市場調查報告書
商品編碼
1154886
全球薄晶圓市場規模、份額、行業趨勢分析報告:按晶圓尺寸(300毫米、200毫米、125毫米)、技術(切割、拋光、研磨)、應用、區域展望、預測2022-2028Global Thin Wafer Market Size, Share & Industry Trends Analysis Report By Wafer Size (300 mm, 200 mm and 125 mm), By Technology (Dicing, Polishing and Grinding), By Application, By Regional Outlook and Forecast, 2022 - 2028 |
全球薄晶圓市場規模預計將在 2028 年達到 222 億美元,預測期內復合年增長率為 13.0%。
晶圓由極其純淨、幾乎無缺陷的材料製成,純度為 99.9999999 個百分點 (9N) 或更高。生產結晶晶片的方法之一是由波蘭化學家 Jan Czochralski 開發的“Czochralski 方法”。通過從熔體中提取晶種,可以生產出矽或鍺等高純度單晶半導體的柱狀“晶錠”。在矽的情況下,可以以精確的比例添加硼或磷等雜質原子,以形成 n 型或 p 型外部半導體。
此晶錠用晶圓鋸(一種線鋸)切割成晶圓,進行機加工以提高平整度,化學擦除以去除機加工造成的晶體損傷,並拋光完成。太陽能電池晶圓為 100 至 200 平方毫米,厚度為 100 至 500 毫米,電子元件晶圓的直徑為 100 至 450 毫米。最大的晶圓直徑為450mm,但尚未普及。
COVID-19 影響分析
薄晶圓行業包括製造設施遍布多個國家/地區的 1 級和 2 級製造商。這些公司為電子、汽車和醫療等各種終端市場生產薄晶圓。 COVID-19 不僅影響了上述行業的公司,也影響了晶圓製造商的運營。汽車和電子設備領域的MEMS產品市場預計也將萎縮。 COVID-19 大流行嚴重打擊了晶圓加工和切割設備市場,主要工業基地的生產活動暫時停止,並迫使產量大幅下降。
市場增長因素
採用 5G 技術實現電子設備的小型化正在取得進展
世界各地的企業都在轉向 5G 連接,以提高運營效率並增加交易量。此外,5G網絡可以顯著提高通信速度並減少下載時間,使其適用於汽車和智慧城市發展等領域。基於 GaN 的薄晶圓有可能實現 50% 或更高的功率附加效率 (PAE),並有望得到廣泛應用。此外,5G技術有望在人工智能、無人駕駛、增強現實等領域得到廣泛應用。此外,荷蘭芯片製造商恩智浦在亞利桑那州開設了一家 GaN 5G 芯片製造工廠,旨在提升其 5G 電信設備。這是市場擴張的原動力。
擴大物聯網和人工智能在汽車領域的應用
汽車行業引入工業4.0、物聯網和人工智能等新技術,將對薄晶圓市場的擴張產生重大影響。對汽車連接性不斷增長的需求將刺激新的工業進步。此外,無觸摸人機界面等當前趨勢正在改變汽車行業,導致聯網車輛的相關性增加。物聯網連接未來增長的主要驅動力之一是物聯網在汽車安全和通信技術中的整合。自適應巡航控制、智能停車輔助系統和高級駕駛員輔助系統 (ADAS) 等新技術的出現將進一步刺激市場擴張。
市場約束
窄晶圓效率維持是關鍵問題
隨著薄晶圓的引入,效率已成為一個主要問題。特別是厚度在50m以下的窄晶圓吸收長波長光的能力低,要完全吸收長波長光必須大幅度移動晶圓。薄晶圓的主要目的是讓芯片製造商能夠利用高性能、低功耗和縮小芯片面積的所有優勢。性能可能是公司在引入薄晶圓時面臨的最大挑戰。特別是厚度在50m以下的薄晶片的長波吸收能力低。薄晶圓的高效維護阻礙了薄晶圓市場的增長和滲透。
晶圓尺寸展望
根據晶圓尺寸,薄晶圓市場分為 125 毫米、200 毫米和 300 毫米。 300 毫米細分市場在 2021 年佔據了薄晶圓市場的最高收入份額。 300mm晶圓由於良率高,越來越多地用於LED等應用,這正在推動薄晶圓市場的擴張。 300 毫米晶圓可提供 LED 製造商所需的規模經濟和更高的盈利能力。使用此晶圓,您可以一次製作許多產品。
技術展望
薄晶圓市場按技術細分為研磨、拋光和切割。 2021 年,研磨部分在薄晶圓市場中佔據了很大的收入份額。為了實現集成電路的堆疊和高密度安裝,在稱為晶圓背景(wafer background,IC)的半導體器件製造過程中晶圓厚度被減小。 IC 形成在經過多個處理步驟的薄晶圓上。
應用展望
薄晶圓市場按應用細分為 MEMS、CIS、存儲器、RF 設備、LED、中介層、邏輯等。到 2021 年,薄晶圓市場將在內存領域佔據最高的收入份額。內存在很大程度上依賴於刀片和激光切割的混合來分離複雜的堆棧。由於高金屬濃度,僅頂層的刀片切割會導致分層問題。然而,安全地模擬薄至 50m 的晶圓是很困難的。
區域展望
按地區劃分,在北美、歐洲、亞太地區和 LAMEA 進行了分析。亞太地區將在 2021 年佔據薄晶圓市場的最高收入份額。隨著中國和日本在智能手錶和智能家居小工具等高端消費品的使用方面經歷了爆炸式增長。由於有利的經濟條件和對消費電子產品的需求增加,預計亞太地區的半導體市場將出現顯著增長。
The Global Thin Wafer Market size is expected to reach $22.2 billion by 2028, rising at a market growth of 13.0% CAGR during the forecast period.
