慧型裝置的需求和物聯網 (IoT) 設備的日益普及。功率半導體廣泛應用於智慧型手機、平板電腦、智慧手錶、健身手環和通訊設備等攜帶式輕量消費性電子產品,有助於市場擴張。
市場抑制因素
SiC半導體生產網路與規劃週期的複雜性
由於消費性電子設備和無線通訊設備需求增加等要素,市場正在擴大,但全球矽晶圓短缺等要素,加上投資報酬率指標,預計將對市場擴張構成威脅。然而,碳化矽半導體技術的供應鏈和生產流程的複雜性帶來了限制,使其難以跟上不斷成長的需求。促進因素以及需要具有三個連接器(+、0V、-)的特定電池可能會使其難以在攜帶式設備中使用。因此,這些限制可能會限制未來年度的市場擴張。
產品展望
市場依產品分為功率 MOSFET、IGBT、閘流管、功率二極體等。 2022年,功率MOSFET領域佔據市場最大收入佔有率。功率MOSFET具有閘極驅動功率低、開關速度快、頻寬高、並行度高、穩健性強、易於驅動、易於偏壓、易於應用、易於維修等特點,因此是目前應用最廣泛的功率半導體裝置。世界。特別是,它最常用作低壓開關(低於 200 V)。
應用前景
按應用分類,市場分為 IT 和通訊、電子、工業、汽車、航太和國防、醫療保健、能源和電力等。到 2022 年,能源和電力領域將在市場中佔據重要的收入佔有率。在能源電力領域,功率半導體裝置具有許多優勢。為了確保成本效益,這些設備非常適合用於配電和公用事業系統,例如配電網路、輸電系統和可再生能源基礎設施。這些特性包括寬頻隙、提高能源效率和降低冷卻需求。
材質外觀
依材料分類,市場分為碳化矽(SiC)、氮化鎵(GaN)等。 2022年,SiC細分市場以最大的收入佔有率主導市場。該領域的成長是由於電動車和太陽能逆變器的普及導致碳化矽功率裝置的使用不斷增加。碳化矽的寬頻隙能量(3.2eV)、高擊穿電壓和共同的臨界電場有助於創造具有卓越性能的新型功率元件。
區域展望
從區域來看,我們對北美、歐洲、亞太地區和拉丁美洲地區的市場進行了分析。 2022年,亞太地區的市佔率最高。亞太地區在全球半導體產業中佔據主導地位,隨著政府立法的支持,該市場預計將擴大。越南、泰國、馬來西亞和新加坡是對該地區市場佔有率貢獻顯著的國家。因此,政府目前的「印度製造」計畫預計將帶來對半導體產業的投資。
The Global Power Semiconductor Market size is expected to reach $67 billion by 2030, rising at a market growth of 4.6% CAGR during the forecast period. In the year 2022, the market attained a volume of 1,233.6 million units, experiencing a growth of 2.7% (2019-2022).
Power semiconductors are often found in automotive equipment, including steering, braking, fuel distribution, and safety systems with electrical components and integrated chips. Thus, the Automotive segment captured $1,709.7 million revenue in the year 2022. Power semiconductors aid in the need for high-efficiency power conversion, the development of advanced lighting systems, and the implementation of stricter emission regulations. The rapid adoption of electric and hybrid vehicles, improvements in autonomous driving technology, and rising demand for vehicle connectivity and V2X communication are propelling the growth of this segment. Additionally, power semiconductors aid in the need for high-efficiency power conversion, the development of advanced lighting systems, and the implementation of stricter emission regulations.
The major strategies followed by the market participants are Partnerships as the key developmental strategy to keep pace with the changing demands of end users. For instance, In July, 2023, Onsemi joined hands with BorgWarner Inc., to enhance the performance of electric vehicles. Additionally, In February, 2023, Infineon Technologies teamed up with Infinitum, to bring enhanced energy-efficient motor controls with silicon carbide and other materials to the market.
Based on the Analysis presented in the KBV Cardinal matrix; Texas Instruments Inc. is the forerunners in the Market. In December, 2022, Texas Instruments signed a partnership with Chicony Power, to decrease the size of the chicony's adapter by 50% and enhance efficiency by up to 94% with the help of TI's half-bridge GaN FET with an integrated gate driver. Companies such as ON Semiconductor Corporation, Renesas Electronics Corporation, and Infineon Technologies AG are some of the key innovators in the Market.
