市場調查報告書
商品編碼
1115043
2022-2028 年全球集成無源器件市場規模、份額、行業趨勢分析報告(按應用、最終用戶(汽車、家用電器、醫療保健、其他))、區域展望和預測Global Integrated Passive Devices Market Size, Share & Industry Trends Analysis Report By Application, By End User (Automotive, Consumer Electronics, Healthcare and Others), By Regional Outlook and Forecast, 2022 - 2028 |
到 2028 年,集成無源器件的全球市場規模預計將達到 36 億美元,在預測期內以 10.9% 的複合年增長率增長。
在電子系統的組裝中,集成的無源器件可以被封裝,用作裸片、芯片,甚至可以三維(3D)堆疊在其他 IPD 和有源集成電路之上。我有。電子封裝中使用的標准直插式 (SIL)、SIP 或其他封裝(DIL、DIP、QFN、芯片級封裝/CSP、晶圓級封裝/WLP 等)是集成無源器件的典型。它是一種封裝。集成無源器件還充當模塊基板,使其成為芯片組模塊、多芯片模塊、混合模塊等的組件。
IPD 基板是玻璃、覆蓋有介電層(例如二氧化矽)的矽、層狀陶瓷(低溫共燒陶瓷/LTCC、高溫共燒陶瓷/HTCC)、氧化鋁/氧化鋁陶瓷、共燒陶瓷。有時會使用硬質材料,例如(LTCC、HTCC)。基板也可以是柔性的,例如 Kapton、FR4 或類似的聚□亞胺層壓板,或其他合適的多聚體,例如封裝中介層(也稱為有源中介層)。忽略和理解基板和潛在封裝對 IPD 性能的影響有利於電子系統的設計。
COVID-19 影響分析
COVID-19 的爆發及其對無源電子元件的影響降低了整個供應鏈在元件和原材料製造層面的功能水平。這表明無源集成器件在許多國家和地區的銷售額都在下降。另一方面,該地區的日本貿易公司和相關公司持平。通過在單個矽片上集成耦合器、諧波濾波器、耦合器和阻抗匹配器等多個功能模塊,可以在提高器件性能的同時使無源元件集成器件更小。
市場增長因素
在消費品領域擴大 IPD 的使用
IPD 技術最常見的用途之一是在白色家電中。研究表明,集成無源器件廣泛應用於消費電子行業,包括數字電視、機頂盒、智能手機、平板電腦和便攜式媒體播放器等產品。由於近年來對智能手機的高需求,需要將許多功能打包到一個緊湊的外形中,因此出現了集成無源器件。智能手機配備了許多功能,例如 Wi-Fi、藍牙、定位系統和短距離無線通信。
邁向 5G 網絡時代
5G有望投入實際使用。 IPD 嵌入在平衡不平衡轉換器、濾波器和雙工器等物品中,並且必須為 5G 做好準備。電信行業尤其將從 IPD 的加入中受益,因為它們可以減少電信基礎設施設備的尺寸和能耗。到2022年,預計5G用戶數將達到8900萬,IPD市場增長潛力可期。用於 5G 的 IPD 射頻濾波器由高效的 3D Glass Solutions 製造。此外,預計到 2021 年,美國、日本、韓國、英國、德國和中國將引入 5G 技術,並有望支持後續集成無源市場的擴張。
市場製約因素
集成無源器件比分立元件更昂貴
與分立元件相比,集成無源器件的高成本阻礙了其市場。然而,隨著行業巨頭努力降低 IPD 的價格,長期影響可能很小。此外,重要的是以低成本製造以提高盈利能力。然而,傳統的印刷電路板是用於分立元件,而不是用於 IPD。將傳統印刷電路板用於 IPD 會產生額外成本。一個分立元件的 IPD 成本為 1:31 (1.5 x 1.5)。這部分是由於分立元件的商品化和廣泛使用。
應用前景
集成無源器件市場按應用細分為靜態/電磁對抗、高頻、LED 照明和數字/混合信號。靜電放電/電磁干擾 (ESD/EMI) 保護部分將在 2021 年佔據集成無源器件市場的最高收入份額。這是因為在手機中採用這些無源集成元件是擴大這一市場的主要因素。在接下來的九年中,EMS 和 EMI 保護產品領域預計將顯著增長。這些解決方案避免了傳輸損耗並改善了信號接收。
最終用戶展望
集成無源器件市場按最終用途細分為汽車、消費電子產品、醫療保健等。 2021 年,消費電子部門在集成無源器件市場中取得了可觀的收入份額。集成無源設備市場擴張的主要驅動力是智能手機和其他物聯網設備的日益普及。此外,芯片小型化等技術發展使電子產品小型化成為可能,這也是手機、LED電視、平板電腦和筆記本電腦等消費電子設備越來越普及的原因。
地區概覽
對北美、歐洲、亞太地區和 LAMEA 地區的集成無源器件市場進行了分析。 2021 年,歐洲部門在集成無源器件市場的收入份額最高。 Infineon Technologies AG、STMicroelectronics 和 IPDiA 等主要供應商在該地區提供基於高效研發的尖端產品,並為增長做出了貢獻。此外,這一發展為醫療保健、汽車和電子等各個行業做出了貢獻,在該地區產生了大量投資。
The Global Integrated Passive Devices Market size is expected to reach $3.6 billion by 2028, rising at a market growth of 10.9% CAGR during the forecast period.
The integrated passive device (IPD), also known as the integrated passive component (IPC), or embedded passive component (EPC), is an electronic component that combines resistors, capacitors, inductors, coils/chokes, microstrip lines, impedance matching components, baluns, or any combination of these components in the same package or on the same substrate. Even though the distinction between incorporated and integrated passives is technically ambiguous, integrated passives are occasionally referred to as embedded passives.