While creating integrated circuits, a thin wafer is a slice of semiconductor material. One of the main drivers of a thin wafer market's expansion is the rising demand for semiconductor devices in sectors like telecommunications, consumer electronics, and automotive.
Wafer, also known as a slice or a substrate, is a thin semiconductor slice used in electronics for the production of solar cells and integrated circuits made of crystalline silicon (c-Si). The wafer, which serves as the foundation for those devices, is built inside of and on top. It undergoes numerous microfabrication techniques, such as photolithographic patterning, electrodeposition, doping, etching, and thin-film deposition of various materials. The individual microcircuits are separated by wafer dicing, and they are subsequently assembled into an integrated circuit.
Wafers are made of material that is extremely pure, almost defect-free and has a purity of 99.9999999percentage points (9N) or higher. The C zochralski method, developed by Polish chemist Jan Czochralski, is one method for producing crystalline wafers. Pulling a seed crystal from a melt creates a boule, a cylindrical ingot of a high-purity monocrystalline semiconductor like silicon or germanium. The molten intrinsic material can be doped to create an extrinsic semiconductor of the n-type or p-type by adding donor impurity atoms in exact proportions, such as boron or phosphorus in the case of silicon.
The boule is then cut into wafer-shaped pieces using a wafer saw (a sort of wire saw), machined to increase flatness, chemically erased to remove machining-related crystal damage, and polished to finish. Photovoltaic wafers range in size from 100 to 200 mm square and range in thickness from 100 to 500 m. Electronics employ wafers with diameters ranging from 100 to 450 mm. The largest manufactured wafers are 450 mm in diameter, although they are not yet in widespread use.
COVID-19 Impact Analysis
The thin wafer industry includes producers of Tier 1 and Tier 2 with manufacturing facilities dispersed across numerous nations. These companies produce thin wafers that are utilized in a variety of end markets, including electronics, automobiles, medical, and a few more. Covid-19 had an impact on both enterprises in the aforementioned sectors as well as thin wafer industry players' operations. The market for MEMS products from the automotive and electronic goods sectors is also anticipated to decrease. The present COVID-19 pandemic has harmed the market for thin wafer processing and dicing equipment, causing a sizable output slowdown as manufacturing activities are momentarily suspended throughout key industrial centers.
Market Growth Factors
Smaller Electrical Device Sizes High 5g Technology Adoption
Companies all around the world are switching to 5G connectivity to boost operational effectiveness and increase transaction volumes. Additionally, 5G networks can give substantially faster speeds and shorter download times, making them suitable for use in sectors like automotive and smart city development. GaN-based thin wafers, which have the potential to achieve power-added efficiencies (PAE) of 50% or more, are expected to gain popularity. Additionally, it is projected that 5G technology would be widely used in fields like AI, driverless vehicles, and augmented reality. Additionally, the Dutch chipmaker NXP opened a GaN 5G chip manufacturing facility in Arizona intending to enhance 5G communications equipment. This is propelling market expansion.
Increasing IoT And AI Usage In The Automotive Sector
The introduction of Industry 4.0 and new technologies like IoT and AI in the automobile industry will have a big impact on the expansion of the thin wafer market. The rising need for car connectivity will spur new industry advancements. Additionally, the relevance of linked cars is expanding as a result of current trends like touch-free human-machine interfaces, which are transforming the automotive industry. One of the main drivers of future IoT connection growth is the integration of IoT in vehicle safety and communication technologies. The advent of new technologies including adaptive cruise control, intelligent parking assistance systems, and advanced driver assistance systems (ADAS) will further spur market expansion.
Market Restraining Factors
The Maintenance Of Narrow Wafer Efficiency Is A Critical Issue
Efficiency is the major problem businesses are currently having while implementing thin wafers. A narrow wafer has poor capability for long-wavelength light absorption, especially if its thickness is less than 50 m. In the case of long wavelengths, the light must travel a great distance before it can be entirely absorbed by the wafer. The main goal in creating a thin wafer was to provide chip makers access to all of its advantages, including high performance, low power consumption, and a smaller die area. Performance is perhaps the biggest challenge that businesses are encountering when deploying thin wafers. The thin wafer has a poor ability for long wavelength absorption, especially if its thickness is less than 50 m. The efficient maintenance of the thin wafers hampers the growth and adoption of the thin wafer market.