Market Growth Factors
Circuits are crucial in the automotive industry
Automobile components, motors, air conditioning systems, and silicon-based power metal-oxide-semiconductor field-effect transistors (MOSFETs) in electric vehicles all require power electronic circuits and semiconductors. Power semiconductors are often found in automotive equipment, including steering, braking, fuel distribution, and safety systems with electrical components and integrated chips. Silicon carbide and other high wideband semiconductors are used close to temperature sites in circuits. They reduce the circuit area, have high breakdown voltage, and allow switching at higher frequencies. Additionally, several technological developments are boosting market growth, such as using x-by-wire or drive-by-wire technologies that help reduce vehicle weight, fuel efficiency, and emissions.
Consumer electronics and wireless communications are in greater demand
The market is growing favourably due to the rising consumption of consumer electronics products worldwide. Today, many consumer products, including communication devices (such as smartphones, tablets, smartwatches, and other gadgets), computers (personal and corporate computers feature PCBs), entertainment systems, and home appliances, require semiconductors. The smartphone is the main consumer of semiconductors in this sector. The smartphone industry has experienced intense competition in recent years due to increased mobile phone usage. The demand for smart devices and the growing use of Internet of Things (IoT) devices are expected to be significantly fuelled by connected home technology. The power semiconductor's widespread use in portable, lightweight consumer gadgets, including smartphones, tablets, smartwatches, fitness bands, and communication devices, contributes to the market's expansion.
Market Restraining Factors
Complexity of the SiC semiconductor production network and planning cycle
While the market is expanding as a result of factors like increased consumer electronics and wireless communication devices' demand, factors such as the global silicon wafer shortage combined with ROI metrics, are predicted to pose a threat to that expansion. However, the intricacy of the SiC semiconductor technology's supply chain and production process is a constraint that could make it difficult to keep up with the rising demand. Due to the requirement for additional DC-DC drivers or specific batteries with three connectors (+, 0V, and -) could make it difficult for them to be used in portable equipment. Therefore, these constraints may limit market expansion in the coming years.
Product Outlook
Based on product, the market is segmented into power MOSFET, IGBT, thyristor, power diode, and others. In 2022, the power MOSFET segment witnessed the largest revenue share in the market. The power MOSFET is the world's most widely used power semiconductor device because of its low gate drive power, quick switching speed, wide bandwidth, simple advanced paralleling capability, robustness, easy drive, easy biasing, simplicity of application, and ease of repair. It is particularly the most often used low-voltage switch (less than 200 V).
Application Outlook
On the basis of application, the market is classified into IT & telecom, electronics, industrial, automotive, aerospace & defence, healthcare, energy & power, and others. The energy & power segment covered a considerable revenue share in the market in 2022. In the energy & power sector, power semiconductor devices have many advantages. To ensure cost-effectiveness, these devices are ideal for use in power distribution and utility systems, such as distribution grids, transmission systems, and renewable energy infrastructure. These features include a wide band gap, enhanced energy efficiency, and reduced cooling requirements.
Material Outlook
Based on material, the market is classified into silicon carbide (SiC), gallium nitride (GaN), and others. In 2022, the SiC segment dominated the market with the maximum revenue share. The growth of the segment is owed to the increasing usage of SiC power devices along with the increased popularity of electric vehicles and photovoltaic inverters. In order to create novel power devices with excellent performance, it is convenient to take advantage of silicon carbide's wider bandgap energy (3.2eV), high breakdown voltage, and usual critical electric field.
Regional Outlook
Region wise, the market is analysed across North America, Europe, Asia Pacific, and LAMEA. In 2022, the Asia Pacific region generated the highest revenue share in the market. The market will expand in the Asia Pacific region due to the region's dominance in the global semiconductor industry and the support of government laws. Vietnam, Thailand, Malaysia, and Singapore are some nations that considerably contribute to the region's market share. As a result, the government's present Make in India initiative is anticipated to lead to investments in the semiconductor industry.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Infineon Technologies AG. Texas Instruments Inc., STMicroelectronics N.V., NXP Semiconductors N.V., ON Semiconductor Corporation, Mitsubishi Electric Corporation, Renesas Electronics Corporation, Toshiba Corporation, Fuji Electric Co., Ltd. and Hitachi, Ltd.
Recent Strategies Deployed in Power Semiconductor Market
Partnerships, Collaborations and Agreements:
Jul-2023: onsemi joined hands with BorgWarner Inc., a global company engaged in offering advanced sustainable mobility solutions. Through this collaboration, BorgWarner would combine onsemi EliteSiC 1200 V and 750 V power devices into its VIPER power modules for solutions of its traction inverter to enhance the performance of electric vehicles.
Jun-2023: Renesas Electronics Corporation collaborated with Nidec Corporation, a Japanese manufacturer and distributor of electric motors. This collaboration aims to develop the semiconductor solutions for E-Axle (X-in-1 system) that combines power electronics and an EV drive motor for electric vehicles (EVs).