In both situations, passives are implemented on the same substrate or in-between dielectric layers. Resistor, capacitor, resistor-capacitor, coil/inductor (RCL), and resistor-capacitor networks are the first types of IPDs. Additionally, passive transformers can be created as integrated passive devices, such as by stacking two coils on top of one another and separating them with a thin layer of dielectric. When the substrate is silicon or another semiconductor like gallium arsenide, diodes (PN, PIN, Zener, etc.) can occasionally be integrated into it with integrated passives (GaAs).
In an electronic system assembly, integrated passive devices may be packaged, used as bare dies or chips, or even stacked in three dimensions (3D) on top of other IPDs or active integrated circuits. Standard in Line (SIL), SIP, or any other packages (such as DIL, DIP, QFN, chip-scale package/CSP, wafer level package/WLP, etc.) used in electronic packaging are typical packages for integrated passives. Integrated passives can also serve as a module substrate, making them a component of chipset modules, multi-chip modules, and hybrid modules.
The substrate for IPDs can be stiff materials like glass, silicon covered with a dielectric layer like silicon dioxide, layered ceramics (low temperature co-fired ceramic/LTCC, high-temperature, and high co-fired ceramic/HTCC), aluminum oxide/alumina ceramic, and co-fired ceramics (LTCC, HTCC). The substrate can also be flexible, such as a laminate made of Kapton, FR4, or a similar polyimide, or any other suitable polyposis, such as a package interposer (also known as an active interposer). The ability to ignore or understand the impact of the substrate and potential package on the performance of IPDs is advantageous for the design of electronics systems.
COVID-19 Impact Analysis
The COVID-19 outbreak and its effects on passive electronic components resulted in lower functioning levels throughout the supply chain at the components and raw materials manufacturing levels. This indicates a decline in the sales of passive integrated devices across numerous countries and regions. On the other hand, the Japanese traders and associated businesses in the area stayed the same. By combining several functional blocks, such as couplers, harmonic filters, couplers, and impedance matching devices, into a single silicon wafer, integrated passive devices can miniaturize devices while improving device performance.
Market Growth Factors
Ipd Is Becoming More Widely Used In Consumer Goods
One of the IPD technology's most common uses is in white goods. According to research, integrated passive devices are widely used in the consumer electronics industry, which includes products like digital TVs, set-top boxes, smartphones, tablets, and portable media players. Since there has been such a high demand for smartphones in recent years, integrated passive devices have emerged as a result of the necessity for many features to be crammed into a compact form factor. Numerous functions, including Wi-Fi, Bluetooth, the positioning system, near-field communication, and others, are available on smartphones.
The Upcoming Era Of The 5g Network
5G is anticipated to be commercially available. IPDs must be incorporated into items like baluns, filters, and diplexers to make them 5G compliant. The telecom industry in particular would benefit from the integration of IPDs since it would assist reduce the size and energy consumption of telecom infrastructure items. By 2022, the 5G market is anticipated to have 89 million subscriptions, which would present a growth potential for the IPD market. 5G IPD RF filters with great efficiency have been created by 3D Glass Solutions. In addition, 5G technology is expected to be implemented in the US, Japan, South Korea, UK, Germany, and China by 2021, which is projected to support the expansion of the market for integrated passive devices in the ensuing years.
Market Restraining Factors
Ipds Are More Expensive Than Discrete Components
The market for integrated passive devices is being constrained by IPDs' high cost when compared to discrete components. Long-term effects are anticipated to be minimal because major companies in this industry are working to bring down the price of IPDs. To optimize profitability, low-cost manufacturing is also crucial. Traditional printed circuit boards, however, are not specified for IPDs; rather, they are for individual discrete components. Using traditional PCBs with IPDs results in additional costs. A single discrete component's cost to IPD is 1:31 (1.5 X 1.5). This is partly because discrete components have become commodities and are widely used.
Application Outlook
On the basis of Application, The Integrated Passive Devices market is segmented into Electrostatic discharge/electromagnetic interference (ESD/EMI) Protection, Radio frequency, LED lighting, and Digital & mixed-signal IPD. The Electrostatic discharge/electromagnetic interference (ESD/EMI) Protection segment acquired the highest revenue share in the integrated passive device market in 2021. It is due to the adoption of these passive integrated components in mobile phones is a major driver of this market's expansion. Over the next nine years, it is anticipated that the EMS and EMI protection product segments would experience significant growth. These solutions avoid transmission loss and enhance signal reception.
End-Use Outlook
Based on End-use, The Integrated Passive Devices market is classified into Automotive, Consumer electronics, Healthcare, and Others. The consumer electronics segment recorded a substantial revenue share in the integrated passive device market in 2021. The main driver of the market expansion for integrated passive devices is the rising adoption of smartphones and other IoT devices. Additionally, technological developments like smaller chips have made it possible for electrical gadgets to be smaller, which helps to explain why consumer electronics like mobile phones, LED televisions, tablets, and laptops are becoming more and more popular.
Regional Outlook
Region wise, The Integrated Passive Devices market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Europe segments procured the highest revenue share in the integrated passive device market in 2021. Key vendors like Infineon Technologies AG, STMicroelectronics, and IPDiA that provide cutting-edge products based on efficient research and development are present in this region, which contributes to the growth. Additionally, the developments serve a variety of industries, including healthcare, automobile, and electronics, generating significant investment in this region.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include STMicroelectronics N.V., Infineon Technologies AG, Jiangsu Changjing Electronics Technology Co., Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ON Semiconductor Corporation, Murata Manufacturing Co., Ltd., Johanson Technology, Inc., and OnChip Devices, Inc.
Market Segments covered in the Report:
By Application
By End User
By Geography
Companies Profiled
Unique Offerings from KBV Research
List of Figures