Wafer Size Outlook
Based on the Wafer Size, the Thin Wafer Market is segmented into 125 mm, 200 mm, and 300 mm. The 300 mm segment acquired the highest revenue share in the thin wafer market in 2021. Due to their higher yield, 300 mm wafers are increasingly being used in applications like LED, which is boosting the thin wafer market's expansion. These wafers provide the scale economies and increased profitability that LED makers now find to be necessary. With the help of these wafers, producers may create a large number of products in a single batch.
Technology Outlook
By Technology, the Thin Wafer Market is classified into Grinding, Polishing, and Dicing. The grinding segment recorded a substantial revenue share in the thin wafer market in 2021. To enable stacking and high-density packing of integrated circuits, the wafer thickness is decreased during the semiconductor device manufacture process known as wafer backgrounding (IC). On thin wafers that undergo several processing processes, ICs are created.
Application Outlook
Based on the Application, the Thin Wafer Market is bifurcated into MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic, and Others. The memory segment garnered the highest revenue share in the thin wafer market in 2021. Memory has relied mainly on a mixture of blades and laser dicing to separate complicated stacks. The high metal concentration causes delamination problems when just blade dicing is used on top layers. However, it is challenging to simulate 50 m thin wafers safely.
Regional Outlook
Region-wise, the Thin Wafer Market is analyzed across North America, Europe, Asia Pacific, and LAMEA.The Asia Pacific segment acquired the highest revenue share in the thin wafer market in 2021. Due to China's and Japan's explosive growth in the use of high-end consumer goods, including smartwatches and smart home gadgets. Due to good economic conditions and rising consumer electronics demand, the Asia Pacific region is predicted to experience significant growth in the semiconductor market.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Shin-Etsu Chemical Co., Ltd., SUMCO Corporation, GlobalWafers Co., Ltd., Siltronic AG, SK Siltron Co., Ltd., SUSS MicroTec SE, Soitec, DISCO Corporation, 3M Company, and Applied Materials, Inc.
Strategies deployed in Thin Wafer Market
May-2022: Soitec launched a 200 mm silicon carbide SmartSiC wafer. With this launch, Soitec would broaden its SiC product offering a further 150 mm, take the production of its SmartSiC wafers to the next grade, and meet the increasing demand of the automotive industry.
Mar-2022: Wafer supplier Soitec expanded its geographical footprint by establishing a fabrication facility at its headquarters in Bernin, France. This expansion would fulfill the need for silicon carbide for electric vehicles and industrial purposes, with wafers produced utilizing the SmartSiC production procedure. Moreover, it would sustain the production of 300mm diameter silicon-on-insulator (SOI) wafers.
Nov-2021: Soitec completed the acquisition of NOVASiC, an advanced technology business specializing in polishing and reclaiming wafers on silicon carbide. With this acquisition, Soitec would propel the growth of semiconductors for power supply systems in industrial and electromobility applications.
Sep-2019: SK Siltron completed the acquisition of DuPont's wafer business, which manufactures a broad array of industrial chemicals, and synthetic fibers. With this acquisition, DuPont's SiC unit would provide SK Siltron with a sturdy wafer supply and develop synergy within the group.
May-2019: Soitec took over EpiGaN, a foremost European supplier of GaN epitaxial wafer (epi-wafer) materials. Under this acquisition, EpiGaN would develop new supplementary growth possibilities within Soitec's living Power-SOI products given GaN's benefit in power transistor structures.
Mar-2019: Soitec joined hands with Agency for Science, Technology and Research's (A*STAR) Institute of Microelectronics. Together, the companies aimed to design and incorporate a new layer transfer process within developed wafer-level multi-chip packaging techniques. Additionally, IME's Fan-Out Wafer Level Packaging (FOWLP) and 2.5D Through Silicon Interposer (TSI) technologies along with Soitec's Smart Cut(TM) technology, the latest cost-competitive approach delivers energy efficiency, higher commission, and improved product output.
Feb-2019: SUSS MicroOptics expanded its geographical footprint by establishing an excellence center in Neuchatel Switzerland for manufacturing wafer-level optics. This expansion aimed to satisfy the need for precision optics applications.
Dec-2018: DISCO Corporation introduced DFG8640, a new completely automatic grinder consistent with 8-inch wafers and capable to grind a broad variety of materials, such as silicon, LiNbO3, LiTaO3, and SiC. The new DFG8640 contains high accuracy grinding; optimizing the processing point layout decreases consistency variation for both separate wafers and between wafers; a new spindle with high stability, lower vibration, and minor rotation speed change.
Market Segments covered in the Report:
By Wafer Size
By Technology
By Application
By Geography
Companies Profiled
Unique Offerings from KBV Research
List of Figures