Feb-2023: Infineon Technologies teamed up with Infinitum, a creator of the breakthrough, sustainable air core motor. The collaboration aims to bring enhanced energy-efficient motor controls with silicon carbide and other materials to the market.
Jan-2023: Infineon Technologies AG came into partnership with Resonac Corporation, a Japan-based chemical company. Under this partnership, companies would go on with the supply of SiC materials for power semiconductors to Infineon and together develop technologies related to SiC materials.
Dec-2022: NXP Semiconductors came into an agreement with Delta Electronics, Inc., a provider of power and thermal management solutions globally. Under this collaboration, both companies would develop traction inverter and power conversion platforms for next-generation electric vehicles.
Dec-2022: Texas Instruments signed a partnership with Chicony Power, a manufacturer, and marketer of power supplies and LED lighting products. Following this partnership, companies would design 65-W laptop power adapters. Furthermore, both companies would decrease the size of the chicony's adapter by 50% and enhance efficiency by up to 94% with the help of TI's half-bridge GaN FET with an integrated gate driver.
Sep-2022: Renesas Electronics Corporation signed an agreement with VinFast, a Vietnam-based global EV maker. This agreement would include the development of automotive technology for electric vehicles (EVs) and delivery of system components. Moreover, Renesas would offer a wide range of products to VinFast, which consists of SoCs, microcontrollers, analog and power semiconductors.
Jul-2022: STMicroelectronics N.V. partnered with GlobalFoundries Inc., a global semiconductor contract manufacturing and design company. Under this partnership, companies would aim to open a brand new, high-volume semiconductor manufacturing facility in Crolles (France). This partnership helped STMicroelectronics to expand its feet in the French market. Additionally, it will reinforce the European and French FD-SOI ecosystem.
Jun-2022: Renesas Electronics Corporation partnered with Tata Motors Ltd. (TML) and Tejas Networks Ltd., both subsidiaries of Tata Group, an India-based global company. Under this partnership, both companies aim to enhance semiconductor solutions across electronic systems for Indian and growing markets. Additionally, both companies accelerated the growth in advanced electronics and its multitudes of applications for the market.
Mar-2022: NXP teamed up with Hitachi Energy, a global technology company engaged in advancing a sustainable energy future. Following this collaboration, both companies would integrate NXP's GD3160 isolated gate driver and Hitachi Energy's RoadPak SiC power modules to bring reliable, functionally safe, and efficient ePowertrains to commercialize more rapidly.
Product Launches and Product Expansion:
Dec-2022: Toshiba introduced TK055U60Z1, the first MOSFET of the 600V DTMOSVI series. The launched product provides a 13 percent RDS (on) advancement over similar devices released in its earlier DTMOSIV-H series.
May-2022: Hitachi Energy released RoadPak, a leading power semiconductor module for electric vehicles. The RoadPak module utilizes advanced silicon carbide (SiC) technology to achieve outstanding levels of power density for reliability, faster charging, over the vehicle's lifetime, and the minimum possible power losses for the highest potential driving range.
Acquisitions and Mergers:
Feb-2023: Mitsubishi Electric Corporation completed the acquisition of Scibreak AB, a Sweden-based company engaged in commercializing new technology for interrupting electric current. Through this acquisition, both companies would work together on developing DCCB technologies for high-voltage direct current (HVDC) systems, and Mitsubishi Electric utilizing Scibreak's technology.
Nov-2021: onsemi acquired GT Advanced Technologies, a company engaged in providing silicon carbide (SiC). This acquisition strengthens onsemi's capability to secure and grow the supply of SiC. Moreover, the acquisition empowers onsemi's ability to propel innovation and invest in dynamic, high-growth technologies.
Jun-2021: Texas Instruments Incorporated signed an agreement to acquire the 300-mm semiconductor factory of Micron Technology, a company specializing in innovative memory and storage solutions. This acquisition strengthens competitive advantage in manufacturing and technology and is part of long-term capacity planning.
Geographical Expansions:
Sep-2021: Infineon opened a new facility in Villach, Austria. The high-tech chip factory for power electronics on 300-millimeter thin wafers aims to fulfil the growing demand for power semiconductors. Moreover, the additional capacity would help Infineon to serve its customers globally.
Market Segments covered in the Report:
By Product (Volume, Million Units, USD Million, 2019-2030)
By Application (Volume, Million Units, USD Million, 2019-2030)
By Material (Volume, Million Units, USD Million, 2019-2030)
By Geography (Volume, Million Units, USD Million, 2019-2030)
Companies Profiled
Unique Offerings from KBV Research